MC68341 [MOTOROLA]
Integrated Processor Users Manual; 集成的处理器的用户手册型号: | MC68341 |
厂家: | MOTOROLA |
描述: | Integrated Processor Users Manual |
文件: | 总21页 (文件大小:135K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Parts Not Suitable for New Designs
For Additional Information
End-Of-Life Product Change Notice
Order this document by
MC68341UMAD/AD
Microprocessor and Memory
Technologies Group
MC68341
ADDENDUM TO
MC68341 Integrated Processor User's Manual
April 19, 1995
This addendum to the initial release of the MC68341UM/AD User’s Manual provides corrections to the original
text, plus additional information not included in the original. This document and other information on this product
is maintained on the AESOP BBS, which can be reached at (800)843-3451 (from the US and Canada) or
(512)891-3650. Configure modem for up to 14.4Kbaud, 8 bits, 1 stop bit, and no parity. Terminal software
should support VT100 emulation. Internet access is provided by telneting to pirs.aus.sps.mot.com
[129.38.233.1] or through the World Wide Web at http://pirs.aus.sps.mot.com.
1. Signal Index
On page 2-4, Table 2-4, the QSPI serial clock QSCLK should be listed as an I/O signal. At the bottom of Table
2-5, FC3/DTC is an output-only signal.
2. Operand Alignment
On page 3-9, last paragraph, change the first two lines to: “The CPU32 restricts all operands (both data and
instructions) to be word-aligned. That is, word and long-word operands must be located on a word boundary.”
Long-word operands do not have to be long-word aligned.
3. WE on Fast Termination
On page 3-17, Figure 3-6, UWE and LWE do not assert for fast termination writes.
4. Write Cycle Timing Waveforms
On page 3-25, the M68300 write cycle timing diagram (Figure 3-12) shows incorrect timing for DS, UWE, and
LWE. On page 3-28, the M68000 write cycle timing diagram (Figure 3-14) shows incorrect timing for AS68K,
CSx, UDS/LDS, and UWE/LWE. Replace these figures with the following corrected figures.
5. Additional Note on MBAR Decode
Add to the CPU Space Cycles description on page 3-31: The CPU space decode logic allocates the 256-byte
block from $3FF00-3FFFF to the SIM module. An internal 2-clock termination is provided by this initial decode
for any access to this range, but selection of specific registers depends on additional decode.
Accesses to the MBAR register at long word $3FF00 are internal only, and are only visible by enabling show
cycles. Users should directly access only the MBAR register, and use the LPSTOP instruction to generate the
LPSTOP broadcast access to $3FFFE. The remaining address range $3FF04-3FFFD is Motorola reserved and
should not be accessed.
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
SEMICONDUCTOR PRODUCT INFORMATION
MOTOROLA, 1995
S2
S0
S2
S4
S0
S4
S0
S2
S4
CLKOUT
A31–A2
A1
A0
FC3–FC0
SIZ1
BYTE
WORD
SIZ0
R/W
AS
CSx
DS
AS68K
UDS, LDS
UWE
LWE
DSACK
DTC
D15–D8
OP2
OP3
D7–D0
OP3
OP3
WORD WRITE
BYTE WRITE
BYTE WRITE
Figure 3-12. M68300 Write Cycle timing
MOTOROLA
MC68341 USER’S MANUAL ADDENDUM
2
S2
S0
S2
S4
S0
S4
S0
S2
CLKOUT
A31–A2
A1
A0
C3–FC0
SIZ1
BYTE
WORD
SIZ0
R/W
AS68K
CSx
DS
AS
UDS
LDS
UWE
LWE
DSACK
DTC
D15–D8
OP2
OP3
D7–D0
OP3
OP3
WORD WRITE
BYTE WRITE
BYTE WRITE
Figure 3-14. M68000 Write Cycle Timing
MOTOROLA
MC68341 USER’S MANUAL ADDENDUM
3
6. Additional Notes on CPU Space Address Encoding
On page 3-31, Figure 3-16, the BKPT field for the Breakpoint Acknowledge address encoding is on bits 4-2,
and the T bit is on bit 1. The Interrupt Acknowledge LEVEL field is on bits 3-1.
7. Breakpoints
On page 3-31, the last paragraph implies that either a software breakpoint (BKPT instruction) or hardware
breakpoint can be used to insert an instruction. As noted in the following paragraphs, only a software
breakpoint can be used to insert an instruction on the breakpoint acknowledge cycle.
