MC13142FTB [MOTOROLA]
TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PQFP20, TQFP-20;型号: | MC13142FTB |
厂家: | MOTOROLA |
描述: | TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PQFP20, TQFP-20 蜂窝 |
文件: | 总49页 (文件大小:988K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LOW POWER DC – 1.8 GHz
LNA, MIXER and VCO
The MC13142 is intended to be used as a first amplifier, voltage controlled
oscillator and down converter for RF applications. It features wide band
operation, low noise, high gain and high linearity while maintaining low
current consumption. The circuit consists of a Low Noise Amplifier (LNA), a
Voltage Controlled Oscillator (VCO), a buffered oscillator output, a mixer, an
SEMICONDUCTOR
TECHNICAL DATA
Intermediate Frequency amplifier (IF ) and a dc control section. The wide
amp
mixer IF bandwidth allows this part also to be used as an up converter and
exciter amplifier.
• Wide RF Bandwidth: DC–1.8 GHz
• Wide LO Bandwidth: DC–1.8 GHz
• Wide IF Bandwidth: DC–1.8 GHz
16
• Low Power: 13 mA @ V
= 2.7–6.5 V
CC
1
• High Mixer Linearity: P
= +3.0 dBm
i1.0 dB
• Linearity Adjustment Increases IP
• Single–Ended 50 Ω Mixer Input
• Double Balanced Mixer Operation
• Open Collector Mixer Output
Up to +20 dBm
3in
D SUFFIX
PLASTIC PACKAGE
CASE 751B
(SO–16)
• Single Transistor Oscillator with Collector, Base and Emitter Pinned Out
• Buffered Oscillator Output
• Mixer and Oscillator Can be Enabled Independently in TQFP–20
Package Only
20
1
ORDERING INFORMATION
Operating
FTB SUFFIX
PLASTIC PACKAGE
CASE 976
Temperature Range
Device
MC13142D
MC13142FTB
Package
SO–16
(Thin QFP)
T
A
= –40° to +85°C
TQFP–20
PIN CONNECTIONS
TQFP–20
SO–16
EN
RF
V
1
2
3
4
5
6
7
16
15
out
5
4
3
2
1
RF
in
CC
Mx Lin
Cont
6
7
20
19
18
17
RF
RF
In
V
EE
Mix Lin Cont
m
14
13
12
11
10
V
EE
V
EE
Osc E
RF
m
V
EE
V
EE
8
V
EE
Osc B
IF+
Osc E
Osc B
9
Osc C, V
IF+
IF–
CC
10
16 IF–
Buff
11 12 13 14 15
V
CC
8
9
V
EE
This device contains 176 active transistors.
8–235
MOTOROLA ANALOG IC DEVICE DATA
MC13142
MAXIMUM RATINGS (T = 25°C, unless otherwise noted.)
A
Rating
Power Supply Voltage
Symbol
Value
Unit
Vdc
Vdc
V
7.0 (max)
2.7–6.5
CC
CC
Operating Supply Voltage Range
V
NOTE: ESD data available upon request.
ELECTRICAL CHARACTERISTICS (V
= 3.0 V, T = 25°C, LO = –10 dBm @ 950 MHz, IF @ 50 MHz.)
in
CC
A
Characteristic
Symbol
Min
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Typ
100
13.5
12
Max
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Unit
pA
Supply Current (Power Down)
Supply Current (Power Up)
I
I
CC
mA
dB
CC
Amplifier Gain (50 Ω Insertion Gain)
Amplifier Reverse Isolation
S
21
12
S
–33
–10
–15
–15
–5.0
1.8
dB
Amplifier Input Match
Γ
dB
in amp
Amplifier Output Match
Γ
dB
out amp
Amplifier 1.0 dB Gain Compression
Amplifier Input Third Order Intercept
Amplifier Noise Figure (Application Circuit)
Amplifier Gain @ N.F.
Pin
dBm
dBm
dB
–1.0 dB
IP3
in
NF
G
17
dB
NF
Mixer Voltage Conversion Gain (R = R = 800 Ω)
VG
PG
9.0
dB
P
L
C
C
Mixer Power Conversion Gain (R = R = 800 Ω)
–3.0
–20
12
dB
P
L
Mixer Input Match
Γ
dB
in M
Mixer SSB Noise Figure
NF
dB
SSBM
Mixer 1.0 dB Gain Compression
Mixer Input Third Order Intercept
Oscillator Buffer Drive (50 Ω)
Pin
–1.0 dBM
3.0
dBm
dBm
dBm
dBc/Hz
dB
IP3
–1.0
–16
–90
–35
–35
–35
–35
–35
–25
–25
InM
P
VCO
Oscillator Phase Noise @ 25 kHz Offset
N
Φ
RF Feedthrough to RF
P
RFin–RFm
in
m
RF
Feedthrough to RF
P
dB
out
m
RFout–RFm
LO Feedthrough to IF
LO Feedthrough to RF
LO Feedthrough to RF
P
dBm
dBm
dBm
dB
LO–IF
P
in
LO–RFin
LO–RFm
P
m
Mixer RF Feedthrough to IF
Mixer RF Feedthrough to RF
P
RFm–IF
P
dB
in
RFm–RFin
8–236
MOTOROLA ANALOG IC DEVICE DATA
MC13142
CIRCUIT DESCRIPTION
General
The MC13142 is a low power LNA, double–balanced
(MSG) yields noise performance within a few tenths of a dB
of the minimum noise figure.
Mixer, and VCO. This device is designated for use as the
frontend section in analog and digital FM systems such as
Digital European Cordless Telephone (DECT), PHS, PCS,
Cellular, UHF and 800 MHz Special Mobile Radio (SMR),
UHF Family Radio Services and 902 to 928 MHz cordless
telephones. It features a mixer linearity control to preset or
auto program the mixer dynamic range, an enable function
and a wideband IF so the IC may be used either as a down
converter or an up converter. Further details are covered in
the Pin by Pin Description which shows the equivalent
internal circuit and external circuit requirements.
Mixer
The mixer is a double–balanced four quadrant multiplier
biased class AB allowing for programmable linearity control
via an external current source. An input third order intercept
point of 20 dBm may be achieved. All 3 ports of the mixer are
designed to work up to 1.8 GHz. The mixer has a 50 Ω
single–ended RF input and open collector differential IF
outputs. An on–board Local Oscillator transistor has the
emitter, base and collector pinned out to implement a low
phase noise VCO in various configurations. Additionally, a
buffered LO output is provided for operation with a frequency
synthesizer. The linear gain of the mixer is approximately
0 dB with a SSB noise figure of 12 dB in the IF output circuit
configuration shown in the application example.
Current Regulation/Enable
Temperature compensating voltage independent current
regulators are controlled by the enable function in which
“high” powers up the IC.
Local Oscillator
Low Noise Amplifier (LNA)
The on–chip transistor operates with coaxial transmission
line or LC resonant elements to over 2.0 GHz. Biasing is
done with a temperature compensated current source in the
emitter and a collector to base internal resistor of 7.6 kΩ;
The LNA is internally biased at low supply current
(approximately 2.0 mA emitter current) for optimal noise
figure and gain. The LNA output is biased internally with a
however, an RFC from V
application circuit shows a voltage controlled Clapp oscillator
operating at center frequency of 975 MHz.
to base is recommended. The
600 Ω resistor to V . Input and output matching may be
achieved at various frequencies using few external
components. Matching the LNA for Maximum stable gain
CC
CC
8–237
MOTOROLA ANALOG IC DEVICE DATA
MC13142
PIN FUNCTION DESCRIPTION
Pin
16 Pin
SOIC
20 Pin
TQFP
Equivalent Internal Circuit
(20 Pin TQFP)
Symbol
Description
1
4
5
EN
E Osc
Enable, E Osc
V
CC
In SO–16, both enables, (for the Oscillator/LO
Buffer and LNA/Mixer) are bonded to Pin 1. In the
TQFP, two pins are provided, Pin 5, E Osc enables
the oscillator and buffer while Pin 4, EN enables
the LNA/Mixer.
4
40 k
2.0 V
EN
BE
Enable by pulling up to V
CC
or to greater than
2.0 V
.
BE
V
CC
70 k
2.0 V
5
E Osc
BE
2
3
6
RF
in
RF Input
V
CC
The input is the base of an NPN low noise
amplifier. Minimum external matching is required to
optimize the input return loss and gain.
600
3
RF
V
ref2
out
7, 8
V
EE
V
– Negative Supply
pin is taken to an ample dc ground plane
EE
V
EE
V
EE
through a low impedance path. The path should be
kept as short as possible. A two sided PCB is
implemented so that ground returns can be easily
made through via holes.
V
ref3
6
RF
in
7
2.0 mA
V
EE
16
3
RF
out
RF Output
V
CC
The output is from the collector of the LNA; it is
internally biased with a 600 Ω resistor to V . As
CC
shown in the 926 MHz application receiver the
output is conjugately matched with a shunt L, and
series L and C network.
8
V
EE
4
5
6
9
10
11
Osc E
Osc B
Osc C
On–Board VCO Transistor
The transistor has the emitter, base and collector +
9
V
pins available. Internal biasing which is
CC
Osc E
compensated for stability over temperature is
provided. It is recommended that the base pin is
10
10
pulled up to V
through an RFC chosen for the
CC
1.5
mA
12
V
CC
particular oscillator center frequency. The
application circuit shows a modified Colpitts or
Clapp oscillator configuration and its design is
discussed in detail in the application section.
Osc B
7.6 k
11
V
EE
Osc C
6
8
12
14
V
CC
V
CC
Supply Voltage (V )
CC
Two V
CC
pins are provided for the Local Oscillator
and LO Buffer Amplifier. The operating supply
voltage range is from 2.7 Vdc to 6.5 Vdc. In the
V
EE
PCB layout, the V
trace must be kept as wide as
V
CC
CC
feasible to minimize inductive reactances along the
trace. V should be decoupled to V at the IC
13
CC
EE
pin as shown in the component placement view.
LOBuf
7
13
LO Buff
Local Oscillator Buffer
This is a buffered output providing –16 dBm
(50 Ω termination) to drive the f pin of a PLL
synthesizer. Impedance matching to the
synthesizer may be necessary to deliver the
optimal signal and to improve the phase noise
performance of the VCO.
1.0
mA
14
in
V
CC
V
EE
8–238
MOTOROLA ANALOG IC DEVICE DATA
MC13142
PIN FUNCTION DESCRIPTION (continued)
Pin
16 Pin
SOIC
20 Pin
TQFP
Equivalent Internal Circuit
(20 Pin TQFP)
Symbol
Description
9, 12
15, 18, 19
16, 17
V
V
, Negative Supply
EE
EE
These pins are V
V
CC
V
CC
supply for the mixer IF output.
EE
In the application PC board these pins are tied to a
common V
trace with other V pins.
EE
EE
10, 11
IF–, IF+
IF Output
The IF is a differential open collector configuration
which designed to use over a wide frequency range
for up conversion as well as down conversion.
Differential to single–ended circuit configuration
and matching options are discussed in the
application section. 6.0 dB of additional Mixer gain
can be achieved by conjugately matching at the
desired IF frequency.
16
IF–
15
17
IF+
18, 19
V
EE
13
20
RF
Mixer RF Input
m
V
CC
The mixer input impedance is broadband 50 Ω for
applications up to 1.8 GHz. It easily interfaces with
a RF ceramic filter as shown in the application
schematic.
V
ref1
33
V
EE
20
14
1
Mix Lin
Cont
Mixer Linearity Control
RF
m
The mixer linearity control circuit accepts
approximately 0 to 2.3 mA control current to set
the dynamic range of the mixer. An Input Third
Order Intercept Point, IIP3 of 20 dBm may be
achieved at 2.3 mA of control current
(approximately 7.0 mA of additional supply
current).
