70246-2401 [MOLEX]

2.54mm (.100") Pitch C-Grid Header, Low Profile, Dual Row, Vertical, Shrouded, 24 Circuits, 0.38um (15u") Gold (Au); 2.54毫米( .100“ )间距C-网格标题,低调,双排,垂直,罩, 24电路, 0.38um ( 15U ”),金(Au )
70246-2401
元器件型号: 70246-2401
生产厂家: Molex Electronics Ltd.    Molex Electronics Ltd.
描述和应用:

2.54mm (.100") Pitch C-Grid Header, Low Profile, Dual Row, Vertical, Shrouded, 24 Circuits, 0.38um (15u") Gold (Au)
2.54毫米( .100“ )间距C-网格标题,低调,双排,垂直,罩, 24电路, 0.38um ( 15U ”),金(Au )

连接器 集管和边缘连接器 PC
PDF文件: 总4页 (文件大小:179K)
下载文档:  下载PDF数据表文档文件
型号参数:70246-2401参数

70246-2402

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 24Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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8 MOLEX

70246-2452

Board Connector, 24 Contact(s), 2 Row(s), Male, Straight, Solder Terminal

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0 MOLEX

70246-2452

Board Connector, 24 Contact(s), 2 Row(s), Male, Straight, Solder Terminal

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0 MOLEX

70246-2501

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded,26 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, Void

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11 MOLEX

70246-2502

Board Connector, 26 Contact(s), 2 Row(s), Male, Straight, Solder Terminal

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0 MOLEX

70246-2601

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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12 MOLEX

70246-2602

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 26 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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9 MOLEX

70246-2604

2.54mm (.100) Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 26 Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC Tail Plating

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18 MOLEX

70246-3001

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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15 MOLEX

70246-3002

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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13 MOLEX

70246-3004

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC Tail Plating

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8 MOLEX

70246-3023

Board Connector, 30 Contact(s), 2 Row(s), Male, Straight, Solder Terminal

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0 MOLEX

70246-3023

Board Connector, 30 Contact(s), 2 Row(s), Male, Straight, Solder Terminal

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0 MOLEX

70246-3401

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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10 MOLEX

70246-3402

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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12 MOLEX