47356-0020 [MOLEX]

Camera Sockets; 摄像头插座
47356-0020
型号: 47356-0020
厂家: Molex    Molex
描述:

Camera Sockets
摄像头插座

插座
文件: 总2页 (文件大小:126K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
FEATURES AND SPECIFICATIONS  
Camera Sockets  
47249 8 x 8, Top Mount  
Molex's Mobile Phone Camera Sockets Offer Versatility for Mounting  
Camera Modules  
47337 8.5 x 8.5, Top Mount  
47356 6 x 6, Mid Mount with Cap  
47357 8 x 8, Mid Mount  
47578 6 x 6, Top Mount  
The mobile phone has become more than just an audio communication device  
over the past few years. With advances in cellular networks and camera  
modules, improved bandwidths have provided mobile phone manufacturers  
more options to include cameras and video-conference capabilities.  
Visual transmission is via the camera module connected to the camera  
socket. The entire assembly is either soldered onto flex or PCB of the mobile  
phone. These sockets allow mobile phone makers to reduce their bills-of-  
material (BOM) due to the socket's compact design and simple assembly  
process. Another major benefit arising from the size of the sockets is the  
reduction in space.  
Molex offers a wide range of socket configurations that includes application  
extraction tooling to disengage the camera module from the socket.  
Features  
Benefits  
Low profile  
Excellent for Slim type cell phone  
Stable high quality image  
Options for module mating design  
High reliability  
Side contact and bottom contact solution  
Top mount and mid mount solution  
Top cover available for  
Provides various height options  
EMI and module holding  
Allows re-work  
Module extraction tool available  
SPECIIFICATIONS  
Reference Information  
Mechanical  
Packaging: Embossed Tape on Reel  
UL File No.: Pending  
Unmating Force: 1.00N  
Durability: 30 cycles  
CSA File No.: Pending  
Mates With: Respective camera module  
Designed In: mm  
Physical  
Housing: PA Polyamide (nylon), UL 94V-0  
Contact: Copper Alloy  
Electrical  
Plating:  
Voltage: 50V  
Contact Area — 12 μ”Gold  
Solder Tail Area — Gold  
Underplating — Nickel  
PCB Thickness:  
Current: 0.5A  
Contact Resistance: 60 milliohms max.  
Dielectric Withstanding Voltage: 150V AC  
Insulation Resistance: 400 Megohms min.  
Operating Temperature: -55°C to +85°C  
MARKETS AND APPLICATIONS  
Mobile phones  
Camera Sockets  
47249 8 x 8, Top Mount  
47337 8.5 x 8.5, Top Mount  
47356 6 x 6, Mid Mount with Cap  
47357 8 x 8, Mid Mount  
47578 6 x 6, Top Mount  
ORDERING INFORMATION  
Imager  
Dim.  
(mm)  
PCB  
Mounting  
Type  
Physical Size (L x W x H)  
in mm  
Capacity  
(Mega Pixels)  
Pitch  
(mm)  
Contact  
Type  
Description  
Order No.  
Circuits  
0.30 MP  
(VGA)  
47578-0001  
47356-0020  
47249-0001  
47357-0001  
6 x 6  
Top  
Mid  
Top  
Mid  
Top  
0.65  
0.65  
0.90  
0.90  
0.90  
20  
20  
24  
24  
24  
8.20 x 8.20 x 4.00  
7.90 x 7.90 x 2.90  
10.10 x 10.10 x 4.20  
10.18 x 10.18 x 3.35  
10.60 x 10.60 x 4.20  
Bottom  
Bottom  
Side  
0.30 MP  
(VGA)  
6 x 6  
8 x 8  
8 x 8  
1 - 2 MP  
(CMOS)  
Camera  
Socket  
1 – 2 MP  
(CMOS)  
Side  
2.0 MP  
(CMOS)  
47337-0001 8.5 x 8.5  
Side  
Americas Headquarters  
2222 Wellington Ct.  
Lisle, Illinois 60532 USA  
1-800-78MOLEX  
Asia Pacific North Headquarters  
Yamato, Kanagawa, Japan  
81-462-65-2324  
Asia Pacific South Headquarters  
Jurong, Singapore  
65-6-268-6868  
European Headquarters  
Munich, Germany  
49-89-413092-0  
Corporate Headquarters  
2222 Wellington Ct.  
Lisle, Illinois 60532 USA  
630-969-4550  
feninfo@molex.com  
fesinfo@molex.com  
eurinfo@molex.com  
amerinfo@molex.com  
Visit our Web site at http://www.molex.com  
Order No. SNG-079  
©2007, Molex  

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