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MC13025DR2 [MOTOROLA]

1-BAND, AUDIO TUNER, PDSO16, PLASTIC, SO-16;
MC13025DR2
型号： MC13025DR2
厂家： MOTOROLA    MOTOROLA
描述：

1-BAND, AUDIO TUNER, PDSO16, PLASTIC, SO-16

放大器 光电二极管 商用集成电路
文件： 总42页 (文件大小：943K)
中文：  中文翻译
下载：  下载PDF数据表文档文件
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ETR FRONT END for  
C–QUAM AM STEREO  
The MC13025 is the complementary ETR Electronically Tuned Radio  
front–end for the second generation MC13022 C–QUAM AM stereo IF and  
decoder. The MC13025 provides a high dynamic range mixer, voltage  
controlled oscillator, and first IF that with the MC13022 and synthesizer form  
a complete digitally controlled AM stereo tuner system. This system in turn  
may drive a dual channel audio processor and high power amplifiers for car  
radio or home stereo applications. Other applications include portable radio  
“boom boxes”, table radios and component stereo systems.  
SEMICONDUCTOR  
TECHNICAL DATA  
P SUFFIX  
PLASTIC PACKAGE  
CASE 648  
16  
• Operates Over a Wide Range of Supply Voltages: 6.0 V  
CC  
to 10 V  
CC  
1
• Wideband AGC Voltage to RF Amp for Extended Dynamic Range  
• Buffered VCO Output to Frequency Synthesizer  
D SUFFIX  
PLASTIC PACKAGE  
CASE 751B  
16  
1
• No External RF Amp Needed for Most Home Stereo and  
(SO–16)  
Portable Radios  
• IF Drive Output Matches the MC13022 for Optimum Performance  
• VCO Operates at Four Times Local Oscillator Injection Frequency  
PIN CONNECTIONS  
Wideband  
AGC Out  
Wideband  
AGC  
V
1
2
3
4
5
6
7
8
16  
CC  
Wideband  
AGC In  
B
E
C
Base  
15  
14  
ORDERING INFORMATION  
Operating  
In  
Mixer  
PNP  
Emitter  
Mixer  
Temperature Range  
Device  
MC13025D  
MC13025P  
Package  
SO–16  
Out  
13 Collector  
Gnd  
Gnd  
V
12  
11  
T
= –40° to +85°C  
A
VCLO  
4x LO  
÷ 4  
IF Amp In  
Plastic DIP  
In  
CLO  
3V Ref  
In  
10 LO Output  
N.C. Open  
LO  
Buffer  
IF Amp Out  
9
IF Amp  
(Top View)  
Simplified Block Diagram  
RF Amplifier  
Mixer  
IF Amplifier  
Right Channel  
Audio Out  
Varactor  
Tuned  
Circuit  
MC13022  
Wideband  
AGC  
Variable Bandwidth IF  
Amplifier with Notch Filter  
and C–QUAM AM  
Stereo Decoder  
Buffer  
÷ 4  
Left Channel  
Voltage  
Controlled  
Oscillator  
Pin Attn.  
Driver  
MC13025  
Varactor  
Tuned  
Circuit  
Frequency  
Synthesizer  
Stereo Indicator  
This device contains 93 active transistors.  
9–91  
MOTOROLA ANALOG IC DEVICE DATA  
MC13025  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
12  
Unit  
Vdc  
°C  
Supply Voltage  
V
CC  
Ambient Operating Temperature  
Storage Temperature  
Junction Temperature  
T
A
–40 to +85  
–65 to +150  
150  
T
stg  
°C  
T
J
°C  
Power Dissipation  
Derate above 25°C  
P
D
1.25  
10  
W
mW/°C  
ELECTRICAL CHARACTERISTICS (T = 25°C, 8.0 V  
test circuit as shown in Figure 2.)  
A
CC  
Characteristics  
Supply Current  
Pin  
1
Min  
7.0  
Typ  
8.2  
Max  
10  
Unit  
mAdc  
µAdc  
3.0 V Ref, Current In  
7
–50  
0.9  
7.0  
90  
IF Out DC Current  
8
1.05  
0.77  
330  
1.2  
0.82  
390  
mAdc  
mAdc  
mVrms  
Mixer DC Current Output  
4
0.70  
270  
IF Output Amplitude, RF Input  
@ 1.7 MHz, 31.6 mV  
8
Local Oscillator Output  
10  
16  
160  
0.5  
181  
1.0  
220  
1.5  
–
mVrms  
mAdc  
Wideband AGC Pull–Down Current  
PNP Darlington (DC Beta @ 5.0 mA I )  
1000  
–0.13  
2500  
–0.06  
E
PNP Darlington Collector Leakage (V = V = 8.0 V)  
13  
–
µAdc  
E
B
Figure 1. Test Circuit  
V
CC  
47 k  
10 µF  
Wideband  
AGC Out  
1
V
16  
15  
14  
13  
12  
11  
WB Out  
CC  
0.01  
0.01  
0.01  
Wideband  
AGC In  
PNP  
Base  
2
3
4
5
6
7
8
PNP Base  
WB In  
Mix In  
50  
PNP  
Emit  
PNP Emitter  
PNP Collector  
Mixer In  
0.01  
1.8 k  
PNP  
Coll  
50  
Mixer Out  
Gnd  
3.0  
mH  
Toko 126ANS–7594HM  
Toko  
Gnd  
A119ANS–10287RS  
1
6
0.01  
IF In  
(4x) V  
CLO  
430  
SFG450E  
3
4
22 k  
1.0 k  
0.1  
Osc  
Tune  
3.0 V  
Ref  
In  
LO 10  
510  
0.01  
MVAM125  
3.3 k  
IF Out  
NC  
9
120  
1.0 mH  
LO  
0.01  
IF Out  
10 µF  
LO Load  
10 k  
100  
9–92  
MOTOROLA ANALOG IC DEVICE DATA  
Figure 2. Cascode RF ETR Application  
(NRSC – Notch Filters – Optional Pilot High Pass)  
V
CC  
R18  
10  
C36  
0.22  
C37  
100 µF  
C18  
0.01  
C19  
10 µF  
C34  
0.001  
C21  
C17  
0.01  
MC13022  
T4  
1
2
3
4
E
I 28  
3
2
1
T5  
6
4
3
1
0.001  
9
NC  
IF Out  
8
7
2
Dec In  
Reg  
AGC  
L–R 27  
R20  
13 k  
C1  
R19  
47  
C35  
R15  
3.0 V  
In  
0.001  
10 LO Out  
LO  
R16  
4.7 k  
Q
26  
25  
C16  
0.02  
CF1  
3.3 k  
0.001  
C20  
47µF  
C22  
10 µF  
C38  
0.001  
11  
V
IF In  
6
T3  
CLO  
V
CC  
6
4
1
3
R32  
2.2 k  
C23  
C2  
430  
10 µF  
C24  
0.01  
12 Gnd  
Gnd  
Mixer Out  
Mixer In  
5
4
3
2
1
Blend  
5
6
IF In  
SS  
Loop 24  
Blend 23  
C39  
47 µF  
R21  
100 k  
MC13025  
R14  
PNP  
13  
Coil  
V3  
R43  
1.8 k  
C25  
1.0 µF  
Interstation  
Mute  
Q3  
MPS6515  
C40  
20 µF  
V1235H3  
PNP  
14  
100 k  
Emit  
7
8
L Filter  
In  
Gnd 22  
Pilot In 21  
Osc Fb 20  
Osc In 19  
C3  
5–25  
Notch Filters  
C14  
0.01  
WB AGC  
In  
PNP  
15  
R33  
1.0 k  
R22  
44.2 k  
Base  
Stereo  
C15  
68  
C4  
16  
R13  
8.2 k  
C26  
360  
C28  
720  
R17  
WB AGC  
Out  
16  
V
CC  
X1  
C12  
9
Ctr  
L
R23  
C11  
C13  
5–25  
3.3 k  
LED V  
CC  
0.4 pF  
R34  
5–25  
C27  
360  
22.1 k  
R24  
44.2 k  
R2  
22 k  
LED  
R6  
T1  
T2  
3.9 k  
C41  
51  
3
1
6
4
10  
11  
6
4
1
3
C42  
30 k  
R8  
0.001  
3.3 k  
V2  
LV1235M3  
R
Pilot DET In 18  
Pilot I 17  
R25  
44.2 k  
V1  
C44  
1.0 µF  
C29  
360  
JU1  
C43 0.22  
JU3  
C31  
720  
LV1235M3  
R7  
R44  
22 k  
Q2  
R9  
18  
R10  
18  
Force  
Stereo  
12 Ctr  
R26  
MPS6515  
C5  
3.3 µF  
C6  
33 µF  
1.0 k  
R5  
C45  
10 µF  
C30  
360  
22.1 k  
R27  
44.2 k  
C10  
8200  
R11  
10 k  
13 In  
Pilot Q 16  
V
CC  
C46  
0.47  
Filter  
Control  
14 R Filter  
Filter Cntl 15  
C9  
0.1  
C7  
R45  
Q1  
1
J310  
0.01  
L1  
3.0 mH  
R3  
100 k  
C55  
C51  
0.22  
C52  
0.22  
R12  
1.0 k  
R46  
Hi–Pass  
3
C8  
R4  
Hi–Pass  
NRSC  
NRSC  
0.01  
220  
Filt  
R28  
Filt  
R30  
R36  
150 k  
R30  
2.4 k  
R28  
2.4 k  
R35  
150 k  
C49  
0.22  
C50  
Coils  
Toko Part Nos.  
0.22  
L1 Ant. Input  
T1,2 RF Input  
T3 VCO  
T4 IF  
126ANS–7594HM  
A78RS–11081RS  
A119ANS–19035RS  
A7NRES–T11148N  
7NRES–T1370Y  
C54  
C53  
R31  
5.6 k  
R29  
5.6 k  
Q4  
MPSA18  
Q5  
MPSA18  
C48  
0.0022  
0.22  
R38  
0.22  
R37  
C33  
0.015  
C47  
0.0022  
C32  
0.015  
T5 IF  
8.2 k  
8.2 k  
R41  
680  
R39  
39 k  
R40  
39 k  
R42  
680  
Ceramic Res.  
MURATA  
Signal Strength and  
Stop Sense  
X1  
CF1  
CSA3.60MGF103  
SFG450E or F  
SFH450E or F  
Antenna  
Left Audio  
Right Audio  
Tuning  
Voltage  
Optional Filtering  
Tape and Reel Options  
In Brief . . .  
Motorola offers the convenience of Tape and Reel  
packaging for our growing family of standard integrated circuit  
products. Reels are available to support the requirements of  
both first and second generation pick–and–place equipment.  
The packaging fully conforms to the latest EIA–481A  
specification. The antistatic embossed tape provides a  
secure cavity, sealed with a peel–back cover tape.  
Page  
Tape and Reel Configurations . . . . . . . . . . . . . . . . . . . . . 12–2  
Tape and Reel Information Table . . . . . . . . . . . . . . . . . . . 12–4  
Analog MPQ Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12–5  
12–1  
MOTOROLA ANALOG IC DEVICE DATA  
Tape and Reel Configurations  
Mechanical Polarization  
SOIC and Micro–8  
DEVICES  
PLCC DEVICES  
Typical  
Typical  
PIN 1  
User Direction of Feed  
User Direction of Feed  
2
DPAK and D PAK  
DEVICES  
Typical  
User Direction of Feed  
SOT–23 (5 Pin)  
DEVICES  
Typical  
SOT–89 (3 Pin)  
DEVICES  
Typical  
SOT–89 (5 Pin)  
DEVICES  
Typical  
User Direction of Feed  
User Direction of Feed  
User Direction of Feed  
12–2  
MOTOROLA ANALOG IC DEVICE DATA  
Tape and Reel Configurations (continued)  
TO–92 Reel Styles  
STYLE A  
(Preferred)  
STYLE E  
Carrier Strip  
Carrier Strip  
Rounded  
Side  
Flat Side  
Adhesive Tape  
Adhesive Tape  
Feed  
Feed  
Rounded side of transistor and adhesive tape visible.  
Flat side of transistor and adhesive tape visible.  
TO–92 Ammo Pack Styles  
STYLE P  
(Preferred)  
STYLE M  
Adhesive Tape On  
Top Side  
Adhesive Tape On  
Top Side  
Feed  
Feed  
Rounded Side  
Flat Side  
Carrier  
Strip  
Carrier  
Strip  
Flat side of transistor and  
adhesive tape visible.  
Rounded side of transistor and  
adhesive tape visible.  
Label  
Label  
Style P ammo pack is equivalent to Styles A and B of reel pack  
dependent on feed orientation from box.  
Style M ammo pack is equivalent to Style E of reel  
pack dependent on feed orientation from box.  
TO–92 EIA Radial Tape in Fan Fold Box or On Reel  
H2A  
H2A  
H2B  
H2B  
H
W2  
H4  
H5  
T1  
L1  
H1  
W1  
W
L
T
T2  
F1  
F2  
D
P2  
P1  
P2  
P
12–3  
MOTOROLA ANALOG IC DEVICE DATA  
Tape and Reel Information Table  
(1)  
Devices  
per Reel  
Tape Width  
(mm)  
Reel Size  
(inch)  
Device  
Suffix  
Package  
SO–8, SOP–8  
SO–14  
SO–16  
12  
16  
16  
2,500  
2,500  
2,500  
13  
13  
13  
R2  
R2  
R2  
SO–16L, SO–8+8L WIDE  
SO–20L WIDE  
SO–24L WIDE  
SO–28L WIDE  
SO–28L WIDE  
16  
24  
24  
24  
32  
1,000  
1,000  
1,000  
1,000  
1,000  
13  
13  
13  
13  
13  
R2  
R2  
R2  
R2  
R3  
Micro–8  
12  
2,500  
13  
R2  
PLCC–20  
PLCC–28  
PLCC–44  
16  
24  
32  
1,000  
500  
500  
13  
13  
13  
R2  
R2  
R2  
PLCC–52  
PLCC–68  
PLCC–84  
32  
44  
44  
500  
250  
250  
13  
13  
13  
R2  
R2  
R2  
(2)  
TO–226AA (TO–92)  
18  
2,000  
13  
RA, RE, RP, or RM  
(Ammo Pack) only  
DPAK  
16  
24  
8
2,500  
800  
13  
13  
7
RK  
R4  
TR  
T1  
2
D PAK  
SOT–23 (5 Pin)  
3,000  
1,000  
SOT–89 (3/5 Pin)  
(1)  
12  
7
Minimum order quantity is 1 reel. Distributors/OEM customers may break lots or reels at their option, however broken reels may not be returned.  
