MC54HC165JD [MOTOROLA]

Parallel In Serial Out, HC/UH Series, 8-Bit, Right Direction, Complementary Output, CMOS, CDIP16, 620-09;
MC54HC165JD
型号: MC54HC165JD
厂家: MOTOROLA    MOTOROLA
描述:

Parallel In Serial Out, HC/UH Series, 8-Bit, Right Direction, Complementary Output, CMOS, CDIP16, 620-09

移位寄存器
文件: 总10页 (文件大小:140K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SEMICONDUCTOR TECHNICAL DATA  
J SUFFIX  
CERAMIC PACKAGE  
CASE 620–10  
High–Performance Silicon–Gate CMOS  
The MC54/74HC165A is identical in pinout to the LS165. The device  
inputs are compatible with standard CMOS outputs; with pullup resistors,  
they are compatible with LSTTL outputs.  
This device is an 8–bit shift register with complementary outputs from the  
last stage. Data may be loaded into the register either in parallel or in serial  
form. When the Serial Shift/Parallel Load input is low, the data is loaded  
asynchronously in parallel. When the Serial Shift/Parallel Load input is high,  
the data is loaded serially on the rising edge of either Clock or Clock Inhibit  
(see the Function Table).  
The 2–input NOR clock may be used either by combining two independent  
clock sources or by designating one of the clock inputs to act as a clock  
inhibit.  
16  
16  
1
N SUFFIX  
PLASTIC PACKAGE  
CASE 648–08  
1
D SUFFIX  
SOIC PACKAGE  
CASE 751B–05  
16  
1
DT SUFFIX  
TSSOP PACKAGE  
CASE 948F–01  
16  
Output Drive Capability: 10 LSTTL Loads  
Outputs Directly Interface to CMOS, NMOS, and TTL  
Operating Voltage Range: 2 to 6 V  
1
Low Input Current: 1 µA  
ORDERING INFORMATION  
High Noise Immunity Characteristic of CMOS Devices  
In Compliance with the Requirements Defined by JEDEC Standard  
No. 7A  
MC54HCXXXAJ  
Ceramic  
Plastic  
SOIC  
MC74HCXXXAN  
MC74HCXXXAD  
MC74HCXXXADT  
Chip Complexity: 286 FETs or 71.5 Equivalent Gates  
TSSOP  
LOGIC DIAGRAM  
11  
A
12  
PIN ASSIGNMENT  
B
9
7
13  
Q
Q
SERIAL SHIFT/  
H
SERIAL  
DATA  
OUTPUTS  
C
D
E
1
2
16  
15  
V
CC  
PARALLEL LOAD  
PARALLEL  
DATA  
INPUTS  
14  
3
CLOCK  
CLOCK INHIBIT  
H
E
F
3
4
5
6
7
8
14  
13  
12  
11  
10  
9
D
C
B
A
4
5
F
G
H
G
H
6
PIN 16 = V  
CC  
PIN 8 = GND  
SERIAL  
DATA  
INPUT  
10  
S
A
Q
S
A
H
1
SERIAL SHIFT/  
PARALLEL LOAD  
GND  
Q
H
2
CLOCK  
15  
CLOCK INHIBIT  
FUNCTION TABLE  
Inputs  
Internal Stages  
Output  
Serial Shift/  
Clock  
Parallel Load  
Inhibit  
Clock  
S
A
A – H  
Q
Q
Q
H
Operation  
A
B
L
X
X
X
a h  
a
b
h
Asynchronous Parallel Load  
H
H
L
L
L
H
X
X
L
H
Q
Q
Q
Q
An  
An  
Gn  
Gn  
Serial Shift via Clock  
H
H
L
L
L
H
X
X
L
H
Q
Q
Q
Q
An  
An  
Gn  
Gn  
Serial Shift via Clock Inhibit  
H
H
X
H
H
X
X
X
X
X
No Change  
Inhibited Clock  
No Clock  
H
L
L
X
X
No Change  
X = don’t care  
Q
– Q  
= Data shifted from the preceding stage  
Gn  
An  
This document contains information on a product under development. Motorola reserves the right to change or  
discontinue this product without notice.  