8. Interrupt Latency
Add to the Interrupt Acknowledge Bus Cycles section on page 3-36: Interrupt latency from IRQx assert to
prefetch of the first instruction in the interrupt handler is about 37 clocks + worst case instruction length in
clocks (using 2-clock memory and autovector termination). From the instruction timing tables, this gives 37+71
(DIVS.L with worst-case <fea>) = 108 clocks worst case interrupt latency time. For applications requiring
shorter interrupt response time the latency can be reduced by using simpler addressing modes and/or avoiding
use of longer instructions (specifically DIVS.L, DIVU.L, MUL.L).
9. Interrupt Hold Time and Spurious Interrupts
Add to the Interrupt Acknowledge Bus Cycles section on page 3-36: Level sensitive interrupts must remain
asserted until the corresponding IACK cycle; otherwise, a spurious interrupt exception may result or the inter-
rupt may be ignored entirely. This is also true for level sensitive external interrupts which are autovectored us-
ing either the AVEC signal or the AVEC register, since the SIM will not respond to an interrupt arbitration cycle
on the IMB if the external interrupt at that level has been removed. External interrupts configured as edge sen-
sitive only have to be held a minimum of 1.5 clocks - see section 4.3.5.8 PROGRAMMABLE INTERRUPT
REGISTER (PIR).
Note that the level 7 interrupt is also level sensitive, and must be held until a level 7 IACK begins. The level 7
interrupt is unique in that it cannot be masked - another level 7 interrupt exception can be created after the
IACK cycle by negating IRQ7 and reasserting, even though the interrupt mask level in the SR is now set to
level 7.
10. Typos in IACK Cycle Timing Waveforms
On page 3-38, Figure 3-21, the text “VECTOR FROM 16-BIT PORT” should be on D7-D0, and “VECTOR
FROM 8-BIT PORT” should be on D15-D8. The responding device returns the vector number on the least sig-
nificant byte of the data port.
11. Additional Note on Internal Autovector Operation
Add to the Autovector Interrupt Acknowledge Cycle section on page 3-38: If an external interrupt level is
autovectored either by the AVEC register programming or the external AVEC signal, an external IACK will be
started and terminated internally. The interrupting device should not respond to this IACK in any way, or the
resulting operation is undefined.
12. Additional Notes on Retry Termination
On page 3-42, Table 3-4: When HALT and BERR are asserted together in case #5 to force a retry of the current
bus cycle, relative timing of HALT and BERR must be controlled to avoid inadvertently causing bus error ter-
MOTOROLA
MC68341 USER’S MANUAL ADDENDUM
4
mination case #3. This can be done by asserting HALT and BERR either synchronously to the clock to directly
control which edge each is recognized on, or asynchronously with HALT asserted for time [spec 47A+spec
47B] ns before BERR to guarantee recognition on or before the same clock edge as BERR.
13. Active Negate on Bus Arbitration
The 68341 actively pulls up all tri-stateable bus pins other than the data bus before tristating them during bus
arbitration. This pullup function is not guaranteed to result in spec VOH levels before tristating, but will help
reduce rise time on these signals when using weak external bus pullups.
14. Additional Note on Bus Arbitration Priority
For the bus arbitration description beginning on page 3-49: The arbitration priority between possible bus mas-
ters for this device is external request via BR (highest priority), DMA, then CPU (lowest). The priority of DMA
channels 1 and 2 relative to each other is selected by their respective MAID levels which must be unique.
15. Additional Note on Bus Arbitration and Operand Coherency
For the bus arbitration description beginning on page 3-49: Each bus master maintains operand coherency
when a higher priority request is recognized. For example, a CPU write of a long-word operand to a byte port
results in a sequence of four bus cycles to complete the operand transfer - the CPU will not release the bus
until the completion of the fourth bus cycle. A single address DMA transfer is handled in a similar manner. For
a dual address DMA transfer, the read and write portions are handled as separate operands, allowing arbitra-
tion between the read and write bus cycles. Also, if different port sizes are specified in the DMA configuration
for the source and destination, arbitration can occur between each of the multiple operand accesses which
must be made to the smaller port for each operand access to the larger port. The RMC read/write sequences
for a TAS instruction is also indivisible to guarantee data coherency. Arbitration is allowed between each op-
erand transfer of a multi-operand operation such as a MOVEM instruction or exception stacking.
