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75827-0204 [MOLEX]

1.85 by 1.85mm (.073 by .073”) Pitch GbX* Backplane Connector System in 2, 3, 4 and 5-Pair Columns; 1.85由1.85毫米（ 0.073由0.073 “ ）间距的GbX *背板连接器系统在2 ， 3 ， 4和5对列
75827-0204
型号： 75827-0204
厂家： Molex    Molex
描述：

1.85 by 1.85mm (.073 by .073”) Pitch GbX* Backplane Connector System in 2, 3, 4 and 5-Pair Columns
1.85由1.85毫米（ 0.073由0.073 “ ）间距的GbX *背板连接器系统在2 ， 3 ， 4和5对列

连接器
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1.85 by 1.85mm  
Features and speciFications  
(.073 by .073”) pꢀꢁꢂh GbX*  
Bꢃꢂkꢄlꢃꢅꢆ cꢇꢅꢅꢆꢂꢁꢇꢈ syꢉꢁꢆm  
ꢀꢅ 2, 3, 4 ꢃꢅꢊ 5-pꢃꢀꢈ cꢇlꢋmꢅꢉ  
2 ꢃꢅꢊ 3 cꢇlꢋmꢅꢉ:  
75650, 75370 dꢀffꢆꢈꢆꢅꢁꢀꢃl  
dꢃꢋghꢁꢆꢈꢂꢃꢈꢊ  
aꢉꢉꢆmblꢀꢆꢉ  
75670, 75660 Lꢀꢁꢆ dꢃꢋghꢁꢆꢈꢂꢃꢈꢊ  
aꢉꢉꢆmblꢀꢆꢉ  
75676, 75666 Hybꢈꢀꢊ dꢃꢋghꢁꢆꢈꢂꢃꢈꢊ  
aꢉꢉꢆmblꢀꢆꢉ  
75827, 75433 Bꢃꢂkꢄlꢃꢅꢆ sꢀgꢅꢃl  
Hꢆꢃꢊꢆꢈꢉ  
75861, 75649 Lꢀꢁꢆ Bꢃꢂkꢄlꢃꢅꢆ sꢀgꢅꢃl  
Hꢆꢃꢊꢆꢈꢉ  
75492, 75331 Bꢃꢂkꢄlꢃꢅꢆ pꢇwꢆꢈ  
Top, left to right: 75360, 75220, 75370, 75650. Bottom, left to right: 75237, 75235, 75433, 75827  
2 and 3-Pair Columns add to Molex’s GbX Backplane Interconnect System Offering, Delivering  
Speeds Up To 10 Gbps, High Density (Up to 69 Mated Differential Channels Per Inch) and is  
Custom Configurable  
4 ꢃꢅꢊ 5 cꢇlꢋmꢅꢉ:  
75220, 75360 dꢃꢋghꢁꢆꢈꢂꢃꢈꢊ  
aꢉꢉꢆmblꢀꢆꢉ  
Data rates up to 10 Gbps may now be achieved with  
the GbX 2 and 3-pair column daughtercard and  
backplane system. The 2 and 3-pair column system  
completes the GbX product offering, making it a  
complete solution for high-end telecommunication and  
datacommunication applications.  
solution in the near term, but also by its electrical  
performance in upgradeable systems. Speeds of 10  
Gbps have been demonstrated with appropriate SERDES  
(Serializer/ Deserializer) devices and board-material  
selection. This allows system architects freedom-of-  
design for faster future systems without the worry of  
backward compatibility, along with the economy of a  
common backplane for two generations of equipment.  
75420  
4-pꢃꢀꢈ Lꢀꢁꢆ  
dꢃꢋghꢁꢆꢈꢂꢃꢈꢊ  
aꢉꢉꢆmblꢀꢆꢉ  
4-pꢃꢀꢈ Hybꢈꢀꢊ  
dꢃꢋghꢁꢆꢈꢂꢃꢈꢊ  
aꢉꢉꢆmblꢀꢆꢉ  
75426  
The GbX connector system provides the speed,  
density, and low-applied cost required by leading-  
edge backplane applications. It is especially suited  
for designs that require future speed upgrades by  
daughtercard replacement into an existing backplane.  