1
Mix Lin
Cont
33
400 µA
8–239
MOTOROLA ANALOG IC DEVICE DATA
MC13142
APPLICATIONS INFORMATION
Evaluation PC Board
Component Selection
The evaluation PCB is very versatile and is intended to be
used across the entire useful frequency range of this device.
The PC board accommodates all SMT components on the
circuit side (see Circuit Side Component Placement View).
This evaluation board will be discussed and referenced in
this section.
The evaluation PC board is designed to accommodate
specific components, while also being versatile enough to
use components from various manufacturers. The circuit
side placement view is illustrated for the components
specified in the application circuit. The application circuit
schematic specifies particular components that were used to
achieve the results given and specified in the tables but
alternate components of the same Q and value should give
equivalent results.
Figure 1. Application Circuit
(926.5 MHz)
V
CC
PC Rotary SW
51
47 p
RF
Input
Enable
3.0 p
39 nH
100 p
*Z
50 Ω
=
SMA
O
1
2
3
4
5
6
16
15
14
13
12
11
10
9
DC Bias
LNA
6.8 nH
18 nH
V
Toko RF
Filter
CC
Z
= 50 Ω
O
3.9 p
V
Control
Mixer Linearity
Control
3.6 p
2.3 mA
Max
120 k
2.4 p
100 n
VCO
2.4 p
Mixer
47 p
1.0 µ
2.55 nH
MMBV809
33 k
5.6 p
390 nH
Z Transformer
16 : 1
L
IF
V
CC
Output
IF
Outputs
C
7
8
SMA
100 n
100 p
LO Buffer
LO Buffer
Output
100 p
SMA
NOTE: *50 Ω Microstrip Transmission Line; length shown in Figure 2.
8–240
MOTOROLA ANALOG IC DEVICE DATA
MC13142
Figure 2. Circuit Side Component Placement View
MC13142D
Rev A
Mix In
Mix Lin Cont
Toko
926A10
Dielectric
Filter
C
L
IF
Out
16:1
Impedance
Transformer
LNA
Output
100 p
18 nH
PC
Rotary
51
MC13142D
Switch
2.4 p
2.4 p
47 p
6.8 nH
100 p
390 nH
LNA
Input
LO
Buf
Out
5.6 p
33 k
MMBV809
120 k
V–Cont
V
CC
NOTES: The PCB is laidout for the 4DFA (2 pole SMD type) and 4DFB (3 pole SMD type) filters which are available for applications in
cellular and GSM,GPS (1.2–1.5 GHz), DECT, PHS and PCS (1.8–2.0 GHz) and ISM Bands (902–928 MHz and 2.4–2.5 GHz).
In the component placement shown above, the 926.5 MHz dielectric type image filter is used (Toko Part # 4DFA–926A10).
The PCB also accommodates a surface mount SAW filter in an eight or six pin ceramic package for the cellular base and
handset frequencies. Recommended manufacturers are Siemens and Murata.
Traces are provided on the PCB to evaluate the LNA and mixer separately. The component placement view shows external
circuit components used for the 926.5 MHz application circuit. Note: some traces must be cut to accommodate placement of
components; likewise some traces must be shorted. The voltage controlled oscillator is shown with the varactor referenced to
V
ground. The PCB is modified as shown to do this.
EE
16:1 broadband impedance transformer is mini circuits part #TX16–R3T; it is in the leadless surface mount “TX” package.
Components L and C comprise a low pass filter used to provide narrowband matching at a given IF frequency. For example at
49 MHz C = 36 p and L = 330 nH.
The microstrip trace on the ground side of the PCB is intended for a microstrip resonator; it is cut free when using a lump
inductor as done above.
8–241
MOTOROLA ANALOG IC DEVICE DATA
MC13142
Input Matching/Components
represents the application circuit. In the cascaded noise
analysis the system noise equation is:
Fsystem = F1 + [(F2 –1)/G1] + [(F3–1)]/[(G1)(G2)]
where:
It is desirable to use a RF ceramic or SAW filter before the
mixer to provide image frequency rejection. The filter is
selected based on cost, size and performance tradeoffs.
Typical RF filters have 3.0 to 5.0 dB insertion loss. The PC
board layout accommodates both ceramic and SAW RF
filters which are offered by various suppliers such as
Siemens, Toko and Murata.
Interface matching between the LNA, RF filter and the
mixer will be required. The interface matching networks
shown in the application circuit are designed for 50 Ω
interfaces.
F1 = the Noise Factor of the MC13142 LNA
G1 = the Gain of the LNA
F2 = the Noise factor of the RF Ceramic Filter
G2 = the Gain of the Ceramic Filter
F3 = the Noise factor of the Mixer
Note: the above terms are defined as linear relationships and
are related to the log form for gain and noise figure by the
following:
In the application circuit, the LNA is conjugately matched
–1
–1
F = Log
G = Log
[(NF in dB)/10] and similarly
[(Gain in dB)/10].
to 50 Ω input and output for 3.0 to 5.0 Vdc V . 17 dB gain
CC
and 1.8 dB noise figure is typical at 926 MHz. The mixer
measures 0 dB gain and 12 dB noise figure as shown in the
application circuit. Typical insertion loss of the Toko ceramic
filter is 3.0 dB. Thus, the overall gain of the frontend receiver
is 14 dB with a 3.3 dB noise figure.
Calculating in terms of gain and noise factor yields the
following:
F1 = 1.51; G1 = 50.11
F2 = 1.99; G2 = 0.5
F3 = 15.85
System Noise Considerations
Thus, substituting in the equation for system noise factor:
Fsystem = 2.12; NFsystem = 3.3 dB
The block diagram shows the cascaded noise stages of
the MC13142 in the frontend receiver subsystem; it
Figure 3. Frontend Subsystem Block Diagram for Noise Analysis
V
CC
f
= 926.5 MHz
LNA
RF
Z Transformer
16:1
330 nH
Mixer
NF Meter
Toko Ceramic
Filter
Noise Source
IF Output
= 49.05 MHz
36 p
f
IF
G2 = –3.0 dB
NF2 = 3.0 dB
G1 = 17 dB
NF1 = 1.8 dB
Local Oscillator
= 975.55 MHz
G3 = 0 dB
NF3 = 12 dB
f
LO
G
= 14 dB
sys
sys
NF = 3.3 dB
8–242
MOTOROLA ANALOG IC DEVICE DATA
MC13142
Figure 4. Circuit Side View
MC13142D
Rev A
Mix In
Mix Lin
Cont
IF
Out
LNA
Output
LNA
Input
V
CC
LO Buf
Out
V–Cont
V
CC
NOTES: Critical dimensions are 50 mil centers lead to lead in SO–16 footprint.
Also line widths to labeled ports excluding V
FR4 PCB, 1/32 inch.
are 50 mil (0.050 inch).
CC
8–243
MOTOROLA ANALOG IC DEVICE DATA
MC13142
Figure 5. Ground Side View
V–Cont
V
CC
LNA
Input
LO
Buf Out
LNA
Output
IF
Out
Mix Lin
Cont
Mix In
MC13142D
Rev A
NOTES: FR4 PCB, 1/32 inch.
8–244
MOTOROLA ANALOG IC DEVICE DATA
Tape and Reel Options
In Brief . . .
Motorola offers the convenience of Tape and Reel
packaging for our growing family of standard integrated circuit
products. Reels are available to support the requirements of
both first and second generation pick–and–place equipment.
The packaging fully conforms to the latest EIA–481A
specification. The antistatic embossed tape provides a
secure cavity, sealed with a peel–back cover tape.
Page
Tape and Reel Configurations . . . . . . . . . . . . . . . . . . . . . 12–2
Tape and Reel Information Table . . . . . . . . . . . . . . . . . . . 12–4
Analog MPQ Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12–5
12–1
MOTOROLA ANALOG IC DEVICE DATA
Tape and Reel Configurations
Mechanical Polarization
SOIC and Micro–8
DEVICES
PLCC DEVICES
Typical
Typical
PIN 1
User Direction of Feed
User Direction of Feed
2
DPAK and D PAK
DEVICES
Typical
User Direction of Feed
SOT–23 (5 Pin)
DEVICES
Typical
SOT–89 (3 Pin)
DEVICES
Typical
SOT–89 (5 Pin)
DEVICES
Typical
User Direction of Feed
User Direction of Feed
User Direction of Feed
12–2
MOTOROLA ANALOG IC DEVICE DATA
Tape and Reel Configurations (continued)
TO–92 Reel Styles
STYLE A
(Preferred)
STYLE E
Carrier Strip
Carrier Strip
Rounded
Side
Flat Side
Adhesive Tape
Adhesive Tape
Feed
Feed
Rounded side of transistor and adhesive tape visible.
Flat side of transistor and adhesive tape visible.
TO–92 Ammo Pack Styles
STYLE P
(Preferred)
STYLE M
Adhesive Tape On
Top Side
Adhesive Tape On
Top Side
Feed
Feed
Rounded Side
Flat Side
Carrier
Strip
Carrier
Strip
Flat side of transistor and
adhesive tape visible.
Rounded side of transistor and
adhesive tape visible.
Label
Label
Style P ammo pack is equivalent to Styles A and B of reel pack
dependent on feed orientation from box.
Style M ammo pack is equivalent to Style E of reel
pack dependent on feed orientation from box.
TO–92 EIA Radial Tape in Fan Fold Box or On Reel
H2A
H2A
H2B
H2B
H
W2
H4
H5
T1
L1
H1
W1
W
L
T
T2
F1
F2
D
P2
P1
P2
P
12–3
MOTOROLA ANALOG IC DEVICE DATA
Tape and Reel Information Table
(1)
Devices
per Reel
Tape Width
(mm)
Reel Size
(inch)
Device
Suffix
Package
SO–8, SOP–8
SO–14
SO–16
12
16
16
2,500
2,500
2,500
13
13
13
R2
R2
R2
SO–16L, SO–8+8L WIDE
SO–20L WIDE
SO–24L WIDE
SO–28L WIDE
SO–28L WIDE
16
24
24
24
32
1,000
1,000
1,000
1,000
1,000
13
13
13
13
13
R2
R2
R2
R2
R3
Micro–8
12
2,500
13
R2
PLCC–20
PLCC–28
PLCC–44
16
24
32
1,000
500
500
13
13
13
R2
R2
R2
PLCC–52
PLCC–68
PLCC–84
32
44
44
500
250
250
13
13
13
R2
R2
R2
(2)
TO–226AA (TO–92)
18
2,000
13
RA, RE, RP, or RM
(Ammo Pack) only
DPAK
16
24
8
2,500
800
13
13
7
RK
R4
TR
T1
2
D PAK
SOT–23 (5 Pin)
3,000
1,000
SOT–89 (3/5 Pin)
(1)
12
7
Minimum order quantity is 1 reel. Distributors/OEM customers may break lots or reels at their option, however broken reels may not be returned.
Integrated circuits in TO–226AA packages are available in Styes A and E only, with optional “Ammo Pack” (Suffix RP or RM). The RA and RP configurations
are preferred. For ordering information please contact your local Motorola Semiconductor Sales Office.
