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30069-02C1 [MOLEX]

4.20mm (.165) Pitch Mini-Fit TPA™ Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 2 Circuits, Tin (Sn) Plating, without Drain Holes; 4.20毫米（ 0.165 ）节距微型飞度TPA ™接头，双排，垂直，以管理单元塑料钉板锁， 2回路，锡（Sn ）镀层，无排水孔

30069-02C1


元器件型号：	30069-02C1
生产厂家：	Molex Electronics Ltd.
描述和应用：	4.20mm (.165) Pitch Mini-Fit TPA™ Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 2 Circuits, Tin (Sn) Plating, without Drain Holes 4.20毫米（ 0.165 ）节距微型飞度TPA ™接头，双排，垂直，以管理单元塑料钉板锁， 2回路，锡（Sn ）镀层，无排水孔 PC
PDF文件：	总5页 (文件大小：431K)
下载文档：	下载PDF数据表文档文件
型号参数：30069-02C1参数

30069-02C2

Mini-FitÂ® TPA Header, 4.20mm Pitch, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 2 Circuits, Gold (Au) Plating, without Drain Holes

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0 MOLEX9

3006904

Modular Terminal Block, 57A, 16mm2

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0 PHOENIX

30069-0411

4.20mm Pitch, Mini-FitÂ® TPA Header, Dual Row, Vertical, with PCB Mounting Flange, 4 Circuits, Tin (Sn) Over Nickel (Ni) Plating, without Drain Holes

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0 MOLEX11

30069-04A1

Mini-FitÂ® TPA Header, 4.20mm Pitch, Dual Row, Vertical, with PCB Mounting Flange, 4 Circuits, Tin (Sn) Plating, without Drain Holes

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0 MOLEX11

30069-04A2

Mini-FitÂ® TPA Header, 4.20mm Pitch, Dual Row, Vertical, with PCB Mounting Flange, 4 Circuits, Gold (Au) Plating, without Drain Holes

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0 MOLEX11

30069-04C1

Mini-FitÂ® TPA Header, 4.20mm Pitch, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 4 Circuits, Tin (Sn) Plating, without Drain Holes

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0 MOLEX11

30069-04C2

Mini-FitÂ® TPA Header, 4.20mm Pitch, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 4 Circuits, Gold (Au) Plating, without Drain Holes

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0 MOLEX9

30069-0611

4.20mm Pitch, Mini-FitÂ® TPA Header, Dual Row, Vertical, with PCB Mounting Flange, 6 Circuits, Tin (Sn) Over Nickel (Ni) Plating, without Drain Holes

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0 MOLEX11

30069-06A1

Mini-FitÂ® TPA Header, 4.20mm Pitch, Dual Row, Vertical, with PCB Mounting Flange, 6 Circuits, Tin (Sn) Plating without Drain Holes

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0 MOLEX11

30069-06A2

Mini-FitÂ® TPA Header, 4.20mm Pitch, Dual Row, Vertical, with PCB Mounting Flange, 6 Circuits, Tin (Sn) Plating, without Drain Holes

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0 MOLEX9

30069-06C1

Mini-FitÂ® TPA Header, 4.20mm Pitch, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 6 Circuits, Gold (Au) Plating, without Drain Holes

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0 MOLEX11

30069-06C2

Mini-FitÂ® TPA Header, 4.20mm Pitch, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 6 Circuits, Tin (Sn) Plating, without Drain Holes

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0 MOLEX9

30069-0811

4.20mm Pitch, Mini-FitÂ® TPA Header, Dual Row, Vertical, with PCB Mounting Flange, 8 Circuits, Tin (Sn) Over Nickel (Ni) Plating, without Drain Holes

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0 MOLEX11

30069-08A1

Mini-FitÂ® TPA Header, 4.20mm Pitch, Dual Row, Vertical, with PCB Mounting Flange, 8 Circuits, Tin (Sn) Plating, without Drain Holes

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0 MOLEX11

30069-08C1

4.20mm (.165) Pitch Mini-Fit TPA™ Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 8 Circuits, Tin (Sn) Plating, without Drain Holes

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12 MOLEX

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