73656-0190 [MOLEX]
2.00mm (.079") Pitch HDM® Board-to-Board Backplane Power Module, Vertical, SMC,Power Receptacle, 1 Circuits, Gold (Au) 0.76μm (30μ"); 2.00毫米（ .079 “ ）间距HDM®板对板背板电源模块，垂直， SMC ，电源插座，1个电路，金（Au ） 0.76μm （ 30μ ” ）
| 型号： | 73656-0190 |
| 厂家： | 
Molex |
| 描述： | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Power Module, Vertical, SMC,Power Receptacle, 1 Circuits, Gold (Au) 0.76μm (30μ") |
| 文件： | 总3页 (文件大小：108K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This document was generated on 05/14/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
0736560190
Active
hdm
Overview:
Description:
2.00mm (.079") Pitch HDM® Board-to-Board Backplane Power Module, Vertical, SMC,
Power Receptacle, 1 Circuits, Gold (Au) 0.76µm (30µ")
Documents:
Drawing (PDF)
RoHS Certificate of Compliance (PDF)
Product Specification PS-73670-9999 (PDF)
Series
image - Reference only
China RoHS
General
Product Family
Series
Backplane Connectors
73656
EU RoHS
ELV and RoHS
Compliant
REACH SVHC
Contains SVHC: No
Halogen-Free
Status
Application
Comments
Component Type
Overview
Product Name
Style
Backplane
Backplane Power Module
Power Header
hdm
HDM®
N/A
Not Reviewed
Physical
Circuits (Loaded)
Need more information on product
environmental compliance?
1
Circuits (maximum)
Color - Resin
3
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Black
250
No
No
None
Beryllium Copper
Durability (mating cycles max)
First Mate / Last Break
Guide to Mating Part
Keying to Mating Part
Material - Metal
Please visit the Contact Us section for any
non-product compliance questions.
Material - Plating Mating
Material - Plating Termination
Material - Resin
Number of Columns
Number of Pairs
Gold
Gold
High Temperature Thermoplastic
1
Open Pin Field
Search Parts in this Series
73656Series
Number of Rows
Orientation
3
Mates With
Vertical
73651 HDM® Board-to-Board
Daughterboard Power Module
PC Tail Length (in)
PC Tail Length (mm)
PCB Locator
0.138 In
3.50 mm
No
PCB Retention
None
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
0.063 In, 0.189 In
1.60 mm, 4.80 mm
Tube
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Pitch - Term. Interface (in)
Pitch - Term. Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Polarized to PCB
0.079 In
2.00 mm
0.079 In
2.00 mm
30
0.75
2
0.05
No
Stackable
No
Surface Mount Compatible (SMC)
Temperature Range - Operating
Termination Interface: Style
Yes
-55°C to +105°C
Through Hole - Compliant Pin
Electrical
Current - Maximum per Contact
Data Rate
Real Signals (per 25mm)
Shielded
15A
1.0 Gbps
75
No
Voltage - Maximum
500V AC
Material Info
Reference - Drawing Numbers
Application Specification
Packaging Specification
Product Specification
AS-73656-1998
PK-70873-0819
PS-73670-9999
SDA-73656-0190
Sales Drawing
HDM and High Density Metric are trademarks of Amphenol Corporation
This document was generated on 05/14/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
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