10/95  
REV 0  
Motorola, Inc. 1995  
MC54/74HC165A  
MAXIMUM RATINGS*  
Symbol  
Parameter  
Value  
Unit  
V
This device contains protection  
circuitry to guard against damage  
due to high static voltages or electric  
fields. However, precautions must  
be taken to avoid applications of any  
voltage higher than maximum rated  
voltages to this high–impedance cir-  
V
DC Supply Voltage (Referenced to GND)  
DC Input Voltage (Referenced to GND)  
DC Output Voltage (Referenced to GND)  
DC Input Current, per Pin  
– 0.5 to + 7.0  
CC  
V
– 0.5 to V  
+ 0.5  
V
in  
CC  
V
out  
– 0.5 to V  
+ 0.5  
V
CC  
I
± 20  
mA  
mA  
mA  
mW  
in  
cuit. For proper operation, V and  
in  
I
I
DC Output Current, per Pin  
± 25  
± 50  
out  
V
should be constrained to the  
out  
range GND (V or V  
)
V
CC  
.
DC Supply Current, V  
CC  
and GND Pins  
in out  
CC  
Unused inputs must always be  
tied to an appropriate logic voltage  
P
D
Power Dissipation in Still Air, Plastic or Ceramic DIP†  
SOIC Package†  
750  
500  
450  
level (e.g., either GND or V ).  
CC  
TSSOP Package†  
Unused outputs must be left open.  
T
Storage Temperature  
– 65 to + 150  
C
C
stg  
T
Lead Temperature, 1 mm from Case for 10 Seconds  
(Plastic DIP, SOIC or TSSOP Package)  
(Ceramic DIP)  
L
260  
300  
* Maximum Ratings are those values beyond which damage to the device may occur.  
Functional operation should be restricted to the Recommended Operating Conditions.  
†Derating — Plastic DIP: – 10 mW/ C from 65 to 125 C  
Ceramic DIP: – 10 mW/ C from 100 to 125 C  
SOIC Package: – 7 mW/ C from 65 to 125 C  
TSSOP Package: – 6.1 mW/ C from 65 to 125 C  
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
2.0  
0
Max  
Unit  
V
V
CC  
DC Supply Voltage (Referenced to GND)  
DC Input Voltage, Output Voltage (Referenced to GND)  
Operating Temperature, All Package Types  
6.0  
V , V  
in out  
V
CC  
V
T
A
– 55 + 125  
C
t , t  
r f  
Input Rise and Fall Time  
(Figure 1)  
V
CC  
V
CC  
V
CC  
V
CC  
= 2.0 V  
= 3.0 V  
= 4.5 V  
= 6.0 V  
0
0
0
1000  
600  
500  
400  
ns  
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)  
Guaranteed Limit  
– 55 to  
V
CC  
V
25 C  
Symbol  
Parameter  
Test Conditions  
Unit  
85 C  
125 C  
V
IH  
Minimum High–Level Input  
Voltage  
V
= 0.1 V or V  
– 0.1 V  
2.0  
3.0  
4.5  
6.0  
1.5  
2.1  
3.15  
4.2  
1.5  
2.1  
3.15  
4.2  
1.5  
2.1  
3.15  
4.2  
V
out  
CC  
|I  
|
20 µA  
out  
V
IL  
Maximum Low–Level Input  
Voltage  
V
= 0.1 V or V  
– 0.1 V  
2.0  
3.0  
4.5  
6.0  
0.5  
0.9  
1.35  
1.80  
0.5  
0.9  
1.35  
1.80  
0.5  
0.9  
1.35  
1.80  
V
out  
CC  
|I  
|
20 µA  
out  
V
OH  
Minimum High–Level Output  
Voltage  
V
= V or V  
IH IL  
2.0  
4.5  
6.0  
1.9  
4.4  
5.9  
1.9  
4.4  
5.9  
1.9  
4.4  
5.9  
V
V
in  
|I  
|
20 µA  
out  
V
in  
= V or V  
IH  
|I  
|I  
|I  
|
|
|
2.4 mA  
4.0 mA  
5.2 mA  
3.0  
4.5  
6.0  
2.48  
3.98  
5.48  
2.34  
3.84  
5.34  
2.20  
3.70  
5.20  
IL out  
out  
out  
MOTOROLA  
2
MC54/74HC165A  
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)  
Guaranteed Limit  
– 55 to  
V
CC  
V
25 C  
Symbol  
Parameter  
Test Conditions  
85 C  
125 C  
Unit  
V
OL  
Maximum Low–Level Output  
Voltage  
V
V
= V or V  
2.0  
4.5  
6.0  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
in  
IH IL  
|I  
|
20 µA  
out  
V
in  
= V or V  
IH  
|I  
|I  
|I  
|
|
|
2.4 mA  
4.0 mA  
5.2 mA  
3.0  
4.5  
6.0  
0.26  
0.26  
0.26  
0.33  
0.33  
0.33  
0.40  
0.40  
0.40  
IL out  
out  
out  
I
Maximum Input Leakage Current  
V
V
= V  
= V  
or GND  
6.0  
6.0  
± 0.1  
± 1.0  
± 1.0  
µA  
µA  
in  
in  
CC  
I
Maximum Quiescent Supply  
Current (per Package)  
or GND  
4
40  
160  
CC  
in  
CC  
I
= 0 µA  
out  
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).  
