87914-0807 [MOLEX]

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54μm (100μ) Tin (Sn) Overall Plating, Tray Packaging; 2.54毫米( .100 )间距C- Grid®头,通孔,双排,垂直, 8电路, 2.54μm ( 100μ ),锡(Sn )总体电镀,包装纸盒
87914-0807
型号: 87914-0807
厂家: Molex    Molex
描述:

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54μm (100μ) Tin (Sn) Overall Plating, Tray Packaging
2.54毫米( .100 )间距C- Grid®头,通孔,双排,垂直, 8电路, 2.54μm ( 100μ ),锡(Sn )总体电镀,包装纸盒

文件: 总48页 (文件大小:3770K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
This document was generated on 05/25/2010  
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION  
Part Number:  
Status:  
0879140807  
Active  
cgrid__sl_products  
Overview:  
Description:  
2.54mm (.100") Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 8 Circuits,  
2.54µm (100µ") Tin (Sn) Overall Plating, Tray Packaging, Void Positions at circuit  
2,3,4,5,6,8, Lead-free  
Documents:  
Drawing (PDF)  
RoHS Certificate of Compliance (PDF)  
Series  
Product Specification PS-87920-019 (PDF)  
image - Reference only  
China RoHS  
Agency Certification  
UL  
EU RoHS  
E29179  
ELV and RoHS  
Compliant  
REACH SVHC  
Not Reviewed  
Halogen-Free  
Status  
Not Reviewed  
Need more information on product  
environmental compliance?  
General  
Product Family  
Series  
Application  
Comments  
Overview  
PCB Headers  
87914  
Board-to-Board, Wire-to-Board  
Void Positions: Circuits 2,3,4,5,6,8  
cgrid__sl_products  
C-Grid®  
Product Name  
Physical  
Breakaway  
Email productcompliance@molex.com  
Yes  
For a multiple part number RoHS Certificate of  
Compliance, click here  
Circuits (Loaded)  
Circuits (maximum)  
Color - Resin  
First Mate / Last Break  
Flammability  
8
8
Black  
No  
94V-0  
Please visit the Contact Us section for any  
non-product compliance questions.  
Glow-Wire Compliant  
Guide to Mating Part  
Keying to Mating Part  
Lock to Mating Part  
Mated Height (in)  
No  
No  
None  
None  
Search Parts in this Series  
87914Series  
0.650 In  
Mated Height (mm)  
Material - Metal  
16.51 mm  
Copper Alloy  
Mates With  
Material - Plating Mating  
Material - Plating Termination  
Material - Resin  
Tin  
Tin  
7859 Shunts. C-Grid® PCB Receptacles like  
71850. SL™ IDT Housing like 70450  
High Temperature Thermoplastic  
Number of Rows  
2
Orientation  
PC Tail Length (in)  
PC Tail Length (mm)  
PCB Locator  
Vertical  
0.116 In  
2.95 mm  
No  
PCB Retention  
None  
PCB Thickness Recommended (in)  
PCB Thickness Recommended (mm)  
Packaging Type  
0.063 In  
1.60 mm  
Tray  
Pitch - Mating Interface (in)  
Pitch - Mating Interface (mm)  
Pitch - Term. Interface (in)  
Pitch - Term. Interface (mm)  
Plating min: Mating (µin)  
Plating min: Mating (µm)  
Plating min: Termination (µin)  
Plating min: Termination (µm)  
0.100 In  
2.54 mm  
0.100 In  
2.54 mm  
101.6  
2.54  
101.6  
2.54  
Polarized to Mating Part  
Polarized to PCB  
No  
No  
Shrouded  
No  
Stackable  
No  
Surface Mount Compatible (SMC)  
Temperature Range - Operating  
Termination Interface: Style  
Yes  
-55°C to +105°C  
Through Hole  
Electrical  
Current - Maximum per Contact  
Voltage - Maximum  
3A  
250V  
Solder Process Data  
Duration at Max. Process Temperature (seconds)  
Lead-free Process Capability  
12  
Wave Capable (TH only)  
Max. Cycles at Max. Process Temperature  
Process Temperature max. C  
1
260  
Material Info  
Reference - Drawing Numbers  
Packaging Specification  
Product Specification  
PK-89990-489  
PS-87920-019  
SD-87914-013  
Sales Drawing  
This document was generated on 05/25/2010  
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION  

相关型号:

87914-0816

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX

87914-0827

Board Connector, 8 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Black Insulator,
MOLEX

87914-1013

Board Connector, 10 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Locking, Black Insulator, Receptacle,
MOLEX

87914-1016

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 10 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX

87914-1216

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 12 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX

87914-1416

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 14 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX

87914-1616

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 16 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX

87914-1816

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX

87914-2016

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 20 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX

87914-2216

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX

87914-2416

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 24 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX

87914-2616

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 26 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
MOLEX