(2)
12–4
MOTOROLA ANALOG IC DEVICE DATA
Analog MPQ Table
Tape/Reel and Ammo Pack
Package Type
Package Code
MPQ
PLCC
Case 775
Case 776
Case 777
0802
0804
0801
1000/reel
500/reel
500/reel
SOIC
Case 751
Case 751A
Case 751B
Case 751G
Case 751D
Case 751E
Case 751F
0095
0096
0097
2003
2005
2008
2009
2500/reel
2500/reel
2500/reel
1000/reel
1000/reel
1000/reel
1000/reel
Micro–8
Case 846A
–
2500/reel
TO–92
Case 29
Case 29
0031
0031
2000/reel
2000/Ammo Pack
DPAK
Case 369A
–
–
–
–
–
2500/reel
800/reel
2
D PAK
Case 936
SOT–23 (5 Pin)
Case 1212
3000/reel
1000/reel
1000/reel
SOT–89 (3 Pin)
Case 1213
SOT–89 (5 Pin)
Case 1214
12–5
MOTOROLA ANALOG IC DEVICE DATA
12–6
MOTOROLA ANALOG IC DEVICE DATA
Packaging Information
In Brief . . .
The packaging availability for each device type is indicated
on the individual data sheets and the Selector Guide. All of the
outline dimensions for the packages are given in this section.
The maximum power consumption an integrated circuit
can tolerate at a given operating ambient temperature can be
found from the equation:
T
– T
A
J(max)
P
=
D(TA)
R
θJA(Typ)
where:
P
= Power Dissipation allowable at a given
operating ambient temperature. This must
be greater than the sum of the products of
the supply voltages and supply currents at
the worst case operating condition.
D(TA)
T
= Maximum operating Junction Temperature
as listed in the Maximum Ratings Section.
J(max)
See individual data sheets for T
information.
J(max)
T
A
= Maximum desired operating Ambient
Temperature
R
= Typical Thermal Resistance Junction-to-
Ambient
θJA(Typ)
13–1
MOTOROLA ANALOG IC DEVICE DATA
Case Outline Dimensions
LP, P, Z SUFFIX
CASE 29-04
NOTES:
Plastic Package
(TO-226AA/TO-92)
ISSUE AD
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. DIMENSION F APPLIES BETWEEN P AND L.
DIMENSION D AND J APPLY BETWEEN L AND K
MINIMUM. LEAD DIMENSION IS UNCONTROLLED
IN P AND BEYOND DIMENSION K MINIMUM.
A
B
R
P
INCHES
DIM MIN MAX
MILLIMETERS
L
MIN
4.45
4.32
3.18
0.41
0.41
1.15
2.42
0.39
MAX
5.20
5.33
4.19
0.55
0.48
1.39
2.66
0.50
–––
F
SEATING
PLANE
A
B
C
D
F
G
H
J
0.175 0.205
0.170 0.210
0.125 0.165
0.016 0.022
0.016 0.019
0.045 0.055
0.095 0.105
0.015 0.020
K
1
2
3
D
X X
G
K
L
N
P
0.500
0.250
0.080 0.105
––– 0.100
––– 12.70
–––
J
H
V
6.35
2.04
–––
2.93
3.43
–––
2.66
2.54
–––
C
SECTION X–X
R
V
0.115
0.135
–––
–––
1
–––
N
N
KC, T SUFFIX
CASE 221A-06
Plastic Package
ISSUE Y
SEATING
PLANE
–T–
C
NOTES:
T
F
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
–B–
S
2. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
0.560 0.625 14.23 15.87
MILLIMETERS
MIN MAX
4
4
Q
A
A
B
C
D
F
U
0.380 0.420
0.140 0.190
0.020 0.045
0.139 0.155
0.100 BSC
9.66 10.66
1
2
3
3.56
0.51
3.53
4.82
1.14
3.93
H
L
–Y–
G
H
J
2.54 BSC
K
––– 0.280
0.012 0.045
–––
0.31
7.11
1.14
1
2
3
K
L
N
Q
R
S
0.500 0.580 12.70 14.73
R
0.045 0.070
0.200 BSC
1.15
5.08 BSC
1.77
J
0.100 0.135
2.54
2.04
0.51
5.97
0.00
3.42
2.92
1.39
6.47
1.27
G
0.080
0.115
D 3 PL
0.020 0.055
0.235 0.255
0.000 0.050
T
U
M
M
0.25 (0.010)
B
Y
N
13–2
MOTOROLA ANALOG IC DEVICE DATA
TH SUFFIX
CASE 314A-03
Plastic Package
ISSUE D
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
–T–
Y14.5M, 1982.
B
–P–
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 0.043 (1.092) MAXIMUM.
C
E
Q
OPTIONAL
CHAMFER
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
A
U
F
A
B
C
D
E
F
0.572 0.613 14.529 15.570
0.390 0.415 9.906 10.541
0.170 0.180 4.318 4.572
0.025 0.038 0.635 0.965
0.048 0.055 1.219 1.397
0.570 0.585 14.478 14.859
L
K
1
5
G
J
K
L
Q
S
0.067 BSC
1.702 BSC
G
0.015 0.025 0.381 0.635
0.730 0.745 18.542 18.923
0.320 0.365 8.128 9.271
0.140 0.153 3.556 3.886
0.210 0.260 5.334 6.604
0.468 0.505 11.888 12.827
5X J
S
5X D
M
M
0.014 (0.356)
T P
U
NOTES:
T, TV SUFFIX
CASE 314B-05
Plastic Package
ISSUE J
C
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
B
–P–
OPTIONAL
CHAMFER
Q
F
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 0.043 (1.092) MAXIMUM.
E
A
INCHES
DIM MIN MAX
A
B
C
D
E
MILLIMETERS
MIN MAX
0.613 14.529 15.570
0.415 9.906 10.541
U
L
S
V
0.572
0.390
0.170
0.025
0.048
0.850
0.067 BSC
0.166 BSC
0.015
0.900
0.320
0.320 BSC
0.140
–––
0.468
–––
0.090
W
K
0.180 4.318
0.038 0.635
0.055 1.219
4.572
0.965
1.397
F
0.935 21.590 23.749
1
G
H
J
K
L
N
Q
S
1.702 BSC
4.216 BSC
5
0.025 0.381
1.100 22.860 27.940
0.635
5X J
0.365 8.128
9.271
G
M
0.24 (0.610)
T
H
N
8.128 BSC
5X D
0.153 3.556
0.620
0.505 11.888 12.827
0.735 ––– 18.669
0.110 2.286 2.794
3.886
––– 15.748
M
M
0.10 (0.254)
T P
U
V
W
SEATING
PLANE
–T–
B
–Q–
SEATING
PLANE
T SUFFIX
–T–
CASE 314C–01
Plastic Package
ISSUE A
C
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
A
K
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 10.92 (0.043) MAXIMUM.
1
2 3 4 5
INCHES
DIM MIN MAX
0.625 15.59
MILLIMETERS
L
MIN
MAX
15.88
10.67
4.83
1
A
B
C
D
E
G
J
0.610
0.380
0.160
0.020
0.035
5
0.420
0.190
0.040
0.055
9.65
4.06
0.51
0.89
1.02
1.40
0.067 BSC
1.702 BSC
0.015
0.500
0.355
0.139
0.025
––– 12.70
0.370
0.147
0.38
0.64
–––
9.40
3.73
K
L
Q
9.02
3.53
G
D 5 PL
M
M
0.356 (0.014)
T Q
J
13–3
MOTOROLA ANALOG IC DEVICE DATA
T, T1 SUFFIX
CASE 314D-03
Plastic Package
ISSUE D
SEATING
PLANE
–T–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
C
–Q–
B
Y14.5M, 1982.
E
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 10.92 (0.043) MAXIMUM.
U
A
S
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
L
A
B
C
D
E
G
H
J
0.572
0.390
0.170
0.025
0.048
0.613 14.529 15.570
0.415 9.906 10.541
0.180 4.318
0.038 0.635
0.055 1.219
1
2
3
4 5
K
4.572
0.965
1.397
0.067 BSC
1.702 BSC
0.087
0.015
1.020
0.320
0.140
0.105
0.543
0.112 2.210
0.025 0.381
2.845
0.635
1
2
3
4
K
L
Q
U
S
1.065 25.908 27.051
5
0.365 8.128
0.153 3.556
0.117 2.667
9.271
3.886
2.972
J
G
H
0.582 13.792 14.783
D 5 PL
M
M
0.356 (0.014)
T Q
DT-1 SUFFIX
CASE 369-07
Plastic Package
(DPAK)
C
B
R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
V
ISSUE K
E
INCHES
DIM MIN MAX
MILLIMETERS
4
MIN
5.97
6.35
2.19
0.69
0.84
0.94
MAX
6.35
6.73
2.38
0.88
1.01
1.19
4
A
B
C
D
E
F
G
H
J
0.235 0.250
0.250 0.265
0.086 0.094
0.027 0.035
0.033 0.040
0.037 0.047
0.090 BSC
0.034 0.040
0.018 0.023
0.350 0.380
0.175 0.215
0.050 0.090
0.030 0.050
A
1
2
3
S
–T–
SEATING
PLANE
2.29 BSC
1
2
3
K
0.87
0.46
8.89
4.45
1.27
0.77
1.01
0.58
9.65
5.46
2.28
1.27
K
R
S
J
F
V
H
D 3 PL
G
M
0.13 (0.005)
T
DT SUFFIX
CASE 369A-13
Plastic Package
(DPAK)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
SEATING
PLANE
–T–
C
B
ISSUE Y
INCHES
DIM MIN MAX
MILLIMETERS
E
V
R
MIN
5.97
6.35
2.19
0.69
0.84
0.94
MAX
6.35
6.73
2.38
0.88
1.01
1.19
A
B
C
D
E
F
G
H
J
K
L
R
S
U
V
Z
0.235 0.250
0.250 0.265
0.086 0.094
0.027 0.035
0.033 0.040
0.037 0.047
0.180 BSC
4
4
Z
1
A
K
S
1
2
3
3
4.58 BSC
U
0.034 0.040
0.018 0.023
0.87
0.46
2.60
1.01
0.58
2.89
0.102
0.114
0.090 BSC
0.175 0.215
0.020 0.050
2.29 BSC
F
J
4.45
0.51
0.51
0.77
3.51
5.46
1.27
–––
1.27
–––
L
H
0.020
0.030 0.050
0.138 –––
–––
D 2 PL
M
G
0.13 (0.005)
T
13–4
MOTOROLA ANALOG IC DEVICE DATA
DP1, N, P, P1 SUFFIX
CASE 626-05
Plastic Package
ISSUE K
8
5
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
–B–
1
4
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
MILLIMETERS
DIM MIN MAX
9.40 10.16 0.370 0.400
INCHES
MIN MAX
F
A
B
C
D
F
–A–
NOTE 2
6.10
3.94
0.38
1.02
6.60 0.240 0.260
4.45 0.155 0.175
0.51 0.015 0.020
1.78 0.040 0.070
L
G
H
J
K
L
2.54 BSC
0.100 BSC
1.27 0.030 0.050
0.30 0.008 0.012
8
C
0.76
0.20
2.92
1
J
3.43
0.115
0.135
–T–
SEATING
PLANE
7.62 BSC
0.300 BSC
N
M
N
–––
10
–––
10
0.76
1.01 0.030 0.040
M
D
K
G
H
M
M
M
0.13 (0.005)
T A
B
N, P, N-14, P2 SUFFIX
CASE 646-06
Plastic Package
ISSUE L
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
14
1
8
B
7
INCHES
DIM MIN MAX
0.770 18.16
MILLIMETERS
A
F
MIN
MAX
19.56
6.60
4.69
0.53
1.78
A
B
C
D
F
0.715
0.240
0.145
0.015
0.040
0.260
0.185
0.021
0.070
6.10
3.69
0.38
1.02
L
14
1
C
G
H
J
K
L
0.100 BSC
2.54 BSC
0.052
0.008
0.115
0.095
0.015
0.135
1.32
0.20
2.92
2.41
0.38
3.43
J
N
0.300 BSC
7.62 BSC
SEATING
PLANE
K
M
N
0
10
0.039
0
0.39
10
1.01
0.015
H
G
D
M
DP2, N, P, PC SUFFIX
CASE 648-08
Plastic Package
ISSUE R
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
16
1
9
8
B
S
INCHES
DIM MIN MAX
0.770 18.80
MILLIMETERS
MIN
MAX
19.55
6.85
4.44
0.53
1.77
F
A
B
C
D
F
0.740
0.250
0.145
0.015
0.040
C
L
0.270
0.175
0.021
0.70
6.35
3.69
0.39
1.02
16
1
SEATING
PLANE
–T–
G
H
J
K
L
M
S
0.100 BSC
0.050 BSC
2.54 BSC
1.27 BSC
K
M
0.008
0.015
0.130
0.305
10
0.21
0.38
3.30
7.74
10
H
J
0.110
0.295
0
2.80
7.50
0
G
D 16 PL
0.020
0.040
0.51
1.01
M
M
0.25 (0.010)
T A
13–5
MOTOROLA ANALOG IC DEVICE DATA
B, P, P2, V SUFFIX
CASE 648C-03
Plastic Package
(DIP–16)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. INTERNAL LEAD CONNECTION BETWEEN 4 AND
5, 12 AND 13.
