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87937-0202 [MOLEX]

Board Stacking Connector, 2 Contact(s), 1 Row(s), Male, Straight, Solder Terminal,;
87937-0202
型号: 87937-0202
厂家: Molex    Molex
描述:

Board Stacking Connector, 2 Contact(s), 1 Row(s), Male, Straight, Solder Terminal,

连接器
文件: 总2页 (文件大小:150K)
中文:  中文翻译
下载:  下载PDF数据表文档文件

相关型号:

87937-0406

2.54mm (.100) Pitch KK® Header, Single Row Dual Body, Through Hole, Vertical, 4 Circuits, 2.50μm (100μ) Tin (Sn) Plating, 11.00mm (.433) Stacking Height

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87937-0502

2.54mm (.100) Pitch KK® Header, Single Row Dual Body, Through Hole, Vertical, 5 Circuits, 2.50μm (100μ") Tin (Sn) Plating, 11.00mm (.433) Stacking Height

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87937-0600

2.54mm (.100) Pitch KK® Header, Single Row Dual Body, Through Hole, Vertical, 6 Circuits, 0.75μm (29μ) Gold (Au) Plating, 10.90mm (.429) Stacking Height

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87937-0800

2.54mm (.100) Pitch KK® Header, Single Row Dual Body, Through Hole, Vertical, 8 Circuits, 2.50μm (100μ) Tin (Sn) Plating, 12.00mm (.472) Stacking Height

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87937-0801

2.54mm (.100) Pitch KK® Header, Single Row Dual Body, Through Hole, Vertical, 8 Circuits, 0.75μm (29μ) Gold (Au) Plating, 10.90mm (.429) Stacking Height

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87937-0802

2.54mm (.100) Pitch KK® Header, Single Row Dual Body, Through Hole, Vertical, 8 Circuits, 2.50μm (100μ) Tin (Sn) Plating, 11.00mm (.433) Stacking Height

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87937-1206

2.54mm (.100) Pitch KK® Header, Single Row Dual Body, Through Hole, Vertical, 12 Circuits, 2.50μm (100μ) Tin (Sn) Plating, 11.00mm (.433) Stacking Height

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87937-1600

2.54mm (.100) Pitch KK® Header, Single Row Dual Body, Through Hole, Vertical, 16 Circuits, 0.25μm (10μ) Gold(Au) Selective Plating, 17.63mm (.694) Stacking Height

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87937-1601

2.54mm (.100) Pitch KK® Header, Single Row Dual Body, Through Hole, Vertical, 16 Circuits, 0.25μm (10μ) Gold(Au) Selective Plating, 19.05mm (.750) Stacking Height

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87937-1602

Board Stacking Connector, 16 Contact(s), 1 Row(s), Male, Straight, Solder Terminal,

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879371601

Board Stacking Connector, 16 Contact(s), 1 Row(s), Male, Straight, Solder Terminal,

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87938-0002

2.54mm (.100) Pitch KK® Header, Surface Mount, Single Row Dual Body, Vertical, 8 Circuits, Gold (Au) Selective Plating, 8.07mm (.318) Stacking Height

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87939-0001

2.54mm (.100) Pitch C-Grid® Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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87939-2000

2.54mm (.100) Pitch C-Grid® Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 20 Circuits, 2.50μm (100μ) Tin (Sn) Plating, 15.35mm(.604) Stacking Height

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87939-4001

2.54mm (.100) Pitch C-Grid® Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 40 Circuits, 0.75μm (30μ) Gold (Au) Selective Plating, 6.40mm(.251)

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87942-7001

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87943

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87943-1101

2.50mm (.098) / 3.50mm (.138) Pitch Wire-to-Board Female Crimp Terminal, Tin (Sn) Overall, 16 AWG, Reel Packaging, Lead-free

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87943-2101

2.50mm (.098) / 3.50mm (.138) Pitch Wire-to-Board Female Crimp Terminal, Tin (Sn) Overall, 20 AWG, Reel Packaging, Lead-free

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87943-7001

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