16. Additional Notes on RESET Interaction with Current Bus Cycle
Add to the Reset Operation description beginning page 3-55:
Hardware resets are held off until completion of the current operand transfer in order to maintain operand co-
herency. The processor resets at the end of the bus cycle in which the last portion of the operand is transferred,
or after the bus monitor has timed out. The bus monitor operates for this specific case whether it is enabled or
not, for the period of time that the BMT bits are set to.
The following reset sources reset all internal registers to their reset state: external, POR, software watchdog,
double bus fault, loss of clock. Execution of a RESET instruction resets the peripheral module registers with
the exception of the MCR registers. The MCR register in each module, the SIM41 registers, and the CPU state
are not affected by execution of a RESET instruction.
17. External Reset
On page 3-56, Figure 3-33, the RESET signal negates for two clocks between internal and external assertions,
not one. Note that RESET is not actively negated, and its rise time is dependent on the pullup resistor used.
18. Power-On Reset
On page 3-57, Figure 3-34. Power-Up Reset Timing Diagram: CLKOUT is not gated by VCO lock or other in-
ternal control signals, and can begin toggling as soon as VCC is high enough for the internal logic to begin
operating. For crystal mode and external clock with VCO mode, after the VCO frequency has reached an initial
MOTOROLA
MC68341 USER’S MANUAL ADDENDUM
5
stable value, the 328*TCLKIN delay is counted down, and VCO lock is set after completion of the 328 clock
delay. For external clock mode without VCO, the 328*TCLKIN delay starts as soon as EXTAL clock transitions
are recognized. See note for page11-3 for more POR information.
19. Internal IMB Arbitration
On page 4-6, first paragraph, change the first sentence to read “There are eight arbitration levels for the various
bus masters on the MC68341 to access the inter-module bus (IMB).”
20. Additional Note for External Clock Mode with PLL
On page 4-9, Table 4-1, External Clock Mode with PLL: the PLL phase locks the CLKOUT falling edge to the
falling edge of the EXTCLK input clock. Maximum skew between falling edges of the EXTCLK and CLKOUT
signals is specified in the Section 12 Electrical Characteristics.
21. External Clock Mode Operation
The next-to-last paragraph on page 4-11 incorrectly states that the SYNCR V, W, X, Y, and Z bits can all affect
the system frequency in external clock mode. In external clock mode only the V bit affects the system frequen-
cy, by selecting either EXTCLK or EXTCLK/2 as reference input to the phase comparator. The VCO frequency
divided by 2 is used both for CLKOUT as well as the feedback input to the phase comparator. A reset forces
V=0, resulting in an initial processor operating frequency of 1/2 the EXTCLK frequency.
For applications using external clock mode, the 32KHz crystal connected to EXTAL and XTAL is only required
if the realtime clock function is needed - ground EXTAL if the RTC is not used. Also, the clock input on EXT-
CLK should be very clean when the 32KHz oscillator is used. Excessive undershoot or overshoot, as well as
fast edge rates may result in coupling to the adjacent XTAL input, affecting operation of the 32kHz oscillator.
22. Recommended XFC Capacitor Values
On page 4-12, third paragraph, and page 11-2, last paragraph: The XFC capacitor recommendation of 0.01µF
to 0.1µF applies specifically to crystal mode operation. When using external clock with VCO mode, for phase
detector refernce frequencies > 1MHz start with a capacitance value of 10000pf/F_MHz. For example at
16.0MHz the recommended XFC capacitance is approximately 10000pf/16.0 = 625pf - choose the next higher
standard value available.
23. CLKOUT and VCO Frequency Programming
On pages 4-13 and 4-14, the column for W=1:Z=0:X=1 is incorrect - the correct value for each entry in this
column is 2x the frequency in the X=0 column immediately to the left. A corrected table is shown on the follow-
ing pages. Note that although a complete table is shown for all W:X:Y:Z combinations, both CLKOUT and VCO
frequency limits must be observed when programming the SYNCR. For example, a system operating frequen-
cy (CLKOUT) of 25.16MHz can be selected with W:X:Y:Z=1:1:23:1, resulting in a VCO frequency of 50.3MHz.
However, programming W:X:Y:Z=1:0:47:1 to achieve the same system frequency would result in a VCO fre-
quency of greater than 100MHz, which is outside the spec VCO frequency operating range.
