A-70567-0143 [MOLEX]

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating; 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 6电路,锡(Sn )镀层
A-70567-0143
元器件型号: A-70567-0143
生产厂家: Molex Electronics Ltd.    Molex Electronics Ltd.
描述和应用:

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 6电路,锡(Sn )镀层

PDF文件: 总7页 (文件大小:1221K)
下载文档:  下载PDF数据表文档文件
型号参数:A-70567-0143参数

A-70567-0144

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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2 MOLEX

A-70567-0144

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

A-70567-0145

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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2 MOLEX

A-70567-0145

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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1 MOLEX

A-70567-0146

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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3 MOLEX

A-70567-0147

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

A-70567-0147

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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2 MOLEX

A-70567-0148

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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2 MOLEX

A-70567-0148

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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1 MOLEX

A-70567-0149

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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1 MOLEX

A-70567-0149

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

A-70567-0150

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

A-70567-0150

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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1 MOLEX

A-70567-0151

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

A-70567-0152

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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2 MOLEX