Integrated circuits in TO–226AA packages are available in Styes A and E only, with optional “Ammo Pack” (Suffix RP or RM). The RA and RP configurations  
are preferred. For ordering information please contact your local Motorola Semiconductor Sales Office.  
(2)  
12–4  
MOTOROLA ANALOG IC DEVICE DATA  
Analog MPQ Table  
Tape/Reel and Ammo Pack  
Package Type  
Package Code  
MPQ  
PLCC  
Case 775  
Case 776  
Case 777  
0802  
0804  
0801  
1000/reel  
500/reel  
500/reel  
SOIC  
Case 751  
Case 751A  
Case 751B  
Case 751G  
Case 751D  
Case 751E  
Case 751F  
0095  
0096  
0097  
2003  
2005  
2008  
2009  
2500/reel  
2500/reel  
2500/reel  
1000/reel  
1000/reel  
1000/reel  
1000/reel  
Micro–8  
Case 846A  
–
2500/reel  
TO–92  
Case 29  
Case 29  
0031  
0031  
2000/reel  
2000/Ammo Pack  
DPAK  
Case 369A  
–
–
–
–
–
2500/reel  
800/reel  
2
D PAK  
Case 936  
SOT–23 (5 Pin)  
Case 1212  
3000/reel  
1000/reel  
1000/reel  
SOT–89 (3 Pin)  
Case 1213  
SOT–89 (5 Pin)  
Case 1214  
12–5  
MOTOROLA ANALOG IC DEVICE DATA  
12–6  
MOTOROLA ANALOG IC DEVICE DATA  
Packaging Information  
In Brief . . .  
The packaging availability for each device type is indicated  
on the individual data sheets and the Selector Guide. All of the  
outline dimensions for the packages are given in this section.  
The maximum power consumption an integrated circuit  
can tolerate at a given operating ambient temperature can be  
found from the equation:  
T
– T  
A
J(max)  
P
=
D(TA)  
R
θJA(Typ)  
where:  
P
= Power Dissipation allowable at a given  
operating ambient temperature. This must  
be greater than the sum of the products of  
the supply voltages and supply currents at  
the worst case operating condition.  
D(TA)  
T
= Maximum operating Junction Temperature  
as listed in the Maximum Ratings Section.  
J(max)  
See individual data sheets for T  
information.  
J(max)  
T
A
= Maximum desired operating Ambient  
Temperature  
R
= Typical Thermal Resistance Junction-to-  
Ambient  
θJA(Typ)  
13–1  
MOTOROLA ANALOG IC DEVICE DATA  
Case Outline Dimensions  
LP, P, Z SUFFIX  
CASE 29-04  
NOTES:  
Plastic Package  
(TO-226AA/TO-92)  
ISSUE AD  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. CONTOUR OF PACKAGE BEYOND DIMENSION R  
IS UNCONTROLLED.  
4. DIMENSION F APPLIES BETWEEN P AND L.  
DIMENSION D AND J APPLY BETWEEN L AND K  
MINIMUM. LEAD DIMENSION IS UNCONTROLLED  
IN P AND BEYOND DIMENSION K MINIMUM.  
A
B
R
P
INCHES  
DIM MIN MAX  
MILLIMETERS  
L
MIN  
4.45  
4.32  
3.18  
0.41  
0.41  
1.15  
2.42  
0.39  
MAX  
5.20  
5.33  
4.19  
0.55  
0.48  
1.39  
2.66  
0.50  
–––  
F
SEATING  
PLANE  
A
B
C
D
F
G
H
J
0.175 0.205  
0.170 0.210  
0.125 0.165  
0.016 0.022  
0.016 0.019  
0.045 0.055  
0.095 0.105  
0.015 0.020  
K
1
2
3
D
X X  
G
K
L
N
P
0.500  
0.250  
0.080 0.105  
––– 0.100  
––– 12.70  
–––  
J
H
V
6.35  
2.04  
–––  
2.93  
3.43  
–––  
2.66  
2.54  
–––  
C
SECTION X–X  
R
V
0.115  
0.135  
–––  
–––  
1
–––  
N
N
KC, T SUFFIX  
CASE 221A-06  
Plastic Package  
ISSUE Y  
SEATING  
PLANE  
–T–  
C
NOTES:  
T
F
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
–B–  
S
2. CONTROLLING DIMENSION: INCH.  
INCHES  
DIM MIN MAX  
0.560 0.625 14.23 15.87  
MILLIMETERS  
MIN MAX  
4
4
Q
A
A
B
C
D
F
U
0.380 0.420  
0.140 0.190  
0.020 0.045  
0.139 0.155  
0.100 BSC  
9.66 10.66  
1
2
3
3.56  
0.51  
3.53  
4.82  
1.14  
3.93  
H
L
–Y–  
G
H
J
2.54 BSC  
K
––– 0.280  
0.012 0.045  
–––  
0.31  
7.11  
1.14  
1
2
3
K
L
N
Q
R
S
0.500 0.580 12.70 14.73  
R
0.045 0.070  
0.200 BSC  
1.15  
5.08 BSC  
1.77  
J
0.100 0.135  
2.54  
2.04  
0.51  
5.97  
0.00  
3.42  
2.92  
1.39  
6.47  
1.27  
G
0.080  
0.115  
D 3 PL  
0.020 0.055  
0.235 0.255  
0.000 0.050  
T
U
M
M
0.25 (0.010)  
B
Y
N
13–2  
MOTOROLA ANALOG IC DEVICE DATA  
TH SUFFIX  
CASE 314A-03  
Plastic Package  
ISSUE D  
SEATING  
PLANE  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
–T–  
Y14.5M, 1982.  
B
–P–  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION D DOES NOT INCLUDE  
INTERCONNECT BAR (DAMBAR) PROTRUSION.  
DIMENSION D INCLUDING PROTRUSION SHALL  
NOT EXCEED 0.043 (1.092) MAXIMUM.  
C
E
Q
OPTIONAL  
CHAMFER  
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN MAX  
A
U
F
A
B
C
D
E
F
0.572 0.613 14.529 15.570  
0.390 0.415 9.906 10.541  
0.170 0.180 4.318 4.572  
0.025 0.038 0.635 0.965  
0.048 0.055 1.219 1.397  
0.570 0.585 14.478 14.859  
L
K
1
5
G
J
K
L
Q
S
0.067 BSC  
1.702 BSC  
G
0.015 0.025 0.381 0.635  
0.730 0.745 18.542 18.923  
0.320 0.365 8.128 9.271  
0.140 0.153 3.556 3.886  
0.210 0.260 5.334 6.604  
0.468 0.505 11.888 12.827  
5X J  
S
5X D  
M
M
0.014 (0.356)  
T P  
U
NOTES:  
T, TV SUFFIX  
CASE 314B-05  
Plastic Package  
ISSUE J  
C
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
B
–P–  
OPTIONAL  
CHAMFER  
Q
F
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION D DOES NOT INCLUDE  
INTERCONNECT BAR (DAMBAR) PROTRUSION.  
DIMENSION D INCLUDING PROTRUSION SHALL  
NOT EXCEED 0.043 (1.092) MAXIMUM.  
E
A
INCHES  
DIM MIN MAX  
A
B
C
D
E
MILLIMETERS  
MIN MAX  
0.613 14.529 15.570  
0.415 9.906 10.541  
U
L
S
V
0.572  
0.390  
0.170  
0.025  
0.048  
0.850  
0.067 BSC  
0.166 BSC  
0.015  
0.900  
0.320  
0.320 BSC  
0.140  
–––  
0.468  
–––  
0.090  
W
K
0.180 4.318  
0.038 0.635  
0.055 1.219  
4.572  
0.965  
1.397  
F
0.935 21.590 23.749  
1
G
H
J
K
L
N
Q
S
1.702 BSC  
4.216 BSC  
5
0.025 0.381  
1.100 22.860 27.940  
0.635  
5X J  
0.365 8.128  
9.271  
G
M
0.24 (0.610)  
T
H
N
8.128 BSC  
5X D  
0.153 3.556  
0.620  
0.505 11.888 12.827  
0.735 ––– 18.669  
0.110 2.286 2.794  
3.886  
––– 15.748  
M
M
0.10 (0.254)  
T P  
U
V
W
SEATING  
PLANE  
–T–  
B
–Q–  
SEATING  
PLANE  
T SUFFIX  
–T–  
CASE 314C–01  
Plastic Package  
ISSUE A  
C
E
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
A
K
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION D DOES NOT INCLUDE  
INTERCONNECT BAR (DAMBAR) PROTRUSION.  
DIMENSION D INCLUDING PROTRUSION SHALL  
NOT EXCEED 10.92 (0.043) MAXIMUM.  
1
2 3 4 5  
INCHES  
DIM MIN MAX  
0.625 15.59  
MILLIMETERS  
L
MIN  
MAX  
15.88  
10.67  
4.83  
1
A
B
C
D
E
G
J
0.610  
0.380  
0.160  
0.020  
0.035  
5
0.420  
0.190  
0.040  
0.055  
9.65  
4.06  
0.51  
0.89  
1.02  
1.40  
0.067 BSC  
1.702 BSC  
0.015  
0.500  
0.355  
0.139  
0.025  
––– 12.70  
0.370  
0.147  
0.38  
0.64  
–––  
9.40  
3.73  
K
L
Q
9.02  
3.53  
G
D 5 PL  
M
M
0.356 (0.014)  
T Q  
J
13–3  
MOTOROLA ANALOG IC DEVICE DATA  
T, T1 SUFFIX  
CASE 314D-03  
Plastic Package  
ISSUE D  
SEATING  
PLANE  
–T–  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
C
–Q–  
B
Y14.5M, 1982.  
E
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION D DOES NOT INCLUDE  
INTERCONNECT BAR (DAMBAR) PROTRUSION.  
DIMENSION D INCLUDING PROTRUSION SHALL  
NOT EXCEED 10.92 (0.043) MAXIMUM.  
U
A
S
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN MAX  
L
A
B
C
D
E
G
H
J
0.572  
0.390  
0.170  
0.025  
0.048  
0.613 14.529 15.570  
0.415 9.906 10.541  
0.180 4.318  
0.038 0.635  
0.055 1.219  
1
2
3
4 5  
K
4.572  
0.965  
1.397  
0.067 BSC  
1.702 BSC  
0.087  
0.015  
1.020  
0.320  
0.140  
0.105  
0.543  
0.112 2.210  
0.025 0.381  
2.845  
0.635  
1
2
3
4
K
L
Q
U
S
1.065 25.908 27.051  
5
0.365 8.128  
0.153 3.556  
0.117 2.667  
9.271  
3.886  
2.972  
J
G
H
0.582 13.792 14.783  
D 5 PL  
M
M
0.356 (0.014)  
T Q  
DT-1 SUFFIX  
CASE 369-07  
Plastic Package  
(DPAK)  
C
B
R
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
V
ISSUE K  
E
INCHES  
DIM MIN MAX  
MILLIMETERS  
4
MIN  
5.97  
6.35  
2.19  
0.69  
0.84  
0.94  
MAX  
6.35  
6.73  
2.38  
0.88  
1.01  
1.19  
4
A
B
C
D
E
F
G
H
J
0.235 0.250  
0.250 0.265  
0.086 0.094  
0.027 0.035  
0.033 0.040  
0.037 0.047  
0.090 BSC  
0.034 0.040  
0.018 0.023  
0.350 0.380  
0.175 0.215  
0.050 0.090  
0.030 0.050  
A
1
2
3
S
–T–  
SEATING  
PLANE  
2.29 BSC  
1
2
3
K
0.87  
0.46  
8.89  
4.45  
1.27  
0.77  
1.01  
0.58  
9.65  
5.46  
2.28  
1.27  
K
R
S
J
F
V
H
D 3 PL  
G
M
0.13 (0.005)  
T
DT SUFFIX  
CASE 369A-13  
Plastic Package  
(DPAK)  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
SEATING  
PLANE  
–T–  
C
B
ISSUE Y  
INCHES  
DIM MIN MAX  
MILLIMETERS  
E
V
R
MIN  
5.97  
6.35  
2.19  
0.69  
0.84  
0.94  
MAX  
6.35  
6.73  
2.38  
0.88  
1.01  
1.19  
A
B
C
D
E
F
G
H
J
K
L
R
S
U
V
Z
0.235 0.250  
0.250 0.265  
0.086 0.094  
0.027 0.035  
0.033 0.040  
0.037 0.047  
0.180 BSC  
4
4
Z
1
A
K
S
1
2
3
3
4.58 BSC  
U
0.034 0.040  
0.018 0.023  
0.87  
0.46  
2.60  
1.01  
0.58  
2.89  
0.102  
0.114  
0.090 BSC  
0.175 0.215  
0.020 0.050  
2.29 BSC  
F
J
4.45  
0.51  
0.51  
0.77  
3.51  
5.46  
1.27  
–––  
1.27  
–––  
L
H
0.020  
0.030 0.050  
0.138 –––  
–––  
D 2 PL  
M
G
0.13 (0.005)  
T
13–4  
MOTOROLA ANALOG IC DEVICE DATA  
DP1, N, P, P1 SUFFIX  
CASE 626-05  
Plastic Package  
ISSUE K  
8
5
NOTES:  
1. DIMENSION L TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
2. PACKAGE CONTOUR OPTIONAL (ROUND OR  
SQUARE CORNERS).  