AC ELECTRICAL CHARACTERISTICS (C = 50 pF, Input t = t = 6 ns)  
L
r
f
Guaranteed Limit  
– 55 to  
V
CC  
V
25 C  
Symbol  
Parameter  
Unit  
85 C  
125 C  
f
Maximum Clock Frequency (50% Duty Cycle)  
(Figures 1 and 8)  
2.0  
3.0  
4.5  
6.0  
10  
15  
30  
50  
9
8
MHz  
max  
14  
28  
45  
12  
25  
40  
t
t
t
t
,
Maximum Propagation Delay, Clock (or Clock Inhibit) to Q or Q  
H
2.0  
3.0  
4.5  
6.0  
110  
36  
22  
125  
45  
26  
160  
60  
32  
ns  
ns  
ns  
ns  
pF  
PLH  
H
t
(Figures 1 and 8)  
PHL  
19  
23  
28  
,
Maximum Propagation Delay, Serial Shift/Parallel Load to Q or Q  
H
(Figures 2 and 8)  
2.0  
3.0  
4.5  
6.0  
85  
57  
25  
19  
96  
63  
29  
23  
106  
71  
32  
PLH  
H
t
PHL  
27  
,
Maximum Propagation Delay, Input H to Q or Q  
H
2.0  
3.0  
4.5  
6.0  
110  
36  
22  
125  
45  
26  
160  
60  
32  
PLH  
H
t
(Figures 3 and 8)  
PHL  
19  
23  
28  
,
Maximum Output Transition Time, Any Output  
(Figures 1 and 8)  
2.0  
3.0  
4.5  
6.0  
75  
27  
15  
13  
95  
32  
19  
16  
110  
36  
22  
TLH  
t
THL  
19  
C
Maximum Input Capacitance  
10  
10  
10  
in  
NOTES:  
1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).  
2. Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).  
Typical @ 25°C, V  
= 5.0 V  
CC  
C
Power Dissipation Capacitance (Per Package)*  
pF  
40  
PD  
2
* Used to determine the no–load dynamic power consumption: P = C  
D
Motorola High–Speed CMOS Data Book (DL129/D).  
