75003-0X08 [MOLEX]

Combination High Speed Mezzanine; 结合高速夹层
75003-0X08
型号: 75003-0X08
厂家: Molex    Molex
描述:

Combination High Speed Mezzanine
结合高速夹层

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Combination High Speed  
Mezzanine  
FEATURES AND SPECIFICATIONS  
1.20mm (.047") Pitch  
Plateau HS Mezz™  
Combining Plateau HS Mezz and SlimStack stacking connectors optimizes performance  
and cost for high circuit count applications  
Molex offers a significant cost reduction over  
competing products for high-circuit count board-to-  
board applications with the Combination High Speed  
Mezzanine solutions. Achieve superior electrical  
performance and signal speeds up to 10Gbps and  
beyond utilizing the differential-pair design of the  
Plateau HS Mezz system. At the same time, double up  
on circuit density and cost savings with the SlimStack  
family of mezzanine-style connectors for single-ended  
speeds up to 3Gbps.  
Combinations of mated heights from 10.00 to  
15.00mm (.354 to .591”) and packaging styles are  
also available, including tubes and embossed tape with  
or without pick-and-place covers.  
High Speed Mezzanine  
0.635mm (.025") Pitch  
SlimStack™ SMT Stacking  
Board-to-Board  
Plateau HS Mezz and SlimStack are well suited to work  
in tandem for a range of mezzanine applications.  
Connector designs provide generous lead-ins, allowing  
for maximum processing and mismating tolerances.  
Features and Benefits  
Plateau HS Mezz  
Advanced gold-plated plastic housings with  
integrated shielding system support high-speed  
differential signaling in excess of 10Gbps  
Mezzanine card with HS Mezz and SlimStack for a cost effective solution using high-speed and  
lower-speed requirements.  
Contacts on 1.20mm (.047”) centerline pitch  
arranged in isolated differential pairs on 3.50mm  
(.138”) pitch for controlled impedance  
Multiple stack heights from 10.00 to 25.00mm  
(.394 to .984”) with circuit size ranging from 6 to  
36 pairs (12 to 72 circuits)  
SlimStack  
Contacts on 0.635mm (.025”) centerline pitch  
support single-ended signal speeds up to 3Gbps  
Gold plated contacts with wide-angled mating  
surfaces to minimize risk of damage during mating  
Multiple stack heights from 6.00 to 16.00mm  
(.236” to .630”) with circuit sizes ranging from 20  
to 240 circuits for high-density design flexibility  
SlimStack  
Plateau HS Mezz  
Combination High Speed Mezzanine arrangement absorbs up to 0.1mm in mis-alignment in X and  
Y axis when 2 mating pairs are used.  
APPLICATIONS  
Switches and Hubs  
Routers  
Workstations  
Storage Devices  
Servers and Blade Servers  
Combination High Speed  
Mezzanine  
SPECIFICATIONS  
1.20mm (.047") Pitch  
Plateau HS Mezz™  
High Speed Mezzanine  
Plateau HS Mezz  
SlimStack  
0.635mm (.025") Pitch  
SlimStack™ SMT Stacking  
Board-to-Board  
Electrical  
Electrical  
Upper-End Speed: 3Gbps (2GHz)  
Single-ended 1:1 S:G pattern  
Impedance: 64 ohms - 16.00mm (.630”) stack height  
Crosstalk: Less than 8% @ 50 psec  
Current Rating: 0.5A per circuit  
Upper-End Speed: 10.0Gbps (6.8GHz)  
No special S:G pattern needed  
Impedance: 100 ± 10 ohms at 50 psec risetime  
(10/90%) for all stack heights  
Crosstalk: Less than 2% @ 50 psec  
Current Rating: 1.5A per circuit  
ORDERING INFORMATION  
Circuit Size  
Plateau HS Mezz  
SlimStack  
Mated Stack Height  
10.00mm (.394“)  
12.00mm (.472“)  
13.00mm (.512“)  
Plateau HS Mezz  
SlimStack  
Plug  
Receptacle  
Plug  
Receptacle.  
52760  
53553  
52885*  
52760  
20, 40, 60, 80, 100, 120,  
140, 160, 180, 200  
12, 24, 48, 72  
75003-0X05  
75005-0X04  
53627*  
55091  
53481  
53625*  
53552  
53649*  
52885*  
52837  
20 to 180  
40 to 80  
12, 24  
12, 24  
75003-0X05  
75003-0X08  
75005-0X06  
75005-0X04  
52901*  
52837  
52901*  
52837  
20 to 180  
40 to 140  
52901*  
52837  
52901*  
52837  
75003-0X08  
75003-0X10  
75005-0X06  
75005-0X04  
15.00mm (.591“)  
12, 24, 48, 72  
52901*  
*Embossed tape and reel packaging  
Plateau HS Mezz Circuit Sizes  
X=3  
X=0  
X=1  
X=2  
12 circuit (6 pair)  
24 circuit (12 pair)  
48 circuit (24 pair)  
72 circuit (36 pair)  
Americas Headquarters  
Lisle, Illinois 60532 U.S.A.  
1-800-78MOLEX  
Far East North Headquarters  
Far East South Headquarters  
Jurong, Singapore  
European Headquarters  
Munich, Germany  
Corporate Headquarters  
2222 Wellington Ct.  
Lisle, IL 60532 U.S.A.  
630-969-4550  
Yamato, Kanagawa, Japan  
81-462-65-2324  
65-6-268-6868  
49-89-413092-0  
amerinfo@molex.com  
feninfo@molex.com  
fesinfo@molex.com  
Visit our Web site at http://www.molex.com  
eurinfo@molex.com  
Fax:630-969-1352  
Order No. USA-330  
Printed in USA/10K/JI/JI/2006.02  
©2006, Molex  

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