In addition, the GbX Lite Series system provides a  
complimentary high-density open pin field for cost-  
effective design of slower-speed circuits along the same  
75235, 75237 Bꢃꢂkꢄlꢃꢅꢆ sꢀgꢅꢃl  
Hꢆꢃꢊꢆꢈꢉ  
With native differential signaling speeds up to 10 Gbps, stiffener as the standard, high-speed GbX wafers. For  
75465  
4-pꢃꢀꢈ Lꢀꢁꢆ Bꢃꢂkꢄlꢃꢅꢆ  
sꢀgꢅꢃl Hꢆꢃꢊꢆꢈ  
GbX is well suited for existing and future generations  
of XAUI (10 Gigabit Attachment Unit Interface) and  
InfiniBand† based systems, in addition to those based  
on ATCA‡ (Advanced Telecom Computing Architecture)  
and OIF (Optical Internetworking Forum) chip  
protocols.  
more information on Molex’s extensive GbX offering,  
please visit: www.molex.com/product/backplan/gbx.  
html.  
75341, 75510 Bꢃꢂkꢄlꢃꢅꢆ pꢇwꢆꢈ  
*GbX and VHDM-HSD are registered trademarks of Amphenol  
Corporation  
†InfiniBand is a registered trademark of the InfiniBand Trade  
Association  
‡ATCA is a trademark of the PCI Industrial Manufacturers  
Group  
sꢁꢃꢅꢊ-alꢇꢅꢆ Gꢋꢀꢊꢆ pꢀꢅ Kꢀꢁ:  
75234  
Internetworking and telecommunication equipment  
engineers will benefit by the GbX connector’s ability  
to provide not only a high-density, low applied-cost  
Features and Benefits  
n
n
n
Up to 69 real differential pairs per linear inch (27  
Modular daughtercard components with GbX  
L-Series available with custom, cost-effective  
receptacle assemblies  
Data rate options up to 10 Gbps are able to support  
future daughtercard speed upgrades  
real differential pairs per 10.00mm (.393”) offers  
high density with more differential pairs per linear  
inch than VHDM-HSD*  
n
Optimized differential pair contacts for easier  
board trace routing  
n
Bifurcated contact beams in daughtercard  
receptacle provide greater reliability with two  
points of contact to header pin  
1.85 by 1.85mm (.073  
by .073”) pꢀꢁꢂh GbX*  
Bꢃꢂkꢄlꢃꢅꢆ cꢇꢅꢅꢆꢂꢁꢇꢈ syꢉꢁꢆm  
ꢀꢅ 2, 3, 4 ꢃꢅꢊ 5-pꢃꢀꢈ  
cꢇlꢋmꢅꢉ  
speciFications  
Reference Information  
Packaging:  
Mechanical  
Contact Insertion Force: 35.58N (8.00 lb) max. per  
contact  
Daughtercard Assemblies: Tray  
Contact Retention Force: 6.67N (1.50 lb) min. per  
contact  
Backplane Headers: 2, 4 and 5 Pair- Tray;  
3 Pair- Tube  
Mating Force: 0.59N (0.13 lb) max. per contact  
Unmating Force: 0.342N (0.077 lb) min. per contact  
Durability: 250 cycles max.  
UL File No.: E29179  
Designed In: Millimeters  
Electrical  
Physical  
Signal/Shield Contact Current Rating: 1.0A  
Power Contact Current Rating: 6.0A  
Contact to Plated-Through-Hole Resistance:  
1.0 milliohm max.  
2 and 3-pair:  
Top, left to right: 75370, 75650  
Bottom, left to right: 75433, 75827  
Housing: Liquid Crystal Polymer, UL 94V-0  
Contact: Copper Alloy  
Plating:  
Power Blade Contact Resistance: 3.0 milliohms max.  
Dielectric Withstanding Voltage: 750V RMS  
Insulation Resistance: 1,000 Megohms min.  
Contact Area – 0.76μm (30μ”) Gold (Au) min.  