V
f + I  
V
. For load considerations, see Chapter 2 of the  
PD CC  
CC CC  
3
MOTOROLA  
MC54/74HC165A  
TIMING REQUIREMENTS (Input t = t = 6 ns)  
r
f
Guaranteed Limit  
– 55 to  
V
CC  
V
Symbol  
Parameter  
25 C  
Unit  
85 C  
125 C  
t
t
t
t
Minimum Setup Time, Parallel Data Inputs to Serial Shift/Parallel Load  
(Figure 4)  
2.0  
3.0  
4.5  
6.0  
75  
30  
15  
13  
95  
40  
19  
16  
110  
55  
22  
ns  
su  
su  
su  
su  
19  
Minimum Setup Time, Input SA to Clock (or Clock Inhibit)  
(Figure 5)  
2.0  
3.0  
4.5  
6.0  
75  
30  
15  
13  
95  
40  
19  
16  
110  
55  
22  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
19  
Minimum Setup Time, Serial Shift/Parallel Load to Clock (or Clock Inhibit)  
(Figure 6)  
2.0  
3.0  
4.5  
6.0  
75  
30  
15  
13  
95  
40  
19  
16  
110  
55  
22  
19  
Minimum Setup Time, Clock to Clock Inhibit  
(Figure 7)  
2.0  
3.0  
4.5  
6.0  
75  
30  
15  
13  
95  
40  
19  
16  
110  
55  
22  
19  
t
t
t
Minimum Hold Time, Serial Shift/Parallel Load to Parallel Data Inputs  
(Figure 4)  
2.0  
3.0  
4.5  
6.0  
1
1
1
1
1
1
1
1
1
1
1
1
h
h
h
Minimum Hold Time, Clock (or Clock Inhibit) to Input SA  
(Figure 5)  
2.0  
3.0  
4.5  
6.0  
1
1
1
1
1
1
1
1
1
1
1
1
Minimum Hold Time, Clock (or Clock Inhibit) to Serial Shift/Parallel Load  
(Figure 6)  
2.0  
3.0  
4.5  
6.0  
1
1
1
1
1
1
1
1
1
1
1
1
t
Minimum Recovery Time, Clock to Clock Inhibit  
(Figure 7)  
2.0  
3.0  
4.5  
6.0  
75  
30  
15  
13  
95  
40  
19  
16  
110  
55  
22  
rec  
19  
t
Minimum Pulse Width, Clock (or Clock Inhibit)  
(Figure 1)  
2.0  
3.0  
4.5  
6.0  
70  
27  
15  
13  
90  
32  
19  
16  
100  
36  
22  
w
w
19  
t
Minimum Pulse width, Serial Shift/Parallel Load  
(Figure 2)  
2.0  
3.0  
4.5  
6.0  
70  
27  
15  
13  
90  
32  
19  
16  
100  
36  
22  
19  
t , t  
r f  
Maximum Input Rise and Fall Times  
(Figure 1)  
2.0  
3.0  
4.5  
6.0  
1000  
800  
500  
400  
1000  
800  
500  
400  
1000  
800  
500  
400  
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).  
MOTOROLA  
4
MC54/74HC165A  
PIN DESCRIPTIONS  
INPUTS  
applied to this pin, data at the Parallel Data inputs are  
asynchronously loaded into each of the eight internal stages.  
A, B, C, D, E, F, G, H (Pins 11, 12, 13, 14, 3, 4, 5, 6)  
Parallel Data inputs. Data on these inputs are asynchro-  
nously entered in parallel into the internal flip–flops when the  
Serial Shift/Parallel Load input is low.  
Clock, Clock Inhibit (Pins 2, 15)  
Clock inputs. These two clock inputs function identically.  
Either may be used as an active–high clock inhibit. However,  
to avoid double clocking, the inhibit input should go high only  
while the clock input is high.  
The shift register is completely static, allowing Clock rates  
down to DC in a continuous or intermittent mode.  
SA (Pin 10)  
Serial Data input. When the Serial Shift/Parallel Load input  
is high, data on this pin is serially entered into the first stage  
of the shift register with the rising edge of the Clock.  
OUTPUTS  
CONTROL INPUTS  
Q , Q (Pins 9, 7)  
Serial Shift/Parallel Load (Pin 1)  
H
H
Data–entry control input. When a high level is applied to  
this pin, data at the Serial Data input (SA) are shifted into the  
register with the rising edge of the Clock. When a low level is  
Complementary Shift Register outputs. These pins are the  
noninverted and inverted outputs of the eighth stage of the  
shift register.  
