MC10H162LD [MOTOROLA]
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| 型号： | MC10H162LD |
| 厂家： | 
MOTOROLA |
| 描述： | 暂无描述 解码器 驱动器 逻辑集成电路 |
| 文件： | 总4页 (文件大小：118K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SEMICONDUCTOR TECHNICAL DATA
The MC10H162 provides parallel decoding of a three bit binary word to one
of eight lines. The MC10H162 is useful in high–speed multiplexer/ demultiplexer
applications.
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
The MC10H162 is designed to decode a three bit input word to one of eight
output lines. The MC10H162 output will be high when selected while all other
output are low. The enable inputs, when either or both are high, force all outputs
low.
The MC10H162 is a true parallel decoder. This eliminates unequal parallel
path delay times found in other decoder designs. These devices are ideally
suited for multiplexer/demultiplexer applications.
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
•
•
•
Propagation Delay, 1.0 ns Typical
Power Dissipation, 315 mW Typical (same as MECL 10K)
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
LOGIC DIAGRAM
E0
E1 15
2
6
5
Q0
Q1
•
•
Voltage Compensated
MECL 10K–Compatible
V
V
V
= Pin 1
= Pin 16
= Pin 8
CC1
CC2
EE
4
3
Q2
Q3
A
7
9
MAXIMUM RATINGS
13 Q4
12 Q5
B
Characteristic
Symbol
Rating
Unit
Vdc
Vdc
mA
Power Supply (V
= 0)
V
EE
–8.0 to 0
CC
11 Q6
10 Q7
Input Voltage (V
= 0)
V
I
0 to V
CC
EE
C
14
Output Current— Continuous
— Surge
I
out
50
100
TRUTH TABLE
OUTPUTS
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
Operating Temperature Range
T
0 to +75
°C
A
INPUTS
E0 E1
C
B
A
Storage Temperature Range— Plastic
— Ceramic
T
stg
–55 to +150
–55 to +165
°C
°C
L
L
L
L
L
L
L
L
H
X
L
L
L
L
L
L
L
L
X
H
L
L
L
L
L
H
H
L
L
H
L
H
L
H
L
H
X
X
H
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
H
L
L
ELECTRICAL CHARACTERISTICS (V
0°
= –5.2 V ±5%) (See Note)
EE
L
H
H
H
H
X
X
25°
75°
L
H
H
X
X
Characteristic
Power Supply Current
Input Current High
Input Current Low
High Output Voltage
Low Output Voltage
High Input Voltage
Low Input Voltage
AC PARAMETERS
Symbol Min
Max
84
Min
—
Max
76
Min
—
Max
84
Unit
I
E
—
—
mA
µA
µA
I
465
—
—
275
—
—
275
—
inH
I
0.5
0.5
0.3
inL
DIP
V
OH
–1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc
–1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc
–1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc
–1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc
PIN ASSIGNMENT
V
OL
V
IH
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
V
CC2
E1
CC1
E0
V
IL
Q3
Q2
Q1
Q0
A
C
Q4
Propagation Delay
Pins 7, 9, 14 Only
Pins 2, 15 Only
t
pd
ns
0.7
0.8
2.0
2.3
0.7
0.8
2.1
2.4
0.8
0.9
2.5
2.6
Q5
Q6
Rise Time
Fall Time
t
0.6
0.6
1.8
1.8
0.6
0.6
1.9
1.9
0.6
0.6
2.0
2.0
ns
ns
Q7
B
r
t
f
V
EE
NOTE:
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
afterthermalequilibriumhasbeenestablished.Thecircuitisinatestsocketormountedonaprintedcircuit
board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through
a 50–ohm resistor to –2.0 volts.
3/93
Motorola, Inc. 1996
REV 5
MC10H162
TYPICAL APPLICATIONS
FIGURE 1 — HIGH SPEED 16-BIT MULTIPLEXER/DEMULTIPLEXER
Control Selection
S0
15 14 13 12 11 10
9
8
7
6
5
4
3
2 1 0
S1
MC10H136
C
R
A
B
C
D
E1
E1
C
B
C
B
MC10H164
MC10H164
D0
A
A
D0
S0
S1
S0
S1
MC10H136
C
R
A
B
C
D
C
R
E0
E0
E1
C
B
E1
C
B
MC10H162
MC10H162
Start/Stop
A
A
15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
0
MOTOROLA
2–254
MC10H162
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
M
S
S
0.007 (0.180)
T
L–M
N
B
Y BRK
–M–
–N–
M
S
S
0.007 (0.180)
T
L–M
N
U
D
D
–L–
Z
W
20
1
S
S
S
0.010 (0.250)
T
L–M
N
G1
X
V
VIEW D–D
M
M
S
S
S
S
A
R
0.007 (0.180)
0.007 (0.180)
T
L–M
L–M
N
N
Z
T
M
S
S
0.007 (0.180)
T
L–M
N
H
C
K1
E
K
0.004 (0.100)
–T– SEATING
G
J
PLANE
M
S
S
0.007 (0.180)
T
L–M
N
F
VIEW S
G1
VIEW S
S
S
S
0.010 (0.250)
T
L–M
N
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
INCHES
MILLIMETERS
DIM
MIN
MAX
0.395
0.395
0.180
0.110
0.019
MIN
9.78
9.78
4.20
2.29
0.33
MAX
10.03
10.03
4.57
2.79
0.48
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
A
B
C
E
0.385
0.385
0.165
0.090
0.013
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
F
G
H
J
K
R
U
V
W
X
Y
0.050 BSC
1.27 BSC
0.026
0.020
0.025
0.350
0.350
0.042
0.042
0.042
–––
0.032
–––
–––
0.356
0.356
0.048
0.048
0.056
0.020
10
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
–––
2
0.81
–––
–––
9.04
9.04
1.21
1.21
1.42
0.50
10
Z
G1
K1
2
0.310
0.040
0.330
–––
7.88
1.02
8.38
–––
2–255
MOTOROLA
MC10H162
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
–A–
NOTES:
ISSUE V
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
16
1
9
8
–B–
C
L
INCHES
MILLIMETERS
DIM
A
B
C
D
MIN
MAX
0.785
0.295
0.200
0.020
MIN
19.05
6.10
–––
MAX
19.93
7.49
5.08
0.50
0.750
0.240
–––
–T–
SEATING
PLANE
0.015
0.39
K
N
E
0.050 BSC
1.27 BSC
F
0.055
0.065
1.40
1.65
G
H
K
L
M
N
0.100 BSC
2.54 BSC
M
E
0.008
0.125
0.015
0.170
0.21
3.18
0.38
4.31
F
J 16 PL
G
0.300 BSC
7.62 BSC
M
S
0.25 (0.010)
T B
0
15
0
15
D 16 PL
0.25 (0.010)
0.020
0.040
0.51
1.01
M
S
T
A
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
16
1
9
8
B
S
INCHES
MILLIMETERS
DIM
A
B
C
D
F
MIN
MAX
0.770
0.270
0.175
0.021
0.70
MIN
18.80
6.35
3.69
0.39
1.02
MAX
19.55
6.85
4.44
0.53
1.77
F
0.740
0.250
0.145
0.015
0.040
C
L
SEATING
–T–
G
H
J
K
L
0.100 BSC
0.050 BSC
2.54 BSC
1.27 BSC
PLANE
K
M
0.008
0.015
0.130
0.305
10
0.21
0.38
3.30
7.74
10
H
J
0.110
0.295
0
2.80
7.50
0
G
D 16 PL
0.25 (0.010)
M
S
0.020
0.040
0.51
1.01
M
M
T
A
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specificallydisclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
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MC10H162/D
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