MC10H117PS [MOTOROLA]
OR-AND/OR-AND-Invert Gate, ECL, PDIP16;型号: | MC10H117PS |
厂家: | MOTOROLA |
描述: | OR-AND/OR-AND-Invert Gate, ECL, PDIP16 栅 |
文件: | 总3页 (文件大小:101K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SEMICONDUCTOR TECHNICAL DATA
The MC10H117 dual 2–wide 2–3–input OR–AND/OR–AND–Invert gate is a
general purpose logic element designed for use in data control, such as digital
multiplexing or data distribution. Pin 9 is common to both gates. This MECL 10H
part is a functional/pinout duplication of the standard MECL 10K family part,
with 100% improvement in propagation delay, and no increase in power–supply
current.
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
•
•
•
Propagation Delay, 1.0 ns Typical
Power Dissipation 100 mW/Gate Typical (same as MECL 10K)
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
FN SUFFIX
PLCC
CASE 775–02
•
•
Voltage Compensated
MECL 10K–Compatible
LOGIC DIAGRAM
MAXIMUM RATINGS
Characteristic
Symbol
Rating
Unit
Vdc
Vdc
mA
4
5
Power Supply (V
= 0)
V
EE
–8.0 to 0
CC
3
2
Input Voltage (V
= 0)
V
I
0 to V
CC
EE
6
7
Output Current— Continuous
— Surge
I
out
50
100
Operating Temperature Range
T
A
0 to +75
°C
9
Storage Temperature Range— Plastic
— Ceramic
T
–55 to +150
–55 to +165
°C
°C
stg
10
11
ELECTRICAL CHARACTERISTICS (V
0°
= –5.2 V ±5%) (See Note)
14
15
EE
25°
75°
12
13
Characteristic
Symbol Min
Max
Min
Max
Min
Max
Unit
Power Supply Current
I
—
29
—
26
—
29
mA
E
V
V
V
= PIN 1
= PIN 16
= PIN 8
CC1
CC2
EE
Input Current High
Pins 4, 5, 12, 13
Pins 6, 7, 10, 11
Pin 9
I
µA
inH
—
—
—
465
545
710
—
—
—
275
320
415
—
—
—
275
320
415
DIP
Input Current Low
High Output Voltage
Low Output Voltage
High Input Voltage
Low Input Voltage
I
0.5
—
0.5
—
0.3
—
µA
inL
PIN ASSIGNMENT
V
OH
–1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc
–1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc
–1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc
–1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc
V
OL
V
A
V
B
B
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
CC1
CC2
OUT
OUT
V
IH
OUT
OUT
V
IL
A
AC PARAMETERS
Propagation Delay
Rise Time
B1
A1
A1
A2
A2
V
t
pd
0.45
0.5
1.35
1.5
0.45
0.5
1.35
1.6
0.5
0.5
0.5
1.5
1.7
1.7
ns
ns
ns
IN
IN
IN
IN
IN
IN
t
r
B1
Fall Time
t
0.5
1.5
0.5
1.6
f
B2
B2
A2
IN
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
afterthermalequilibriumhasbeenestablished.Thecircuitisinatestsocketormountedonaprintedcircuit
board and transverse air flow greater than 500 Iinear fpm is maintained. Outputs are terminated through
a 50–ohm resistor to –2.0 volts.
IN
B2
IN, IN
EE
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
3/93
Motorola, Inc. 1996
REV 5
MC10H117
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
M
S
S
0.007 (0.180)
T
L–M
N
B
Y BRK
–M–
–N–
M
S
S
0.007 (0.180)
T
L–M
N
U
D
D
–L–
Z
W
20
1
S
S
S
0.010 (0.250)
T
L–M
N
G1
X
V
VIEW D–D
M
M
S
S
S
S
A
R
0.007 (0.180)
0.007 (0.180)
T
L–M
L–M
N
N
Z
T
M
S
S
0.007 (0.180)
T
L–M
N
H
C
K1
E
K
0.004 (0.100)
–T– SEATING
G
J
PLANE
M
S
S
0.007 (0.180)
T
L–M
N
F
VIEW S
G1
VIEW S
S
S
S
0.010 (0.250)
T
L–M
N
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
INCHES
MILLIMETERS
DIM
MIN
MAX
0.395
0.395
0.180
0.110
0.019
MIN
9.78
9.78
4.20
2.29
0.33
MAX
10.03
10.03
4.57
2.79
0.48
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
A
B
C
E
0.385
0.385
0.165
0.090
0.013
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
F
G
H
J
K
R
U
V
W
X
Y
0.050 BSC
1.27 BSC
0.026
0.020
0.025
0.350
0.350
0.042
0.042
0.042
–––
0.032
–––
–––
0.356
0.356
0.048
0.048
0.056
0.020
10
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
–––
2
0.81
–––
–––
9.04
9.04
1.21
1.21
1.42
0.50
10
Z
G1
K1
2
0.310
0.040
0.330
–––
7.88
1.02
8.38
–––
MOTOROLA
2–224
MC10H117
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
–A–
NOTES:
ISSUE V
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
16
1
9
8
–B–
C
L
INCHES
MILLIMETERS
DIM
A
B
C
D
MIN
MAX
0.785
0.295
0.200
0.020
MIN
19.05
6.10
–––
MAX
19.93
7.49
5.08
0.50
0.750
0.240
–––
–T–
SEATING
PLANE
0.015
0.39
K
N
E
0.050 BSC
1.27 BSC
F
0.055
0.065
1.40
1.65
G
H
K
L
M
N
0.100 BSC
2.54 BSC
M
E
0.008
0.125
0.015
0.170
0.21
3.18
0.38
4.31
F
J 16 PL
G
0.300 BSC
7.62 BSC
M
S
0.25 (0.010)
T B
0
15
0
15
D 16 PL
0.25 (0.010)
0.020
0.040
0.51
1.01
M
S
T
A
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
16
1
9
8
B
S
INCHES
MILLIMETERS
DIM
A
B
C
D
F
MIN
MAX
0.770
0.270
0.175
0.021
0.70
MIN
18.80
6.35
3.69
0.39
1.02
MAX
19.55
6.85
4.44
0.53
1.77
F
0.740
0.250
0.145
0.015
0.040
C
L
SEATING
–T–
G
H
J
K
L
0.100 BSC
0.050 BSC
2.54 BSC
1.27 BSC
PLANE
K
M
0.008
0.015
0.130
0.305
10
0.21
0.38
3.30
7.74
10
H
J
0.110
0.295
0
2.80
7.50
0
G
D 16 PL
0.25 (0.010)
M
S
0.020
0.040
0.51
1.01
M
M
T
A
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MC10H117/D
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