–A–
ISSUE C
16
1
9
8
–B–
INCHES
DIM MIN MAX
0.840 18.80
MILLIMETERS
L
MIN
MAX
21.34
6.60
4.69
0.53
A
B
C
D
E
F
0.740
0.240
0.145
0.015
0.050 BSC
0.040
0.100 BSC
0.008
0.115
0.300 BSC
0
0.260
0.185
0.021
6.10
3.69
0.38
NOTE 5
16
1
1.27 BSC
C
0.70
1.02
1.78
G
J
K
L
M
N
2.54 BSC
0.015
0.135
0.20
2.92
0.38
3.43
–T–
SEATING
PLANE
M
N
7.62 BSC
K
10
0.040
0
10
E
0.015
0.39
1.01
J 16 PL
F
G
D 16 PL
M
S
0.13 (0.005)
T B
M
S
0.13 (0.005)
T A
–A–
P SUFFIX
NOTES:
CASE 648E–01
Plastic Package
(DIP–16)
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION A AND B DOES NOT INCLUDE MOLD
PROTRUSION.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.25 (0.010).
R
16
1
9
8
ISSUE O
–B–
6. ROUNDED CORNER OPTIONAL.
M
P
L
INCHES
DIM MIN MAX
0.760 18.80
MILLIMETERS
F
MIN
MAX
19.30
6.60
4.44
0.53
1.77
A
B
C
D
F
0.740
0.245
0.145
0.015
0.050
0.260
0.175
0.021
0.070
6.23
3.69
0.39
1.27
16
J
1
C
G
H
J
K
L
M
P
0.100 BSC
0.050 BSC
2.54 BSC
1.27 BSC
0.21
3.05
7.50
0
5.08 BSC
7.62 BSC
0.39 0.88
–T–
SEATING
PLANE
0.008
0.015
0.140
0.305
10
0.38
3.55
7.74
10
S
0.120
0.295
0
K
H
G
0.200 BSC
0.300 BSC
0.015 0.035
R
S
D 13 PL
M
S
S
0.25 (0.010)
T B
A
P SUFFIX
CASE 649-03
Plastic Package
ISSUE D
P
A
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
13
24
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
L
Q
B
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
1.265
0.540
0.205
0.020
0.060
1
A
B
C
D
F
31.50
13.21
4.70
0.38
1.02
32.13 1.240
13.72 0.520
5.21 0.185
0.51 0.015
1.52 0.040
12
M
J
H
F
C
G
H
J
K
L
M
N
P
2.54 BSC
0.100 BSC
1.65
0.20
2.92
14.99
–––
2.16 0.065
0.30 0.008
3.43
15.49 0.590
10 –––
0.085
0.012
0.135
0.610
10
24
N
0.115
1
K
0.51
0.13
0.51
1.02 0.020
0.38 0.005
0.76 0.020
0.040
0.015
0.030
D
G
SEATING
PLANE
Q
13–6
MOTOROLA ANALOG IC DEVICE DATA
A, B, N, P SUFFIX
CASE 707-02
Plastic Package
ISSUE C
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
18
10
9
B
1
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
A
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.915
0.260
0.180
0.022
0.070
L
A
B
C
D
F
22.22
6.10
3.56
0.36
1.27
23.24 0.875
6.60 0.240
4.57 0.140
0.56 0.014
1.78 0.050
C
18
1
G
H
J
K
L
2.54 BSC
0.100 BSC
K
N
1.02
0.20
2.92
1.52 0.040
0.30 0.008
3.43
0.060
0.012
0.135
J
M
F
D
SEATING
PLANE
0.115
H
G
7.62 BSC
0.300 BSC
M
N
0
0.51
15
0
15
0.040
1.02 0.020
P SUFFIX
CASE 710-02
Plastic Package
ISSUE B
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
28
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
1
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
28
1
15
A
B
C
D
F
36.45 37.21 1.435 1.465
13.72 14.22 0.540 0.560
B
3.94
0.36
1.02
5.08 0.155 0.200
0.56 0.014 0.022
1.52 0.040 0.060
14
G
H
J
K
L
2.54 BSC
0.100 BSC
2.16 0.065 0.085
0.38 0.008 0.015
1.65
0.20
2.92
L
C
A
3.43
0.115
0.135
15.24 BSC
0.600 BSC
N
M
N
0
0.51
15
0
15
1.02 0.020 0.040
J
M
G
H
F
K
SEATING
PLANE
D
P SUFFIX
CASE 711-03
Plastic Package
ISSUE C
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
40
1
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
40
21
20
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
B
A
B
C
D
F
51.69 52.45 2.035 2.065
13.72 14.22 0.540 0.560
3.94
0.36
1.02
5.08 0.155 0.200
0.56 0.014 0.022
1.52 0.040 0.060
1
G
H
J
K
L
2.54 BSC
0.100 BSC
2.16 0.065 0.085
0.38 0.008 0.015
L
A
1.65
0.20
2.92
C
3.43
0.115
0.135
N
15.24 BSC
0.600 BSC
M
N
0
0.51
15
0
15
J
1.02 0.020 0.040
K
SEATING
PLANE
M
H
G
F
D
13–7
MOTOROLA ANALOG IC DEVICE DATA
F, P, P-3 SUFFIX
CASE 724-03
Plastic Package
(NDIP–24)
NOTES:
1. CHAMFERED CONTOUR OPTIONAL.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
24
ISSUE D
1
4. CONTROLLING DIMENSION: INCH.
–A–
INCHES
DIM MIN MAX
1.265 31.25
MILLIMETERS
MIN
MAX
32.13
6.85
4.44
0.51
24
1
13
12
A
B
C
D
E
F
1.230
0.250
0.145
0.015
0.050 BSC
0.040
–B–
0.270
0.175
0.020
6.35
3.69
0.38
1.27 BSC
1.02
L
C
0.060
1.52
G
J
K
L
M
N
0.100 BSC
2.54 BSC
0.007
0.110
0.012
0.140
0.18
2.80
0.30
3.55
NOTE 1
–T–
SEATING
PLANE
K
0.300 BSC
7.62 BSC
N
M
0
15
0
15
E
0.020
0.040
0.51
1.01
G
J 24 PL
F
M
M
0.25 (0.010)
T B
D 24 PL
M
M
0.25 (0.010)
T A
H, P, DP SUFFIX
CASE 738-03
Plastic Package
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
–A–
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
20
1
11
B
INCHES
DIM MIN MAX
1.010 1.070 25.66
MILLIMETERS
10
MIN
MAX
27.17
6.60
A
B
C
D
E
F
0.240 0.260
0.150 0.180
0.015 0.022
0.050 BSC
6.10
3.81
0.39
L
4.57
0.55
C
1.27 BSC
0.050 0.070
0.100 BSC
1.27
1.77
20
G
2.54 BSC
1
J
0.008 0.015
0.21
2.80
7.62 BSC
0
0.51
0.38
3.55
K
L
M
N
0.110
0.140
–T–
SEATING
PLANE
K
M
0.300 BSC
0
15
15
1.01
0.020 0.040
N
E
J 20 PL
G
F
M
M
0.25 (0.010)
T B
D 20 PL
M
M
0.25 (0.010)
T A
D, D1, D2 SUFFIX
CASE 751-05
Plastic Package
(SO-8, SOP-8)
ISSUE R
NOTES:
D
A
E
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETERS.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
C
8
1
5
4
M
M
0.25
B
H
MILLIMETERS
8
h X 45
B
C
DIM MIN
MAX
1.75
0.25
0.49
0.25
5.00
4.00
e
1
A
A1
B
C
D
E
1.35
0.10
0.35
0.18
4.80
3.80
A
SEATING
PLANE
e
H
h
1.27 BSC
0.10
L
5.80
0.25
0.40
0
6.20
0.50
1.25
7
A1
B
L
M
S
S
0.25
C B
A
13–8
MOTOROLA ANALOG IC DEVICE DATA
D SUFFIX
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
CASE 751A-03
Plastic Package
(SO-14)
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
ISSUE F
14
1
8
7
–B–
P 7 PL
M
M
0.25 (0.010)
B
MILLIMETERS
DIM MIN MAX
INCHES
14
1
MIN
MAX
0.344
0.157
0.068
0.019
0.049
F
A
B
C
D
F
8.55
3.80
1.35
0.35
0.40
8.75 0.337
4.00 0.150
1.75 0.054
0.49 0.014
1.25 0.016
R X 45
G
C
G
J
K
M
P
1.27 BSC
0.050 BSC
–T–
SEATING
PLANE
J
M
0.19
0.10
0
0.25 0.008
0.25 0.004
0.009
0.009
7
K
D 14 PL
7
0
M
S
S
0.25 (0.010)
T B
A
5.80
0.25
6.20 0.228
0.50 0.010
0.244
0.019
R
–A–
D SUFFIX
NOTES:
CASE 751B-05
Plastic Package
(SO-16)
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
16
9
ISSUE J
–B–
P 8 PL
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
M
S
0.25 (0.010)
B
1
8
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
G
MILLIMETERS
DIM MIN MAX
9.80 10.00 0.386 0.393
INCHES
MIN MAX
16
1
A
B
C
D
F
F
K
3.80
1.35
0.35
0.40
4.00 0.150 0.157
1.75 0.054 0.068
0.49 0.014 0.019
1.25 0.016 0.049
R X 45
C
G
J
K
M
P
1.27 BSC
0.050 BSC
0.25 0.008 0.009
0.25 0.004 0.009
–T–
SEATING
PLANE
0.19
0.10
0
J
M
D
16 PL
7
0
7
5.80
0.25
6.20 0.229 0.244
0.50 0.010 0.019
M
S
S
0.25 (0.010)
T B
A
R
DW, FP SUFFIX
–A–
NOTES:
CASE 751D-04
Plastic Package
(SO-20L, SO–20)
ISSUE E
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
20
11
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
10X P
–B–
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
M
M
0.010 (0.25)
B
1
10
J
F
20X D
MILLIMETERS
DIM MIN MAX
12.65 12.95 0.499 0.510
INCHES
MIN MAX
M
S
S
0.010 (0.25) T A
B
A
B
C
D
F
20
7.40
2.35
0.35
0.50
7.60 0.292 0.299
2.65 0.093 0.104
0.49 0.014 0.019
0.90 0.020 0.035
1
R X 45
G
J
K
M
P
1.27 BSC
0.050 BSC
0.32 0.010 0.012
0.25 0.004 0.009
C
0.25
0.10
0
SEATING
PLANE
7
0
7
–T–
10.05 10.55 0.395 0.415
18X G
R
0.25
0.75 0.010 0.029
K
M
13–9
MOTOROLA ANALOG IC DEVICE DATA
DW SUFFIX
CASE 751E-04
Plastic Package
(SO-24L,
SOP (16+4+4)L)
ISSUE E
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
24
13
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
–B– 12X P
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
M
M
0.010 (0.25)
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