24. Additional Note for Global Chip Select
On page 4-16, section 4.2.4.2: When operating as a global chip select, CS0 does not assert for accesses to
either the MBAR or to internal peripheral module registers.
MOTOROLA
MC68341 USER’S MANUAL ADDENDUM
6
Table 4-2. System Frequencies from 32.768-kHz Reference
VCO
VCO
CLKOUT (kHz)
W = 0
(kHz)
W = 0
Z = x
X = x
524
CLKOUT (kHz)
W = 1
(kHz)
W = 1
Z = x
Z = 0
Z = 1
Z = 0
Z = 1
X = 0
16
X = 1
33
X = 0
131
X = 1
262
X = 0
66
X = 1
131
X = 0
524
X = 1
1049
2097
3146
4194
5243
6291
7340
8389
9437
X = x
Y
0
2097
1
33
66
262
524
1049
1573
2097
2621
3146
3670
4194
4719
5243
5767
6291
6816
7340
7864
8389
8913
9437
9961
10486
11010
11534
12059
12583
13107
13631
14156
14680
15204
15729
16253
16777
131
262
1049
1573
2097
2621
3146
3670
4194
4719
5243
5767
6291
6816
7340
7864
8389
8913
9437
9961
10486
11010
11534
12059
12583
13107
13631
14156
14680
15204
15729
16253
16777
4194
2
49
98
393
786
197
393
6291
3
66
131
164
197
229
262
295
328
360
393
426
459
492
524
557
590
623
655
688
721
754
786
819
852
885
918
950
983
1016
1049
524
1049
1311
1573
1835
2097
2359
2621
2884
3146
3408
3670
3932
4194
4456
4719
4981
5243
5505
5767
6029
6291
6554
6816
7078
7340
7602
7864
8126
8389
262
524
8389
4
82
655
328
655
10486
12583
14680
16777
18874
20972
23069
25166
27263
29360
31457
33554
35652
37749
39846
41943
44040
46137
48234
50332
52429
54526
56623
58720
60817
62915
65012
67109
5
98
786
393
786
6
115
131
147
164
180
197
213
229
246
262
279
295
311
328
344
360
377
393
410
426
442
459
475
492
508
524
918
459
918
7
1049
1180
1311
1442
1573
1704
1835
1966
2097
2228
2359
2490
2621
2753
2884
3015
3146
3277
3408
3539
3670
3801
3932
4063
4194
524
1049
1180
1311
1442
1573
1704
1835
1966
2097
2228
2359
2490
2621
2753
2884
3015
3146
3277
3408
3539
3670
3801
3932
4063
4194
8
590
9
655
10486
11534
12583
13631
14680
15729
16777
17826
18874
19923
20972
22020
23069
24117
25166
26214
27263
28312
29360
30409
31457
32506
33554
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
721
786
852
918
983
1049
1114
1180
1245
1311
1376
1442
1507
1573
1638
1704
1769
1835
1901
1966
2032
2097
MOTOROLA
MC68341 USER’S MANUAL ADDENDUM
7
Table 4-2. System Frequencies from 32.768-kHz Reference (Continued)
VCO
VCO
CLKOUT (kHz)
W = 0
(kHz)
W = 0
Z = x
CLKOUT (kHz)
W = 1
(kHz)
W = 1
Z = x
Z = 0
Z = 1
Z = 0
Z = 1
X = 0
X = 0
541
557
573
590
606
623
639
655
672
688
705
721
737
754
770
786
803
819
836
852
868
885
901
918
934
950
967
983
999
1016
1032
1049
X = 1
1081
1114
1147
1180
1212
1245
1278
1311
1343
1376
1409
1442
1475
1507
1540
1573
1606
1638
1671
1704
1737
1769
1802
1835
1868
1901
1933
1966
1999
2032
2064
2097
X = 0
4325
4456
4588
4719
4850
4981
5112
5243
5374
5505
5636
5767
5898
6029
6160
6291
6423
6554
6685
6816
6947
7078
7209
7340
7471
7602
7733
7864
7995
8126
8258
8389
X = 1
8651
8913
9175
9437
9699
9961
X = x
X = 0
2163
2228
2294
2359
2425
2490
2556
2621
2687
2753
2818
2884
2949
3015
3080
3146
3211
3277
3342
3408
3473
3539
3604
3670
3736
3801
3867
3932
3998
4063
4129
4194
X = 1
4325
4456
4588
4719
4850
4981
5112
5243
5374
5505
5636
5767
5898
6029
6160
6291
6423
6554
6685
6816
6947
7078
7209
7340
7471
7602
7733
7864
7995
8126
8258
8389
X = 1
34603
35652
36700
37749
38797
39846
40894
41943
42992
44040
45089
46137
47186
48234
49283
50332
51380
52429
53477
54526
55575
56623
57672
58720
59769
60817
61866
62915
63963
65012
66060
67109
X = x
Y
32
17302
17826
18350
18874
19399
19923
20447
20972
21496
22020
22544
23069
23593
24117
24642
25166
25690
26214
26739
27263
27787
28312
28836
29360
29884
30409
30933
31457
31982
32506
33030
33554
17302
17826
