75003-0008 [MOLEX]
High Speed Mezzanine for 10.0 Gbps Bandwidth; 高速夹层为10.0 Gbps的带宽
| 型号： | 75003-0008 |
| 厂家： | 
Molex |
| 描述： | High Speed Mezzanine for 10.0 Gbps Bandwidth |
| 文件： | 总2页 (文件大小：692K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Plateau HS Mezz™
High Speed Mezzanine for
10.0 Gbps Bandwidth
75003, 75005
High Speed Mezzanine Connectors Feature
Innovative Plated Plastic Housing for
Outstanding Performance
Molex utilizes its proprietary Plateau Technology™ to
create a high-speed, superior performance surface-
mounted mezzanine connector system. This technology
permits the customer to use a smaller footprint
connector than other typical designs, translating into
savings on circuit count and board space.
The shielding properties of the plated housing
effectively isolate each differential pair, eliminating the
need to use signal pins for ground.
These mezzanine connectors are ideal for servers,
mainframe computers, workstations, test equipment
and telecommunications equipment such as switches
and routers.
Features and Benefits
■ Advanced gold-plated plastic housings with
integrated shielding system support high-speed
differential signaling in excess of 10.0 Gbps
■ Impedance of 100 ± 10 ohms at 50 psec risetime
(10/90%) maintained for all stack heights to
ensure very low crosstalk between signals
■ Contacts on 1.20mm (.047”) pitch arranged in
isolated differential pairs on 3.50mm (.138”) pitch
for controlled impedance
■ Two points of contact on each signal ensure high
reliability
■ Available in 6, 12, 24 and 36 differential pair sizes
(12, 24, 48 and 72 total contacts) to accommodate
a range of applications
■ Multiple stack heights from 9.00 to 23.00mm
(.354 to .906”) to meet nearly every parallel
board requirement, with capability up to 25.00mm
(.984”)
■ Molded and plated housing pegs facilitate
attachment to PCB ground plane
SPECIFICATIONS
Reference Information
Packaging: Tape and Reel or Tube
Designed In: Millimeters
UL File No.: E29179
Electrical
Physical
Voltage: 30V DC
Housing: LCP
Current: 1.5A max.
Contact: Copper Alloy
Contact Resistance: 25 milliohms
Dielectric Withstanding Voltage: 500V
Insulation Resistance: 1,000 Megohms
Impedance: 100 +/- 10 Ohms @ 50psec risetime
Plating: Contact Area – 0.76µm (30µ”) min. select
Gold and 3.81µm (150µ”) min. select Tin/Lead
over 1.27µm (50µ”) min. Nickel overall
Housing – 0.10µm (4µ”) max. Gold over 3.81µm
(150µ”) min. Nickel over 3.81µm (150µ”) min.
Copper
CSA File No.: LR19980
Mechanical
Mating Force: 2.0N (.45lb) max. per circuit
Unmating Force: 0.9N (.20lb) min. per circuit
Durability: 25 cycles
Operating Temperature: -20 to +85°C
SMT Lead Coplanarity: 0.102mm (.004”)
Plateau HS Mezz™
APPLICATIONS
High Speed Mezzanine for
10.0 Gbps Bandwidth
The Plateau HS Mezz connector system is specifically
suited for mezzanine applications where high
differential signal speeds and cost efficiency are
desired, including:
75003, 75005
■ Switches and hubs
■ Routers
■ Servers and blade servers
■ Workstations
■ Storage devices
ORDERING INFORMATION
Order No.
Mated Stack Height
No. of Differential Pairs
No. of Circuits
Plug Height
Receptacle Height
Plug
Receptacle
75005-0304
75005-0004
75005-0104
75005-0204
75005-0306
75005-0006
75005-0106
75005-0206
75005-0304
75005-0004
75005-0104
75005-0204
75005-0304
75005-0004
75005-0104
75005-0204
75005-0306
75005-0006
75005-0106
75005-0206
75005-0306
75005-0006
75005-0106
75005-0206
6
12
24
48
72
12
24
48
72
12
24
48
72
12
24
48
72
12
24
48
72
12
24
48
72
12
24
48
72
12
24
48
72
12
24
48
72
75003-0305
75003-0005
75003-0105
75003-0205
75003-0305
75003-0005
75003-0105
75003-0205
75003-0308
75003-0008
75003-0108
75003-0208
75003-0310
75003-0010
75003-0110
75003-0210
75003-0308
75003-0008
75003-0108
75003-0208
75003-0310
75003-0010
75003-0110
75003-0210
75003-0305
75003-0005
75003-0105
75003-0205
75003-0308
75003-0008
75003-0108
75003-0208
75003-0310
75003-0010
75003-0110
75003-0210
12
24
36
6
12
24
36
6
12
24
36
6
12
24
36
6
12
24
36
6
12
24
36
6
12
24
36
6
12
24
36
6
10.00mm (.394")
5.50mm (.217")
4.50mm (.117")
12.00mm (.472")
13.00mm (.512")
5.50mm (.217")
8.50mm (.335")
10.50mm (.413")
8.50mm (.335")
10.50mm (.413")
5.50mm (.217")
8.50mm (.335")
10.50mm (.413")
6.50mm (.256")
4.50mm (.117")
4.50mm (.117")
6.50mm (.256")
6.50mm (.256")
14.50mm (.571")
14.50mm (.571")
14.50mm (.571")
15.00mm (.591")
17.00mm (.669")
20.00mm (.787")
23.00mm (.906")
75005-0014
75005-0114
75005-0214
75005-0014
75005-0114
75005-0214
12
24
36
75005-0014
75005-0114
75005-0214
25.00mm (.984")
Contact Molex for availability
Americas Headquarters
Lisle, Illinois 60532 U.S.A.
1-800-78MOLEX
Far East North Headquarters
Far East South Headquarters
Jurong, Singapore
European Headquarters
Munich, Germany
Corporate Headquarters
2222 Wellington Ct.
Lisle, IL 60532 U.S.A.
630-969-4550
Yamato, Kanagawa, Japan
81-462-65-2324
65-6-268-6868
49-89-413092-0
amerinfo@molex.com
feninfo@molex.com
fesinfo@molex.com
Visit our website at www.molex.com/product/hsmezz.html
eurinfo@molex.com
Fax:630-969-1352
Order No. USA-195 Rev. 1
Printed in USA/5K/JI/JI/2005.11
©2005, Molex
相关型号：
75003-0305
Includes KK100,HDM,EBBl 50D, SEARAY,Plateau HS Mezz,IEEE1386,SlimStack Product Families. Pitches range:0.635mm-2.54mm
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75003-0308
Includes KK100,HDM,EBBl 50D, SEARAY,Plateau HS Mezz,IEEE1386,SlimStack Product Families. Pitches range:0.635mm-2.54mm
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