–B–  
1
4
3. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
MILLIMETERS  
DIM MIN MAX  
9.40 10.16 0.370 0.400  
INCHES  
MIN MAX  
F
A
B
C
D
F
–A–  
NOTE 2  
6.10  
3.94  
0.38  
1.02  
6.60 0.240 0.260  
4.45 0.155 0.175  
0.51 0.015 0.020  
1.78 0.040 0.070  
L
G
H
J
K
L
2.54 BSC  
0.100 BSC  
1.27 0.030 0.050  
0.30 0.008 0.012  
8
C
0.76  
0.20  
2.92  
1
J
3.43  
0.115  
0.135  
–T–  
SEATING  
PLANE  
7.62 BSC  
0.300 BSC  
N
M
N
–––  
10  
–––  
10  
0.76  
1.01 0.030 0.040  
M
D
K
G
H
M
M
M
0.13 (0.005)  
T A  
B
N, P, N-14, P2 SUFFIX  
CASE 646-06  
Plastic Package  
ISSUE L  
NOTES:  
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE  
POSITION AT SEATING PLANE AT MAXIMUM  
MATERIAL CONDITION.  
2. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
3. DIMENSION B DOES NOT INCLUDE MOLD  
FLASH.  
4. ROUNDED CORNERS OPTIONAL.  
14  
1
8
B
7
INCHES  
DIM MIN MAX  
0.770 18.16  
MILLIMETERS  
A
F
MIN  
MAX  
19.56  
6.60  
4.69  
0.53  
1.78  
A
B
C
D
F
0.715  
0.240  
0.145  
0.015  
0.040  
0.260  
0.185  
0.021  
0.070  
6.10  
3.69  
0.38  
1.02  
L
14  
1
C
G
H
J
K
L
0.100 BSC  
2.54 BSC  
0.052  
0.008  
0.115  
0.095  
0.015  
0.135  
1.32  
0.20  
2.92  
2.41  
0.38  
3.43  
J
N
0.300 BSC  
7.62 BSC  
SEATING  
PLANE  
K
M
N
0
10  
0.039  
0
0.39  
10  
1.01  
0.015  
H
G
D
M
DP2, N, P, PC SUFFIX  
CASE 648-08  
Plastic Package  
ISSUE R  
NOTES:  
–A–  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.  
5. ROUNDED CORNERS OPTIONAL.  
16  
1
9
8
B
S
INCHES  
DIM MIN MAX  
0.770 18.80  
MILLIMETERS  
MIN  
MAX  
19.55  
6.85  
4.44  
0.53  
1.77  
F
A
B
C
D
F
0.740  
0.250  
0.145  
0.015  
0.040  
C
L
0.270  
0.175  
0.021  
0.70  
6.35  
3.69  
0.39  
1.02  
16  
1
SEATING  
PLANE  
–T–  
G
H
J
K
L
M
S
0.100 BSC  
0.050 BSC  
2.54 BSC  
1.27 BSC  
K
M
0.008  
0.015  
0.130  
0.305  
10  
0.21  
0.38  
3.30  
7.74  
10  
H
J
0.110  
0.295  
0
2.80  
7.50  
0
G
D 16 PL  
0.020  
0.040  
0.51  
1.01  
M
M
0.25 (0.010)  
T A  
13–5  
MOTOROLA ANALOG IC DEVICE DATA  
B, P, P2, V SUFFIX  
CASE 648C-03  
Plastic Package  
(DIP–16)  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.  
5. INTERNAL LEAD CONNECTION BETWEEN 4 AND  
5, 12 AND 13.  
–A–  
ISSUE C  
16  
1
9
8
–B–  
INCHES  
DIM MIN MAX  
0.840 18.80  
MILLIMETERS  
L
MIN  
MAX  
21.34  
6.60  
4.69  
0.53  
A
B
C
D
E
F
0.740  
0.240  
0.145  
0.015  
0.050 BSC  
0.040  
0.100 BSC  
0.008  
0.115  
0.300 BSC  
0
0.260  
0.185  
0.021  
6.10  
3.69  
0.38  
NOTE 5  
16  
1
1.27 BSC  
C
0.70  
1.02  
1.78  
G
J
K
L
M
N
2.54 BSC  
0.015  
0.135  
0.20  
2.92  
0.38  
3.43  
–T–  
SEATING  
PLANE  
M
N
7.62 BSC  
K
10  
0.040  
0
10  
E
0.015  
0.39  
1.01  
J 16 PL  
F
G
D 16 PL  
M
S
0.13 (0.005)  
T B  
M
S
0.13 (0.005)  
T A  
–A–  
P SUFFIX  
NOTES:  
CASE 648E–01  
Plastic Package  
(DIP–16)  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
4. DIMENSION A AND B DOES NOT INCLUDE MOLD  
PROTRUSION.  
5. MOLD FLASH OR PROTRUSIONS SHALL NOT  
EXCEED 0.25 (0.010).  
R
16  
1
9
8
ISSUE O  
–B–  
6. ROUNDED CORNER OPTIONAL.  
M
P
L
INCHES  
DIM MIN MAX  
0.760 18.80  
MILLIMETERS  
F
MIN  
MAX  
19.30  
6.60  
4.44  
0.53  
1.77  
A
B
C
D
F
0.740  
0.245  
0.145  
0.015  
0.050  
0.260  
0.175  
0.021  
0.070  
6.23  
3.69  
0.39  
1.27  
16  
J
1
C
G
H
J
K
L
M
P
0.100 BSC  
0.050 BSC  
2.54 BSC  
1.27 BSC  
0.21  
3.05  
7.50  
0
5.08 BSC  
7.62 BSC  
0.39 0.88  
–T–  
SEATING  
PLANE  
0.008  
0.015  
0.140  
0.305  
10  
0.38  
3.55  
7.74  
10  
S
0.120  
0.295  
0
K
H
G
0.200 BSC  
0.300 BSC  
0.015 0.035  
R
S
D 13 PL  
M
S
S
0.25 (0.010)  
T B  
A
P SUFFIX  
CASE 649-03  
Plastic Package  
ISSUE D  
P
A
NOTES:  
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE  
POSITION AT SEATING PLANE AT MAXIMUM  
MATERIAL CONDITION.  
13  
24  
2. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
L
Q
B
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN  
MAX  
1.265  
0.540  
0.205  
0.020  
0.060  
1
A
B
C
D
F
31.50  
13.21  
4.70  
0.38  
1.02  
32.13 1.240  
13.72 0.520  
5.21 0.185  
0.51 0.015  
1.52 0.040  
12  
M
J
H
F
C
G
H
J
K
L
M
N
P
2.54 BSC  
0.100 BSC  
1.65  
0.20  
2.92  
14.99  
–––  
2.16 0.065  
0.30 0.008  
3.43  
15.49 0.590  
10 –––  
0.085  
0.012  
0.135  
0.610  
10  
24  
N
0.115  
1
K
0.51  
0.13  
0.51  
1.02 0.020  
0.38 0.005  
0.76 0.020  
0.040  
0.015  
0.030  
D
G
SEATING  
PLANE  
Q
13–6  
MOTOROLA ANALOG IC DEVICE DATA  
A, B, N, P SUFFIX  
CASE 707-02  
Plastic Package  
ISSUE C  
NOTES:  
1. POSITIONAL TOLERANCE OF LEADS (D),  
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM  
MATERIAL CONDITION, IN RELATION TO  
SEATING PLANE AND EACH OTHER.  
2. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
18  
10  
9
B
1
3. DIMENSION B DOES NOT INCLUDE MOLD  
FLASH.  
A
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN  
MAX  
0.915  
0.260  
0.180  
0.022  
0.070  
L
A
B
C
D
F
22.22  
6.10  
3.56  
0.36  
1.27  
23.24 0.875  
6.60 0.240  
4.57 0.140  
0.56 0.014  
1.78 0.050  
C
18  
1
G
H
J
K
L
2.54 BSC  
0.100 BSC  
K
N
1.02  
0.20  
2.92  
1.52 0.040  
0.30 0.008  
3.43  
0.060  
0.012  
0.135  
J
M
F
D
SEATING  
PLANE  
0.115  
H
G
7.62 BSC  
0.300 BSC  
M
N
0
0.51  
15  
0
15  
0.040  
1.02 0.020  
P SUFFIX  
CASE 710-02  
Plastic Package  
ISSUE B  
NOTES:  
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL  
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL  
CONDITION, IN RELATION TO SEATING PLANE  
AND EACH OTHER.  
28  
2. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.  
1
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
28  
1
15  
A
B
C
D
F
36.45 37.21 1.435 1.465  
13.72 14.22 0.540 0.560  
B
3.94  
0.36  
1.02  
5.08 0.155 0.200  
0.56 0.014 0.022  
1.52 0.040 0.060  
14  
G
H
J
K
L
2.54 BSC  
0.100 BSC  
2.16 0.065 0.085  
0.38 0.008 0.015  
1.65  
0.20  
2.92  
L
C
A
3.43  
0.115  
0.135  
15.24 BSC  
0.600 BSC  
N
M
N
0
0.51  
15  
0
15  
1.02 0.020 0.040  
J
M
G
H
F
K
SEATING  
PLANE  
D
P SUFFIX  
CASE 711-03  
Plastic Package  
ISSUE C  
NOTES:  
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL  
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL  
CONDITION, IN RELATION TO SEATING PLANE  
AND EACH OTHER.  
40  
1
2. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.  
40  
21  
20  
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
B
A
B
C
D
F
51.69 52.45 2.035 2.065  
13.72 14.22 0.540 0.560  
3.94  
0.36  
1.02  
5.08 0.155 0.200  
0.56 0.014 0.022  
1.52 0.040 0.060  
1
G
H
J
K
L
2.54 BSC  
0.100 BSC  
2.16 0.065 0.085  
0.38 0.008 0.015  
L
A
1.65  
0.20  
2.92  
C
3.43  
0.115  
0.135  
N
15.24 BSC  
0.600 BSC  
M
N
0
0.51  
15  
0
15  
J
1.02 0.020 0.040  
K
SEATING  
PLANE  
M
H
G
F
D
13–7  
MOTOROLA ANALOG IC DEVICE DATA  
F, P, P-3 SUFFIX  
CASE 724-03  
Plastic Package  
(NDIP–24)  
NOTES:  
1. CHAMFERED CONTOUR OPTIONAL.  
2. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
3. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
24  
ISSUE D  
1
4. CONTROLLING DIMENSION: INCH.  
–A–  
INCHES  
DIM MIN MAX  
1.265 31.25  
MILLIMETERS  
MIN  
MAX  
32.13  
6.85  
4.44  
0.51  
24  
1
13  
12  
A
B
C
D
E
F
1.230  
0.250  
0.145  
0.015  
0.050 BSC  
0.040  
–B–  
0.270  
0.175  
0.020  
6.35  
3.69  
0.38  
1.27 BSC  
1.02  
L
C
0.060  
1.52  
G
J
K
L
M
N
0.100 BSC  
2.54 BSC  
0.007  
0.110  
0.012  
0.140  
0.18  
2.80  
0.30  
3.55  
NOTE 1  
–T–  
SEATING  
PLANE  
K
0.300 BSC  
7.62 BSC  
N
M
0
15  
0
15  
E
0.020  
0.040  
0.51  
1.01  
G
J 24 PL  
F
M
M
0.25 (0.010)  
T B  
D 24 PL  
M
M
0.25 (0.010)  
T A  
H, P, DP SUFFIX  
CASE 738-03  
Plastic Package  
ISSUE E  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
–A–  
4. DIMENSION B DOES NOT INCLUDE MOLD  
FLASH.  
20  
1
11  
B
INCHES  
DIM MIN MAX  
1.010 1.070 25.66  
MILLIMETERS  
10  
MIN  
MAX  
27.17  
6.60  
A
B
C
D
E
F
0.240 0.260  
0.150 0.180  
0.015 0.022  
0.050 BSC  
6.10  
3.81  
0.39  
L
4.57  
0.55  
C
1.27 BSC  
0.050 0.070  
0.100 BSC  
1.27  
1.77  
20  
G
2.54 BSC  
1
J
0.008 0.015  
0.21  
2.80  
7.62 BSC  
0
0.51  
0.38  
3.55  
K
L
M
N
0.110  
0.140  
–T–  
SEATING  
PLANE  
K
M
0.300 BSC  
0
15  
15  
1.01  
0.020 0.040  
N
E
J 20 PL  
G
F
M
M
0.25 (0.010)  
T B  
D 20 PL  
M
M
0.25 (0.010)  
T A  
D, D1, D2 SUFFIX  
CASE 751-05  
Plastic Package  
(SO-8, SOP-8)  
ISSUE R  
NOTES:  
D
A
E
1. DIMENSIONING AND TOLERANCING PER ASME  
Y14.5M, 1994.  
2. DIMENSIONS ARE IN MILLIMETERS.  
3. DIMENSION D AND E DO NOT INCLUDE MOLD  
PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.  
5. DIMENSION B DOES NOT INCLUDE MOLD  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS  
OF THE B DIMENSION AT MAXIMUM MATERIAL  
CONDITION.  
