MC14519BCPD [MOTOROLA]

4000/14000/40000 SERIES, QUAD 2-INPUT XNOR GATE, PDIP16, PLASTIC, DIP-16;
MC14519BCPD
型号: MC14519BCPD
厂家: MOTOROLA    MOTOROLA
描述:

4000/14000/40000 SERIES, QUAD 2-INPUT XNOR GATE, PDIP16, PLASTIC, DIP-16

文件: 总6页 (文件大小:204K)
中文:  中文翻译
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SEMICONDUCTOR TECHNICAL DATA  
L SUFFIX  
CERAMIC  
CASE 620  
The MC14519B is constructed with MOS P–channel and N–channel  
enhancement mode devices in a monolithic structure. These complementary  
MOS logic gates find primary use where low power dissipation and/or high  
noise immunity is desired.  
P SUFFIX  
PLASTIC  
CASE 648  
This device provides three functions in one package; a 4–Bit AND/OR  
Selector, a Quad 2–Channel Data Selector, or a Quad Exclusive NOR Gate.  
D SUFFIX  
SOIC  
CASE 751B  
Diode Protection on All Inputs  
Supply Voltage Range = 3.0 Vdc to 18 Vdc  
Capable of Driving Two Low–power TTL Loads or One Low–power  
Schottky TTL Load Over the Rated Temperature Range  
Plug–in Replacement for CD4019 in Most Applications  
ORDERING INFORMATION  
MC14XXXBCP  
MC14XXXBCL  
MC14XXXBD  
Plastic  
Ceramic  
SOIC  
LOGIC DIAGRAM  
T
A
= – 55° to 125°C for all packages.  
A
B
9
CONTROL  
INPUTS  
14  
TRUTH TABLE  
10 Z0  
11 Z1  
12 Z2  
13 Z3  
Control Inputs  
Output  
X0  
Y0  
6
7
A
B
Z
n
0
0
1
1
0
1
0
1
0
Y
X
n
n
X1  
Y1  
4
5
x
Y
n
n
DATA  
INPUTS  
NOTE: X  
Y means X  
n
n
n
X2  
Y2  
2
3
(Exclusive–NOR) Y  
n
X3 15  
Y3  
1
V
V
= PIN 16  
= PIN 8  
DD  
SS  
REV 3  
1/94  
Motorola, Inc. 1995  
MAXIMUM RATINGS* (Voltages Referenced to V  
)
SS  
PIN ASSIGNMENT  
Symbol  
Parameter  
DC Supply Voltage  
Value  
Unit  
V
V
DD  
– 0.5 to + 18.0  
Y3  
X2  
Y2  
X1  
Y1  
X0  
Y0  
1
2
16  
15  
V
DD  
X3  
B
V , V  
Input or Output Voltage (DC or Transient)  
– 0.5 to V  
DD  
+ 0.5  
V
in out  
I , I  
3
4
5
6
7
8
14  
13  
12  
11  
10  
9
Input or Output Current (DC or Transient),  
per Pin  
± 10  
mA  
in out  
Z3  
Z2  
Z1  
Z0  
A
P
D
Power Dissipation, per Package†  
Storage Temperature  
500  
mW  
C
T
stg  
– 65 to + 150  
260  
T
L
Lead Temperature (8–Second Soldering)  
C
* Maximum Ratings are those values beyond which damage to the device may occur.  
