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A-70567-0164 [MOLEX]

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating; 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 6电路，锡（Sn ）镀层
A-70567-0164
元器件型号： A-70567-0164
生产厂家： Molex Electronics Ltd.    Molex Electronics Ltd.
描述和应用：

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 6电路，锡（Sn ）镀层
PDF文件： 总7页 (文件大小：1221K)
下载文档：  下载PDF数据表文档文件
型号参数：A-70567-0164参数
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A-70567-0165

 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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4 MOLEX

A-70567-0165

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1 MOLEX

A-70567-0166

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2 MOLEX

A-70567-0166

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2 MOLEX

A-70567-0167

 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

A-70567-0168

 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

A-70567-0168

 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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3 MOLEX

A-70567-0169

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2 MOLEX

A-70567-0170

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2 MOLEX

A-70567-0170

 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 72 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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1 MOLEX

A-70567-0171

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2 MOLEX

A-70567-0172

 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

A-70567-0173

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A-70567-0174

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2 MOLEX

A-70567-0175

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2 MOLEX
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