87797-1800 [MOLEX]

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row Dual Body, Vertical, 18 Circuits, Gold (Au) Flash Plating, 9.35mm (.368) Stacking Height, Tray Packaging; 2.54毫米( .100 )间距C- Grid®头,通孔,双排双机身,垂直, 18电路,金(Au )闪镀, 9.35毫米( 0.368 )堆码高度,托盘包装
87797-1800
型号: 87797-1800
厂家: Molex Electronics Ltd.    Molex Electronics Ltd.
描述:

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row Dual Body, Vertical, 18 Circuits, Gold (Au) Flash Plating, 9.35mm (.368) Stacking Height, Tray Packaging
2.54毫米( .100 )间距C- Grid®头,通孔,双排双机身,垂直, 18电路,金(Au )闪镀, 9.35毫米( 0.368 )堆码高度,托盘包装

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