87832-4022 [MOLEX]
2.00mm (.079) Pitch Milli-Grid™ Header, Surface Mount, Vertical, Shrouded, Leadfree 40 Circuits, 0.38μm (15μ) Gold (Au) Plating, Pick-and-Place Cap; 2.00毫米（ 0.079 ）间距的Milli-电网™接头，表面贴装，立式，带罩， 40无铅电路， 0.38μm （ 15μ ），金（Au ），电镀，拾取 - 放置盖
| 型号： | 87832-4022 |
| 厂家： | 
Molex |
| 描述： | 2.00mm (.079) Pitch Milli-Grid™ Header, Surface Mount, Vertical, Shrouded, Leadfree 40 Circuits, 0.38μm (15μ) Gold (Au) Plating, Pick-and-Place Cap |
| 文件： | 总6页 (文件大小：371K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This document was generated on 05/25/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
0878321622
Active
milligrid
Overview:
Description:
2.00mm (.079") Pitch Milli-Grid™ Header, Surface Mount, Vertical, Shrouded, Lead-
free, 16 Circuits, 0.38µm (15µ") Gold (Au) Plating, Pick-and-Place Cap, with Locking
Windows and Center Polarization Slot, PCB Locator, Tube
Documents:
3D Model
Drawing (PDF)
Product Specification PS-87831-027 (PDF)
RoHS Certificate of Compliance (PDF)
Series
image - Reference only
Agency Certification
CSA
UL
EU RoHS
ELV and RoHS
Compliant
China RoHS
LR19980
E29179
General
Product Family
Series
Application
Comments
REACH SVHC
Contains SVHC: No
Halogen-Free
Status
PCB Headers
87832
Wire-to-Board
With Cap|Contact Molex for application in automotive
Not Halogen-Free
industry
milligrid
Need more information on product
environmental compliance?
Overview
Product Name
Milli-Grid™
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Physical
Breakaway
No
Circuits (Loaded)
Circuits (maximum)
Color - Resin
First Mate / Last Break
Flammability
Glow-Wire Compliant
Guide to Mating Part
Keying to Mating Part
Lock to Mating Part
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
16
16
Black
No
94V-0
No
No
Yes
Yes
Phosphor Bronze
Gold
Tin
Nylon
2
Please visit the Contact Us section for any
non-product compliance questions.
Search Parts in this Series
87832Series
Mates With
50394 Wire-to-Board Terminals. 51110
Wire-to-Board Crimp Housing. 87568 Wire-
to-Board IDT Housings. 79107 Board-to-
Board Top Entry Through Hole Receptacle.
79108 Board-to-Board FFC/FPC Top Entry
Through Hole Receptacle. L
Number of Rows
Orientation
PCB Locator
Vertical
Yes
PCB Retention
Packaging Type
None
Tube
0.079 In
2.00 mm
0.079 In
2.00 mm
15
0.38
75
1.88
Side Slots (2)
No
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Pitch - Term. Interface (in)
Pitch - Term. Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Polarized to Mating Part
Polarized to PCB
Shrouded
Stackable
Fully
No
Temperature Range - Operating
Termination Interface: Style
-55°C to +105°C
Surface Mount
Electrical
Current - Maximum per Contact
Voltage - Maximum
2A
125V
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
10
Reflow Capable (SMT only)
Max. Cycles at Max. Process Temperature
Process Temperature max. C
1
260
Material Info
Reference - Drawing Numbers
Product Specification
Sales Drawing
PS-87831-027
SD-87832-006
This document was generated on 05/25/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
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