MBRB20100CTT4 [MOTOROLA]
10A, 100V, SILICON, RECTIFIER DIODE;
| 型号： | MBRB20100CTT4 |
| 厂家： | 
MOTOROLA |
| 描述： | 10A, 100V, SILICON, RECTIFIER DIODE 二极管 |
| 文件： | 总6页 (文件大小：105K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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by MBRB20100CT/D
SEMICONDUCTOR TECHNICAL DATA
2
D PAK Surface Mount Power Package
Motorola Preferred Device
2
The D PAK Power Rectifier employs the use of the Schottky Barrier principle
with a platinum barrier metal. These state–of–the–art devices have the
following features:
SCHOTTKY BARRIER
RECTIFIER
•
•
•
•
•
•
•
•
•
Package Designed for Power Surface Mount Applications
Center–Tap Configuration
Guardring for Stress Protection
Low Forward Voltage
150°C Operating Junction Temperature
20 AMPERES
100 VOLTS
Epoxy Meets UL94, V at 1/8″
O
Guaranteed Reverse Avalanche
Short Heat Sink Tab Manufactured — Not Sheared!
Similar in Size to Industry Standard TO–220 Package
4
1
3
4
1
Mechanical Characteristics
3
•
•
•
Case: Epoxy, Molded
Weight: 1.7 grams (approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal Leads are
Readily Solderable
CASE 418B–02
2
D PAK
•
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
•
•
Shipped 50 units per plastic tube
Available in 24 mm Tape and Reel, 800 units per 13″ reel by adding a “T4”
suffix to the part number
•
Marking: B20100T
MAXIMUM RATINGS, PER LEG
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
V
100
Volts
RRM
RWM
R
V
Average Rectified Forward Current
I
10
20
Amps
Amps
Amps
F(AV)
(Rated V ) T = 110°C
Total Device
R
C
Peak Repetitive Forward Current
I
20
FRM
(Rated V , Square Wave, 20 kHz), T = 100°C
R
C
Non-repetitive Peak Surge Current
I
150
FSM
(Surge applied at rated load conditions halfwave, single phase, 60 Hz)
Peak Repetitive Reverse Surge Current (2.0 µs, 1.0 kHz)
Storage Temperature
I
0.5
Amp
°C
RRM
T
stg
–65 to +175
–65 to +150
10000
Operating Junction Temperature
T
J
°C
Voltage Rate of Change (Rated V )
R
dv/dt
V/µs
THERMAL CHARACTERISTICS, PER LEG
Thermal Resistance — Junction to Case
— Junction to Ambient (1)
R
θJC
R
θJA
2.0
50
°C/W
(1) See Chapter 7 for mounting conditions
Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit
curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.
Designer’s and SWITCHMODE are trademarks of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value.
Rev 1
Motorola, Inc. 1996
ELECTRICAL CHARACTERISTICS, PER LEG
Rating
Symbol
Value
Unit
Maximum Instantaneous Forward Voltage (2)
(i = 10 Amp, T = 125°C)
v
0.75
0.85
0.85
0.95
Volts
F
C
F
(i = 10 Amp, T = 25°C)
F
F
C
C
C
(i = 20 Amp, T = 125°C)
(i = 20 Amp, T = 25°C)
F
Maximum Instantaneous Reverse Current (2)
(Rated dc Voltage, T = 125°C)
i
R
6.0
0.1
mA
J
(Rated dc Voltage, T = 25°C)
J
(2) Pulse Test: Pulse Width = 300 µs, Duty Cycle ≤ 2.0%.
50
T
= 150
°
C
J
150°C
20
10
10
T
T
= 125
= 100
°
C
C
J
J
175°C
°
100°C
1
5
3
T
= 25
°C
J
0.1
1
0.01
T = 25°C
J
0.5
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
0
20
40
60
80
100
120
v , INSTANTANEOUS VOLTAGE (VOLTS)
V
, REVERSE VOLTAGE (VOLTS)
F
R
Figure 1. Typical Forward Voltage Per Diode
Figure 2. Typical Reverse Current Per Diode
32
28
24
20
20
18
16
I
/I
= 5
PK AV
RATED VOLTAGE
APPLIED
T
= 125°C
J
PI
I
/I = 10
PK AV
14
12
10
8
R
= 2°C/W
θ
JC
I
/I = 20
PK AV
16
12
DC
SQUARE
WAVE
SQUARE
WAVE
6
8
4
0
DC
4
2
0
80
90
100
110
120
130
140
150
160
0
2
4
6
8
10
12
14
16
18
20
T
, CASE TEMPERATURE (°C)
AVERAGE CURRENT (AMPS)
C
Figure 3. Typical Current Derating, Case,
Per Leg
Figure 4. Average Power Dissipation and
Average Current
2
Rectifier Device Data
2
INFORMATION FOR USING THE D PAK SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must be
the correct size to insure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self align when subjected to a
solder reflow process.
0.74
18.79
0.065
1.651
0.420
10.66
0.07
1.78
0.14
3.56
0.330
8.38
inches
mm
2
D PAK POWER DISSIPATION
2
2
ThepowerdissipationoftheD PAKisafunctionofthedrain
pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power dissipation.
