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87914-3435 [MOLEX]

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free; 2.54毫米（ .100 ）间距C- Grid®头，通孔，双排，垂直， 34电路， 0.76μm （ 30μ ），金（Au ）选择性电镀，纸盒包装，无铅
87914-3435
元器件型号： 87914-3435
生产厂家： Molex Electronics Ltd.    Molex Electronics Ltd.
描述和应用：

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.54毫米（ .100 ）间距C- Grid®头，通孔，双排，垂直， 34电路， 0.76μm （ 30μ ），金（Au ）选择性电镀，纸盒包装，无铅
PDF文件： 总48页 (文件大小：3779K)
下载文档：  下载PDF数据表文档文件
型号参数：87914-3435参数
 查看货源

87914-3616

 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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1 MOLEX

87914-3816

 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 38 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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2 MOLEX

87914-4016

 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 40 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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8 MOLEX

87914-4201

 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 42 Circuits, 0.38μm (15μ) Gold (Au) Plating, Tray Packaging, Lead-free

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5 MOLEX

87914-4216

 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 42 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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3 MOLEX

87914-4405

 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 44 Circuits, 0.76μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free

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7 MOLEX

87914-4416

 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 44 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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7 MOLEX

87914-4616

 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 46 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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19 MOLEX

87914-4816

 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 48 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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12 MOLEX

87914-5016

 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 50 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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12 MOLEX

87914-8016

 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 80 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Lead-free

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8 MOLEX

87916-0001

 1.00mm (.039) Pitch DDR-2 DIMM Socket, 22.5 Degree Angle, Through Hole, 240 Circuits, 1.8V Voltage Key, 0.76μm (30μ) Gold (Au) Plating

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9 MOLEX

87916-0011

 1.00mm (.039) Pitch DDR-2 DIMM Socket, 22.5 Degree Angle, Through Hole, 240 Circuits, 1.8V Voltage Key, 0.76μm (30μ) Gold (Au) Plating

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10 MOLEX

87916-007

 Board Connector, 7 Contact(s), 1 Row(s), Male, Straight, Solder Terminal

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0 AMPHENOL

87916-007HLF

 Board Connector, 7 Contact(s), 1 Row(s), Male, Straight, Solder Terminal, LEAD FREE

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0 AMPHENOL
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