MC10H350LS [MOTOROLA]
ECL to TTL Translator, ECL, CDIP16;型号: | MC10H350LS |
厂家: | MOTOROLA |
描述: | ECL to TTL Translator, ECL, CDIP16 转换器 电平转换器 驱动程序和接口 锁存器 接口集成电路 |
文件: | 总4页 (文件大小:110K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SEMICONDUCTOR TECHNICAL DATA
The MC10H350 is a member of Motorola’s 10H family of high performance
ECL logic. It consists of 4 translators with differential inputs and TTL outputs.
The 3–state outputs can be disabled by applying a HIGH TTL logic level on the
common OE input.
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
The MC10H350 is designed to be used primarily in systems incorporating
both ECL and TTL logic operating off a common power supply. The separate
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
V
power pins are not connected internally and thus isolate the noisy TTL V
CC
runs from the relatively quiet ECL V
CC
runs on the printed circuit board. The
CC
differential inputs allow the H350 to be used as an inverting or noninverting
translator, or a differential line receiver. The H350 can also drive CMOS with the
addition of a pullup resistor.
FN SUFFIX
PLCC
CASE 775–02
•
Propagation Delay, 3.5 ns Typical
•
MECL 10K–Compatible
MAXIMUM RATINGS
Characteristic
= Gnd)
Symbol
Rating
7.0
Unit
LOGIC DIAGRAM
Power Supply (V
EE
V
Vdc
CC
9
2
Operating Temperature Range
T
A
0 to +75
°C
Storage Temperature Range — Plastic
— Ceramic
T
–55 to +150
–55 to +165
°C
°C
stg
3
4
ELECTRICAL CHARACTERISTICS (V
= 5.0 V ±5%) (See Note 1)
CC
T
= 0°C to 75°C
A
5
6
7
Characteristic
Symbol
Min
Max
Unit
Power Supply Current
Input Current High
Input Current Low
TTL
ECL
I
—
—
20
12
mA
CC
11
12
10
15
Pin 9
Others
I
—
—
20
50
µA
IH
I
INH
Pin 9
Others
I
—
—
–0.6
50
mA
µA
IL
13
14
I
INL
Input Voltage High
Pin 9
Pin 9
V
2.0
—
—
0.8
—
Vdc
Vdc
mV
IH
V
(+5.0 VDC) = PINS 1 AND 16
GND = PIN 8
CC
Input Voltage Low
V
IL
Differential Input Voltage (1)
V
350
DIFF
Pins 3–6, 11–14 (1)
Pins 3–6, 11–14
Voltage Common Mode
Output Voltage High
V
2.8
2.7
—
V
Vdc
Vdc
Vdc
mA
µA
CM
CC
DIP
PIN ASSIGNMENT
V
—
0.5
OH
I
= 3.0 mA
OH
Output Voltage Low
= 20 mA
ECL V
A
TTL V
C
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
I
CC
CC
OL
I
OL
Short Circuit Current
= 0 V
OUT
IN
OUT
–60
—
–150
50
OS
V
OUT
Output Disable Current High
= 2.7 V
C
C
D
A
IN
I
OZH
A
V
IN
IN
OUT
Output Disable Current Low
= 0.5 V
I
—
–50
µA
OZL
B
IN
IN
V
OUT
(1) Common mode input voltage to pins 3–4, 5–6, 11–12, 13–14 must be between the values of 2.8
V and 5.0 V. This common mode input voltage range includes the differential input swing.
D
D
B
IN
IN
(2) For single ended use, apply 3.75 V (V ) to either input depending on output polarity required.
BB
B
OUT
OUT
Signal level range to other input is 3.3 V to 4.2 V.
(3) Any unused gates should have the inverting inputs tied to V
to ground to prevent output glitching.
and the non–inverting inputs tied
CC
OE
GND
(4) 1.0 V to 2.0 V w/50 pF into 500 ohms.