18350
18874
19399
19923
20447
20972
21496
22020
22544
23069
23593
24117
24642
25166
25690
26214
26739
27263
27787
28312
28836
29360
29884
30409
30933
31457
31982
32506
33030
33554
69206
71303
73400
75497
77595
79692
81789
83886
85983
88080
90178
92275
94372
96469
98566
100663
102760
104858
106955
109052
111149
113246
115343
117441
119538
121635
123732
125829
127926
130023
132121
134218
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
10224
10486
10748
11010
11272
11534
11796
12059
12321
12583
12845
13107
13369
13631
13894
14156
14418
14680
14942
15204
15466
15729
15991
16253
16515
16777
NOTES:
1. Some W/X/Y/Z bit combinations shown may select a CLKOUT or VCO frequency higher than spec. Refer to Sec-
tion 11 Electrical Characteristics for CLKOUT and VCO frequency limits.
2. Any change to W or Y results in a change in the VCO frequency - the VCO should be allowed to relock if necessary.
MOTOROLA
MC68341 USER’S MANUAL ADDENDUM
8
25. Additional Note on PORTA/B Output Timing
Add to the External Bus Interface Operation description on page 4-17: The Port A and Port B output pins tran-
sition after the S4 falling edge for the internal write to the respective data register. This places port pin transi-
tions at roughly the same time DS negates for the data register write - note this output delay is not currently
specified in the Electrical Specifications.
26. RTC Memory Map
The RTC register offsets shown on page 4-21 are incorrect - a corrected memory map is shown below. Ad-
dresses within the RTC can be accessed as either bytes or words, with the exception of the reserved byte at
offset $0CE. Note that RTC registers marked S/U are read/write in supervisor mode, but can only be read in
user mode.
ADDR FC
15
8
ADDR FC
7
0
0C0
0C2
0C4
0C6
0C8
0CA
0CC
0CE
S
RTC INTERRUPT CONTROL (RICR)
S/U MINUTES (MIN)
S/U DATE
0C3
0C5
0C7
0C9
0CB
0CD
0CF
S/U SECONDS (SEC)
S/U HOUR
S/U YEAR
S/U DAY
S/U MONTH
S
RTC CONTROL/STATUS (RCR)
S/U MINUTES ALARM (MINA)
S/U DATE ALARM (DATEA)
S/U SECONDS ALARM (SECA)
S/U HOURS ALARM (HOURA)
-
RESERVED
S
RTC CALIBRATION (RCCR)
27. MBAR Register Reset Values
On page 4-22, the reset values for MBAR bits 31-12 are undefined.
28. MBAR AS7 Bit and IACK Cycles
On page 4-23, the second code sequence initializes the MBAR register with AS7 set. This prevents the ad-
dress decode for the internal 4K register block from responding to CPU space accesses. In particular, it pre-
vents the register block decode of $FFFFFxxx from interfering with IACK cycles (address $FFFFFFFx), and
possibly corrupting the vector number returned. Normal interrupt acknowledge operation for the internal mod-
ules is not affected by this change.
Early versions of the MC68330 User’s Manual (original release) and MC68340 User’s Manual (original and
Rev. 1 releases) did not show AS7 set. Code which was developed based on these manual revisions should
be checked for this problem when porting to the MC68341 - this change should also be applied back to the
MC68330 and/or MC68340.
29. Additional Note on VCO Overshoot
On page 4-30 place the following note under the Y-bits description:
MOTOROLA
MC68341 USER’S MANUAL ADDENDUM
9
A VCO overshoot can occur when increasing the operating frequency by changing the Y bits in the SYNCR
register. The effects of this overshoot can be controlled by following this procedure:
1. Write the X bit to zero. This will reduce the previous frequency by one half.
2. Write the Y bits to the desired frequency divided by 2.
3. After the VCO lock has occurred, write the X bit to one. This changes the
clock frequency to the desired frequency.
