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A-70568-0138 [MOLEX]

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating; 2.54毫米（ .100 ）间距C- Grid®头，通孔，双排，垂直，高温，罩，用PEG ， 6电路，锡（Sn ）镀层
A-70568-0138
元器件型号： A-70568-0138
生产厂家： Molex Electronics Ltd.    Molex Electronics Ltd.
描述和应用：

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
2.54毫米（ .100 ）间距C- Grid®头，通孔，双排，垂直，高温，罩，用PEG ， 6电路，锡（Sn ）镀层
PDF文件： 总4页 (文件大小：381K)
下载文档：  下载PDF数据表文档文件
型号参数：A-70568-0138参数
 查看货源

A-70568-0139

 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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1 MOLEX

A-70568-0140

 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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1 MOLEX

A-70568-0141

 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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1 MOLEX

A-70568-0142

 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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1 MOLEX

A-70568-0143

 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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1 MOLEX

A-70568-0144

 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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1 MOLEX

A-70568-0145

 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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1 MOLEX

A-70568-0146

 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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1 MOLEX

A-70568-0147

 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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1 MOLEX

A-70568-0148

 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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2 MOLEX

A-70568-0149

 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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1 MOLEX

A-70568-0150

 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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1 MOLEX

A-70568-0151

 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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1 MOLEX

A-70568-0152

 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

Warning: Undefined variable $rtag in /www/wwwroot/www.icpdf.com/pdf/pdf/index.php on line 156
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1 MOLEX

A-70568-0153

 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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1 MOLEX
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