MC10H100FN [MOTOROLA]
Quad 2-Input NOR Gate With Strobe; 四2输入或非门选通
| 型号： | MC10H100FN |
| 厂家： | 
MOTOROLA |
| 描述： | Quad 2-Input NOR Gate With Strobe |
| 文件： | 总3页 (文件大小：101K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SEMICONDUCTOR TECHNICAL DATA
The MC10H100 is a quad NOR gate. Each gate has 3 inputs, two of which
are independent and one of which is tied common to all four gates.
•
•
•
Propagation Delay, 1.0 ns Typical
25 mW Typ/Gate (No Load)
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
Voltage Compensated
MECL 10K–Compatible
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
•
•
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
MAXIMUM RATINGS
FN SUFFIX
PLCC
CASE 775–02
Characteristic
Symbol
Rating
Unit
Vdc
Vdc
mA
Power Supply (V
= 0)
V
EE
–8.0 to 0
CC
Input Voltage (V
= 0)
V
I
0 to V
50
CC
EE
Output Current— Continuous
— Surge
I
out
100
LOGIC DIAGRAM
Operating Temperature Range
T
0 to +75
°C
°C
A
4
5
Storage Temperature Range— Plastic
— Ceramic
T
stg
–55 to +150
–55 to +165
2
3
6
ELECTRICAL CHARACTERISTICS (V
0°
= –5.2 V ±5%) (See Note)
EE
7
9
25°
75°
10
Characteristic
Symbol Min
Max
Min
Max
Min
Max
Unit
14
15
11
Power Supply Current
I
E
—
29
—
26
—
29
mA
12
13
Input Current High
Pin 9
All Other Inputs
I
µA
inH
—
—
900
500
—
—
560
310
—
—
560
310
V
= PIN 1
= PIN 16
= PIN 8
2 = 4 + 5 + 9
CC1
V
V
CC2
Input Current Low
High Output Voltage
Low Output Voltage
High Input Voltage
Low Input Voltage
I
0.5
—
0.5
—
0.3
—
µA
inL
EE
V
–1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc
–1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc
–1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc
–1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc
OH
V
OL
DIP
V
IH
PIN ASSIGNMENT
V
IL
AC PARAMETERS
V
V
CC2
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
CC1
OUT
OUT
Propagation Delay
Pin 9 Only
Exclude Pin 9
t
ns
pd
D
C
D
D
C
C
A
B
OUT
0.65
0.4
1.6
1.3
0.7
0.45
1.7
1.35
0.7
0.5
1.8
1.5
OUT
IN
Rise Time
Fall Time
NOTE:
t
r
0.5
0.5
2.0
2.0
0.5
0.5
2.1
2.1
0.5
0.5
2.2
2.2
ns
ns
A
IN
t
f
A
IN
IN
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed
circuitboard and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through
a 50–ohm resistor to –2.0 volts.
B
IN
IN
B
IN
IN
COMMON
INPUT
V
EE
(A, B, C, D)
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
3/93
Motorola, Inc. 1996
REV 5
MC10H100
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
M
S
S
0.007 (0.180)
T
L–M
N
B
Y BRK
–M–
–N–
M
S
S
0.007 (0.180)
T
L–M
N
U
D
D
–L–
Z
W
20
1
S
S
S
0.010 (0.250)
T
L–M
N
G1
X
V
VIEW D–D
M
M
S
S
S
S
A
R
0.007 (0.180)
0.007 (0.180)
T
L–M
L–M
N
N
Z
T
M
S
S
0.007 (0.180)
T
L–M
N
H
C
K1
E
K
0.004 (0.100)
–T– SEATING
G
J
PLANE
M
S
S
0.007 (0.180)
T
L–M
N
F
VIEW S
G1
VIEW S
S
S
S
0.010 (0.250)
T
L–M
N
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
INCHES
MILLIMETERS
DIM
MIN
MAX
0.395
0.395
0.180
0.110
0.019
MIN
9.78
9.78
4.20
2.29
0.33
MAX
10.03
10.03
4.57
2.79
0.48
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
A
B
C
E
0.385
0.385
0.165
0.090
0.013
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
F
G
H
J
K
R
U
V
W
X
Y
0.050 BSC
1.27 BSC
0.026
0.020
0.025
0.350
0.350
0.042
0.042
0.042
–––
0.032
–––
–––
0.356
0.356
0.048
0.048
0.056
0.020
10
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
–––
2
0.81
–––
–––
9.04
9.04
1.21
1.21
1.42
0.50
10
Z
G1
K1
2
0.310
0.040
0.330
–––
7.88
1.02
8.38
–––
2–27
MOTOROLA
MC10H100
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
–A–
NOTES:
ISSUE V
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
16
1
9
8
–B–
C
L
INCHES
MILLIMETERS
DIM
A
B
C
D
MIN
MAX
0.785
0.295
0.200
0.020
MIN
19.05
6.10
–––
MAX
19.93
7.49
5.08
0.50
0.750
0.240
–––
–T–
SEATING
PLANE
0.015
0.39
K
N
E
0.050 BSC
1.27 BSC
F
0.055
0.065
1.40
1.65
G
H
K
L
M
N
0.100 BSC
2.54 BSC
M
E
0.008
0.125
0.015
0.170
0.21
3.18
0.38
4.31
F
J 16 PL
G
0.300 BSC
7.62 BSC
M
S
0.25 (0.010)
T B
0
15
0
15
D 16 PL
0.25 (0.010)
0.020
0.040
0.51
1.01
M
S
T
A
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
16
1
9
8
B
S
INCHES
MILLIMETERS
DIM
A
B
C
D
F
MIN
MAX
0.770
0.270
0.175
0.021
0.70
MIN
18.80
6.35
3.69
0.39
1.02
MAX
19.55
6.85
4.44
0.53
1.77
F
0.740
0.250
0.145
0.015
0.040
C
L
SEATING
–T–
G
H
J
K
L
0.100 BSC
0.050 BSC
2.54 BSC
1.27 BSC
PLANE
K
M
0.008
0.015
0.130
0.305
10
0.21
0.38
3.30
7.74
10
H
J
0.110
0.295
0
2.80
7.50
0
G
D 16 PL
0.25 (0.010)
M
S
0.020
0.040
0.51
1.01
M
M
T
A
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
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MC10H100/D
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