1
12
24X D
24
J
MILLIMETERS
DIM MIN MAX
INCHES
M
S
S
0.010 (0.25)
T A
B
1
MIN
MAX
0.612
0.299
0.104
0.019
0.035
A
B
C
D
F
15.25
7.40
2.35
0.35
0.41
15.54 0.601
7.60 0.292
2.65 0.093
0.49 0.014
0.90 0.016
F
R X 45
G
J
K
M
P
1.27 BSC
0.050 BSC
0.23
0.13
0
0.32 0.009
0.29 0.005
0.013
0.011
8
C
K
–T–
SEATING
8
0
M
10.05
0.25
10.55 0.395
0.75 0.010
0.415
0.029
PLANE
R
22X G
DW SUFFIX
CASE 751F-04
NOTES:
Plastic Package
(SO-28L, SOIC–28)
ISSUE E
28
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE
1
–A–
15
28
14X P
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
M
M
0.010 (0.25)
B
–B–
1
MILLIMETERS
DIM MIN MAX
INCHES
14
MIN
MAX
0.711
0.299
0.104
0.019
0.035
M
A
B
C
D
F
17.80
7.40
2.35
0.35
0.41
18.05 0.701
7.60 0.292
2.65 0.093
0.49 0.014
0.90 0.016
28X D
R
X 45
M
S
S
0.010 (0.25)
T A
B
G
J
K
M
P
1.27 BSC
0.050 BSC
0.23
0.13
0
0.32 0.009
0.29 0.005
0.013
0.011
8
C
8
0
–T–
SEATING
PLANE
10.01
0.25
10.55 0.395
0.75 0.010
0.415
0.029
26X G
F
R
K
J
DW SUFFIX
CASE 751G-02
Plastic Package
(SO-16L, SOP–16L,
SOP-8+8L)
ISSUE A
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
16
9
–B–
8X P
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
M
M
0.010 (0.25)
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
1
8
J
16X D
16
MILLIMETERS
DIM MIN MAX
10.15 10.45 0.400
INCHES
M
S
S
0.010 (0.25)
T A
B
MIN
MAX
1
A
B
C
D
F
0.411
F
7.40
2.35
0.35
0.50
7.60 0.292 0.299
2.65 0.093 0.104
0.49 0.014 0.019
0.90 0.020 0.035
R X 45
G
J
K
M
P
1.27 BSC
0.050 BSC
0.32 0.010 0.012
0.25 0.004 0.009
0.25
0.10
0
C
7
0
7
–T–
M
10.05 10.55 0.395 0.415
0.25 0.75 0.010 0.029
SEATING
14X G
K
PLANE
R
13–10
MOTOROLA ANALOG IC DEVICE DATA
D SUFFIX
16
CASE 751K–01
Plastic Package
(SO–16)
NOTES:
1
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
–A–
ISSUE O
4
5
MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
16
9
DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
M
–B–
P
MILLIMETERS
DIM MIN MAX
INCHES
F
MIN
MAX
0.393
0.157
0.068
0.019
0.049
A
B
C
D
F
9.80
3.80
1.35
0.35
0.40
10.00 0.368
4.00 0.150
1.75 0.054
0.49 0.014
1.25 0.016
1
8
G
R X 45
G
J
K
M
P
1.27 BSC
0.050 BSC
0.19
0.10
0
0.25 0.008
0.25 0.004
7
0.009
0.009
7
C
SEATING
PLANE
–T–
0
5.80
0.25
6.20 0.229
0.50 0.010
0.244
0.019
14 X D
J
K
R
M
S
S
0.25 (0.010)
T A
B
–A–
DW SUFFIX
CASE 751N–01
Plastic Package
(SOP–16L)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
T
16
9
ISSUE O
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
M
M
–B–
P
0.010 (0.25)
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
1
8
16
J
F
MILLIMETERS
DIM MIN MAX
10.15 10.45 0.400
INCHES
13X D
1
MIN
MAX
A
B
C
D
F
0.411
M
S
S
0.010 (0.25)
T A
B
7.40
2.35
0.35
0.50
7.60 0.292 0.299
2.65 0.093 0.104
0.49 0.014 0.019
0.90 0.020 0.035
G
J
K
M
P
R
S
T
1.27 BSC
0.050 BSC
0.32 0.010 0.012
0.25 0.004 0.009
R X 45
0.25
0.10
0
7
0
7
C
10.05 10.55 0.395 0.415
0.25 0.75 0.010 0.029
2.54 BSC
3.81 BSC
–T–
SEATING
PLANE
M
S
0.100 BSC
0.150 BSC
K
9X G
13–11
MOTOROLA ANALOG IC DEVICE DATA
CASE 762-01
Plastic Medium Power Package
(SIP-9)
ISSUE C
9
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
Q
1
M
M
0.25 (0.010)
T A
–A–
MILLIMETERS
DIM MIN MAX
22.40 23.00 0.873 0.897
INCHES
MIN MAX
–C–
U
V
A
B
C
D
E
M
X
6.40
3.45
0.40
9.35
1.40
6.60 0.252 0.260
3.65 0.135 1.143
0.55 0.015 0.021
9.60 0.368 0.377
1.60 0.055 0.062
S
W
E
F
Y
G
H
J
2.54 BSC
0.100 BSC
1.51
1.71 0.059 0.067
0.360 0.400 0.014 0.015
R
B
N
K
M
N
Q
R
S
U
V
W
X
Y
3.95
30 BSC
2.50
3.15
13.60 13.90 0.535 0.547
1.65 1.95 0.064 0.076
22.00 22.20 0.866 0.874
0.55
2.89 BSC
4.20 0.155 0.165
30 BSC
2.70 0.099 0.106
3.45 0.124 0.135
9
1
SEATING
PLANE
–T–
K
M
M
0.25 (0.010)
T C
J
H
G
F
0.75 0.021 0.029
0.113 BSC
0.75 0.025 0.029
D 9 PL
0.65
2.70
M
M
0.25 (0.010)
T A
2.80 0.106
0.110
FN SUFFIX
CASE 775-02
Plastic Package
(PLCC-20)
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
1
ISSUE C
M
S
S
0.007 (0.180) T L–M
N
B
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
M
S
S
N
0.007 (0.180) T L–M
Y BRK
–N–
U
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
D
–L–
Z
–M–
W
D
20
1
S
S
S
0.010 (0.250) T L–M
N
G1
X
V
VIEW D–D
INCHES
DIM MIN MAX
MILLIMETERS
MIN
9.78
9.78
4.20
2.29
0.33
MAX
10.03
10.03
4.57
2.79
0.48
M
S
S
S
A
R
0.007 (0.180) T L–M
N
A
B
C
E
0.385
0.385
0.165
0.090
0.013
0.395
0.395
0.180
0.110
0.019
Z
M
S
0.007 (0.180) T L–M
N
F
M
S
S
H
0.007 (0.180) T L–M
N
G
H
J
0.050 BSC
1.27 BSC
C
0.026
0.020
0.025
0.350
0.350
0.042
0.042
0.042
–––
0.032
–––
–––
0.356
0.356
0.048
0.048
0.056
0.020
10
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
–––
2
0.81
–––
–––
9.04
9.04
1.21
1.21
1.42
0.50
10
E
0.004 (0.100)
K1
K
K
R
U
V
W
X
Y
Z
G
–T– SEATING
J
PLANE
VIEW S
M
S
S
0.007 (0.180) T L–M
N
G1
F
S
S
S
0.010 (0.250) T L–M
N
VIEW S
2
G1 0.310
K1 0.040
0.330
–––
7.88
1.02
8.38
–––
13–12
MOTOROLA ANALOG IC DEVICE DATA
FN SUFFIX
CASE 776-02
Plastic Package
(PLCC–28)
ISSUE D
1
M
S
S
0.007 (0.180)
T L–M
N
B
Z
Y BRK
D
–N–
M
S
S
0.007 (0.180)
T L–M
N
U
–M–
–L–
W
D
S
S
S
0.010 (0.250)
T L–M
N
X
G1
V
28
1
VIEW D–D
M
S
S
S
A
0.007 (0.180)
0.007 (0.180)
T L–M
N
M
S
S
H
0.007 (0.180)
T L–M
N
Z
M
S
T L–M
N
R
K1
C
E
0.004 (0.100)
SEATING
PLANE
G
K
–T–
VIEW S
J
M
S
S
0.007 (0.180)
T L–M
N
F
G1
S
S
S
0.010 (0.250)
T L–M
N
VIEW S
NOTES:
INCHES
DIM MIN MAX
MILLIMETERS
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
MIN
MAX
12.57
12.57
4.57
2.79
0.48
A
B
C
E
0.485
0.485
0.165
0.090
0.013
0.495 12.32
0.495 12.32
0.180
0.110
0.019
4.20
2.29
0.33
F
G
H
J
0.050 BSC
1.27 BSC
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042
–––
0.032
–––
–––
0.456
0.456
0.048
0.048
0.056
0.020
10
0.66
0.51
0.64
11.43
11.43
1.07
1.07
1.07
–––
0.81
–––
–––
11.58
11.58
1.21
1.21
1.42
0.50
10
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
K
R
U
V
W
X
Y
Z
2
2
G1 0.410
K1 0.040
0.430 10.42
––– 1.02
10.92
–––
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
13–13
MOTOROLA ANALOG IC DEVICE DATA
FN SUFFIX
CASE 777-02
Plastic Package
(PLCC)
M
S
S
0.007(0.180)
T
L–M
N
B
M
S
S
0.007(0.180)
T
L–M
N
U
1
ISSUE C
D
–N–
Z
Y BRK
–M–
–L–
X
G1
S
S
S
0.010 (0.25)
T
L–M
N
VIEW D–D
H
V
W
D
M
S
S
0.007(0.180)
T
L–M
N
44
1
M
M
S
S
S
S
A
R
0.007(0.180)
0.007(0.180)
T
T
L–M
L–M
N
N
K1
Z
K
J
C
F
E
M
S
S
0.007(0.180)
VIEW S
T
L–M
N
0.004 (0.10)
G
SEATING
PLANE
–T–
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
G1
VIEW S
A
B
C
E
0.685 0.695 17.40 17.65
0.685 0.695 17.40 17.65
S
S
S
0.010 (0.25)
T
L–M
N
0.165 0.180
0.090 0.110
0.013 0.019
0.050 BSC
4.20
2.29
0.33
4.57
2.79
0.48
NOTES:
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE
TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
F
1. DATUMS –L–, –M–, AND –N– ARE DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010
(0.25) PER SIDE.
G
H
J
1.27 BSC
0.026 0.032
0.66
0.51
0.64
0.81
–––
–––
0.020
0.025
–––
–––
K
R
U
V
W
X
Y
Z
0.650 0.656 16.51 16.66
0.650 0.656 16.51 16.66
0.042 0.048
0.042 0.048
0.042 0.056
––– 0.020
1.07
1.07
1.07
–––
2
1.21
1.21
1.42
0.50
10
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
2
10
G1 0.610 0.630 15.50 16.00
K1 0.040 ––– 1.02 –––
NOTES:
M SUFFIX
CASE 803C
PRELIMINARY
Plastic Package
6
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
–A–
7
8
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
–F–
9
MAXIMUM MOLD PROTRUSION 0.15 (0.008) PER
SIDE.
