78079-0211 [MOLEX]
1.00mm (.039") Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Blue Housing and Off-White Latches, 0.76μm (30μ") Gold (Au) Plating2.67mm(.105") Soldertail, 240 Circuits, Lead free; 1.00毫米（ .039 “ ）间距DDR3 DIMM插槽，垂直，通孔，与斜面金属针，蓝房灰白色锁存器， 0.76μm （ 30μ ”），金（Au ） Plating2.67mm （ 0.105 “ ） Soldertail ， 240电路，无铅
| 型号： | 78079-0211 |
| 厂家： | 
Molex |
| 描述： | 1.00mm (.039") Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Blue Housing and Off-White Latches, 0.76μm (30μ") Gold (Au) Plating2.67mm(.105") Soldertail, 240 Circuits, Lead free |
| 文件： | 总10页 (文件大小：814K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This document was generated on 04/07/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
0780790211
Active
Description:
1.00mm (.039") Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled
Metal Pins, Blue Housing and Off-White Latches, 0.76µm (30µ") Gold (Au) Plating,
2.67mm(.105") Soldertail, 240 Circuits, Lead free
Documents:
Drawing (PDF)
RoHS Certificate of Compliance (PDF)
Product Specification PS-78079-002 (PDF)
Series
image - Reference only
China RoHS
Agency Certification
CSA
UL
LR19980
E29179
EU RoHS
ELV and RoHS
Compliant
General
REACH SVHC
Not Reviewed
Halogen-Free
Status
Product Family
Series
Component Type
JEDEC Outline
Product Name
Memory Module Sockets
78079
Socket
MO-269
DDR3 DIMM
Not Reviewed
Need more information on product
environmental compliance?
Physical
Circuits (Loaded)
240
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Circuits (maximum)
Color - Resin
Durability (mating cycles max)
Entry Angle
Flammability
240
BLUE/NATURAL
25
Vertical
94V-0
Yes
Copper Alloy
Please visit the Contact Us section for any
non-product compliance questions.
Keying to Mating Part
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
PC Tail Length (in)
PC Tail Length (mm)
PCB Locator
Gold
Tin
Search Parts in this Series
78079Series
High Temperature Thermoplastic
0.105 In
2.67 mm
Yes
Mates With
PCB Retention
Yes
JEDEC standard 1.27mm modules
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
0.062 In
1.57 mm
Tray
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Pitch - Term. Interface (in)
Pitch - Term. Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Temperature Range - Operating
Termination Interface: Style
0.039 In
1.00 mm
0.039 In
1.00 mm
30
0.76
100
2.54
-55°C to +85°C
Through Hole
Electrical
Current - Maximum per Contact
Voltage - Maximum
Voltage Key
1A
30V AC (RMS)/DC
Center
Material Info
Reference - Drawing Numbers
Product Specification
Sales Drawing
PS-78079-002
SD-78079-001
This document was generated on 04/07/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
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