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A-70568-0061 [MOLEX]

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating; 2.54毫米（ .100 ）间距C- GridÂ®头，通孔，双排，垂直，高温，罩，用PEG ， 6电路，锡（Sn ）镀层

A-70568-0061


元器件型号：	A-70568-0061
生产厂家：	Molex Electronics Ltd.
描述和应用：	2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating 2.54毫米（ .100 ）间距C- GridÂ®头，通孔，双排，垂直，高温，罩，用PEG ， 6电路，锡（Sn ）镀层
PDF文件：	总4页 (文件大小：381K)
下载文档：	下载PDF数据表文档文件
型号参数：A-70568-0061参数

A-70568-0062

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 60 Circuits, 0.38μm (15μ) Gold (Au) Selective

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3 MOLEX

A-70568-0062

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

A-70568-0063

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 62 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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1 MOLEX

A-70568-0063

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

A-70568-0064

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 64 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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1 MOLEX

A-70568-0064

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

A-70568-0065

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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1 MOLEX

A-70568-0065

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 66 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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2 MOLEX

A-70568-0066

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 68 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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1 MOLEX

A-70568-0066

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

A-70568-0067

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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4 MOLEX

A-70568-0067

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 70 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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1 MOLEX

A-70568-0068

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 72 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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0 MOLEX

A-70568-0068

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

A-70568-0069

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

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