20
1
11
10
10 DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.006) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
K
–B–
1
J
20
G
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.504
0.215
0.081
0.020
0.032
S 10 PL
A
B
C
D
E
F
12.35
5.10
1.95
0.35
–––
12.80 0.486
5.45 0.201
2.05 0.077
0.50 0.014
M
M
0.13 (0.005)
B
N
0.81
12.40*
–––
0.488*
G
H
J
K
L
M
N
S
1.15
0.59
0.18
1.10
0.05
0
1.39 0.045
0.81 0.023
0.27 0.007
1.50 0.043
0.20 0.001
0.055
0.032
0.011
0.059
0.008
10
C
0.10 (0.004)
E
L
M
10
0
D 20 PL
–T–
SEATING
PLANE
0.50
7.40
0.85 0.020
8.20 0.291
0.033
0.323
M
S
S
0.13 (0.005)
T B
A
*APPROXIMATE
13–14
MOTOROLA ANALOG IC DEVICE DATA
TV SUFFIX
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
CASE 821C-04
Plastic Package
(15-Pin ZIP)
ISSUE D
1
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
15
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.010 (0.250).
6. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.003 (0.076) TOTAL IN EXCESS OF THE D
DIMENSION. AT MAXIMUM MATERIAL CONDITION.
SEATING
PLANE
–T–
C
E
M
B
–Q–
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
–P–
U
A
B
C
D
E
0.684 0.694 17.374 17.627
0.784 0.792 19.914 20.116
0.173 0.181 4.395 4.597
0.024 0.031 0.610 0.787
0.058 0.062 1.473 1.574
Y
K
V
A
R
G
H
J
K
L
0.050 BSC
0.169 BSC
0.018 0.024 0.458 0.609
0.700 0.710 17.780 18.034
1.270 BSC
4.293 BSC
S
0.200 BSC
5.080 BSC
PIN 15
M
R
S
U
V
Y
0.148 0.151 3.760 3.835
0.416 0.426 10.567 10.820
0.157 0.167 3.988 4.242
PIN 1
H
L
G
0.105
0.868 REF
0.625 0.639 15.875 16.231
0.115 2.667 2.921
15X D
15X J
22.047 REF
S
M
M
Q
0.010 (0.254)
T P
0.024 (0.610)
T
T SUFFIX
CASE 821D-03
Plastic Package
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
1
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
15
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.010 (0.250).
6. DELETED
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.003 (0.076) TOTAL IN EXCESS OF THE D
DIMENSION. AT MAXIMUM MATERIAL CONDITION.
SEATING
PLANE
Q
–L–
–T–
C
B
E
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
–P–
U
A
B
C
D
E
F
0.681 0.694 17.298 17.627
0.784 0.792 19.914 20.116
0.173 0.181 4.395 4.597
0.024 0.031 0.610 0.787
0.058 0.062 1.473 1.574
0.016 0.023 0.407 0.584
A
R
K
G
H
J
K
Q
R
U
Y
0.050 BSC
0.110 BSC
0.018 0.024 0.458 0.609
1.078 1.086 27.382 27.584
0.148 0.151 3.760 3.835
0.416 0.426 10.567 10.820
1.270 BSC
2.794 BSC
Y
PIN 1
PIN 15
H
G
0.110 BSC
0.503 REF
2.794 BSC
12.776 REF
7X F
15X D
15X J
S
M
L
0.010 (0.254)
T P
M
0.024 (0.610)
T
13–15
MOTOROLA ANALOG IC DEVICE DATA
FTB SUFFIX
CASE 824D–01
Plastic Package
(TQFP–44)
1
ISSUE O
L
–T–, –U–, –Z–
–Z–
44
34
33
1
AE
G
AE
DETAIL AA
–T–
L
–U–
F
PLATING
BASE METAL
DETAIL AA
J
11
23
N
12
22
D
M
S
S
0.20 (0.008)
AC T–U
Z
A
SECTION AE–AE
M
S
S
0.20 (0.008)
AB T–U
Z
Z
0.05 (0.002) T–U
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
M
S
S
0.20 (0.008)
AC T–U
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED AT
DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
M
DETAIL AD
–AB–
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –AB–.
E
C
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL NOT
CAUSE THE D DIMENSION TO EXCEED 0.530
(0.021).
0.10 (0.004)
–AC–
H
Y
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
A
B
C
D
E
9.950 10.050 0.392 0.396
9.950 10.050 0.392 0.396
1.400 1.600 0.055 0.063
0.300 0.450 0.012 0.018
1.350 1.450 0.053 0.057
0.300 0.400 0.012 0.016
R
F
G
H
J
K
L
M
N
Q
R
S
V
W
X
Y
0.800 BSC
0.031 BSC
K
0.050 0.150 0.002 0.006
0.090 0.200 0.004 0.008
0.450 0.550 0.018 0.022
8.000 BSC
12 REF
Q
W
X
0.315 BSC
12 REF
VIEW AD
0.090 0.160 0.004 0.006
1
5
1
5
0.100 0.200 0.004 0.008
11.900 12.100 0.469 0.476
11.900 12.100 0.469 0.476
0.200 REF
1.000 REF
12 REF
0.008 REF
0.039 REF
12 REF
13–16
MOTOROLA ANALOG IC DEVICE DATA
FB SUFFIX
CASE 824E–02
Plastic Package
(QFP)
44
1
ISSUE A
S
–L–, –M–, –N–
M
S
S
S
S
0.20 (0.008)
0.20 (0.008)
T L–M
H L–M
N
N
A
M
0.05 (0.002) L–M
PIN 1
IDENT
J1
J1
G
44
34
33
1
VIEW Y
3 PL
F
PLATING
BASE METAL
–L–
–M–
J
B1
D
M
VIEW Y
S
S
0.20 (0.008)
T L–M
N
SECTION J1–J1
11
23
G 40X
44 PL
12
22
–N–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED
AT DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –T–.
M
VIEW P
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.530 (0.021).
E
DATUM
C
–H–
PLANE
0.01 (0.004)
–T–
W
Y
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.398
0.398
0.087
A
B
C
D
E
9.90
9.90
2.00
0.30
2.00
0.30
10.10 0.390
10.10 0.390
2.21 0.079
0.45 0.0118 0.0177
2.10 0.079
0.40 0.012
1
0.083
0.016
F
R R1
R R2
G
J
K
M
S
V
W
Y
A1
0.80 BSC
0.031 BSC
0.13
0.65
5
0.23 0.005
0.95 0.026
10
0.009
0.037
10
DATUM
PLANE
–H–
5
12.95
12.95
0.000
5
13.45 0.510
13.45 0.510
0.210 0.000
0.530
0.530
0.008
10
K
10
5
2
A1
0.450 REF
0.170 0.005
1.600 REF
0.130
0.300
0.300 0.005
0.018 REF
0.007
0.063 REF
B1 0.130
C1
R1
R2 0.130
1
2
C1
VIEW P
0.005
0.012
0.012
10
5
0
10
7
5
0
7
13–17
MOTOROLA ANALOG IC DEVICE DATA
FB SUFFIX
CASE 840F–01
Plastic Package
ISSUE O
64
1
L
–Z–
64
49
1
48
–T–, –U–, –Z–
P
AE
AE
L
B
V
G
–U–
–T–
DETAIL AA
DETAIL AA
16
33
32
17
BASE
METAL
A
N
M
S
S
S
S
0.20 (0.008)
AB T–U
Z
Z
0.050 (0.002) T–U
S
D
F
M
0.20 (0.008)
AC T–U
M
J
C
E
SECTION AE–AE
–AB–
0.10 (0.004)
–AC–
Y
H
DETAIL AD
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.396
0.396
0.063
0.011
0.057
0.009
NOTES:
A
B
C
D
E
F
9.950 10.050 0.392
9.950 10.050 0.392
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
1.400
0.170
1.350
0.170
1.600 0.055
0.270 0.007
1.450 0.053
0.230 0.007
Q
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED
AT DATUM PLANE –AC–.
G
H
J
K
L
M
N
P
0.500 BSC
0.020 BSC
R
0.050
0.090
0.450
0.150 0.002
0.200 0.004
0.550 0.018
0.006
0.008
0.022
K
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
7.500 BSC
12° REF
0.090 0.160 0.004
0.250 BSC 0.010 BSC
0.295 BSC
12° REF
0.006
W
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25 (0.010 ) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
X
°
°
5
Q
R
S
V
W
X
Y
1°
0.100
5
1°
0.200 0.004
DETAIL AD
0.008
0.476
0.476
11.900 12.100 0.469
11.900 12.100 0.469
0.200 REF
1.000 REF
12 REF
0.008 REF
0.039 REF
°
12 REF
°
13–18
MOTOROLA ANALOG IC DEVICE DATA
DM SUFFIX
CASE 846A–02
Plastic Package
(Micro–8)
8
1
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
–A–
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
–B–
K
MILLIMETERS
INCHES
PIN 1 ID
G
DIM MIN
MAX
3.10
3.10
1.10
MIN
0.114
0.114
MAX
0.122
0.122
D 8 PL
A
B
C
D
G
H
J
2.90
2.90
–––
M
S
S
0.08 (0.003)
T B
A
––– 0.043
0.25
0.40 0.010 0.016
0.65 BSC
0.026 BSC
0.15 0.002 0.006
0.23 0.005 0.009
5.05 0.187 0.199
0.70 0.016 0.028
0.05
0.13
4.75
0.40
SEATING
PLANE
–T–
K
L
0.038 (0.0015)
C
L
J
H
13–19
MOTOROLA ANALOG IC DEVICE DATA
FB SUFFIX
CASE 848B-04
Plastic Package
(TQFP–52)
1
52
ISSUE C
L
39
27
26
40
B
B
DETAIL A
–B–
–A–
L
–A–, –B–, –D–
DETAIL A
14
52
1
13
–D–
F
B
M
S
S
S
0.20 (0.008)
H A–B
D
D
0.05 (0.002) A–B
J
N
V
M
S
0.20 (0.008)
C A–B
BASE METAL
D
DETAIL C
M
M
C
M
S
S
0.02 (0.008)
C A–B
D
E
SECTION B–B
DATUM
PLANE
–H–
0.10 (0.004)
H
SEATING
PLANE
–C–
G
MILLIMETERS
DIM MIN MAX
INCHES
NOTES:
MIN
MAX
0.398
0.398
0.096
0.015
0.083
0.013
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT
DATUM PLANE –H–.
U
A
B
C
D
E
9.90
9.90
2.10
0.22
2.00
0.22
10.10 0.390
10.10 0.390
2.45 0.083
0.38 0.009
2.10 0.079
0.33 0.009
F
G
H
J
K
L
0.65 BSC
0.026 BSC
R
–––
0.13
0.65
0.25
0.23 0.005
0.95 0.026
–––
0.010
0.009
0.037
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
Q
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
7.80 REF
0.307 REF
M
N
Q
R
S
5
0.13
0
0.13
12.95
0.13
0
12.95
0.35
1.6 REF
10
5
10
0.007
7
0.17 0.005
7
0.30 0.005
13.45 0.510
––– 0.005
K
T
0
W
X
0.012
0.530
–––
T
U
V
W
X
–––
0
–––
DETAIL C
13.45 0.510
0.45 0.014
0.530
0.018
0.063 REF
13–20
MOTOROLA ANALOG IC DEVICE DATA
FB SUFFIX
CASE 848D–03
Plastic Package
ISSUE C
1
52
4X
4X TIPS
0.20 (0.008) H L–M N
0.20 (0.008) T L–M N
–X–
X=L, M, N
52
1
40
C
L
39
AB
AB
G
3X VIEW Y
–L–
–M–
B1
VIEW Y
B
V
V1
BASE METAL
F
PLATING
13
14
27
26
J
U
–N–
A1
S1
D
M
S
S
0.13 (0.005)
T L–M
N
A
S
SECTION AB–AB
ROTATED 90 CLOCKWISE
4X θ2
4X θ3
C
0.10 (0.004) T
–H–
–T–
SEATING
PLANE
VIEW AA
MILLIMETERS
INCHES
MIN MAX
0.394 BSC
0.197 BSC
0.394 BSC
0.197 BSC
DIM MIN
MAX
10.00 BSC
5.00 BSC
A
A1
B
B1
C
C1
C2
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
S
0.05 (0.002)
10.00 BSC
5.00 BSC
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED
AT DATUM PLANE –H–.
