70246-1404 [MOLEX]
2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin (Sn) PC TailPlating; 2.54毫米( .100“ )间距C- Grid®头,低调,双排,垂直,带罩, 14Circuits , 0.127μm ( 5μ ”),金(Au )镀层,锡(Sn ) PC TailPlating型号: | 70246-1404 |
厂家: | Molex |
描述: | 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin (Sn) PC TailPlating |
文件: | 总4页 (文件大小:180K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
This document was generated on 05/25/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
0702461404
Active
cgrid__sl_products
Overview:
Description:
2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 14
Circuits, 0.127µm (5µ") Gold (Au) Plating, Tin (Sn) PC TailPlating
Documents:
3D Model
Drawing (PDF)
Product Specification PS-70246-100 (PDF)
RoHS Certificate of Compliance (PDF)
Series
image - Reference only
China RoHS
Agency Certification
CSA
UL
LR19980
E29179
EU RoHS
ELV and RoHS
Compliant
REACH SVHC
Contains SVHC: No
Halogen-Free
Status
General
Product Family
Series
Application
Overview
PCB Headers
70246
Wire-to-Board
cgrid__sl_products
C-Grid®
Not Reviewed
Product Name
Need more information on product
environmental compliance?
Physical
Breakaway
No
14
Email productcompliance@molex.com
Circuits (Loaded)
For a multiple part number RoHS Certificate of
Compliance, click here
Circuits (maximum)
First Mate / Last Break
Flammability
Glow-Wire Compliant
Guide to Mating Part
Keying to Mating Part
Lock to Mating Part
Material - Plating Mating
Material - Plating Termination
Number of Rows
14
No
94V-0
No
No
None
None
Gold
Tin
2
Please visit the Contact Us section for any
non-product compliance questions.
Search Parts in this Series
70246Series
Orientation
PC Tail Length (in)
PC Tail Length (mm)
PCB Locator
Vertical
0.135 In
3.43 mm
No
Mates With
70450 SL™ Crimp Housing, 70058 SL™
Crimp Terminal
PCB Retention
None
0.062 In
1.60 mm
Tray
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Pitch - Term. Interface (in)
Pitch - Term. Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Polarized to Mating Part
Polarized to PCB
0.100 In
2.54 mm
0.100 In
2.54 mm
5.2
0.13
75.2
1.88
Yes
No
Shrouded
Stackable
Closed Ends
No
Surface Mount Compatible (SMC)
Temperature Range - Operating
No
-55°C to +120°C
Termination Interface: Style
Through Hole
Electrical
Current - Maximum per Contact
Voltage - Maximum
2.5A
250V DC
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
10
Wave Capable (TH only)
Max. Cycles at Max. Process Temperature
Process Temperature max. C
1
265
Material Info
Reference - Drawing Numbers
Packaging Specification
Product Specification
PK-87835-001
PS-70246-100
Sales Drawing
SDA-70246-**20-25,39
This document was generated on 05/25/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
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2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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