C
8
1
5
4
M
M
0.25  
B
H
MILLIMETERS  
8
h X 45  
B
C
DIM MIN  
MAX  
1.75  
0.25  
0.49  
0.25  
5.00  
4.00  
e
1
A
A1  
B
C
D
E
1.35  
0.10  
0.35  
0.18  
4.80  
3.80  
A
SEATING  
PLANE  
e
H
h
1.27 BSC  
0.10  
L
5.80  
0.25  
0.40  
0
6.20  
0.50  
1.25  
7
A1  
B
L
M
S
S
0.25  
C B  
A
13–8  
MOTOROLA ANALOG IC DEVICE DATA  
D SUFFIX  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
CASE 751A-03  
Plastic Package  
(SO-14)  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 (0.005) TOTAL  
IN EXCESS OF THE D DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
–A–  
ISSUE F  
14  
1
8
7
–B–  
P 7 PL  
M
M
0.25 (0.010)  
B
MILLIMETERS  
DIM MIN MAX  
INCHES  
14  
1
MIN  
MAX  
0.344  
0.157  
0.068  
0.019  
0.049  
F
A
B
C
D
F
8.55  
3.80  
1.35  
0.35  
0.40  
8.75 0.337  
4.00 0.150  
1.75 0.054  
0.49 0.014  
1.25 0.016  
R X 45  
G
C
G
J
K
M
P
1.27 BSC  
0.050 BSC  
–T–  
SEATING  
PLANE  
J
M
0.19  
0.10  
0
0.25 0.008  
0.25 0.004  
0.009  
0.009  
7
K
D 14 PL  
7
0
M
S
S
0.25 (0.010)  
T B  
A
5.80  
0.25  
6.20 0.228  
0.50 0.010  
0.244  
0.019  
R
–A–  
D SUFFIX  
NOTES:  
CASE 751B-05  
Plastic Package  
(SO-16)  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
16  
9
ISSUE J  
–B–  
P 8 PL  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
M
S
0.25 (0.010)  
B
1
8
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 (0.005) TOTAL  
IN EXCESS OF THE D DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
G
MILLIMETERS  
DIM MIN MAX  
9.80 10.00 0.386 0.393  
INCHES  
MIN MAX  
16  
1
A
B
C
D
F
F
K
3.80  
1.35  
0.35  
0.40  
4.00 0.150 0.157  
1.75 0.054 0.068  
0.49 0.014 0.019  
1.25 0.016 0.049  
R X 45  
C
G
J
K
M
P
1.27 BSC  
0.050 BSC  
0.25 0.008 0.009  
0.25 0.004 0.009  
–T–  
SEATING  
PLANE  
0.19  
0.10  
0
J
M
D
16 PL  
7
0
7
5.80  
0.25  
6.20 0.229 0.244  
0.50 0.010 0.019  
M
S
S
0.25 (0.010)  
T B  
A
R
DW, FP SUFFIX  
–A–  
NOTES:  
CASE 751D-04  
Plastic Package  
(SO-20L, SO–20)  
ISSUE E  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
20  
11  
4. MAXIMUM MOLD PROTRUSION 0.150  
(0.006) PER SIDE.  
10X P  
–B–  
5. DIMENSION D DOES NOT INCLUDE  
DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.13  
(0.005) TOTAL IN EXCESS OF D DIMENSION  
AT MAXIMUM MATERIAL CONDITION.  
M
M
0.010 (0.25)  
B
1
10  
J
F
20X D  
MILLIMETERS  
DIM MIN MAX  
12.65 12.95 0.499 0.510  
INCHES  
MIN MAX  
M
S
S
0.010 (0.25) T A  
B
A
B
C
D
F
20  
7.40  
2.35  
0.35  
0.50  
7.60 0.292 0.299  
2.65 0.093 0.104  
0.49 0.014 0.019  
0.90 0.020 0.035  
1
R X 45  
G
J
K
M
P
1.27 BSC  
0.050 BSC  
0.32 0.010 0.012  
0.25 0.004 0.009  
C
0.25  
0.10  
0
SEATING  
PLANE  
7
0
7
–T–  
10.05 10.55 0.395 0.415  
18X G  
R
0.25  
0.75 0.010 0.029  
K
M
13–9  
MOTOROLA ANALOG IC DEVICE DATA  
DW SUFFIX  
CASE 751E-04  
Plastic Package  
(SO-24L,  
SOP (16+4+4)L)  
ISSUE E  
–A–  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
24  
13  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
–B– 12X P  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
M
M
0.010 (0.25)  
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN  
EXCESS OF D DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
1
12  
24X D  
24  
J
MILLIMETERS  
DIM MIN MAX  
INCHES  
M
S
S
0.010 (0.25)  
T A  
B
1
MIN  
MAX  
0.612  
0.299  
0.104  
0.019  
0.035  
A
B
C
D
F
15.25  
7.40  
2.35  
0.35  
0.41  
15.54 0.601  
7.60 0.292  
2.65 0.093  
0.49 0.014  
0.90 0.016  
F
R X 45  
G
J
K
M
P
1.27 BSC  
0.050 BSC  
0.23  
0.13  
0
0.32 0.009  
0.29 0.005  
0.013  
0.011  
8
C
K
–T–  
SEATING  
8
0
M
10.05  
0.25  
10.55 0.395  
0.75 0.010  
0.415  
0.029  
PLANE  
R
22X G  
DW SUFFIX  
CASE 751F-04  
NOTES:  
Plastic Package  
(SO-28L, SOIC–28)  
ISSUE E  
28  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE  
1
–A–  
15  
28  
14X P  
DAMBAR PROTRUSION SHALL BE 0.13  
(0.005) TOTAL IN EXCESS OF D DIMENSION  
AT MAXIMUM MATERIAL CONDITION.  
M
M
0.010 (0.25)  
B
–B–  
1
MILLIMETERS  
DIM MIN MAX  
INCHES  
14  
MIN  
MAX  
0.711  
0.299  
0.104  
0.019  
0.035  
M
A
B
C
D
F
17.80  
7.40  
2.35  
0.35  
0.41  
18.05 0.701  
7.60 0.292  
2.65 0.093  
0.49 0.014  
0.90 0.016  
28X D  
R
X 45  
M
S
S
0.010 (0.25)  
T A  
B
G
J
K
M
P
1.27 BSC  
0.050 BSC  
0.23  
0.13  
0
0.32 0.009  
0.29 0.005  
0.013  
0.011  
8
C
8
0
–T–  
SEATING  
PLANE  
10.01  
0.25  
10.55 0.395  
0.75 0.010  
0.415  
0.029  
26X G  
F
R
K
J
DW SUFFIX  
CASE 751G-02  
Plastic Package  
(SO-16L, SOP–16L,  
SOP-8+8L)  
ISSUE A  
–A–  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
16  
9
–B–  
8X P  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER  
SIDE.  
M
M
0.010 (0.25)  
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN  
EXCESS OF D DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
1
8
J
16X D  
16  
MILLIMETERS  
DIM MIN MAX  
10.15 10.45 0.400  
INCHES  
M
S
S
0.010 (0.25)  
T A  
B
MIN  
MAX  
1
A
B
C
D
F
0.411  
F
7.40  
2.35  
0.35  
0.50  
7.60 0.292 0.299  
2.65 0.093 0.104  
0.49 0.014 0.019  
0.90 0.020 0.035  
R X 45  
G
J
K
M
P
1.27 BSC  
0.050 BSC  
0.32 0.010 0.012  
0.25 0.004 0.009  
0.25  
0.10  
0
C
7
0
7
–T–  
M
10.05 10.55 0.395 0.415  
0.25 0.75 0.010 0.029  
SEATING  
14X G  
K
PLANE  
R
13–10  
MOTOROLA ANALOG IC DEVICE DATA  
D SUFFIX  
16  
CASE 751K–01  
Plastic Package  
(SO–16)  
NOTES:  
1
1
DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2
3
CONTROLLING DIMENSION: MILLIMETER.  
DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
–A–  
ISSUE O  
4
5
MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER  
SIDE.  
16  
9
DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN  
EXCESS OF THE D DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
M
–B–  
P
MILLIMETERS  
DIM MIN MAX  
INCHES  
F
MIN  
MAX  
0.393  
0.157  
0.068  
0.019  
0.049  
A
B
C
D
F
9.80  
3.80  
1.35  
0.35  
0.40  
10.00 0.368  
4.00 0.150  
1.75 0.054  
0.49 0.014  
1.25 0.016  
1
8
G
R X 45  
G
J
K
M
P
1.27 BSC  
0.050 BSC  
0.19  
0.10  
0
0.25 0.008  
0.25 0.004  
7
0.009  
0.009  
7
C
SEATING  
PLANE  
–T–  
0
5.80  
0.25  
6.20 0.229  
0.50 0.010  
0.244  
0.019  
14 X D  
J
K
R
M
S
S
0.25 (0.010)  
T A  
B
–A–  
DW SUFFIX  
CASE 751N–01  
Plastic Package  
(SOP–16L)  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
T
16  
9
ISSUE O  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER  
SIDE.  
M
M
–B–  
P
0.010 (0.25)  
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN  
EXCESS OF D DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
1
8
16  
J
F
MILLIMETERS  
DIM MIN MAX  
10.15 10.45 0.400  
INCHES  
13X D  
1
MIN  
MAX  
A
B
C
D
F
0.411  
M
S
S
0.010 (0.25)  
T A  
B
7.40  
2.35  
0.35  
0.50  
7.60 0.292 0.299  
2.65 0.093 0.104  
0.49 0.014 0.019  
0.90 0.020 0.035  
G
J
K
M
P
R
S
T
1.27 BSC  
0.050 BSC  
0.32 0.010 0.012  
0.25 0.004 0.009  
R X 45  
0.25  
0.10  
0
7
0
7
C
10.05 10.55 0.395 0.415  
0.25 0.75 0.010 0.029  
2.54 BSC  
3.81 BSC  
–T–  
SEATING  
PLANE  
M
S
0.100 BSC  
0.150 BSC  
K
9X G  
13–11  
MOTOROLA ANALOG IC DEVICE DATA  
CASE 762-01  
Plastic Medium Power Package  
(SIP-9)  
ISSUE C  
9
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
Q
1
M
M
0.25 (0.010)  
T A  
–A–  
MILLIMETERS  
DIM MIN MAX  
22.40 23.00 0.873 0.897  
INCHES  
MIN MAX  
–C–  
U
V
A
B
C
D
E
M
X
6.40  
3.45  
0.40  
9.35  
1.40  
6.60 0.252 0.260  
3.65 0.135 1.143  
0.55 0.015 0.021  
9.60 0.368 0.377  
1.60 0.055 0.062  
S
W
E
F
Y
G
H
J
2.54 BSC  
0.100 BSC  
1.51  
1.71 0.059 0.067  
0.360 0.400 0.014 0.015  
R
B
N
K
M
N
Q
R
S
U
V
W
X
Y
3.95  
30 BSC  
2.50  
3.15  
13.60 13.90 0.535 0.547  
1.65 1.95 0.064 0.076  
22.00 22.20 0.866 0.874  
0.55  
2.89 BSC  
4.20 0.155 0.165  
30 BSC  
2.70 0.099 0.106  
3.45 0.124 0.135  
9
1
SEATING  
PLANE  
–T–  
K
M
M
0.25 (0.010)  
T C  
J
H
G
F
0.75 0.021 0.029  
0.113 BSC  
0.75 0.025 0.029  
D 9 PL  
0.65  
2.70  
M
M
0.25 (0.010)  
T A  
2.80 0.106  
0.110  
FN SUFFIX  
CASE 775-02  
Plastic Package  
(PLCC-20)  
NOTES:  
1. DATUMS –L–, –M–, AND –N– DETERMINED  
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC  
BODY AT MOLD PARTING LINE.  
2. DIMENSION G1, TRUE POSITION TO BE  
MEASURED AT DATUM –T–, SEATING PLANE.  
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD  
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)  
PER SIDE.  
1
ISSUE C  
M
S
S
0.007 (0.180) T L–M  
N
B
4. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
5. CONTROLLING DIMENSION: INCH.  
M
S
S
N
0.007 (0.180) T L–M  
Y BRK  
–N–  
U
6. THE PACKAGE TOP MAY BE SMALLER THAN THE  
PACKAGE BOTTOM BY UP TO 0.012 (0.300).  
DIMENSIONS R AND U ARE DETERMINED AT THE  
OUTERMOST EXTREMES OF THE PLASTIC BODY  
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,  
GATE BURRS AND INTERLEAD FLASH, BUT  
INCLUDING ANY MISMATCH BETWEEN THE TOP  
AND BOTTOM OF THE PLASTIC BODY.  
7. DIMENSION H DOES NOT INCLUDE DAMBAR  
PROTRUSION OR INTRUSION. THE DAMBAR  
PROTRUSION(S) SHALL NOT CAUSE THE H  
DIMENSION TO BE GREATER THAN 0.037 (0.940).  
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE  
THE H DIMENSION TO BE SMALLER THAN 0.025  
(0.635).  
D
–L–  
Z
–M–  
W
D
20  
1
S
S
S
0.010 (0.250) T L–M  
N
G1  
X
V
VIEW D–D  
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN  
9.78  
9.78  
4.20  
2.29  
0.33  
MAX  
10.03  
10.03  
4.57  
2.79  
0.48  
M
S
S
S
A
R
0.007 (0.180) T L–M  
N
A
B
C
E
0.385  
0.385  
0.165  
0.090  
0.013  
0.395  
0.395  
0.180  
0.110  
0.019  
Z
M
S
0.007 (0.180) T L–M  
N
F
M
S
S
H
0.007 (0.180) T L–M  
N
G
H
J
0.050 BSC  
1.27 BSC  
C
0.026  
0.020  
0.025  
0.350  
0.350  
0.042  
0.042  
0.042  
–––  
0.032  
–––  
–––  
0.356  
0.356  
0.048  
0.048  
0.056  
0.020  
10  
0.66  
0.51  
0.64  
8.89  
8.89  
1.07  
1.07  
1.07  
–––  
2
0.81  
–––  
–––  
9.04  
9.04  
1.21  
1.21  
1.42  
0.50  
10  
E
0.004 (0.100)  
K1  
K
K
R
U
V
W
X
Y
Z
G
–T– SEATING  
J
PLANE  
VIEW S  
M
S
S
0.007 (0.180) T L–M  
N
G1  
F
S
S
S
0.010 (0.250) T L–M  
N
VIEW S  
2
G1 0.310  
K1 0.040  
0.330  
–––  
7.88  
1.02  
8.38  
–––  
13–12  
MOTOROLA ANALOG IC DEVICE DATA  
FN SUFFIX  
CASE 776-02  
Plastic Package  
(PLCC–28)  
ISSUE D  
1
M
S
S
0.007 (0.180)  
T L–M  
N
B
Z
Y BRK  
D
–N–  
M
S
S
0.007 (0.180)  
T L–M  
N
U
–M–  
–L–  
W
D
S
S
S
0.010 (0.250)  
T L–M  
N
X
G1  
V
28  
1
VIEW D–D  
M
S
S
S
A
0.007 (0.180)  
0.007 (0.180)  
T L–M  
N
M
S
S
H
0.007 (0.180)  
T L–M  
N
Z
M
S
T L–M  
N
R
K1  
C
E
0.004 (0.100)  
SEATING  
PLANE  
G
K
–T–  
VIEW S  
J
M
S
S
0.007 (0.180)  
T L–M  
N
F
G1  
S
S
S
0.010 (0.250)  
T L–M  
N
VIEW S  
NOTES:  
INCHES  
DIM MIN MAX  
MILLIMETERS  
1. DATUMS –L–, –M–, AND –N– DETERMINED  
WHERE TOP OF LEAD SHOULDER EXITS  
PLASTIC BODY AT MOLD PARTING LINE.  