Power dissipation for a surface mount device is determined by
The50°C/WfortheD PAKpackageassumestheuseofthe
recommended footprint on a glass epoxy printed circuit board
to achieve a power dissipation of 2.5 watts. There are other
alternatives to achieving higher power dissipation from the
2
T
R
, the maximum rated junction temperature of the die,
, the thermal resistance from the device junction to
ambient; and the operating temperature, T . Using the values
D PAK package. One is to increase the area of the drain pad.
J(max)
θJA
By increasing the area of the drain pad, the power dissipation
can be increased. Although one can almost double the power
dissipation with this method, one will be giving up area on the
printed circuit board which can defeat the purpose of using
surface mount technology.
Another alternative would be to use a ceramic substrate or
an aluminum core board such as Thermal Clad . Using a
board material such as Thermal Clad, an aluminum core
board, the power dissipation can be doubled using the same
footprint.
A
2
provided on the data sheet for the D PAK package, P can be
D
calculated as follows:
T
– T
A
J(max)
R
P
=
D
θJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature T of 25°C, one can
calculate the power dissipation of the device which in this case
is 2.5 watts.
A
150°C – 25°C
P
=
= 2.5 watts
D
50°C/W
Rectifier Device Data
3
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
• When shifting from preheating to soldering, the maximum
temperature gradient shall be 5°C or less.
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
• Always preheat the device.
• The delta temperature between the preheat and soldering
should be 100°C or less.*
• After soldering has been completed, the device should be
allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied during
cooling.
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference shall be a maximum of 10°C.
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
* Due to shadowing and the inability to set the wave height to
2
• The soldering temperature and time shall not exceed
260°C for more than 5 seconds.
incorporate other surface mount components, the D PAK is
not recommended for wave soldering.
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of control
settings that will give the desired heat pattern. The operator
must set temperatures for several heating zones, and a figure
for belt speed. Taken together, these control settings make up
a heating “profile” for that particular circuit board. On
machines controlled by a computer, the computer remembers
these profiles from one operating session to the next. Figure
5 shows a typical heating profile for use when soldering the
the graph shows the actual temperature that might be
experienced on the surface of a test board at or near a central
solder joint. The two profiles are based on a high density and
a low density board. The Vitronics SMD310 convection/in-
frared reflow soldering system was used to generate this
profile. The type of solder used was 62/36/2 Tin Lead Silver
with a melting point between 177–189°C. When this type of
furnace is used for solder reflow work, the circuit boards and
solder joints tend to heat first. The components on the board
are then heated by conduction. The circuit board, because it
has a large surface area, absorbs the thermal energy more
efficiently, then distributes this energy to the components.
Because of this effect, the main body of a component may be
up to 30 degrees cooler than the adjacent solder joints.
2
D PAK to a printed circuit board. This profile will vary among
soldering systems but it is a good starting point. Factors that
can affect the profile include the type of soldering system in
use, density and types of components on the board, type of
solder used, and the type of board or substrate material being
used. This profile shows temperature versus time. The line on
STEP 1
PREHEAT
ZONE 1
“RAMP”
STEP 2
VENT
“SOAK” ZONES 2 & 5
“RAMP”
STEP 3
HEATING
STEP 4
HEATING
ZONES 3 & 6
“SOAK”
STEP 5
HEATING
ZONES 4 & 7
“SPIKE”
STEP 6
VENT
STEP 7
COOLING
205
PEAK AT
SOLDER JOINT
° TO 219°C
200
150
100
°
°
°
°
C
C
C
170°C
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
160°C
150
°
C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
140°C
100°
C
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50
C
TIME (3 TO 7 MINUTES TOTAL)
T
MAX
2
Figure 5. Typical Solder Heating Profile for D PAK
4
Rectifier Device Data
PACKAGE DIMENSIONS
C
E
V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
B
4
INCHES
MILLIMETERS
DIM
A
B
C
D
E
MIN
MAX
0.380
0.405
0.190
0.035
0.055
MIN
8.64
9.65
4.06
0.51
1.14
MAX
9.65
10.29
4.83
0.89
1.40
0.340
0.380
0.160
0.020
0.045
A
S
1
2
3
G
H
J
K
S
0.100 BSC
2.54 BSC
–T–
SEATING
PLANE
0.080
0.018
0.090
0.575
0.045
0.110
0.025
0.110
0.625
0.055
2.03
0.46
2.79
0.64
K
2.29
2.79
J
G
14.60
1.14
15.88
1.40
V
H
D 3 PL
STYLE 3:
PIN 1. ANODE
M
0.13 (0.005)
T
2. CATHODE
3. ANODE
4. CATHODE
CASE 418B–02
ISSUE B
Rectifier Device Data
5
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specificallydisclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
datasheetsand/orspecificationscananddovaryindifferentapplicationsandactualperformancemayvaryovertime. Alloperatingparameters,including“Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
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applicationsintended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
ordeathmayoccur. ShouldBuyerpurchaseoruseMotorolaproductsforanysuchunintendedorunauthorizedapplication,BuyershallindemnifyandholdMotorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and
Opportunity/Affirmative Action Employer.
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Mfax is a trademark of Motorola, Inc.
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