Temperature Derating:  
V
SS  
Plastic “P and D/DW” Packages: – 7.0 mW/ C From 65 C To 125 C  
Ceramic “L” Packages: – 12 mW/ C From 100 C To 125 C  
ELECTRICAL CHARACTERISTICS (Voltages Referenced to V  
)
SS  
– 55 C  
25 C  
Typ #  
125 C  
V
Vdc  
DD  
Characteristic  
Output Voltage  
Symbol  
Unit  
Min  
Max  
Min  
Max  
Min  
Max  
“0” Level  
“1” Level  
“0” Level  
V
OL  
5.0  
10  
15  
0.05  
0.05  
0.05  
0
0
0
0.05  
0.05  
0.05  
0.05  
0.05  
0.05  
Vdc  
V
in  
= V  
DD  
or 0  
V
OH  
5.0  
10  
15  
4.95  
9.95  
14.95  
4.95  
9.95  
14.95  
5.0  
10  
15  
4.95  
9.95  
14.95  
Vdc  
Vdc  
V
in  
= 0 or V  
DD  
Input Voltage  
(V = 4.5 or 0.5 Vdc)  
V
IL  
5.0  
10  
15  
1.5  
3.0  
4.0  
2.25  
4.50  
6.75  
1.5  
3.0  
4.0  
1.5  
3.0  
4.0  
O
(V = 9.0 or 1.0 Vdc)  
O
(V = 13.5 or 1.5 Vdc)  
O
“1” Level  
V
IH  
Vdc  
(V = 0.5 or 4.5 Vdc)  
O
5.0  
10  
15  
3.5  
7.0  
11  
3.5  
7.0  
11  
2.75  
5.50  
8.25  
3.5  
7.0  
11  
(V = 1.0 or 9.0 Vdc)  
O
(V = 1.5 or 13.5 Vdc)  
O
Output Drive Current  
I
mAdc  
OH  
(V  
(V  
(V  
(V  
= 2.5 Vdc)  
= 4.6 Vdc)  
= 9.5 Vdc)  
= 13.5 Vdc)  
Source  
Sink  
5.0  
5.0  
10  
– 3.0  
– 0.64  
– 1.6  
– 4.2  
– 2.4  
– 0.51  
– 1.3  
– 3.4  
– 4.2  
– 0.88  
– 2.25  
– 8.8  
– 1.7  
– 0.36  
– 0.9  
– 2.4  
OH  
OH  
OH  
OH  
15  
(V  
OL  
(V  
OL  
(V  
OL  
= 0.4 Vdc)  
= 0.5 Vdc)  
= 1.5 Vdc)  
I
5.0  
10  
15  
0.64  
1.6  
4.2  
0.51  
1.3  
3.4  
0.88  
2.25  
8.8  
0.36  
0.9  
2.4  
mAdc  
OL  
Input Current  
I
15  
± 0.1  
±0.00001  
± 0.1  
± 1.0  
µAdc  
in  
Input Capacitance  
C
5.0  
7.5  
pF  
in  
(V = 0)  
in  
Quiescent Current  
(Per Package)  
I
5.0  
10  
15  
5.0  
10  
20  
0.005  
0.010  
0.015  
5.0  
10  
20  
150  
300  
600  
µAdc  
µAdc  
DD  
Total Supply Current**†  
I
T
5.0  
10  
15  
I
T
I
T
I
T
= (1.2 µA/kHz) f + I  
= (2.4 µA/kHz) f + I  
= (3.6 µA/kHz) f + I  
DD  
DD  
DD  
(Dynamic plus Quiescent,  
Per Package)  
(C = 50 pF on all outputs, all  
L
buffers switching)  
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.  
**The formulas given are for the typical characteristics only at 25 C.  
To calculate total supply current at loads other than 50 pF:  
I (C ) = I (50 pF) + (C – 50) Vfk  
T
L
T
L
where: I is in µA (per package), C in pF, V = (V  
– V ) in volts, f in kHz is input frequency, and k = 0.004.  
