A-70567-0360
更新时间：2024-09-18 12:05:08
品牌：MOLEX
描述：2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
概述
数据手册A-70567-0360 概述
2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 6电路，锡（Sn ）镀层
A-70567-0360 数据手册
通过下载A-70567-0360数据手册来全面了解它。这个PDF文档包含了所有必要的细节，如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载This document was generated on 05/24/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
0015800067
Active
cgrid__sl_products
Overview:
Description:
2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical,
Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating, 3.81mm (.150") Inside
Shroud to End Circuit Spacing
Documents:
3D Model
Drawing (PDF)
Product Specification PS-70567 (PDF)
RoHS Certificate of Compliance (PDF)
Series
image - Reference only
China RoHS
ELV and RoHS
Compliant
Packaging Specification (PDF)
EU RoHS
Agency Certification
CSA
UL
LR19980
E29179
REACH SVHC
Contains SVHC: No
Halogen-Free
Status
General
Product Family
Series
PCB Headers
70567
Not Reviewed
Need more information on product
environmental compliance?
Application
Overview
Product Name
Wire-to-Board
cgrid__sl_products
C-Grid®
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Physical
Breakaway
No
6
Circuits (Loaded)
Circuits (maximum)
Circuits Detail
Color - Resin
6
6
Please visit the Contact Us section for any
non-product compliance questions.
Black
Durability (mating cycles max)
First Mate / Last Break
Flammability
Glow-Wire Compliant
Guide to Mating Part
Keying to Mating Part
Lock to Mating Part
Material - Metal
25
No
94V-0
No
No
None
Yes
Search Parts in this Series
70567Series
Mates With
70013 Interim Clip
Brass, Phosphor Bronze
Material - Plating Mating
Material - Plating Termination
Material - Resin
Tin
Tin
High Temperature Thermoplastic
Number of Rows
2
Orientation
PC Tail Length (in)
PC Tail Length (mm)
PCB Locator
Vertical
0.130 In
3.30 mm
No
PCB Retention
Yes
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
0.093 In
2.36 mm
Tube
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Pitch - Term. Interface (in)
Pitch - Term. Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
0.100 In
2.54 mm
0.100 In
2.54 mm
150
3.75
150
Plating min: Termination (µm)
Polarized to Mating Part
Polarized to PCB
3.75
No
No
Shrouded
Stackable
Open Ends
No
Surface Mount Compatible (SMC)
Temperature Range - Operating
Termination Interface: Style
Yes
-55°C to +105°C
Through Hole
Electrical
Current - Maximum per Contact
Voltage - Maximum
2.5A
250V DC
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
5
SMC & Wave Capable (TH only)
Max. Cycles at Max. Process Temperature
Process Temperature max. C
1
245
Material Info
Old Part Number
A-70567-0205
Reference - Drawing Numbers
Packaging Specification
Product Specification
PK-70873-0018
PS-70567
Sales Drawing
SDA-70567-****
This document was generated on 05/24/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
A-70567-0360 相关器件
| 型号 | 制造商 | 描述 | 价格 | 文档 |
| A-70567-0361 | MOLEX | 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | 获取价格 |
|
| A-70567-0362 | MOLEX | 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | 获取价格 |
|
| A-70567-0363 | MOLEX | 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating | 获取价格 |
|
| A-70567-0364 | MOLEX | 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating | 获取价格 |
|
| A-70567-0365 | MOLEX | 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | 获取价格 |
|
| A-70567-0366 | MOLEX | 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | 获取价格 |
|
| A-70567-0367 | MOLEX | 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | 获取价格 |
|
| A-70567-0368 | MOLEX | 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | 获取价格 |
|
| A-70567-0369 | MOLEX | 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | 获取价格 |
|
| A-70567-0370 | MOLEX | 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating | 获取价格 |
|
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