SD-73780-004 [MOLEX]
2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle; 2.00毫米（ .079 “ ）间距HDM®板对板子卡插座
| 型号： | SD-73780-004 |
| 厂家： | 
Molex |
| 描述： | 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle |
| 文件： | 总3页 (文件大小：205K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This document was generated on 05/14/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
0737800125
Active
hdm
Overview:
Description:
2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal
Module, 72 Circuits, Mounted Height 15.00mm (.591"), Pin Length 2.00mm (.079"),
Solder Tail
Documents:
3D Model
Drawing (PDF)
Product Specification PS-73780-999 (PDF)
RoHS Certificate of Compliance (PDF)
Series
image - Reference only
General
Product Family
Series
Application
Comments
Component Type
Overview
EU RoHS
ELV and RoHS
Compliant
REACH SVHC
Contains SVHC: No
Halogen-Free
Status
China RoHS
Backplane Connectors
73780
Daughtercard, Mezzanine
Solder Tail
PCB Receptacle
hdm
HDM®
N/A
Product Name
Style
Not Reviewed
Need more information on product
environmental compliance?
Physical
Circuits (Loaded)
72
72
Black
250
No
No
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Circuits (maximum)
Color - Resin
Durability (mating cycles max)
First Mate / Last Break
Guide to Mating Part
Keying to Mating Part
Material - Metal
Please visit the Contact Us section for any
non-product compliance questions.
None
Copper-Nickel-Tin
Material - Plating Mating
Material - Plating Termination
Material - Resin
Gold
Tin
Search Parts in this Series
73780Series
High Temperature Thermoplastic
12
Number of Columns
Number of Pairs
Number of Rows
Open Pin Field
6
Mates With
HDM® Board-to-Board Backplane Header
73642 , 73643 , 73644 , 73942 , 73943 ,
73944 , 74349 , 74428. HDM® Board-to-
Board Stacking Header 73769 , 73770 ,
73782 , 73783 , 73771
Orientation
PC Tail Length (in)
PC Tail Length (mm)
PCB Locator
PCB Retention
Vertical
0.079 In
2.00 mm
No
None
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
0.063 In
1.60 mm
Tube
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Pitch - Term. Interface (in)
Pitch - Term. Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Polarized to PCB
0.079 In
2.00 mm
0.079 In
2.00 mm
30
0.75
100
2.5
No
Stackable
Yes
Surface Mount Compatible (SMC)
Temperature Range - Operating
Yes
-55°C to +105°C
Termination Interface: Style
Through Hole
Electrical
Current - Maximum per Contact
Data Rate
Real Signals (per 25mm)
Shielded
15A, 1A
1.0 Gbps
75
No
Voltage - Maximum
250V AC
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
5
Wave Capable (TH only)
Max. Cycles at Max. Process Temperature
Process Temperature max. C
1
260
Material Info
Reference - Drawing Numbers
Product Specification
Sales Drawing
PS-73780-999
SD-73780-004
HDM and High Density Metric are trademarks of Amphenol Corporation
This document was generated on 05/14/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
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