2. DIMENSION G1, TRUE POSITION TO BE  
MEASURED AT DATUM –T–, SEATING PLANE.  
3. DIMENSIONS R AND U DO NOT INCLUDE  
MOLD FLASH. ALLOWABLE MOLD FLASH IS  
0.010 (0.250) PER SIDE.  
MIN  
MAX  
12.57  
12.57  
4.57  
2.79  
0.48  
A
B
C
E
0.485  
0.485  
0.165  
0.090  
0.013  
0.495 12.32  
0.495 12.32  
0.180  
0.110  
0.019  
4.20  
2.29  
0.33  
F
G
H
J
0.050 BSC  
1.27 BSC  
4. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
0.026  
0.020  
0.025  
0.450  
0.450  
0.042  
0.042  
0.042  
–––  
0.032  
–––  
–––  
0.456  
0.456  
0.048  
0.048  
0.056  
0.020  
10  
0.66  
0.51  
0.64  
11.43  
11.43  
1.07  
1.07  
1.07  
–––  
0.81  
–––  
–––  
11.58  
11.58  
1.21  
1.21  
1.42  
0.50  
10  
5. CONTROLLING DIMENSION: INCH.  
6. THE PACKAGE TOP MAY BE SMALLER THAN  
THE PACKAGE BOTTOM BY UP TO 0.012  
(0.300). DIMENSIONS R AND U ARE  
DETERMINED AT THE OUTERMOST  
EXTREMES OF THE PLASTIC BODY  
EXCLUSIVE OF MOLD FLASH, TIE BAR  
BURRS, GATE BURRS AND INTERLEAD  
FLASH, BUT INCLUDING ANY MISMATCH  
BETWEEN THE TOP AND BOTTOM OF THE  
PLASTIC BODY.  
K
R
U
V
W
X
Y
Z
2
2
G1 0.410  
K1 0.040  
0.430 10.42  
––– 1.02  
10.92  
–––  
7. DIMENSION H DOES NOT INCLUDE DAMBAR  
PROTRUSION OR INTRUSION. THE DAMBAR  
PROTRUSION(S) SHALL NOT CAUSE THE H  
DIMENSION TO BE GREATER THAN 0.037  
(0.940). THE DAMBAR INTRUSION(S) SHALL  
NOT CAUSE THE H DIMENSION TO BE  
SMALLER THAN 0.025 (0.635).  
13–13  
MOTOROLA ANALOG IC DEVICE DATA  
FN SUFFIX  
CASE 777-02  
Plastic Package  
(PLCC)  
M
S
S
0.007(0.180)  
T
L–M  
N
B
M
S
S
0.007(0.180)  
T
L–M  
N
U
1
ISSUE C  
D
–N–  
Z
Y BRK  
–M–  
–L–  
X
G1  
S
S
S
0.010 (0.25)  
T
L–M  
N
VIEW D–D  
H
V
W
D
M
S
S
0.007(0.180)  
T
L–M  
N
44  
1
M
M
S
S
S
S
A
R
0.007(0.180)  
0.007(0.180)  
T
T
L–M  
L–M  
N
N
K1  
Z
K
J
C
F
E
M
S
S
0.007(0.180)  
VIEW S  
T
L–M  
N
0.004 (0.10)  
G
SEATING  
PLANE  
–T–  
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN MAX  
G1  
VIEW S  
A
B
C
E
0.685 0.695 17.40 17.65  
0.685 0.695 17.40 17.65  
S
S
S
0.010 (0.25)  
T
L–M  
N
0.165 0.180  
0.090 0.110  
0.013 0.019  
0.050 BSC  
4.20  
2.29  
0.33  
4.57  
2.79  
0.48  
NOTES:  
6. THE PACKAGE TOP MAY BE SMALLER THAN  
THE PACKAGE BOTTOM BY UP TO 0.012  
(0.300). DIMENSIONS R AND U ARE  
DETERMINED AT THE OUTERMOST  
EXTREMES OF THE PLASTIC BODY  
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,  
GATE BURRS AND INTERLEAD FLASH, BUT  
INCLUDING ANY MISMATCH BETWEEN THE  
TOP AND BOTTOM OF THE PLASTIC BODY.  
7. DIMENSION H DOES NOT INCLUDE DAMBAR  
PROTRUSION OR INTRUSION. THE DAMBAR  
PROTRUSION(S) SHALL NOT CAUSE THE H  
DIMENSION TO BE GREATER THAN 0.037  
(0.940). THE DAMBAR INTRUSION(S) SHALL  
NOT CAUSE THE H DIMENSION TO BE  
SMALLER THAN 0.025 (0.635).  
F
1. DATUMS –L–, –M–, AND –N– ARE DETERMINED  
WHERE TOP OF LEAD SHOULDER EXITS  
PLASTIC BODY AT MOLD PARTING LINE.  
2. DIMENSION G1, TRUE POSITION TO BE  
MEASURED AT DATUM –T–, SEATING PLANE.  
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD  
FLASH. ALLOWABLE MOLD FLASH IS 0.010  
(0.25) PER SIDE.  
G
H
J
1.27 BSC  
0.026 0.032  
0.66  
0.51  
0.64  
0.81  
–––  
–––  
0.020  
0.025  
–––  
–––  
K
R
U
V
W
X
Y
Z
0.650 0.656 16.51 16.66  
0.650 0.656 16.51 16.66  
0.042 0.048  
0.042 0.048  
0.042 0.056  
––– 0.020  
1.07  
1.07  
1.07  
–––  
2
1.21  
1.21  
1.42  
0.50  
10  
4. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
5. CONTROLLING DIMENSION: INCH.  
2
10  
G1 0.610 0.630 15.50 16.00  
K1 0.040 ––– 1.02 –––  
NOTES:  
M SUFFIX  
CASE 803C  
PRELIMINARY  
Plastic Package  
6
DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
–A–  
7
8
CONTROLLING DIMENSION: MILLIMETER.  
DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
–F–  
9
MAXIMUM MOLD PROTRUSION 0.15 (0.008) PER  
SIDE.  
20  
1
11  
10  
10 DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.13 (0.006) TOTAL IN  
EXCESS OF THE D DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
K
–B–  
1
J
20  
G
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN  
MAX  
0.504  
0.215  
0.081  
0.020  
0.032  
S 10 PL  
A
B
C
D
E
F
12.35  
5.10  
1.95  
0.35  
–––  
12.80 0.486  
5.45 0.201  
2.05 0.077  
0.50 0.014  
M
M
0.13 (0.005)  
B
N
0.81  
12.40*  
–––  
0.488*  
G
H
J
K
L
M
N
S
1.15  
0.59  
0.18  
1.10  
0.05  
0
1.39 0.045  
0.81 0.023  
0.27 0.007  
1.50 0.043  
0.20 0.001  
0.055  
0.032  
0.011  
0.059  
0.008  
10  
C
0.10 (0.004)  
E
L
M
10  
0
D 20 PL  
–T–  
SEATING  
PLANE  
0.50  
7.40  
0.85 0.020  
8.20 0.291  
0.033  
0.323  
M
S
S
0.13 (0.005)  
T B  
A
*APPROXIMATE  
13–14  
MOTOROLA ANALOG IC DEVICE DATA  
TV SUFFIX  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
CASE 821C-04  
Plastic Package  
(15-Pin ZIP)  
ISSUE D  
1
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH  
OR PROTRUSIONS.  
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH  
OR PROTRUSIONS.  
15  
5. MOLD FLASH OR PROTRUSIONS SHALL NOT  
EXCEED 0.010 (0.250).  
6. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE PROTRUSION SHALL  
BE 0.003 (0.076) TOTAL IN EXCESS OF THE D  
DIMENSION. AT MAXIMUM MATERIAL CONDITION.  
SEATING  
PLANE  
–T–  
C
E
M
B
–Q–  
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN MAX  
–P–  
U
A
B
C
D
E
0.684 0.694 17.374 17.627  
0.784 0.792 19.914 20.116  
0.173 0.181 4.395 4.597  
0.024 0.031 0.610 0.787  
0.058 0.062 1.473 1.574  
Y
K
V
A
R
G
H
J
K
L
0.050 BSC  
0.169 BSC  
0.018 0.024 0.458 0.609  
0.700 0.710 17.780 18.034  
1.270 BSC  
4.293 BSC  
S
0.200 BSC  
5.080 BSC  
PIN 15  
M
R
S
U
V
Y
0.148 0.151 3.760 3.835  
0.416 0.426 10.567 10.820  
0.157 0.167 3.988 4.242  
PIN 1  
H
L
G
0.105  
0.868 REF  
0.625 0.639 15.875 16.231  
0.115 2.667 2.921  
15X D  
15X J  
22.047 REF  
S
M
M
Q
0.010 (0.254)  
T P  
0.024 (0.610)  
T
T SUFFIX  
CASE 821D-03  
Plastic Package  
ISSUE C  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH  
OR PROTRUSIONS.  
1
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH  
OR PROTRUSIONS.  
15  
5. MOLD FLASH OR PROTRUSIONS SHALL NOT  
EXCEED 0.010 (0.250).  
6. DELETED  
7. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE PROTRUSION SHALL  
BE 0.003 (0.076) TOTAL IN EXCESS OF THE D  
DIMENSION. AT MAXIMUM MATERIAL CONDITION.  
SEATING  
PLANE  
Q
–L–  
–T–  
C
B
E
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN MAX  
–P–  
U
A
B
C
D
E
F
0.681 0.694 17.298 17.627  
0.784 0.792 19.914 20.116  
0.173 0.181 4.395 4.597  
0.024 0.031 0.610 0.787  
0.058 0.062 1.473 1.574  
0.016 0.023 0.407 0.584  
A
R
K
G
H
J
K
Q
R
U
Y
0.050 BSC  
0.110 BSC  
0.018 0.024 0.458 0.609  
1.078 1.086 27.382 27.584  
0.148 0.151 3.760 3.835  
0.416 0.426 10.567 10.820  
1.270 BSC  
2.794 BSC  
Y
PIN 1  
PIN 15  
H
G
0.110 BSC  
0.503 REF  
2.794 BSC  
12.776 REF  
7X F  
15X D  
15X J  
S
M
L
0.010 (0.254)  
T P  
M
0.024 (0.610)  
T
13–15  
MOTOROLA ANALOG IC DEVICE DATA  
FTB SUFFIX  
CASE 824D–01  
Plastic Package  
(TQFP–44)  
1
ISSUE O  
L
–T–, –U–, –Z–  
–Z–  
44  
34  
33  
1
AE  
G
AE  
DETAIL AA  
–T–  
L
–U–  
F
PLATING  
BASE METAL  
DETAIL AA  
J
11  
23  
N
12  
22  
D
M
S
S
0.20 (0.008)  
AC T–U  
Z
A
SECTION AE–AE  
M
S
S
0.20 (0.008)  
AB T–U  
Z
Z
0.05 (0.002) T–U  
S
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
M
S
S
0.20 (0.008)  
AC T–U  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF  
LEAD AND IS COINCIDENT WITH THE LEAD WHERE  
THE LEAD EXITS THE PLASTIC BODY AT THE  
BOTTOM OF THE PARTING LINE.  
4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED AT  
DATUM PLANE –AB–.  
5. DIMENSIONS S AND V TO BE DETERMINED AT  
SEATING PLANE –AC–.  
M
DETAIL AD  
–AB–  
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25  
(0.010) PER SIDE. DIMENSIONS A AND B DO  
INCLUDE MOLD MISMATCH AND ARE DETERMINED  
AT DATUM PLANE –AB–.  
E
C
7. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. DAMBAR PROTRUSION SHALL NOT  
CAUSE THE D DIMENSION TO EXCEED 0.530  
(0.021).  
0.10 (0.004)  
–AC–  
H
Y
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
A
B
C
D
E
9.950 10.050 0.392 0.396  
9.950 10.050 0.392 0.396  
1.400 1.600 0.055 0.063  
0.300 0.450 0.012 0.018  
1.350 1.450 0.053 0.057  
0.300 0.400 0.012 0.016  
R
F
G
H
J
K
L
M
N
Q
R
S
V
W
X
Y
0.800 BSC  
0.031 BSC  
K
0.050 0.150 0.002 0.006  
0.090 0.200 0.004 0.008  
0.450 0.550 0.018 0.022  
8.000 BSC  
12 REF  
Q
W
X
0.315 BSC  
12 REF  
VIEW AD  
0.090 0.160 0.004 0.006  
1
5
1
5
0.100 0.200 0.004 0.008  
11.900 12.100 0.469 0.476  
11.900 12.100 0.469 0.476  
0.200 REF  
1.000 REF  
12 REF  
0.008 REF  
0.039 REF  
12 REF  
13–16  
MOTOROLA ANALOG IC DEVICE DATA  
FB SUFFIX  
CASE 824E–02  
Plastic Package  
(QFP)  
44  
1
ISSUE A  
S
–L–, –M–, –N–  
M
S
S
S
S
0.20 (0.008)  
0.20 (0.008)  
T L–M  
H L–M  
N
N
A
M
0.05 (0.002) L–M  
PIN 1  
IDENT  
J1  
J1  
G
44  
34  
33  
1
VIEW Y  
3 PL  
F
PLATING  
BASE METAL  
–L–  
–M–  
J
B1  
D
M
VIEW Y  
S
S
0.20 (0.008)  
T L–M  
N
SECTION J1–J1  
11  
23  
G 40X  
44 PL  
12  
22  
–N–  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF  
LEAD AND IS COINCIDENT WITH THE LEAD  
WHERE THE LEAD EXITS THE PLASTIC BODY AT  
THE BOTTOM OF THE PARTING LINE.  
