73642-1200 [MOLEX]
2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Press-Fit,Open End, 144 Circuits; 2.00毫米（ .079 “ ）间距HDM®板对板背板头，垂直，压配式，开放性的结局， 144电路
| 型号： | 73642-1200 |
| 厂家： | 
Molex |
| 描述： | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Press-Fit,Open End, 144 Circuits |
| 文件： | 总4页 (文件大小：158K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This document was generated on 05/14/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
0736421200
Active
hdm
Overview:
Description:
2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Press-Fit,
Open End, 144 Circuits
Documents:
3D Model
Test Summary (PDF)
Drawing (PDF)
Product Specification PS-73670-9999 (PDF)
RoHS Certificate of Compliance (PDF)
Series
image - Reference only
Agency Certification
CSA
UL
EU RoHS
ELV and RoHS
Compliant
China RoHS
LR19980
E29179
General
Product Family
Series
Application
Comments
Component Type
Overview
REACH SVHC
Contains SVHC: No
Halogen-Free
Status
Halogen-Free
Need more information on product
environmental compliance?
Backplane Connectors
73642
Backplane
Standard Press-Fit
PCB Header
hdm
Product Name
Style
HDM®
N/A
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Physical
Circuits (Loaded)
Circuits (maximum)
Color - Resin
144
144
Black, Natural
Please visit the Contact Us section for any
non-product compliance questions.
Durability (mating cycles max)
First Mate / Last Break
Flammability
Guide to Mating Part
Keying to Mating Part
Material - Metal
250
No
94V-0
No
None
Phosphor Bronze
Search Parts in this Series
73642Series
Material - Plating Mating
Material - Plating Termination
Material - Resin
Number of Columns
Number of Pairs
Number of Rows
Orientation
PC Tail Length (in)
PC Tail Length (mm)
PCB Locator
Gold
Gold
Mates With
73632 HDM PLUS® Board-to-Board
Daughtercard Receptacle. 73780 HDM®
Board-to-Board Daughtercard Receptacle
High Temperature Thermoplastic
24
Open Pin Field
6
Vertical
0.138 In
3.50 mm
No
Application Tooling | FAQ
Tooling specifications and manuals are
found by selecting the products below.
Crimp Height Specifications are then
contained in the Application Tooling
Specification document.
PCB Retention
None
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Pitch - Term. Interface (in)
Pitch - Term. Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
0.062 In
1.60 mm
Tube
0.079 In
2.00 mm
0.079 In
2.00 mm
30
Global
Description
Product #
Flat Rock Tooling for 0622013700
Pneumatic Press
HDM® Backplane
Insertion Signal
Contact Tool
HDM® Backplane
Insertion Head for
144 Positions
0621001400
0622005703
0.75
2
Plating min: Termination (µm)
Polarized to PCB
0.05
No
Extraction Tool
0621001000
Stackable
Yes
Surface Mount Compatible (SMC)
Temperature Range - Operating
Termination Interface: Style
Yes
-55°C to +105°C
Through Hole - Compliant Pin
Electrical
Current - Maximum per Contact
Data Rate
Real Signals (per 25mm)
Shielded
1A
1.0 Gbps
75
No
Voltage - Maximum
250V AC
Material Info
Reference - Drawing Numbers
Packaging Specification
Product Specification
PK-70873-0818
PS-73670-9999
SDA-73642-****
Sales Drawing
HDM and High Density Metric are trademarks of Amphenol Corporation
This document was generated on 05/14/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
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