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A-70567-0081 [MOLEX]

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating; 2.54毫米（ .100 ）间距C- GridÂ®头，通孔无钉，双排，垂直，罩，高温， 6电路，锡（Sn ）镀层

A-70567-0081


元器件型号：	A-70567-0081
生产厂家：	Molex Electronics Ltd.
描述和应用：	2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating 2.54毫米（ .100 ）间距C- GridÂ®头，通孔无钉，双排，垂直，罩，高温， 6电路，锡（Sn ）镀层
PDF文件：	总7页 (文件大小：1221K)
下载文档：	下载PDF数据表文档文件
型号参数：A-70567-0081参数

A-70567-0082

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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2 MOLEX

A-70567-0082

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

A-70567-0083

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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1 MOLEX

A-70567-0083

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits

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2 MOLEX

A-70567-0084

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits

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2 MOLEX

A-70567-0084

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

A-70567-0085

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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3 MOLEX

A-70567-0085

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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3 MOLEX

A-70567-0086

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits

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1 MOLEX

A-70567-0086

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

A-70567-0087

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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3 MOLEX

A-70567-0087

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits

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2 MOLEX

A-70567-0088

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 44 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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2 MOLEX

A-70567-0088

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

A-70567-0089

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

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