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED  
AT DATUM PLANE –H–.  
5. DIMENSIONS S AND V TO BE DETERMINED AT  
SEATING PLANE –T–.  
M
VIEW P  
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25  
(0.010) PER SIDE. DIMENSIONS A AND B DO  
INCLUDE MOLD MISMATCH AND ARE  
DETERMINED AT DATUM PLANE –H–.  
7. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. DAMBAR PROTRUSION SHALL  
NOT CAUSE THE D DIMENSION TO EXCEED  
0.530 (0.021).  
E
DATUM  
C
–H–  
PLANE  
0.01 (0.004)  
–T–  
W
Y
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN  
MAX  
0.398  
0.398  
0.087  
A
B
C
D
E
9.90  
9.90  
2.00  
0.30  
2.00  
0.30  
10.10 0.390  
10.10 0.390  
2.21 0.079  
0.45 0.0118 0.0177  
2.10 0.079  
0.40 0.012  
1
0.083  
0.016  
F
R R1  
R R2  
G
J
K
M
S
V
W
Y
A1  
0.80 BSC  
0.031 BSC  
0.13  
0.65  
5
0.23 0.005  
0.95 0.026  
10  
0.009  
0.037  
10  
DATUM  
PLANE  
–H–  
5
12.95  
12.95  
0.000  
5
13.45 0.510  
13.45 0.510  
0.210 0.000  
0.530  
0.530  
0.008  
10  
K
10  
5
2
A1  
0.450 REF  
0.170 0.005  
1.600 REF  
0.130  
0.300  
0.300 0.005  
0.018 REF  
0.007  
0.063 REF  
B1 0.130  
C1  
R1  
R2 0.130  
1
2
C1  
VIEW P  
0.005  
0.012  
0.012  
10  
5
0
10  
7
5
0
7
13–17  
MOTOROLA ANALOG IC DEVICE DATA  
FB SUFFIX  
CASE 840F–01  
Plastic Package  
ISSUE O  
64  
1
L
–Z–  
64  
49  
1
48  
–T–, –U–, –Z–  
P
AE  
AE  
L
B
V
G
–U–  
–T–  
DETAIL AA  
DETAIL AA  
16  
33  
32  
17  
BASE  
METAL  
A
N
M
S
S
S
S
0.20 (0.008)  
AB T–U  
Z
Z
0.050 (0.002) T–U  
S
D
F
M
0.20 (0.008)  
AC T–U  
M
J
C
E
SECTION AE–AE  
–AB–  
0.10 (0.004)  
–AC–  
Y
H
DETAIL AD  
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN  
MAX  
0.396  
0.396  
0.063  
0.011  
0.057  
0.009  
NOTES:  
A
B
C
D
E
F
9.950 10.050 0.392  
9.950 10.050 0.392  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
1.400  
0.170  
1.350  
0.170  
1.600 0.055  
0.270 0.007  
1.450 0.053  
0.230 0.007  
Q
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF  
LEAD AND IS COINCIDENT WITH THE LEAD  
WHERE THE LEAD EXITS THE PLASTIC BODY AT  
THE BOTTOM OF THE PARTING LINE.  
4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED  
AT DATUM PLANE –AC–.  
G
H
J
K
L
M
N
P
0.500 BSC  
0.020 BSC  
R
0.050  
0.090  
0.450  
0.150 0.002  
0.200 0.004  
0.550 0.018  
0.006  
0.008  
0.022  
K
5. DIMENSIONS S AND V TO BE DETERMINED AT  
SEATING PLANE –AC–.  
7.500 BSC  
12° REF  
0.090 0.160 0.004  
0.250 BSC 0.010 BSC  
0.295 BSC  
12° REF  
0.006  
W
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION. ALLOWABLE PROTRUSION IS  
0.25 (0.010 ) PER SIDE. DIMENSIONS A AND B DO  
INCLUDE MOLD MISMATCH AND ARE  
DETERMINED AT DATUM PLANE –AB–.  
7. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. DAMBAR PROTRUSION SHALL  
NOT CAUSE THE D DIMENSION TO EXCEED  
0.350 (0.014).  
X
°
°
5
Q
R
S
V
W
X
Y
1°  
0.100  
5
1°  
0.200 0.004  
DETAIL AD  
0.008  
0.476  
0.476  
11.900 12.100 0.469  
11.900 12.100 0.469  
0.200 REF  
1.000 REF  
12 REF  
0.008 REF  
0.039 REF  
°
12 REF  
°
13–18  
MOTOROLA ANALOG IC DEVICE DATA  
DM SUFFIX  
CASE 846A–02  
Plastic Package  
(Micro–8)  
8
1
ISSUE C  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
–A–  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,  
PROTRUSIONS OR GATE BURRS. MOLD FLASH,  
PROTRUSIONS OR GATE BURRS SHALL NOT  
EXCEED 0.15 (0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)  
PER SIDE.  
–B–  
K
MILLIMETERS  
INCHES  
PIN 1 ID  
G
DIM MIN  
MAX  
3.10  
3.10  
1.10  
MIN  
0.114  
0.114  
MAX  
0.122  
0.122  
D 8 PL  
A
B
C
D
G
H
J
2.90  
2.90  
–––  
M
S
S
0.08 (0.003)  
T B  
A
––– 0.043  
0.25  
0.40 0.010 0.016  
0.65 BSC  
0.026 BSC  
0.15 0.002 0.006  
0.23 0.005 0.009  
5.05 0.187 0.199  
0.70 0.016 0.028  
0.05  
0.13  
4.75  
0.40  
SEATING  
PLANE  
–T–  
K
L
0.038 (0.0015)  
C
L
J
H
13–19  
MOTOROLA ANALOG IC DEVICE DATA  
FB SUFFIX  
CASE 848B-04  
Plastic Package  
(TQFP–52)  
1
52  
ISSUE C  
L
39  
27  
26  
40  
B
B
DETAIL A  
–B–  
–A–  
L
–A–, –B–, –D–  
DETAIL A  
14  
52  
1
13  
–D–  
F
B
M
S
S
S
0.20 (0.008)  
H A–B  
D
D
0.05 (0.002) A–B  
J
N
V
M
S
0.20 (0.008)  
C A–B  
BASE METAL  
D
DETAIL C  
M
M
C
M
S
S
0.02 (0.008)  
C A–B  
D
E
SECTION B–B  
DATUM  
PLANE  
–H–  
0.10 (0.004)  
H
SEATING  
PLANE  
–C–  
G
MILLIMETERS  
DIM MIN MAX  
INCHES  
NOTES:  
MIN  
MAX  
0.398  
0.398  
0.096  
0.015  
0.083  
0.013  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF  
LEAD AND IS COINCIDENT WITH THE LEAD WHERE  
THE LEAD EXITS THE PLASTIC BODY AT THE  
BOTTOM OF THE PARTING LINE.  
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT  
DATUM PLANE –H–.  
U
A
B
C
D
E
9.90  
9.90  
2.10  
0.22  
2.00  
0.22  
10.10 0.390  
10.10 0.390  
2.45 0.083  
0.38 0.009  
2.10 0.079  
0.33 0.009  
F
G
H
J
K
L
0.65 BSC  
0.026 BSC  
R
–––  
0.13  
0.65  
0.25  
0.23 0.005  
0.95 0.026  
–––  
0.010  
0.009  
0.037  
5. DIMENSIONS S AND V TO BE DETERMINED AT  
SEATING PLANE –C–.  
Q
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25  
(0.010) PER SIDE. DIMENSIONS A AND B DO  
INCLUDE MOLD MISMATCH AND ARE DETERMINED  
AT DATUM PLANE –H–.  
7. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION  
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
DAMBAR CANNOT BE LOCATED ON THE LOWER  
RADIUS OR THE FOOT.  
7.80 REF  
0.307 REF  
M
N
Q
R
S
5
0.13  
0
0.13  
12.95  
0.13  
0
12.95  
0.35  
1.6 REF  
10  
5
10  
0.007  
7
0.17 0.005  
7
0.30 0.005  
13.45 0.510  
––– 0.005  
K
T
0
W
X
0.012  
0.530  
–––  
T
U
V
W
X
–––  
0
–––  
DETAIL C  
13.45 0.510  
0.45 0.014  
0.530  
0.018  
0.063 REF  
13–20  
MOTOROLA ANALOG IC DEVICE DATA  
FB SUFFIX  
CASE 848D–03  
Plastic Package  
ISSUE C  
1
52  
4X  
4X TIPS  
0.20 (0.008) H L–M N  
0.20 (0.008) T L–M N  
–X–  
X=L, M, N  
52  
1
40  
C
L
39  
AB  
AB  
G
3X VIEW Y  
–L–  
–M–  
B1  
VIEW Y  
B
V
V1  
BASE METAL  
F
PLATING  
13  
14  
27  
26  
J
U
–N–  
A1  
S1  
D
M
S
S
0.13 (0.005)  
T L–M  
N
A
S
SECTION AB–AB  
ROTATED 90 CLOCKWISE  
4X θ2  
4X θ3  
C
0.10 (0.004) T  
–H–  
–T–  
SEATING  
PLANE  
VIEW AA  
MILLIMETERS  
INCHES  
MIN MAX  
0.394 BSC  
0.197 BSC  
0.394 BSC  
0.197 BSC  
DIM MIN  
MAX  
10.00 BSC  
5.00 BSC  
A
A1  
B
B1  
C
C1  
C2  
D
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
S
0.05 (0.002)  
10.00 BSC  
5.00 BSC  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF  
LEAD AND IS COINCIDENT WITH THE LEAD  
WHERE THE LEAD EXITS THE PLASTIC BODY AT  
THE BOTTOM OF THE PARTING LINE.  
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED  
AT DATUM PLANE –H–.  
W
–––  
0.05  
1.30  
0.20  
0.45  
0.22  
1.70  
––– 0.067  
2 X R R1  
0.20 0.002 0.008  
1.50 0.051 0.059  
0.40 0.008 0.016  
0.75 0.018 0.030  
0.35 0.009 0.014  
θ1  
E
F
0.25 (0.010)  
C2  
θ
5. DIMENSIONS S AND V TO BE DETERMINED AT  
SEATING PLANE –T–.  
G
0.65 BSC  
0.026 BSC  
GAGE PLANE  
J
K
R1  
S
S1  
U
0.07  
0.08  
12.00 BSC  
6.00 BSC  
0.09  
12.00 BSC  
6.00 BSC  
0.20 REF  
1.00 REF  
0.20 0.003 0.008  
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION. ALLOWABLE PROTRUSION IS  
0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO  
INCLUDE MOLD MISMATCH AND ARE  
DETERMINED AT DATUM PLANE -H-.  
7. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. DAMBAR PROTRUSION SHALL  
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46  
(0.018). MINIMUM SPACE BETWEEN  
0.50 REF  
0.020 REF  
0.20 0.003 0.008  
K
E
0.472 BSC  
0.236 BSC  
0.16 0.004 0.006  
C1  
V
0.472 BSC  
0.236 BSC  
0.008 REF  
0.039 REF  
Z
V1  
W
Z
VIEW AA  
PROTRUSION AND ADJACENT LEAD OR  
PROTRUSION 0.07 (0.003).  
θ
0
0
12  
5
7
0
7
–––  
–––  
θ1  
θ2  
θ3  
0
12  
5
REF  
13  
REF  
13  
13–21  
MOTOROLA ANALOG IC DEVICE DATA  
B SUFFIX  
CASE 858–01  
Plastic Package  
ISSUE O  
42  
1
NOTES:  
–A–  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).  
42  
1
22  
21  
–B–  
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN MAX  
L
A
B
C
D
F
G
H
J
1.435 1.465 36.45 37.21  
0.540 0.560 13.72 14.22  
0.155 0.200  
0.014 0.022  
0.032 0.046  
0.070 BSC  
3.94  
0.36  
0.81  
1.778 BSC  
7.62 BSC  
5.08  
0.56  
1.17  
H
C
K
0.300 BSC  
0.008 0.015  
0.20  
2.92  
0.38  
3.43  
–T–  
K
L
0.115  
0.135  
SEATING  
PLANE  
0.600 BSC  
15.24 BSC  
N
G
M
N
0
15  
0
0.51  
15  
1.02  
M
F
0.020 0.040  
J 42 PL  
D 42 PL  
M
S
0.25 (0.010)  
T B  
M
S
0.25 (0.010)  
T A  
B SUFFIX  
CASE 859–01  
Plastic Package  
(SDIP)  
ISSUE O  
56  
1
–A–  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
56  
29  
28  
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010)  
–B–  
INCHES  
DIM MIN MAX  
MILLIMETERS  
1
MIN  
MAX  
52.45  
14.22  
5.08  
A
B
C
D
E
2.035  
0.540  
0.155  
0.014  
2.065 51.69  
0.560 13.72  
0.200  
0.022  
L
3.94  
0.36  
0.56  
H
C
0.035 BSC  
0.89 BSC  
F
0.032  
0.046  
0.81  
1.17  
G
H
J
K
L
0.070 BSC  
0.300 BSC  
1.778 BSC  
7.62 BSC  
–T–  
K
0.008  
0.115  
0.015  
0.135  
0.20  
2.92  
0.38  
3.43  
SEATING  
PLANE  
0.600 BSC  
15.24 BSC  
N
G
M
F
M
N
0
15  
0
0.51  
15  
1.02  
0.020  
0.040  
E
J 56 PL  
D 56 PL  
M
S
0.25 (0.010)  
T A  
M
S
0.25 (0.010)  
T B  
13–22  
MOTOROLA ANALOG IC DEVICE DATA  
FB, FTB SUFFIX  
CASE 873-01  
Plastic Package  
(TQFP–32)  
1
ISSUE A  
L
17  
24  
25  
16  
B
B
P
–B–  
–A–  
L
V
B
–A–, –B–, –D–  
DETAIL A  
DETAIL A  
32  
9
1
8
F
BASE  
METAL  
–D–  
A
M
S
S
0.20 (0.008)  
C
A–B  
D
0.05 (0.002) A–B  
N
J
S
M
S
S
0.20 (0.008)  
H A–B  
D
D
M
S
S
0.20 (0.008)  
C
A–B  
D
DETAIL C  
M
SECTION B–B  
VIEW ROTATED 90 CLOCKWISE  
E
C
DATUM  
PLANE  
–H–  
–C–  
SEATING  
PLANE  
0.01 (0.004)  
M
H
G
U
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
6.95  
6.95  
1.40  
7.10 0.274 0.280  
7.10 0.274 0.280  
1.60 0.055 0.063  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF  
LEAD AND IS COINCIDENT WITH THE LEAD WHERE  
THE LEAD EXITS THE PLASTIC BODY AT THE  
BOTTOM OF THE PARTING LINE.  