W
–––
0.05
1.30
0.20
0.45
0.22
1.70
––– 0.067
2 X R R1
0.20 0.002 0.008
1.50 0.051 0.059
0.40 0.008 0.016
0.75 0.018 0.030
0.35 0.009 0.014
θ1
E
F
0.25 (0.010)
C2
θ
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –T–.
G
0.65 BSC
0.026 BSC
GAGE PLANE
J
K
R1
S
S1
U
0.07
0.08
12.00 BSC
6.00 BSC
0.09
12.00 BSC
6.00 BSC
0.20 REF
1.00 REF
0.20 0.003 0.008
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46
(0.018). MINIMUM SPACE BETWEEN
0.50 REF
0.020 REF
0.20 0.003 0.008
K
E
0.472 BSC
0.236 BSC
0.16 0.004 0.006
C1
V
0.472 BSC
0.236 BSC
0.008 REF
0.039 REF
Z
V1
W
Z
VIEW AA
PROTRUSION AND ADJACENT LEAD OR
PROTRUSION 0.07 (0.003).
θ
0
0
12
5
7
0
7
–––
–––
θ1
θ2
θ3
0
12
5
REF
13
REF
13
13–21
MOTOROLA ANALOG IC DEVICE DATA
B SUFFIX
CASE 858–01
Plastic Package
ISSUE O
42
1
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
42
1
22
21
–B–
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
L
A
B
C
D
F
G
H
J
1.435 1.465 36.45 37.21
0.540 0.560 13.72 14.22
0.155 0.200
0.014 0.022
0.032 0.046
0.070 BSC
3.94
0.36
0.81
1.778 BSC
7.62 BSC
5.08
0.56
1.17
H
C
K
0.300 BSC
0.008 0.015
0.20
2.92
0.38
3.43
–T–
K
L
0.115
0.135
SEATING
PLANE
0.600 BSC
15.24 BSC
N
G
M
N
0
15
0
0.51
15
1.02
M
F
0.020 0.040
J 42 PL
D 42 PL
M
S
0.25 (0.010)
T B
M
S
0.25 (0.010)
T A
B SUFFIX
CASE 859–01
Plastic Package
(SDIP)
ISSUE O
56
1
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
56
29
28
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010)
–B–
INCHES
DIM MIN MAX
MILLIMETERS
1
MIN
MAX
52.45
14.22
5.08
A
B
C
D
E
2.035
0.540
0.155
0.014
2.065 51.69
0.560 13.72
0.200
0.022
L
3.94
0.36
0.56
H
C
0.035 BSC
0.89 BSC
F
0.032
0.046
0.81
1.17
G
H
J
K
L
0.070 BSC
0.300 BSC
1.778 BSC
7.62 BSC
–T–
K
0.008
0.115
0.015
0.135
0.20
2.92
0.38
3.43
SEATING
PLANE
0.600 BSC
15.24 BSC
N
G
M
F
M
N
0
15
0
0.51
15
1.02
0.020
0.040
E
J 56 PL
D 56 PL
M
S
0.25 (0.010)
T A
M
S
0.25 (0.010)
T B
13–22
MOTOROLA ANALOG IC DEVICE DATA
FB, FTB SUFFIX
CASE 873-01
Plastic Package
(TQFP–32)
1
ISSUE A
L
17
24
25
16
B
B
P
–B–
–A–
L
V
B
–A–, –B–, –D–
DETAIL A
DETAIL A
32
9
1
8
F
BASE
METAL
–D–
A
M
S
S
0.20 (0.008)
C
A–B
D
0.05 (0.002) A–B
N
J
S
M
S
S
0.20 (0.008)
H A–B
D
D
M
S
S
0.20 (0.008)
C
A–B
D
DETAIL C
M
SECTION B–B
VIEW ROTATED 90 CLOCKWISE
E
C
DATUM
PLANE
–H–
–C–
SEATING
PLANE
0.01 (0.004)
M
H
G
U
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
6.95
6.95
1.40
7.10 0.274 0.280
7.10 0.274 0.280
1.60 0.055 0.063
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT
DATUM PLANE –H–.
T
0.273 0.373 0.010 0.015
1.30
0.273
0.80 BSC
–––
0.119
0.33
5.6 REF
6
0.119
0.40 BSC
5
0.15
8.85
0.15
5
8.85
1.00 REF
1.50 0.051 0.059
R
––– 0.010
–––
–H–
0.031 BSC
DATUM
PLANE
0.20
––– 0.008
0.197 0.005 0.008
0.57 0.013 0.022
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
0.220 REF
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
K
8
6
8
Q
0.135 0.005 0.005
0.016 BSC
10
X
10
5
DETAIL C
0.25 0.006 0.010
9.15 0.348 0.360
0.25 0.006 0.010
T
U
V
X
11
9.15 0.348 0.360
0.039 REF
5
11
13–23
MOTOROLA ANALOG IC DEVICE DATA
T SUFFIX
CASE 894-03
Plastic Package
(23-Pin SZIP)
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
1
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.010 (0.250).
23
6. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.003 (0.076) TOTAL IN EXCESS OF
THE D DIMENSION AT MAXIMUM MATERIAL
CONDITION.
C
E
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
B
L
K
Y
A
B
C
D
E
0.684
1.183
0.175
0.026
0.058
0.165
0.694 17.374 17.627
1.193 30.048 30.302
0.179
0.031
0.062
0.175
V
–N–
4.445
0.660
1.473
4.191
4.547
0.787
1.574
4.445
M
A
U
F
P
S
F
G
H
J
K
L
M
N
P
0.050 BSC
0.169 BSC
1.270 BSC
4.293 BSC
0.356 0.508
0.014
0.625
0.770
0.148
0.148
0.020
H
0.639 15.875 16.231
0.790 19.558 20.066
0.152
0.152
R
W
3.760
3.760
3.861
3.861
–T–
SEATING
PLANE
0.390 BSC
9.906 BSC
23X J
R
S
U
V
W
Y
0.416
0.157
0.105
0.868 REF
0.200 BSC
0.700
0.424 10.566 10.770
0.167
0.115
3.988
2.667
4.242
2.921
PIN 1
M
0.024 (0.610)
T
PIN 23
22.047 REF
5.080 BSC
G
0.710 17.780 18.034
23X D
M
S
S
0.010 (0.254)
T Q
N
13–24
MOTOROLA ANALOG IC DEVICE DATA
FTA SUFFIX
CASE 932–02
Plastic Package
(TQFP–48)
ISSUE D
1
48
P
4X
0.200 (0.008) AB T–U
Z
DETAIL Y
9
A
A1
48
37
AE
AE
1
36
–T–
–U–
V1
B
V
B1
–T–, –U–, –Z–
12
25
DETAIL Y
13
24
–Z–
S1
M
TOP & BOTTOM
S
R
4X
GAUGE PLANE
0.200 (0.008) AC T–U
Z
0.250 (0.010)
E
C
H
0.080 (0.003) AC
G
–AB–
–AC–
W
Q
K
AD
DETAIL AD
X
BASE METAL
MILLIMETERS
DIM MIN MAX
7.000 BSC
INCHES
MIN
MAX
NOTES:
A
A1
B
0.276 BSC
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
3.500 BSC
7.000 BSC
3.500 BSC
1.400 1.600 0.055 0.063
0.170 0.270 0.007 0.011
0.138 BSC
0.276 BSC
0.138 BSC
N
J
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
B1
C
D
E
1.350 1.450 0.053 0.057
0.170 0.230 0.007 0.009
F
D
F
G
H
J
K
M
N
P
0.500 BASIC
0.020 BASIC
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
0.050 0.150 0.002 0.006
0.090 0.200 0.004 0.008
0.500 0.700 0.020 0.028
12 REF
0.090 0.160 0.004 0.006
0.250 BASIC 0.010 BASIC
M
S
S
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
0.080 (0.003)
AC T–U
Z
12 REF
SECTION AE–AE
Q
R
1
5
1
5
0.150 0.250 0.006 0.010
S
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
S1
V
V1
W
X
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
13–25
MOTOROLA ANALOG IC DEVICE DATA
D2T SUFFIX
CASE 936–03
Plastic Package
ISSUE B
1
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
3
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
TERMINAL 4
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 4.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
K
U
A
S
V
B
H
F
1
2
3
INCHES
DIM MIN MAX
0.403 9.804 10.236
MILLIMETERS
MIN MAX
A
B
C
D
E
F
0.386
0.356
0.170
0.026
0.045
J
D
0.368 9.042
0.180 4.318
0.036 0.660
0.055 1.143
9.347
4.572
0.914
1.397
G
M
0.010 (0.254)
T
0.051 REF
0.100 BSC
0.539 0.579 13.691 14.707
0.125 MAX
0.050 REF
1.295 REF
2.540 BSC
–T–
E
G
H
J
K
L
M
N
P
R
S
U
V
OPTIONAL
CHAMFER
3.175 MAX
1.270 REF
0.000
0.088
0.018
0.058
5
0.010 0.000
0.254
2.591
0.660
1.981
0.102 2.235
0.026 0.457
0.078 1.473
REF
5 REF
C
0.116 REF
0.200 MIN
0.250 MIN
2.946 REF
5.080 MIN
6.350 MIN
M
L
P
N
R
D2T SUFFIX
CASE 936A–02
Plastic Package
(D PAK)
1
NOTES:
2
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
5
ISSUE A
TERMINAL 6
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 6.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
U
A
V
S
K
B
H
1
2
3
4
5
INCHES
DIM MIN MAX
0.403 9.804 10.236
MILLIMETERS
MIN MAX
A
B
C
D
E
G
H
K
L
M
N
P
R
S
0.386
0.356
0.170
0.026
0.045
0.067 BSC
0.539
0.050 REF
0.000
0.088
0.018
0.058
5
0.116 REF
0.200 MIN
0.250 MIN
0.368 9.042
0.180 4.318
0.036 0.660
0.055 1.143
1.702 BSC
0.579 13.691 14.707
1.270 REF
9.347
4.572
0.914
1.397
D
M
0.010 (0.254)
T
G
–T–
E
OPTIONAL
CHAMFER
0.010 0.000
0.254
2.591
0.660
1.981
0.102 2.235
0.026 0.457
0.078 1.473
REF
5 REF
2.946 REF
5.080 MIN
6.350 MIN
U
V
C
M
L
P
N
R
13–26
MOTOROLA ANALOG IC DEVICE DATA
20
DT, DTB SUFFIX
CASE 948E–02
Plastic Package
(TSSOP–20)
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
1
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
20X K REF
K
M
S
S
0.10 (0.004)
T U
V
S
K1
0.15 (0.006) T U
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
J J1
20
11
2X L/2
B
SECTION N–N
L
–U–
PIN 1
IDENT
0.25 (0.010)
N
10
1
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.260
0.177
0.047
0.006
0.030
M
A
B
C
6.40
4.30
–––
6.60 0.252
4.50 0.169
1.20
S
0.15 (0.006) T U
–––
A
D
F
0.05
0.50
0.15 0.002
0.75 0.020
N
–V–
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
F
0.27
0.09
0.09
0.19
0.19
0.37
0.011
0.015
0.008
0.006
0.012
0.010
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
DETAIL E
C
6.40 BSC
0.252 BSC
M
0
8
0
8
–W–
G
D
H
0.100 (0.004)
–T– SEATING
DETAIL E
PLANE
DTB SUFFIX
CASE 948F–01
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
Plastic Package
1
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
(TSSOP–16, TSSOP–16L)
ISSUE O
16X KREF
M
S
S
0.10 (0.004)
T U
V
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
S
0.15 (0.006) T U
K
K1
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
16
9
2X L/2
J1
SECTION N–N
B
–U–
L
J
PIN 1
IDENT.