5
MOTOROLA  
MC54/74HC165A  
SWITCHING WAVEFORMS  
t
t
f
r
V
CC  
CLOCK  
OR CLOCK INHIBIT  
90%  
50%  
t
w
GND  
10%  
V
CC  
SERIAL SHIFT/  
PARALLEL LOAD  
t
w
50%  
PLH  
50%  
PHL  
GND  
1/f  
max  
t
t
t
t
PHL  
PLH  
90%  
50%  
10%  
Q
OR Q  
H
50%  
Q
OR Q  
H
H
H
t
t
THL  
TLH  
Figure 1. Serial–Shift Mode  
Figure 2. Parallel–Load Mode  
VALID  
50%  
V
CC  
t
t
f
r
INPUTS A–H  
V
CC  
90%  
INPUT H  
GND  
50%  
GND  
10%  
t
t
su  
h
t
t
PHL  
PLH  
V
CC  
90%  
50%  
10%  
SERIAL SHIFT/  
PARALLEL LOAD  
Q
OR Q  
H
H
GND  
t
t
THL  
TLH  
ASYNCHRONOUS PARALLEL  
LOAD  
(LEVEL SENSITIVE)  
Figure 3. Parallel–Load Mode  
Figure 4. Parallel–Load Mode  
V
VALID  
50%  
CC  
SERIAL SHIFT/  
PARALLEL LOAD  
50%  
V
CC  
INPUT S  
A
GND  
GND  
t
t
su  
h
t
t
h
V
su  
CC  
CLOCK  
OR CLOCK INHIBIT  
V
50%  
CC  
CLOCK  
50%  
GND  
OR CLOCK INHIBIT  
GND  
Figure 5. Serial–Shift Mode  
Figure 6. Serial–Shift Mode  
TEST POINT  
CLOCK 2 INHIBITED  
OUTPUT  
DEVICE  
UNDER  
V
CC  
CLOCK INHIBIT  
50%  
GND  
C *  
L
TEST  
t
t
rec  
su  
V
CC  
CLOCK  
50%  
GND  
* Includes all probe and jig capacitance  
Figure 7. Serial–Shift, Clock–Inhibit Mode  
Figure 8. Test Circuit  
MOTOROLA  
6
MC54/74HC165A  
EXPANDED LOGIC DIAGRAM  
A
B
C
F
G
H
11  
12  
13  
4
5
6
SERIAL SHIFT/  
PARALLEL LOAD  
1
9
Q
H
10  
7
SERIAL DATA  
D Q  
D Q  
D Q  
D
Q
D
Q
D Q  
Q
H
A
B
C
F
G
H
INPUT S  
A
C
C
C
C
C
C
C
C
C
C
C C  
2
CLOCK  
CLOCK  
INHIBIT  
15  
TIMING DIAGRAM  
CLOCK  
CLOCK INHIBIT  
S
A
SERIAL SHIFT/  
PARALLEL LOAD  
A
H
L
B
C
D
E
F
H
L
PARALLEL  
DATA  
INPUTS  
H
L
G
H
H
H
H
L
H
L
L
H
L
L
H
L
L
H
L
Q
Q
H
H
H
H
H
CLOCK  
INHIBIT  
MODE  
SERIAL–SHIFT MODE  
PARALLEL LOAD  
7
MOTOROLA  
MC54/74HC165A  
OUTLINE DIMENSIONS  
J SUFFIX  
CERAMIC PACKAGE  
CASE 620–10  
ISSUE V  
–A  
NOTES:  
16  
1
9
8
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
–B  
4. DIM F MAY NARROW TO 0.76 (0.030) WHERE  
THE LEAD ENTERS THE CERAMIC BODY.  
L
C
INCHES  
MILLIMETERS  
DIM  
A
B
C
D
E
MIN  
MAX  
0.785  
0.295  
0.200  
0.020  
MIN  
19.05  
6.10  
0.39  
1.27 BSC  
MAX  
19.93  
7.49  
5.08  
0.50  
0.750  
0.240  
0.015  
0.050 BSC  
–T  
SEAT  
ING  
N
K
PLANE  
F
G
J
K
L
M
N
0.055  
0.100 BSC  
0.008  
0.125  
0.065  
1.40  
2.54 BSC  
0.21  
3.18  
1.65  
E
M
0.015  
0.170  
0.38  
4.31  
J 16 PL  
F
G
0.300 BSC  
15  
0.040  
7.62 BSC  
15  
1.01  
0.51  
M
S
0.25 (0.010)  
T
B
D 16 PL  
°
°
0°  
0°  
M
S
0.25 (0.010)  
T
A
0.020  
N SUFFIX  
PLASTIC PACKAGE  
CASE 648–08  
ISSUE R  
NOTES:  
–A  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
16  
9
B
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.  