Compliant Pin Area – Tin (Sn) or Tin/Lead (SnPb)  
Underplating – Nickel (Ni)  
PCB Thickness: 1.60mm (.062”) min.  
Operating Temperature: -55 to +105°C  
4 and 5-pair:  
Top: 75220  
Bottom: 75235  
appLications  
n Internetworking Equipment:  
- Servers, Hubs, and Routers  
n Telecommunications Equipment:  
- Central Office, Cellular Infrastructure and  
Multi-platform Service (DSL, Cable Data) systems  
n Medical Diagnostic Equipment  
n Test and Measurement Equipment  
1.85 by 1.85mm (.073  
by .073”) pꢀꢁꢂh GbX*  
Bꢃꢂkꢄlꢃꢅꢆ cꢇꢅꢅꢆꢂꢁꢇꢈ syꢉꢁꢆm  
ꢀꢅ 2, 3, 4 ꢃꢅꢊ 5-pꢃꢀꢈ  
cꢇlꢋmꢅꢉ  
orderinG inForꢌation  
Daughtercard Assembly  
*Daughtercards are custom configured. Please visit the Molex Backplane Configurator web site to create a custom daughtercard at: www.molex.com/configurator.html  
dꢃꢋghꢁꢆꢈꢂꢃꢈꢊ aꢉꢉꢆmbly  
2-pꢃꢀꢈ  
3-pꢃꢀꢈ  
4-pꢃꢀꢈ  
5-pꢃꢀꢈ  
75650-XXXX*  
75370-XXXX*  
Signal wafers, power modules,  
and guide modules sequentially  
assigned by application  
75220-XXXX*  
(Wafer 75221-0001 for reference  
information only)  
75360-XXXX*  
(Wafer 75361-0001 for reference  
information only)  
(High-speed differential pair signal  
contacts only; wafer 75651-0001 for  
reference information only)  
(High-speed signal contacts only;  
wafer 75371-0001 for reference  
information only)  
75670-XXXX*  
75660-XXXX*  
75420-XXXX*  
Lite wafer blocks, power modules,  
and guide modules sequentially  
assigned by application  
Low-speed signal contacts only, Lite  
wafer block 75671-0005 for reference  
information only)  
Low-speed signal contacts only,  
Lite wafer block 75661-0005 for  
reference information only)  
Low-speed signal contacts only,  
Lite wafer block 75421-0005 for  
reference information only)  
N/A  
N/A  
75676-XXXX*  
75666-XXXX*  
75426-XXXX*  
Lite wafer blocks, signal wafers,  
power modules, and guide modules  
sequentially assigned by application  
(High-speed differential pair signal  
contacts 75651-0001 and low- speed  
signal contacts 75671-0005 combined  
in one assembly)  
(High-speed differential pair signal  
contacts 75371-0001 and low-speed  
signal contacts 75661-0005 combined  
in one assembly)  
(High-speed differential pair signal  
contacts 75221-0001 and low-speed  
signal contacts 75421-0005 combined  
in one assembly)  
Backplane Signal Headers  
† Multiple keying options are available; contact Molex Inside Sales.  
2-pꢃꢀꢈ (4 cꢀꢈꢂꢋꢀꢁꢉ ꢄꢆꢈ cꢇlꢋmꢅ)†  
3-pꢃꢀꢈ (6 cꢀꢈꢂꢋꢀꢁꢉ ꢄꢆꢈ cꢇlꢋmꢅ)†  
4-pꢃꢀꢈ (8 cꢀꢈꢂꢋꢀꢁꢉ ꢄꢆꢈ cꢇlꢋmꢅ)†  
5-pꢃꢀꢈ (10 cꢀꢈꢂꢋꢀꢁꢉ ꢄꢆꢈ cꢇlꢋmꢅ)†  
Backplane Signal Header  
5 Column Lite Open  
Order No.  
75861-0504  
75861-0104  
75861-0204  
75861-2104  
75861-2204  
75861-4104  
75861-4204  
N/A  
Circuits  
25  
Order No.  
75649-0504  
75649-0104  
N/A  
Circuits  
40  
Order No.  