SS  
T
L
DD  
MC14519B  
2
MOTOROLA CMOS LOGIC DATA  
SWITCHING CHARACTERISTICS* (C = 50 pF, T = 25 C)  
L
A
Characteristic  
Symbol  
V
DD  
Min  
Typ #  
Max  
Unit  
Output Rise and Fall Time  
t
t
,
ns  
TLH  
t
t
t
, t  
= (1.5 ns/pF) C + 25 ns  
= (0.75 ns/pF) C + 12.5 ns  
L
= (0.55 ns/pF) C + 9.5 ns  
5.0  
10  
15  
100  
50  
40  
200  
100  
80  
TLH THL  
L
THL  
, t  
TLH THL  
, t  
TLH THL  
L
Propagation Delay Time  
t
t
,
ns  
PLH  
t
t
t
, t  
= (1.7 ns/pF) C + 165 ns  
= (0.66 ns/pF) C + 82  
= (0.5 ns/pF) C + 65 ns  
L
5.0  
10  
15  
250  
115  
90  
500  
225  
165  
PLH PHL  
L
L
PHL  
, t  
PLH PHL  
, t  
PLH PHL  
* The formulas given are for the typical characteristics only at 25 C.  
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.  
+V  
DD  
Z0  
Z1  
V
DD  
A
B
PULSE  
GENERATOR  
V
in  
C
C
C
L
L
L
20 ns  
20 ns  
X0  
Y0  
V
DD  
90%  
10%  
50% DUTY CYCLE  
X1  
Y1  
V
in  
V
SS  
X2  
Z2  
Z3  
Y2  
X3  
Y3  
V
SS  
C
L
I
SS  
500 µF  
Figure 1. Dynamic Power Dissipation Test Circuit and Waveform  
V
DD  
20 ns  
INPUT  
20 ns  
V
V
DD  
DD  
PULSE  
GENERATOR  
A
B
Z0  
90%  
50%  
10%  
C
C
L
V
V
SS  
X0  
Y0  
X1  
Y1  
X2  
Y2  
X3  
Y3  
t
t
PLH  
PHL  
Z1  
Z2  
Z3  
OH  
L
90%  
50%  
10%  
OUTPUTS  
OUTPUT  
V
OL  
C
C
L
t
THL  
t
TLH  
t
t
PLH  
PHL  
V
V
OH  
V
SS  
L
OUTPUT  
50%  
OL  
Figure 2. Switching Time Test Circuit and Waveforms  
MOTOROLA CMOS LOGIC DATA  
MC14519B  
3
TYPICAL CIRCUIT APPLICATIONS  
DATA REGISTER SELECTION COMPARISON  
MC14015B  
DUAL 4–BIT REGISTER  
DATA A  
CLOCK A  
RESET A  
DATA B  
CLOCK B  
RESET B  
4–BIT REGISTER A  
Q1 Q2 Q3 Q4  
4–BIT REGISTER B  
Q1 Q2 Q3 Q4  
X0  
A
X1  
X2  
X3  
MC14519B  
AND/OR SELECT/EXCL NOR  
Z1 Z2  
Y0  
Y1  
Y2  
Y3  
Z3  
CONTROL A  
CONTROL B  
B
Z0  
INVERT  
MC14070B  
QUAD  
EXCLUSIVE OR  
Q0  
Q1  
Q2  
Q3  
CONVERSION TABLE  
Output  
Operation Code  
Function  
A
B
INV  
Q0  
Q1  
Q2  
Q3  
0
0
1
1
0
0
0
0
0
1
0
1
0
1
X0  
X0  
0
1
X1  
X1  
0
1
X2  
X2  
0
1
X3  
X3  
Inhibit, all zeros  
Inhibit, all ones  
Control A  
Control A and Invert  
0
0
1
1
1
1
1
1
0
1
0
1
Y0  
Y0  
Y1  
Y1  
Y2  
Y2  
Y3  
Y3  
Control B  
Control B and Invert  
Exclusive NOR  
Exclusive OR  
X0  
X0  
Y0  
Y0  
X1  
X1  
Y1  
Y1  
X2  
X2  
Y2  
Y2  
X3  
X3  
Y3  
Y3  
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However,  
precautionsmust be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance  
circuit. For proper operation, V and V  
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either V  
be left open.  
should be constrained to the range V  
(V or V ) V  
.
in out  
SS  
in  
out  
DD  
or V ). Unused outputs must  
SS  
DD  
MC14519B  
MOTOROLA CMOS LOGIC DATA  
4
OUTLINE DIMENSIONS  
L SUFFIX  
CERAMIC DIP PACKAGE  
CASE 620–10  
ISSUE V  
–A–  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
4. DIMENSION F MAY NARROW TO 0.76 (0.030)  
WHERE THE LEAD ENTERS THE CERAMIC  
BODY.  