8
1
N
MILLIMETERS
DIM MIN MAX
INCHES
0.25 (0.010)
MIN
MAX
0.200
0.177
0.047
0.006
0.030
A
B
C
4.90
4.30
–––
5.10 0.193
4.50 0.169
1.20
S
M
0.15 (0.006) T U
A
–––
D
F
0.05
0.50
0.15 0.002
0.75 0.020
–V–
N
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.18
0.09
0.09
0.19
0.19
0.28 0.007
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
0.011
0.008
0.006
0.012
0.010
F
DETAIL E
DETAIL E
6.40 BSC
0.252 BSC
0
C
M
0
8
8
0.10 (0.004)
–W–
H
SEATING
PLANE
–T–
D
G
13–27
MOTOROLA ANALOG IC DEVICE DATA
DTB SUFFIX
CASE 948G–01
Plastic Package
(TSSOP–14)
ISSUE O
14
1
NOTES:
14X K REF
1
DIMENSIONING AND TOLERANCING PER ANSI
M
S
S
Y14.5M, 1982.
0.10 (0.004)
T U
V
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
S
0.15 (0.006) T U
N
0.25 (0.010)
14
4
5
8
2X L/2
M
B
L
N
–U–
PIN 1
IDENT.
F
7
1
6
7
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
DETAIL E
S
K
0.15 (0.006) T U
A
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
K1
–V–
A
B
C
4.90
4.30
–––
5.10 0.193 0.200
4.50 0.169 0.177
1.20
J J1
––– 0.047
D
F
0.05
0.50
0.15 0.002 0.006
0.75 0.020 0.030
SECTION N–N
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.60 0.020 0.024
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
0.50
0.09
0.09
0.19
0.19
–W–
C
6.40 BSC
0.252 BSC
0.10 (0.004)
M
0
8
0
8
SEATING
PLANE
–T–
H
G
DETAIL E
D
13–28
MOTOROLA ANALOG IC DEVICE DATA
DTB SUFFIX
CASE 948H–01
Plastic Package
ISSUE O
24
1
24X KREF
M
S
S
0.10 (0.004)
T U
V
S
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
24
13
2X L/2
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
B
–U–
L
PIN 1
IDENT.
12
1
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
S
0.15 (0.006) T U
A
–V–
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
MILLIMETERS
DIM MIN MAX
7.90 0.303
INCHES
MIN
MAX
C
A
B
7.70
4.30
–––
0.311
4.50 0.169 0.177
1.20 ––– 0.047
C
0.10 (0.004)
D
F
G
H
J
J1
K
K1
L
0.05
0.50
0.65 BSC
0.27
0.09
0.09
0.19
0.19
0.15 0.002 0.006
0.75 0.020 0.030
SEATING
PLANE
–T–
G
H
D
0.026 BSC
0.011 0.015
0.37
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
6.40 BSC
0.252 BSC
M
0
8
0
8
–W–
DETAIL E
N
0.25 (0.010)
K
M
K1
N
J1
F
DETAIL E
SECTION N–N
J
13–29
MOTOROLA ANALOG IC DEVICE DATA
DTB SUFFIX
CASE 948J–01
Plastic Package
(TSSOP–8)
8
1
ISSUE O
NOTES:
8x KREF
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
M
S
S
0.10 (0.004)
T U
V
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
S
0.15 (0.006) T U
K
K1
8
5
2X L/2
4
5
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
J J1
B
–U–
L
PIN 1
IDENT.
SECTION N–N
4
1
N
6
7
0.25 (0.010)
S
0.15 (0.006) T U
A
M
–V–
MILLIMETERS
INCHES
DIM MIN
MAX
3.10
4.50 0.169
1.20 –––
0.15 0.002
0.75 0.020
MIN
0.114
MAX
0.122
0.177
0.047
0.006
0.030
N
A
B
C
2.90
4.30
–––
F
D
F
0.05
0.50
DETAIL E
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.50
0.09
0.09
0.19
0.19
0.60 0.020
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
0.024
0.008
0.006
0.012
0.010
–W–
C
0.10 (0.004)
G
SEE DETAIL E
SEATING
PLANE
–T–
D
6.40 BSC
0.252 BSC
M
0
8
0
8
H
M SUFFIX
CASE 967–01
Plastic Package
(EIAJ–20)
20
1
ISSUE O
NOTES:
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
L
E
20
11
Q
1
4
5
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
H
E
E
M
THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
L
1
10
DETAIL P
Z
D
VIEW P
MILLIMETERS
INCHES
MIN MAX
––– 0.081
e
A
DIM MIN
MAX
c
A
A
–––
0.05
0.35
0.18
2.05
0.20 0.002 0.008
0.50 0.014 0.020
0.27 0.007
1
b
c
0.011
D
E
e
12.35 12.80 0.486 0.504
A
b
1
5.10
5.45 0.201 0.215
1.27 BSC
0.050 BSC
8.20 0.291 0.323
0.85 0.020 0.033
1.50 0.043 0.059
M
0.10 (0.004)
0.13 (0.005)
H
7.40
0.50
1.10
0
0.70
–––
E
L
L
E
M
Q
10
0.90 0.028 0.035
0.81 ––– 0.032
10
0
1
Z
13–30
MOTOROLA ANALOG IC DEVICE DATA
FTB SUFFIX
CASE 976–01
Plastic Package
(TQFP–20)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
20
1
ISSUE O
4X
9
0.200 (0.008) AB T–U Z
5. DIMENSIONS S AND V TO BE DETERMINED AT
DATUM PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
A
A1
DETAIL Y
20
16
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
15
1
–T–
–U–
MILLIMETERS
DIM MIN MAX
4.000 BSC
INCHES
MIN MAX
0.157 BSC
0.079 BSC
0.157 BSC
0.079 BSC
V
B
A
A1
B
2.000 BSC
4.000 BSC
2.000 BSC
1.400 1.600 0.055 0.063
0.170 0.270 0.007 0.011
B1
B1
C
D
E
11
5
V1
1.350 1.450 0.053 0.057
0.170 0.230 0.007 0.009
F
G
H
J
K
M
N
P
0.650 BSC
0.026 BSC
0.050 0.150 0.002 0.006
0.090 0.200 0.004 0.008
0.500 0.700 0.020 0.028
12 REF
0.090 0.160 0.004 0.006
0.250 BSC 0.010 BSC
6
10
12 REF
–Z–
S1
Q
R
S
S1
V
V1
W
X
1
5
1
5
S
0.150 0.250 0.006 0.010
6.000 BSC
3.000 BSC
6.000 BSC
3.000 BSC
0.200 REF
1.000 REF
0.236 BSC
0.118 BSC
0.236 BSC
0.118 BSC
0.008 REF
0.039 REF
4X
0.200 (0.008) AB T–U Z
DETAIL AD
J
N
–AB–
–AC–
F
D
0.080 (0.003) AC
S
S
S
0.080 (0.003)
AC T–U
Z
M
SECTION AE–AE
TOP & BOTTOM
R
–T–, –U–, –Z–
C
H
E
AE
G
AE
W
K
X
GAUGE
PLANE
Q
0.250 (0.010)
DETAIL AD
DETAIL Y
13–31
MOTOROLA ANALOG IC DEVICE DATA
FTA SUFFIX
CASE 977–01
Plastic Package
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
24
1
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
4X
5. DIMENSIONS S AND V TO BE DETERMINED AT
DATUM PLANE –AC–.
9
0.200 (0.008) AB T–U Z
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
A
A1
24
DETAIL Y
19
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
1
18
–T–
–U–
MILLIMETERS
DIM MIN MAX
4.000 BSC
INCHES
MIN MAX
0.157 BSC
0.079 BSC
0.157 BSC
0.079 BSC
A
A1
B
2.000 BSC
4.000 BSC
2.000 BSC
1.400 1.600 0.055 0.063
0.170 0.270 0.007 0.011
V
B
B1
C
D
E
B1
13
6
1.350 1.450 0.053 0.057
0.170 0.230 0.007 0.009
V1
F
G
H
J
K
M
N
P
0.500 BSC
0.020 BSC
0.050 0.150 0.002 0.006
0.090 0.200 0.004 0.008
0.500 0.700 0.020 0.028
12 REF
0.090 0.160 0.004 0.006
0.250 BSC 0.010 BSC
12 REF
7
12
Q
R
S
S1
V
V1
W
X
1
5
1
5
–Z–
S1
0.150 0.250 0.006 0.010
6.000 BSC
3.000 BSC
6.000 BSC
3.000 BSC
0.200 REF
1.000 REF
0.236 BSC
0.118 BSC
0.236 BSC
0.118 BSC
0.008 REF
0.039 REF
S
4X
0.200 (0.008) AB T–U Z
DETAIL AD
–T–, –U–, –Z–
–AB–
–AC–
AE
AE
0.080 (0.003) AC
M
TOP & BOTTOM
P
R
G
DETAIL Y
C
E
J
N
F
W
GAUGE
Q
D
PLANE
H
K
0.250 (0.010)
X
S
S
S
0.080 (0.003)
AC T–U
Z
DETAIL AD
SECTION AE–AE
13–32
MOTOROLA ANALOG IC DEVICE DATA
N SUFFIX
CASE 1212–01
Plastic Package
(SOT–23)
1
ISSUE O
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
A2
B
A
E
D
S
0.05
3. DATUM C IS A SEATING PLANE.
A1
MILLIMETERS
5
1
4
3
DIM MIN
MAX
0.10
1.30
0.50
0.25
3.00
3.10
1.80
L
A1
A2
B
C
D
E
E1
e
e1
L
0.00
1.00
0.30
0.10
2.80
2.50
1.50
0.95 BSC
1.90 BSC
0.20
0.45
2
E1
C
L1
B
5X
C
M
S
S
0.10
C B
A
e
e1
–––
0.75
L1
H SUFFIX
1
CASE 1213–01
Plastic Package
(SOT–89)
ISSUE O
NOTES:
A
D
A2
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCING
PER ASME Y14.5M, 1994.
C
B
D1
3. DATUM C IS A SEATING PLANE.
MILLIMETERS
DIM MIN
MAX
1.60
0.57
0.52
0.50
4.60
1.70
4.25
2.60
E1
E
A2
B
B1
C
D
D1
E
1.40
0.37
0.32
0.30
4.40
1.50
–––
L1
B
C
M
S
S
0.10
C B
A
E1
e
e1
L1
2.40
1.50 BSC
3.00 BSC
0.80 –––
B1 2X
e
M
S
S
0.10
C B
A
e1
13–33
MOTOROLA ANALOG IC DEVICE DATA
相关型号:
MC13145
UHF WIDEBAND RECEIVER SUBSYSTEM (LNA, Mixer, VCO, Prescalar, IF Subsystem, Coilless Detector)
MOTOROLA
MC13145FTA
UHF WIDEBAND RECEIVER SUBSYSTEM (LNA, Mixer, VCO, Prescalar, IF Subsystem, Coilless Detector)
MOTOROLA
MC13145FTA
UHF Wideband Receiver Subsystem (LNA, Mixer, VCO, Prescaler, IF Subsystem, Coiless Detector)
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