87832-1014 [MOLEX]
2.00mm (.079) Pitch Milli-Grid™ Header, Surface Mount, Vertical, Shrouded, Leadfree 10 Circuits, 0.38μm (15μ) Gold (Au) Plating, without Locking Window; 2.00毫米( 0.079 )间距的Milli-电网™接头,表面贴装,立式,带罩, 10无铅电路, 0.38μm ( 15μ ),金(Au ),电镀,无锁定窗口型号: | 87832-1014 |
厂家: | Molex |
描述: | 2.00mm (.079) Pitch Milli-Grid™ Header, Surface Mount, Vertical, Shrouded, Leadfree 10 Circuits, 0.38μm (15μ) Gold (Au) Plating, without Locking Window |
文件: | 总5页 (文件大小:349K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
This document was generated on 05/25/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
0878321014
Active
milligrid
Overview:
Description:
2.00mm (.079") Pitch Milli-Grid™ Header, Surface Mount, Vertical, Shrouded, Lead-
free, 10 Circuits, 0.38µm (15µ") Gold (Au) Plating, without Locking Window, Center
Polarization Slot, Cap, without PCB Locator, Embossed Tape on Reel
Documents:
3D Model
Drawing (PDF)
Product Specification PS-87831-027 (PDF)
RoHS Certificate of Compliance (PDF)
Series
image - Reference only
General
Product Family
Series
Application
Comments
EU RoHS
ELV and RoHS
Compliant
REACH SVHC
Contains SVHC: No
Halogen-Free
Status
China RoHS
PCB Headers
87832
Wire-to-Board
With Cap|Contact Molex for application in automotive
industry
milligrid
Milli-Grid™
Overview
Product Name
Not Halogen-Free
Physical
Breakaway
Need more information on product
environmental compliance?
No
Circuits (Loaded)
Circuits (maximum)
Color - Resin
First Mate / Last Break
Glow-Wire Compliant
Guide to Mating Part
Keying to Mating Part
Lock to Mating Part
Material - Metal
10
10
Black
No
No
No
Yes
No
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Please visit the Contact Us section for any
non-product compliance questions.
Phosphor Bronze
Material - Plating Mating
Material - Plating Termination
Material - Resin
Gold
Tin
Nylon
Search Parts in this Series
87832Series
Number of Rows
Orientation
2
Mates With
Vertical
50394 Wire-to-Board Terminals. 51110
Wire-to-Board Crimp Housing. 87568 Wire-
to-Board IDT Housings. 79107 Board-to-
Board Top Entry Through Hole Receptacle.
79108 Board-to-Board FFC/FPC Top Entry
Through Hole Receptacle. L
PCB Locator
PCB Retention
Packaging Type
No
None
Embossed Tape on Reel
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Pitch - Term. Interface (in)
Pitch - Term. Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Polarized to Mating Part
Polarized to PCB
0.079 In
2.00 mm
0.079 In
2.00 mm
15
0.38
75
1.88
Side Slots (2)
No
Shrouded
Fully
Stackable
No
Temperature Range - Operating
Termination Interface: Style
-55°C to +105°C
Surface Mount
Electrical
Current - Maximum per Contact
2A
Voltage - Maximum
125V
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
10
Reflow Capable (SMT only)
Max. Cycles at Max. Process Temperature
Process Temperature max. C
1
260
Material Info
Reference - Drawing Numbers
Product Specification
Sales Drawing
PS-87831-027
SD-87832-008
This document was generated on 05/25/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
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