16  
1
9
8
–B–  
C
L
INCHES  
MILLIMETERS  
DIM  
A
B
C
D
MIN  
MAX  
0.785  
0.295  
0.200  
0.020  
MIN  
19.05  
6.10  
–––  
MAX  
19.93  
7.49  
5.08  
0.50  
0.750  
0.240  
–––  
–T–  
SEATING  
PLANE  
0.015  
0.39  
K
N
E
0.050 BSC  
1.27 BSC  
F
0.055  
0.065  
1.40  
1.65  
G
H
K
L
M
N
0.100 BSC  
2.54 BSC  
M
E
0.008  
0.125  
0.015  
0.170  
0.21  
3.18  
0.38  
4.31  
F
J
16 PL  
0.25 (0.010)  
G
0.300 BSC  
7.62 BSC  
M
S
T
B
0
15  
0
15  
D 16 PL  
0.25 (0.010)  
0.020  
0.040  
0.51  
1.01  
M
S
T
A
P SUFFIX  
PLASTIC DIP PACKAGE  
CASE 648–08  
ISSUE R  
NOTES:  
–A–  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.  
5. ROUNDED CORNERS OPTIONAL.  
16  
1
9
8
B
S
INCHES  
MILLIMETERS  
DIM  
A
B
C
D
F
MIN  
MAX  
0.770  
0.270  
0.175  
0.021  
0.70  
MIN  
18.80  
6.35  
3.69  
0.39  
1.02  
MAX  
19.55  
6.85  
4.44  
0.53  
1.77  
F
0.740  
0.250  
0.145  
0.015  
0.040  
C
L
SEATING  
–T–  
G
H
J
K
L
0.100 BSC  
0.050 BSC  
2.54 BSC  
1.27 BSC  
PLANE  
K
M
0.008  
0.015  
0.130  
0.305  
10  
0.21  
0.38  
3.30  
7.74  
10  
H
J
0.110  
0.295  
0
2.80  
7.50  
0
G
D 16 PL  
0.25 (0.010)  
M
S
0.020  
0.040  
0.51  
1.01  
M
M
T
A
MOTOROLA CMOS LOGIC DATA  
MC14519B  
5
OUTLINE DIMENSIONS  
D SUFFIX  
PLASTIC SOIC PACKAGE  
CASE 751B–05  
ISSUE J  
–A–  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
16  
1
9
8
–B–  
P 8 PL  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
M
S
0.25 (0.010)  
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 (0.005) TOTAL  
IN EXCESS OF THE D DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
G
MILLIMETERS  
INCHES  
DIM  
A
B
C
D
MIN  
9.80  
3.80  
1.35  
0.35  
0.40  
MAX  
10.00  
4.00  
1.75  
0.49  
1.25  
MIN  
MAX  
0.393  
0.157  
0.068  
0.019  
0.049  
F
0.386  
0.150  
0.054  
0.014  
0.016  
R X 45  
K
C
F
G
J
K
M
P
R
1.27 BSC  
0.050 BSC  
–T–  
SEATING  
PLANE  
0.19  
0.10  
0
0.25  
0.25  
7
0.008  
0.004  
0
0.009  
0.009  
7
J
M
D
16 PL  
5.80  
0.25  
6.20  
0.50  
0.229  
0.010  
0.244  
0.019  
M
S
S
0.25 (0.010)  
T
B
A
Motorolareserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representationorguaranteeregarding  
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,  
and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided  
in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters,  
including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent  
rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant  
into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a  
situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application,  
Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or  
unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and  
trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.  
are registered  
How to reach us:  
USA/EUROPE/Locations Not Listed: Motorola Literature Distribution;  
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MC14519B/D  

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