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT  
DATUM PLANE –H–.  
T
0.273 0.373 0.010 0.015  
1.30  
0.273  
0.80 BSC  
–––  
0.119  
0.33  
5.6 REF  
6
0.119  
0.40 BSC  
5
0.15  
8.85  
0.15  
5
8.85  
1.00 REF  
1.50 0.051 0.059  
R
––– 0.010  
–––  
–H–  
0.031 BSC  
DATUM  
PLANE  
0.20  
––– 0.008  
0.197 0.005 0.008  
0.57 0.013 0.022  
5. DIMENSIONS S AND V TO BE DETERMINED AT  
SEATING PLANE –C–.  
0.220 REF  
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25  
(0.010) PER SIDE. DIMENSIONS A AND B DO  
INCLUDE MOLD MISMATCH AND ARE DETERMINED  
AT DATUM PLANE –H–.  
7. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION  
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
DAMBAR CANNOT BE LOCATED ON THE LOWER  
RADIUS OR THE FOOT.  
K
8
6
8
Q
0.135 0.005 0.005  
0.016 BSC  
10  
X
10  
5
DETAIL C  
0.25 0.006 0.010  
9.15 0.348 0.360  
0.25 0.006 0.010  
T
U
V
X
11  
9.15 0.348 0.360  
0.039 REF  
5
11  
13–23  
MOTOROLA ANALOG IC DEVICE DATA  
T SUFFIX  
CASE 894-03  
Plastic Package  
(23-Pin SZIP)  
ISSUE B  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
1
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH  
OR PROTRUSIONS.  
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH  
OR PROTRUSIONS.  
5. MOLD FLASH OR PROTRUSIONS SHALL NOT  
EXCEED 0.010 (0.250).  
23  
6. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE PROTRUSION  
SHALL BE 0.003 (0.076) TOTAL IN EXCESS OF  
THE D DIMENSION AT MAXIMUM MATERIAL  
CONDITION.  
C
E
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN MAX  
B
L
K
Y
A
B
C
D
E
0.684  
1.183  
0.175  
0.026  
0.058  
0.165  
0.694 17.374 17.627  
1.193 30.048 30.302  
0.179  
0.031  
0.062  
0.175  
V
–N–  
4.445  
0.660  
1.473  
4.191  
4.547  
0.787  
1.574  
4.445  
M
A
U
F
P
S
F
G
H
J
K
L
M
N
P
0.050 BSC  
0.169 BSC  
1.270 BSC  
4.293 BSC  
0.356 0.508  
0.014  
0.625  
0.770  
0.148  
0.148  
0.020  
H
0.639 15.875 16.231  
0.790 19.558 20.066  
0.152  
0.152  
R
W
3.760  
3.760  
3.861  
3.861  
–T–  
SEATING  
PLANE  
0.390 BSC  
9.906 BSC  
23X J  
R
S
U
V
W
Y
0.416  
0.157  
0.105  
0.868 REF  
0.200 BSC  
0.700  
0.424 10.566 10.770  
0.167  
0.115  
3.988  
2.667  
4.242  
2.921  
PIN 1  
M
0.024 (0.610)  
T
PIN 23  
22.047 REF  
5.080 BSC  
G
0.710 17.780 18.034  
23X D  
M
S
S
0.010 (0.254)  
T Q  
N
13–24  
MOTOROLA ANALOG IC DEVICE DATA  
FTA SUFFIX  
CASE 932–02  
Plastic Package  
(TQFP–48)  
ISSUE D  
1
48  
P
4X  
0.200 (0.008) AB T–U  
Z
DETAIL Y  
9
A
A1  
48  
37  
AE  
AE  
1
36  
–T–  
–U–  
V1  
B
V
B1  
–T–, –U–, –Z–  
12  
25  
DETAIL Y  
13  
24  
–Z–  
S1  
M
TOP & BOTTOM  
S
R
4X  
GAUGE PLANE  
0.200 (0.008) AC T–U  
Z
0.250 (0.010)  
E
C
H
0.080 (0.003) AC  
G
–AB–  
–AC–  
W
Q
K
AD  
DETAIL AD  
X
BASE METAL  
MILLIMETERS  
DIM MIN MAX  
7.000 BSC  
INCHES  
MIN  
MAX  
NOTES:  
A
A1  
B
0.276 BSC  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
3.500 BSC  
7.000 BSC  
3.500 BSC  
1.400 1.600 0.055 0.063  
0.170 0.270 0.007 0.011  
0.138 BSC  
0.276 BSC  
0.138 BSC  
N
J
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF  
LEAD AND IS COINCIDENT WITH THE LEAD  
WHERE THE LEAD EXITS THE PLASTIC BODY AT  
THE BOTTOM OF THE PARTING LINE.  
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED  
AT DATUM PLANE –AB–.  
B1  
C
D
E
1.350 1.450 0.053 0.057  
0.170 0.230 0.007 0.009  
F
D
F
G
H
J
K
M
N
P
0.500 BASIC  
0.020 BASIC  
5. DIMENSIONS S AND V TO BE DETERMINED AT  
SEATING PLANE –AC–.  
0.050 0.150 0.002 0.006  
0.090 0.200 0.004 0.008  
0.500 0.700 0.020 0.028  
12 REF  
0.090 0.160 0.004 0.006  
0.250 BASIC 0.010 BASIC  
M
S
S
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION. ALLOWABLE PROTRUSION IS  
0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO  
INCLUDE MOLD MISMATCH AND ARE  
DETERMINED AT DATUM PLANE –AB–.  
7. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. DAMBAR PROTRUSION SHALL  
NOT CAUSE THE D DIMENSION TO EXCEED  
0.350 (0.014).  
0.080 (0.003)  
AC T–U  
Z
12 REF  
SECTION AE–AE  
Q
R
1
5
1
5
0.150 0.250 0.006 0.010  
S
9.000 BSC  
4.500 BSC  
9.000 BSC  
4.500 BSC  
0.200 REF  
1.000 REF  
0.354 BSC  
0.177 BSC  
0.354 BSC  
0.177 BSC  
0.008 REF  
0.039 REF  
S1  
V
V1  
W
X
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE  
0.0076 (0.0003).  
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.  
13–25  
MOTOROLA ANALOG IC DEVICE DATA  
D2T SUFFIX  
CASE 936–03  
Plastic Package  
ISSUE B  
1
2
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
3
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS  
A AND K.  
TERMINAL 4  
4. DIMENSIONS U AND V ESTABLISH A MINIMUM  
MOUNTING SURFACE FOR TERMINAL 4.  
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
FLASH OR GATE PROTRUSIONS. MOLD FLASH  
AND GATE PROTRUSIONS NOT TO EXCEED  
0.025 (0.635) MAXIMUM.  
K
U
A
S
V
B
H
F
1
2
3
INCHES  
DIM MIN MAX  
0.403 9.804 10.236  
MILLIMETERS  
MIN MAX  
A
B
C
D
E
F
0.386  
0.356  
0.170  
0.026  
0.045  
J
D
0.368 9.042  
0.180 4.318  
0.036 0.660  
0.055 1.143  
9.347  
4.572  
0.914  
1.397  
G
M
0.010 (0.254)  
T
0.051 REF  
0.100 BSC  
0.539 0.579 13.691 14.707  
0.125 MAX  
0.050 REF  
1.295 REF  
2.540 BSC  
–T–  
E
G
H
J
K
L
M
N
P
R
S
U
V
OPTIONAL  
CHAMFER  
3.175 MAX  
1.270 REF  
0.000  
0.088  
0.018  
0.058  
5
0.010 0.000  
0.254  
2.591  
0.660  
1.981  
0.102 2.235  
0.026 0.457  
0.078 1.473  
REF  
5 REF  
C
0.116 REF  
0.200 MIN  
0.250 MIN  
2.946 REF  
5.080 MIN  
6.350 MIN  
M
L
P
N
R
D2T SUFFIX  
CASE 936A–02  
Plastic Package  
(D PAK)  
1
NOTES:  
2
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS  
A AND K.  
5
ISSUE A  
TERMINAL 6  
4. DIMENSIONS U AND V ESTABLISH A MINIMUM  
MOUNTING SURFACE FOR TERMINAL 6.  
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
FLASH OR GATE PROTRUSIONS. MOLD FLASH  
AND GATE PROTRUSIONS NOT TO EXCEED  
0.025 (0.635) MAXIMUM.  
U
A
V
S
K
B
H
1
2
3
4
5
INCHES  
DIM MIN MAX  
0.403 9.804 10.236  
MILLIMETERS  
MIN MAX  
A
B
C
D
E
G
H
K
L
M
N
P
R
S
0.386  
0.356  
0.170  
0.026  
0.045  
0.067 BSC  
0.539  
0.050 REF  
0.000  
0.088  
0.018  
0.058  
5
0.116 REF  
0.200 MIN  
0.250 MIN  
0.368 9.042  
0.180 4.318  
0.036 0.660  
0.055 1.143  
1.702 BSC  
0.579 13.691 14.707  
1.270 REF  
9.347  
4.572  
0.914  
1.397  
D
M
0.010 (0.254)  
T
G
–T–  
E
OPTIONAL  
CHAMFER  
0.010 0.000  
0.254  
2.591  
0.660  
1.981  
0.102 2.235  
0.026 0.457  
0.078 1.473  
REF  
5 REF  
2.946 REF  
5.080 MIN  
6.350 MIN  
U
V
C
M
L
P
N
R
13–26  
MOTOROLA ANALOG IC DEVICE DATA  
20  
DT, DTB SUFFIX  
CASE 948E–02  
Plastic Package  
(TSSOP–20)  
ISSUE A  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
1
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)  
PER SIDE.  
20X K REF  
K
M
S
S
0.10 (0.004)  
T U  
V
S
K1  
0.15 (0.006) T U  
5. DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN  
EXCESS OF THE K DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
7. DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE –W–.  
J J1  
20  
11  
2X L/2  
B
SECTION N–N  
L
–U–  
PIN 1  
IDENT  
0.25 (0.010)  
N
10  
1
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN  
MAX  
0.260  
0.177  
0.047  
0.006  
0.030  
M
A
B
C
6.40  
4.30  
–––  
6.60 0.252  
4.50 0.169  
1.20  
S
0.15 (0.006) T U  
–––  
A
D
F
0.05  
0.50  
0.15 0.002  
0.75 0.020  
N
–V–  
G
H
J
J1  
K
K1  
L
0.65 BSC  
0.026 BSC  
F
0.27  
0.09  
0.09  
0.19  
0.19  
0.37  
0.011  
0.015  
0.008  
0.006  
0.012  
0.010  
0.20 0.004  
0.16 0.004  
0.30 0.007  
0.25 0.007  
DETAIL E  
C
6.40 BSC  
0.252 BSC  
M
0
8
0
8
–W–  
G
D
H
0.100 (0.004)  
–T– SEATING  
DETAIL E  
PLANE  
DTB SUFFIX  
CASE 948F–01  
16  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
Plastic Package  
1
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
(TSSOP–16, TSSOP–16L)  
ISSUE O  
16X KREF  
M
S
S
0.10 (0.004)  
T U  
V
4. DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED  
0.25 (0.010) PER SIDE.  
S
0.15 (0.006) T U  
K
K1  
5. DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN  
EXCESS OF THE K DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
7. DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE –W–.  
16  
9
2X L/2  
J1  
SECTION N–N  
B
–U–  
L
J
PIN 1  
IDENT.  
8
1
N
MILLIMETERS  
DIM MIN MAX  
INCHES  
0.25 (0.010)  
MIN  
MAX  
0.200  
0.177  
0.047  
0.006  
0.030  
A
B
C
4.90  
4.30  
–––  
5.10 0.193  
4.50 0.169  
1.20  
S
M
0.15 (0.006) T U  
A
–––  
D
F
0.05  
0.50  
0.15 0.002  
0.75 0.020  
–V–  
N
G
H
J
J1  
K
K1  
L
0.65 BSC  
0.026 BSC  
0.18  
0.09  
0.09  
0.19  
0.19  
0.28 0.007  
0.20 0.004  
0.16 0.004  
0.30 0.007  
0.25 0.007  
0.011  
0.008  
0.006  
0.012  
0.010  
F
DETAIL E  
DETAIL E  
6.40 BSC  
0.252 BSC  
0
C
M
0
8
8
0.10 (0.004)  
–W–  
H
SEATING  
PLANE  
–T–  
D
G
13–27  
MOTOROLA ANALOG IC DEVICE DATA  
DTB SUFFIX  
CASE 948G–01  
Plastic Package  
(TSSOP–14)  
ISSUE O  
14  
1
NOTES:  
14X K REF  
1
DIMENSIONING AND TOLERANCING PER ANSI  
M
S
S
Y14.5M, 1982.  
0.10 (0.004)  
T U  
V
2
3
CONTROLLING DIMENSION: MILLIMETER.  
DIMENSION A DOES NOT INCLUDE MOLD FLASH,  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED  
0.25 (0.010) PER SIDE.  
DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN  
EXCESS OF THE K DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
S
0.15 (0.006) T U  
N
0.25 (0.010)  
14  
4
5
8
2X L/2  
M
B
L
N
–U–  
PIN 1  
IDENT.  
F
7
1
6
7
TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE –W–.  
DETAIL E  
S
K
0.15 (0.006) T U  
A
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
K1  
–V–  
A
B
C
4.90  
4.30  
–––  
5.10 0.193 0.200  
4.50 0.169 0.177  
1.20  
J J1  
––– 0.047  
D
F
0.05  
0.50  
0.15 0.002 0.006  
0.75 0.020 0.030  
SECTION N–N  
G
H
J
J1  
K
K1  
L
0.65 BSC  
0.026 BSC  
0.60 0.020 0.024  
0.20 0.004 0.008  
0.16 0.004 0.006  
0.30 0.007 0.012  
0.25 0.007 0.010  
0.50  
0.09  
0.09  
0.19  
0.19  
–W–  
C
6.40 BSC  
0.252 BSC  
0.10 (0.004)  
M
0
8
0
8
SEATING  
PLANE  
–T–  
H
G
DETAIL E  
D
13–28  
MOTOROLA ANALOG IC DEVICE DATA  
DTB SUFFIX  
CASE 948H–01  
Plastic Package  
ISSUE O  
24  
1
24X KREF  
M
S
S
0.10 (0.004)  
T U  
V
S
0.15 (0.006) T U  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
24  
13  
2X L/2  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED  
0.25 (0.010) PER SIDE.  
B
–U–  
L
PIN 1  
IDENT.  
12  
1
5. DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN  
EXCESS OF THE K DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
S
0.15 (0.006) T U  
A
–V–  
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
7. DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE –W–.  
MILLIMETERS  
DIM MIN MAX  
7.90 0.303  
INCHES  
MIN  
MAX  
C
A
B
7.70  
4.30  
–––  
0.311  
4.50 0.169 0.177  
1.20 ––– 0.047  
C
0.10 (0.004)  
D
F
G
H
J
J1  
K
K1  
L
0.05  
0.50  
0.65 BSC  
0.27  
0.09  
0.09  
0.19  
0.19  
0.15 0.002 0.006  
0.75 0.020 0.030  
SEATING  
PLANE  
–T–  
G
H
D
0.026 BSC  
0.011 0.015  
0.37  
0.20 0.004 0.008  
0.16 0.004 0.006  
0.30 0.007 0.012  
0.25 0.007 0.010  
6.40 BSC  
0.252 BSC  
M
0
8
0
8
–W–  
DETAIL E  
N
0.25 (0.010)  
K
M
K1  
N
J1  
F
DETAIL E  
SECTION N–N  
J
13–29  
MOTOROLA ANALOG IC DEVICE DATA  
DTB SUFFIX  
CASE 948J–01  
Plastic Package  
(TSSOP–8)  
8
1
ISSUE O  
NOTES:  
8x KREF  
1
DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
M
S
S
0.10 (0.004)  
T U  
V
2
3
CONTROLLING DIMENSION: MILLIMETER.  
DIMENSION A DOES NOT INCLUDE MOLD FLASH.  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
S
0.15 (0.006) T U  
K
K1  
8
5
2X L/2  
4
5
DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)  
PER SIDE.  
DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN  
EXCESS OF THE K DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE –W–.  
J J1  
B
–U–  
L
PIN 1  
IDENT.  
SECTION N–N  
4
1
N
6
7
0.25 (0.010)  
S
0.15 (0.006) T U  
A
M
–V–  
MILLIMETERS  
INCHES  
DIM MIN  
MAX  
3.10  
4.50 0.169  
1.20 –––  
0.15 0.002  
0.75 0.020  
MIN  
0.114  
MAX  
0.122  
0.177  
0.047  
0.006  
0.030  
N
A
B
C
2.90  
4.30  
–––  
F
D
F
0.05  
0.50  
DETAIL E  
G
H
J
J1  
K
K1  
L
0.65 BSC  
0.026 BSC  
0.50  
0.09  
0.09  
0.19  
0.19  
0.60 0.020  
0.20 0.004  
0.16 0.004  
0.30 0.007  
0.25 0.007  
0.024  
0.008  
0.006  
0.012  
0.010  
–W–  
C
0.10 (0.004)  
G
SEE DETAIL E  
SEATING  
PLANE  
–T–  
D
6.40 BSC  
0.252 BSC  
M
0
8
0
8
H
M SUFFIX  
CASE 967–01  
Plastic Package  
(EIAJ–20)  
20  
1
ISSUE O  
NOTES:  
1
DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2
3
CONTROLLING DIMENSION: MILLIMETER.  
DIMENSIONS D AND E DO NOT INCLUDE MOLD  
FLASH OR PROTRUSIONS AND ARE MEASURED  
AT THE PARTING LINE. MOLD FLASH OR  
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)  
PER SIDE.  
L
E
20  
11  
Q
1
4
5
TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
H
E
E
M
THE LEAD WIDTH DIMENSION (b) DOES NOT  
INCLUDE DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)  
TOTAL IN EXCESS OF THE LEAD WIDTH  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
DAMBAR CANNOT BE LOCATED ON THE LOWER  
RADIUS OR THE FOOT. MINIMUM SPACE  
BETWEEN PROTRUSIONS AND ADJACENT LEAD  
TO BE 0.46 ( 0.018).  
L
1
10  
DETAIL P  
Z
D
VIEW P  
MILLIMETERS  
INCHES  
MIN MAX  
––– 0.081  
e
A
DIM MIN  
MAX  
c
A
A
–––  
0.05  
0.35  
0.18  
2.05  
0.20 0.002 0.008  
0.50 0.014 0.020  
0.27 0.007  
1
b
c
0.011  
D
E
e
12.35 12.80 0.486 0.504  
A
b
1
5.10  
5.45 0.201 0.215  
1.27 BSC  
0.050 BSC  
8.20 0.291 0.323  
0.85 0.020 0.033  
1.50 0.043 0.059  
M
0.10 (0.004)  
0.13 (0.005)  
H
7.40  
0.50  
1.10  
0
0.70  
–––  
E
L
L
E
M
Q
10  
0.90 0.028 0.035  
0.81 ––– 0.032  
10  
0
1
Z
13–30  
MOTOROLA ANALOG IC DEVICE DATA  
FTB SUFFIX  
CASE 976–01  
Plastic Package  
(TQFP–20)  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF  
LEAD AND IS COINCIDENT WITH THE LEAD  
WHERE THE LEAD EXITS THE PLASTIC BODY AT  
THE BOTTOM OF THE PARTING LINE.  
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED  
AT DATUM PLANE –AB–.  
20  
1
ISSUE O  
4X  
9
0.200 (0.008) AB T–U Z  
5. DIMENSIONS S AND V TO BE DETERMINED AT  
DATUM PLANE –AC–.  
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION. ALLOWABLE PROTRUSION IS  
0.250 (0.010) PER SIDE. DIMENSIONS A AND B  
DO INCLUDE MOLD MISMATCH AND ARE  
DETERMINED AT DATUM PLANE –AB–.  
7. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. DAMBAR PROTRUSION SHALL  
NOT CAUSE THE D DIMENSION TO EXCEED  
0.350 (0.014).  
A
A1  
DETAIL Y  
20  
16  
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE  
0.0076 (0.0003).  
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.  
15  
1
–T–  
–U–  
MILLIMETERS  
DIM MIN MAX  
4.000 BSC  
INCHES  
MIN MAX  
0.157 BSC  
0.079 BSC  
0.157 BSC  
0.079 BSC  
V
B
A
A1  
B
2.000 BSC  
4.000 BSC  
2.000 BSC  
1.400 1.600 0.055 0.063  
0.170 0.270 0.007 0.011  
B1  
B1  
C
D
E
11  
5
V1  
1.350 1.450 0.053 0.057  
0.170 0.230 0.007 0.009  
F
G
H
J
K
M
N
P
0.650 BSC  
0.026 BSC  
0.050 0.150 0.002 0.006  
0.090 0.200 0.004 0.008  
0.500 0.700 0.020 0.028  
12 REF  
0.090 0.160 0.004 0.006  
0.250 BSC 0.010 BSC  
6
10  
12 REF  
–Z–  
S1  
Q
R
S
S1  
V
V1  
W
X
1
5
1
5
S
0.150 0.250 0.006 0.010  
6.000 BSC  
3.000 BSC  
6.000 BSC  
3.000 BSC  
0.200 REF  
1.000 REF  
0.236 BSC  
0.118 BSC  
0.236 BSC  
0.118 BSC  
0.008 REF  
0.039 REF  
4X  
0.200 (0.008) AB T–U Z  
DETAIL AD  
J
N
–AB–  
–AC–  
F
D
0.080 (0.003) AC  
S
S
S
0.080 (0.003)  
AC T–U  
Z
M
SECTION AE–AE  
TOP & BOTTOM  
R
–T–, –U–, –Z–  
C
H
E
AE  
G
AE  
W
K
X
GAUGE  
PLANE  
Q
0.250 (0.010)  
DETAIL AD  
DETAIL Y  
13–31  
MOTOROLA ANALOG IC DEVICE DATA  
FTA SUFFIX  
CASE 977–01  
Plastic Package  
ISSUE O  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
24  
1
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF  
LEAD AND IS COINCIDENT WITH THE LEAD  
WHERE THE LEAD EXITS THE PLASTIC BODY AT  
THE BOTTOM OF THE PARTING LINE.  
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED  
AT DATUM PLANE –AB–.  
4X  
5. DIMENSIONS S AND V TO BE DETERMINED AT  
DATUM PLANE –AC–.  
9
0.200 (0.008) AB T–U Z  
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION. ALLOWABLE PROTRUSION IS  
0.250 (0.010) PER SIDE. DIMENSIONS A AND B  
DO INCLUDE MOLD MISMATCH AND ARE  
DETERMINED AT DATUM PLANE –AB–.  
7. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. DAMBAR PROTRUSION SHALL  
NOT CAUSE THE D DIMENSION TO EXCEED  
0.350 (0.014).  
A
A1  
24  
DETAIL Y  
19  
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE  
0.0076 (0.0003).  
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.  
1
18  
–T–  
–U–  
MILLIMETERS  
DIM MIN MAX  
4.000 BSC  
INCHES  
MIN MAX  
0.157 BSC  
0.079 BSC  
0.157 BSC  
0.079 BSC  
A
A1  
B
2.000 BSC  
4.000 BSC  
2.000 BSC  
1.400 1.600 0.055 0.063  
0.170 0.270 0.007 0.011  
V
B
B1  
C
D
E
B1  
13  
6
1.350 1.450 0.053 0.057  
0.170 0.230 0.007 0.009  
V1  
F
G
H
J
K
M
N
P
0.500 BSC  
0.020 BSC  
0.050 0.150 0.002 0.006  
0.090 0.200 0.004 0.008  
0.500 0.700 0.020 0.028  
12 REF  
0.090 0.160 0.004 0.006  
0.250 BSC 0.010 BSC  
12 REF  
7
12  
Q
R
S
S1  
V
V1  
W
X
1
5
1
5
–Z–  
S1  
0.150 0.250 0.006 0.010  
6.000 BSC  
3.000 BSC  
6.000 BSC  
3.000 BSC  
0.200 REF  
1.000 REF  
0.236 BSC  
0.118 BSC  
0.236 BSC  
0.118 BSC  
0.008 REF  
0.039 REF  
S
4X  
0.200 (0.008) AB T–U Z  
DETAIL AD  
–T–, –U–, –Z–  
–AB–  
–AC–  
AE  
AE  
0.080 (0.003) AC  
M
TOP & BOTTOM  
P
R
G
DETAIL Y  
C
E
J
N
F
W
GAUGE  
Q
D
PLANE  
H
K
0.250 (0.010)  
X
S
S
S
0.080 (0.003)  
AC T–U  
Z
DETAIL AD  
SECTION AE–AE  
13–32  
MOTOROLA ANALOG IC DEVICE DATA  
N SUFFIX  
CASE 1212–01  
Plastic Package  
(SOT–23)  
1
ISSUE O  
NOTES:  
1. DIMENSIONS ARE IN MILLIMETERS.  
2. INTERPRET DIMENSIONS AND TOLERANCES  
PER ASME Y14.5M, 1994.  
A2  
B
A
E
D
S
0.05  
3. DATUM C IS A SEATING PLANE.  
A1  
MILLIMETERS  
5
1
4
3
DIM MIN  
MAX  
0.10  
1.30  
0.50  
0.25  
3.00  
3.10  
1.80  
L
A1  
A2  
B
C
D
E
E1  
e
e1  
L
0.00  
1.00  
0.30  
0.10  
2.80  
2.50  
1.50  
0.95 BSC  
1.90 BSC  
0.20  
0.45  
2
E1  
C
L1  
B
5X  
C
M
S
S
0.10  
C B  
A
e
e1  
–––  
0.75  
L1  
H SUFFIX  
1
CASE 1213–01  
Plastic Package  
(SOT–89)  
ISSUE O  
NOTES:  
A
D
A2  
1. DIMENSIONS ARE IN MILLIMETERS.  
2. INTERPRET DIMENSIONS AND TOLERANCING  
PER ASME Y14.5M, 1994.  
C
B
D1  
3. DATUM C IS A SEATING PLANE.  
MILLIMETERS  
DIM MIN  
MAX  
1.60  
0.57  
0.52  
0.50  
4.60  
1.70  
4.25  
2.60  
E1  
E
A2  
B
B1  
C
D
D1  
E
1.40  
0.37  
0.32  
0.30  
4.40  
1.50  
–––  
L1  
B
C
M
S
S
0.10  
C B  
A
E1  
e
e1  
L1  
2.40  
1.50 BSC  
3.00 BSC  
0.80 –––  
B1 2X  
e
M
S
S
0.10  
C B  
A
e1  
13–33  
MOTOROLA ANALOG IC DEVICE DATA  

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