PUMA68F32006X-15 [MOSAIC]
Flash Module, 1MX32, 150ns, PQMA68, PLASTIC, LCC-68;
| 型号： | PUMA68F32006X-15 |
| 厂家： | 
MOSAIC |
| 描述： | Flash Module, 1MX32, 150ns, PQMA68, PLASTIC, LCC-68 内存集成电路 |
| 文件： | 总5页 (文件大小：127K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1x32FLASHModule
PUMA68F32006X - 90/12/15
Issue 5.0 December 1999
Description
Block Diagram
The PUMA68 range of devices provide a high
density surface mount industry standard memory
solution which may accommodate various memory
technologies including SRAM, EEPROM and
Flash. The devices are designed to offer a defined
upgrade path and may be user configured as 8, 16
or 32 bits wide.
A0~A19
/OE
/WE
1M x 8
1M x 8
1M x 8
1M x 8
FLASH
FLASH
FLASH
FLASH
/CS1
/CS2
/CS3
/CS4
D0~7
D8~15
D16~23
D24~31
The PUMA68F32006X is a 1Mx32 FLASH module
housedina68Jleadedpackagewhichcomplieswith
theJEDEC68PLCCstandard.Accesstimesof 90,
120or150nsareavailable.The5Vdeviceisavailable
to commercial and industrial temperature grade.
2Mx32FLASHPUMA68devicesareavailableinthe
same footprint to offer a defined upgrade path.
Pin Definition
See page 2.
Features
• Access times of 90, 120 and 150ns.
• 5V + 10%.
• CommercialandIndustrialtemperaturegrades
• JEDECStandard68PLCCfootprint.
• Industrystandardpinout.
• May be organised as 1Mx32, 2Mx16 or 4Mx8
• User configurable as 8 / 16 / 32 bits wide.
• 10 Year Data Retention
Pin Functions
Description
Signal
• Write Erase Cycle Endurance 100,000 (min)
• Automatic Write/Erase by Embedded Algorithm
• UniformSectorDevice.
Address Input
A0~A18
D0~D31
/CS1~4
/WE
Data Input/Output
Chip Select
Write Enable
Output Enable
No Connect
Power
/OE
Package Details
NC
VCC
Plastic ‘J’ Leaded JEDEC PLCC
Ground
VSS
Max. Dimensions (mm) - 25.27 x 25.27 x 5.08
11403 West Bernardo Court, Suite 100, San Diego, CA92127.
TEL (001) 858 674 2233, Fax No. (001) 858 674 2230 E-mail: sales@mosaicsemi.com
Pin Definition - PUMA68F32006X
Pin
1
Signal
Pin
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
Signal
VCC
A13
A12
A11
A10
A9
VCC
A19
/CS1
/CS2
/CS3
/CS4
A17
A18
D16
D17
D18
D19
VSS
2
3
4
5
6
7
A8
8
A7
9
D0
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
D1
D2
D3
VSS
D4
D20
D21
D22
D23
VCC
D5
D6
D7
VCC
D8
D24
D25
D26
D27
VSS
D9
D10
D11
VSS
D12
D13
D14
D15
A14
A15
A16
/WE
/OE
NC
NC
D28
D29
D30
D31
A6
A5
A4
A3
A2
A1
A0
Issue 5.0 December 1999
PAGE 2
PckgDetails
PUMA 68 pin JEDEC Surface Mounted PLCC
Pin 1
Pin 68
25.27 (0.995)
25.02 (0.985)
5.08
(0.200)
max
0.90
(0.035)
typ
1.27 typ.
(0.050)
0.46 typ.
(0.018)
24.13 (0.950)
23.11 (0.910)
PAGE 3
Issue 5.0 December 1999
Ordering Information
OdegIfrmation
PUMA 68F32006XI - 90
Speed
90 = 90ns
12 = 120ns
15 = 150ns
Temp.Range/Screening Blank = Commercial
I = Industrial
PinoutConfiguration
X = IndustryStandard
Pinout
MemoryOrganisation
32006 = configurableas
1M x 32, 2M x 16 or
4M x 8
Technology
Package
F = FLASH
PUMA 68 = 68 pin ‘J’ Leaded PLCC
Note :
Although this data is believed to be accurate the information contained herein is not intended to and does not create
any warranty of merchantibility or fitness for a particular purpose.
Our products are subject to a constant process of development. Data may be changed without notice.
Products are not authorised for use as critical components in life support devices without the express written
approval of a company director.
PAGE 4
http://www.mosaicsemi.com/
Issue 5.0 December 1999
CtomrGudlines
Co Planarity
Specified as +/- 2 thou max.
Visual Inspection Standard
All devices inspected to ANSI/J-STD-001B Class 2 standard
Moisture Sensitivity
Devices are moisture sensitive.
Shelf Life in Sealed Bag 12 months at <40OC and <90% relative humidity (RH).
After this bag has been opened, devices that will be subjected to infrared reflow, vapour phase reflow, or
equivalent processing (peak package body temp 220OC) must be :
A : Mounted within 72 Hours at factory conditions of <30OC/60% RH
OR
B : Stored at <20% RH
Iftheseconditionsarenotmetorindicatorcardis>20%whenreadat23OC +/-5% devicesrequirebaking
as specified below.
If baking is required, devices may be baked for :-
A : 24 hours at 125OC +/-5% for high temperature device containers
OR
B : 192 hours at 40OC +5OC/-0OC and <5% RH for low temperature device containers.
Packaging Standard
Devices packaged in dry nitrogen, JED-STD-020.
Packaged in trays as standard.
Tape and reel available for shipment quantities exceeding 200pcs upon request.
Soldering Recomendations
IR/Convection - Ramp Rate
Temp. exceeding 183OC 150 secs. max.
Peak Temperature
225OC
Time within 5OC of peak 20 secs max.
6OC/sec max.
Ramp down
6OC/sec max.
Vapour Phase - Ramp up rate
6OC/sec max.
215 - 219OC
Peak Temperature
Time within 5OC of peak 60 secs max.
Ramp down
6OC/sec max.
The above conditions must not be exceeded.
Note : The above recommendations are based on standard industry practice. Failure to comply with
the above recommendations invalidates product warranty.
PAGE 5
Issue 5.0 December 1999
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