43650-1113 [MOLEX]
3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row,Right Angle, with Solder Tab, 11 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating,Glow Wire Compatible; 3.00毫米( 0.118 “ )间距微飞度3.0 ™接头,表面贴装兼容,单列,直角,用焊片, 11电路, 0.38μm ( 15μ ”),金(Au )选择性电镀,灼热丝兼容![43650-1113](http://pdffile.icpdf.com/pdf1/p00154/img/icpdf/43650-0713_851628_icpdf.jpg)
型号: | 43650-1113 |
厂家: | ![]() |
描述: | 3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row,Right Angle, with Solder Tab, 11 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating,Glow Wire Compatible |
文件: | 总3页 (文件大小:156K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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This document was generated on 05/26/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
0436500713
Active
microfit_30
Overview:
Description:
3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row,
Right Angle, with Solder Tab, 7 Circuits, 0.38µm (15µ") Gold (Au) Selective Plating,
Glow Wire Compatible
Documents:
3D Model
Drawing (PDF)
Product Specification PS-43650 (PDF)
RoHS Certificate of Compliance (PDF)
Series
image - Reference only
China RoHS
ELV and RoHS
Compliant
Agency Certification
EU RoHS
CSA
TUV
UL
LR19980
R72081037
E29179
REACH SVHC
Contains SVHC: No
Halogen-Free
Status
General
Product Family
Series
PCB Headers
43650
Not Reviewed
Application
Wire-to-Board
Comments
Overview
Product Literature Order No
Product Name
High Temperature|Square Pin|Solder Type
microfit_30
USA-106
Need more information on product
environmental compliance?
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Micro-Fit 3.0™
Physical
Breakaway
Circuits (Loaded)
Circuits (maximum)
Color - Resin
No
7
7
Please visit the Contact Us section for any
non-product compliance questions.
Black
Durability (mating cycles max)
Flammability
Glow-Wire Compliant
Mated Height (in)
30
94V-0
Yes
0.275 In
Search Parts in this Series
43650Series
Mated Height (mm)
Material - Metal
6.98 mm
Brass
Mates With
Material - Plating Mating
Material - Plating Termination
Material - Resin
Gold
Tin
43645 Micro-Fit 3.0™ Receptacle Housing
High Temperature Thermoplastic
Number of Rows
1
Orientation
Right Angle
PCB Locator
Yes
PCB Retention
Yes
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
0.062 In
1.60 mm
Embossed Tape on Reel
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Polarized to PCB
0.118 In
3.00 mm
15
0.38
100
2.50
Yes
Shrouded
Fully
Stackable
No
Temperature Range - Operating
-40°C to +105°C
Termination Interface: Style
Surface Mount
Electrical
Current - Maximum per Contact
Voltage - Maximum
5A
250V
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
30
Reflow Capable (SMT only)
Max. Cycles at Max. Process Temperature
Process Temperature max. C
3
260
Material Info
Reference - Drawing Numbers
Packaging Specification
Product Specification
Sales Drawing
PK-70873-07**
PS-43650
SD-43650-005
TS-43045-002
Test Summary
This document was generated on 05/26/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
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