*Positive Emitter Coupled Logic
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
9/96
Motorola, Inc. 1996
REV 6
MC10H350
ELECTRICAL CHARACTERISTICS (V
= 5.0 V ±5%) (See Notes 1 & 4)
CC
T
= 0°C to 75°C
A
Characteristic
Symbol
Min
Max
Unit
AC PARAMETERS (C = 50 pF) (V
= 5.0 ± 5%) (T = 0°C to 75°C)
A
L
CC
Propagation Delay
Data
t
1.5
5.0
ns
pd
Rise Time
t
0.3
0.3
1.6
1.6
ns
ns
ns
r
Fall Time
t
f
Output Disable Time
t
t
2.0
2.0
6.0
6.0
pdLZ
pdHZ
Output Enable Time
t
t
2.0
2.0
8.0
8.0
ns
pdZL
pdZH
3–STATE SWITCHING WAVEFORMS
3–STATE OUTPUT LOW ENABLE AND
DISABLE TIMES
3–STATE OUTPUT HIGH ENABLE AND
DISABLE TIMES
OE
OE
1.5 V
1.5 V
1.5 V
1.5 V
T
T
T
T
PHZ
PZL
PLZ
PZH
V
OH
≈ 3.5 V
V
OUT
1.5 V
1.5 V
V
OUT
V
OL
0.3 V
0.3 V
TEST LOAD
+7.0 V
OPEN
T
,T
PZL PLZ
,O,C,
ALL OTHER
500
Ω
Ω
D.U.T
.
500
50 PF
*INCLUDES JIG AND PROBE CAPACITANCE
Application Note: Pin 9 is an OE and the 10H350 is disabled when OE is at V or higher.
IH
MOTOROLA
2–58
MC10H350
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
M
S
S
0.007 (0.180)
T
L–M
N
B
Y BRK
–M–
–N–
M
S
S
0.007 (0.180)
T
L–M
N
U
D
D
–L–
Z
W
20
1
S
S
S
0.010 (0.250)
T
L–M
N
G1
X
V
VIEW D–D
M
M
S
S
S
S
A
R
0.007 (0.180)
0.007 (0.180)
T
L–M
L–M
N
N
Z
T
M
S
S
0.007 (0.180)
T
L–M
N
H
C
K1
E
K
0.004 (0.100)
–T– SEATING
G
J
PLANE
M
S
S
0.007 (0.180)
T
L–M
N
F
VIEW S
G1
VIEW S
S
S
S
0.010 (0.250)
T
L–M
N
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
INCHES
MILLIMETERS
DIM
MIN
MAX
0.395
0.395
0.180
0.110
0.019
MIN
9.78
9.78
4.20
2.29
0.33
MAX
10.03
10.03
4.57
2.79
0.48
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
A
B
C
E
0.385
0.385
0.165
0.090
0.013
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
F
G
H
J
K
R
U
V
W
X
Y
0.050 BSC
1.27 BSC
0.026
0.020
0.025
0.350
0.350
0.042
0.042
0.042
–––
0.032
–––
–––
0.356
0.356
0.048
0.048
0.056
0.020
10
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
–––
2
0.81
–––
–––
9.04
9.04
1.21
1.21
1.42
0.50
10
Z
G1
K1
2
0.310
0.040
0.330
–––
7.88
1.02
8.38
–––
2–59
MOTOROLA
MC10H350
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
–A–
NOTES:
ISSUE V
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
16
1
9
8
–B–
C
L
INCHES
MILLIMETERS
DIM
A
B
C
D
MIN
MAX
0.785
0.295
0.200
0.020
MIN
19.05
6.10
–––
MAX
19.93
7.49
5.08
0.50
0.750
0.240
–––
–T–
SEATING
PLANE
0.015
0.39
K
N
E
0.050 BSC
1.27 BSC
F
0.055
0.065
1.40
1.65
G
H
K
L
M
N
0.100 BSC
2.54 BSC
M
E
0.008
0.125
0.015
0.170
0.21
3.18
0.38
4.31
F
J
16 PL
0.25 (0.010)
G
0.300 BSC
7.62 BSC
M
S
T
B
0
15
0
15
D 16 PL
0.25 (0.010)
0.020
0.040
0.51
1.01
M
S
T
A
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
16
1
9
8
B
S
INCHES
MILLIMETERS
DIM
A
B
C
D
F
MIN
MAX
0.770
0.270
0.175
0.021
0.70
MIN
18.80
6.35
3.69
0.39
1.02
MAX
19.55
6.85
4.44
0.53
1.77
F
0.740
0.250
0.145
0.015
0.040
C
L
SEATING
–T–
G
H
J
K
L
0.100 BSC
0.050 BSC
2.54 BSC
1.27 BSC
PLANE
K
M
0.008
0.015
0.130
0.305
10
0.21
0.38
3.30
7.74
10
H
J
0.110
0.295
0
2.80
7.50
0
G
D 16 PL
0.25 (0.010)
M
S
0.020
0.040
0.51
1.01
M
M
T
A
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
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MC10H350/D
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