5. ROUNDED CORNERS OPTIONAL.  
1
8
INCHES  
MILLIMETERS  
DIM  
A
B
C
D
F
G
H
J
K
L
MIN  
MAX  
0.770  
0.270  
0.175  
0.021  
MIN  
18.80  
6.35  
3.69  
0.39  
1.02  
MAX  
19.55  
6.85  
4.44  
0.53  
F
C
L
0.740  
0.250  
0.145  
0.015  
0.040  
S
0.070  
1.77  
SEATING  
PLANE  
–T  
0.100 BSC  
0.050 BSC  
0.015  
0.130  
0.305  
2.54 BSC  
1.27 BSC  
0.38  
3.30  
7.74  
M
K
0.008  
0.110  
0.295  
0.21  
2.80  
7.50  
H
J
G
D 16 PL  
M
S
0°  
10°  
0°  
10°  
M
M
0.25 (0.010)  
T
A
0.020  
0.040  
0.51  
1.01  
D SUFFIX  
PLASTIC SOIC PACKAGE  
CASE 751B–05  
ISSUE J  
–A  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
16  
9
8
–B  
P 8 PL  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
M
M
0.25 (0.010)  
B
1
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 (0.005) TOTAL  
IN EXCESS OF THE D DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
G
MILLIMETERS  
INCHES  
DIM  
A
B
C
D
F
G
J
MIN  
9.80  
3.80  
1.35  
0.35  
0.40  
MAX  
10.00  
4.00  
1.75  
0.49  
MIN  
MAX  
0.393  
0.157  
0.068  
0.019  
0.049  
0.386  
0.150  
0.054  
0.014  
0.016  
0.050 BSC  
0.008  
0.004  
F
K
R X 45°  
C
1.25  
1.27 BSC  
–T  
0.19  
0.10  
0.25  
0.25  
0.009  
0.009  
J
SEAT  
ING  
M
K
PLANE  
D 16 PL  
M
P
R
0
5.80  
0.25  
°
7
6.20  
0.50  
°
0
°
7°  
0.244  
0.019  
0.229  
0.010  
M
S
S
0.25 (0.010)  
T
B
A
MOTOROLA  
8
MC54/74HC165A  
OUTLINE DIMENSIONS  
DT SUFFIX  
PLASTIC TSSOP PACKAGE  
CASE 948F–01  
ISSUE O  
16X KREF  
0.10 (0.004)  
M
S
S
T
U
V
NOTES:  
S
0.15 (0.006) T  
U
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
K
K1  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.  
PROTRUSIONS OR GATE BURRS. MOLD FLASH OR  
GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER  
SIDE.  
16  
9
2X L/2  
J1  
4. DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED  
B
–U–  
SECTION N–N  
L
0.25 (0.010) PER SIDE.  
J
5. DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION  
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
PIN 1  
IDENT.  
8
1
N
0.25 (0.010)  
7. DIMENSION A AND B ARE TO BE DETERMINED AT  
DATUM PLANE –W–.  
S
0.15 (0.006) T  
U
A
M
MILLIMETERS  
INCHES  
–V–  
DIM  
A
B
C
D
MIN  
4.90  
4.30  
–––  
0.05  
0.50  
MAX  
5.10  
4.50  
1.20  
0.15  
0.75  
MIN  
MAX  
0.200  
0.177  
0.047  
0.006  
0.030  
N
0.193  
0.169  
–––  
0.002  
0.020  
F
F
DETAIL E  
G
H
J
J1  
K
K1  
L
0.65 BSC  
0.026 BSC  
0.18  
0.09  
0.09  
0.19  
0.19  
0.28  
0.20  
0.16  
0.30  
0.25  
0.007  
0.004  
0.004  
0.007  
0.007  
0.011  
0.008  
0.006  
0.012  
0.010  
–W–  
C
6.40 BSC  
0.252 BSC  
0.10 (0.004)  
M
0
8
0
8
DETAIL E  
H
SEATING  
PLANE  
–T–  
D
G
Motorolareserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representationorguaranteeregarding  
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,  
andspecifically disclaims any and all liability, includingwithoutlimitationconsequentialorincidentaldamages. “Typical” parameters can and do vary in different  
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against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part.  
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