75465-0505  
75465-0104  
75465-0204  
75465-2104  
75465-2204  
75465-4104  
75465-4204  
N/A  
Circuits  
55  
Order No.  
N/A  
Circuits  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
100  
250  
100  
250  
100  
250  
10 Column Lite Open  
25 Column Lite Open  
10 Column Lite Guide Left  
25 Column Lite Guide Left  
10 Column Lite Guide Right  
25 Column Lite Guide Right  
5 Column Open  
50  
80  
110  
275  
110  
275  
110  
275  
N/A  
80  
N/A  
125  
50  
N/A  
N/A  
N/A  
N/A  
N/A  
30  
N/A  
N/A  
N/A  
125  
50  
N/A  
N/A  
N/A  
N/A  
125  
N/A  
40  
N/A  
N/A  
75433-0504  
75433-0104  
75433-0204  
75433-2104  
75433-2204  
75433-4104  
75433-4204  
N/A  
10 Column Open  
75827-0104  
75827-0204  
75827-2104  
75827-2204  
75827-4104  
75827-4204  
60  
75235-0104  
75235-0204  
75235-2104  
75235-2204  
75235-4104  
75235-4204  
75237-0104  
75237-0204  
75237-2104  
75237-2204  
75237-4104  
75237-4204  
25 Column Open  
100  
40  
150  
60  
200  
80  
10 Column Guide Left  
25 Column Guide Left  
10 Column Guide Right  
25 Column Guide Right  
100  
40  
150  
60  
200  
80  
100  
150  
200  
Backplane Power and Guide Components  
2-pꢃꢀꢈ  
3-pꢃꢀꢈ  
4-pꢃꢀꢈ  
5-pꢃꢀꢈ  
Bꢃꢂkꢄlꢃꢅꢆ pꢇwꢆꢈ &  
Gꢋꢀꢊꢆ cꢇmꢄꢇꢅꢆꢅꢁꢉ  
oꢈꢊꢆꢈ nꢇ.  
cꢀꢈꢂꢋꢀꢁꢉ  
oꢈꢊꢆꢈ nꢇ.  
cꢀꢈꢂꢋꢀꢁꢉ  
oꢈꢊꢆꢈ nꢇ.  
cꢀꢈꢂꢋꢀꢁꢉ  
oꢈꢊꢆꢈ nꢇ.  
cꢀꢈꢂꢋꢀꢁꢉ  
Power  
75492-1066  
75234-1508  
4
75331-0444  
6
75341-4444  
8
75517-7766  
10  
Stand-Alone Guide Pin Kit  
75234-1469  
75234-1469  
75234-1469  
amꢆꢈꢀꢂꢃꢉ Hꢆꢃꢊqꢋꢃꢈꢁꢆꢈꢉ  
Lisle, Illinois 60532 U.S.A.  
1-800-78MOLEX  
aꢉꢀꢃ pꢃꢂꢀfiꢂ nꢇꢈꢁh Hꢆꢃꢊqꢋꢃꢈꢁꢆꢈꢉ  
Yamato, Kanagawa, Japan  
81-46-265-2325  
aꢉꢀꢃ pꢃꢂꢀfiꢂ sꢇꢋꢁh Hꢆꢃꢊqꢋꢃꢈꢁꢆꢈꢉ  
Jurong, Singapore  
eꢋꢈꢇꢄꢆꢃꢅ Hꢆꢃꢊqꢋꢃꢈꢁꢆꢈꢉ  
Munich, Germany  
cꢇꢈꢄꢇꢈꢃꢁꢆ Hꢆꢃꢊqꢋꢃꢈꢁꢆꢈꢉ  
2222 Wellington Ct.  
Lisle, IL 60532 U.S.A.  
630-969-4550  
65-6268-6868  
49-89-413092-0  
amerinfo@molex.com  
apninfo@molex.com  
fesinfo@molex.com  
eurinfo@molex.com  
Fax:630-969-1352  
Visit our website at www.molex.com/product/backplan/gbx.html  
Printed in USA/JI/2007.09  
Order No. USA-250 Rev. 1  
©2007, Molex  

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