Steps 1 and 2 may be combined.
30. RCCR Initialization
Add to the RCCR description on page 4-41: the RCCR register is unaffected by a processor reset, and contains
an arbitrary value on initial powerup of the RTC. Calibration software should clear the RCCR register before
beginning the calibration process, since RTC operation with an invalid RCDx value is undefined. RCCR[7] is
reserved - on current silicon it always reads 0, and should always be written 0.
31. RCCR Typos
On page 4-42, delete the first description for RCD4-RCD0 near the top of the page.
32. MONTH Register Range
The valid range for the MONTH register on page 4-43 is 1-12, with “1” corresponding to January and “12” cor-
responding to December.
33. SIM41 Example Code
On page 4-49, about mid-page, change “MOVEQ #8-1,D0” to “MOVEQ #16-1,D0” to initialize all 8 chip se-
lects.
34. Bus Error Stack Frame
On page 5-61, in the next-to-last paragraph, delete “(the internal transfer count register is located at SP+$10
and the SSW is located at SP+12)”. The stack space allocation is the same for both faults - the location of the
internal count register and SSW remains the same. The only difference is that the faulted instruction program
counter location SP+10 and SP+12 will contain invalid data. To tell the difference between the two stack
frames, look at the first nibble of the faulted exception format vector word located at SP+$E - it will be $0 for
the four-word frame, and $2 for the six-word frame.
35. DSO Timing
On page 5-71, Figure 5-23, DSO transitions one clock later than shown.
36. Typo on BDM RSREG Command
On page 5-77, Section 5.6.2.8.6, RSREG register bit #8 should be a “1”.
37. IPIPE Timing
On page 5-88, Figure 5-29 shows the third IPIPE assertion low lasting for 1.5 CLKs - it actually asserts for an
additional 0.5 CLKs. IPIPE transitions occur after the falling edge of CLKOUT.
MOTOROLA
MC68341 USER’S MANUAL ADDENDUM
10
38. Additional Notes on DMA Features
In the feature set listed on page 6-1, bullet six is “Operand Packing and Unpacking for Dual-Address Trans-
fers”. This packing is for transfers between different port sizes selected in the DMA channel control register,
e.g. Byte <> Word transfers. The DMA controller does not do packing for byte > byte transfers, eliminating the
problem of residual bytes left in the controller when a channel is stopped after an odd byte transfer count.
39. Additional Note on Internal Request Generation
Add to the Internal Request Generation section on page 6-5: For internal request operation, DACKx and DON-
Ex are not active as outputs during transfers. DONEx is valid as an input though and will terminate channel
operation if asserted - pull up if not used.
40. Additional Note on DMA Transfer Latency from DREQ
Add to the External Request Generation section beginning 6-5: DREQx assertions require two clocks for input
synchronization and IMB bus arbitration activity before the resulting DMA bus cycle can start. A DREQx as-
sertion will preempt the next CPU bus cycle if it is recognized two or more clocks before the end of the current
bus cycle, unless the current cycle is not the last cycle of an operand transfer, or is the read of an RMC cycle.
Operand transfers and RMC read/write sequences are indivisible to guarantee data coherency - the bus can-
not be arbitrated from the CPU until the complete operand transfer completes, even if operand and memory
sizing results in multiple bus cycles.
For a DREQx assertion during an idle bus period, bus state S0 of the DMA bus cycle starts 2.5 clocks after the
clock falling edge which DREQx is recognized on. The maximum latency from the clock falling edge that
DREQx is recognized on to the falling edge that AS for the DMA cycle asserts from is shown in the following
table for various memory speeds.
DREQ Latency (Clocks) vs. Bus Width and Access Times
Maximum DREQ Latency (Clocks)
Access Type
16-Bit Bus
Clocks/Bus Cycle
8-Bit Bus
Clocks/Bus Cycle
2
7
3
9
4
5
2
3
4
5
Longword
11
14
13
16
11
10
15
12
19
14
23
16
RMC (TAS)
10
12
41. Additional Note on Burst Transfer DREQx Negation and Overhead
On page 6-5, replace the 2nd paragraph of 6.3.2.1 External Burst Mode with the following: DREQx must be
negated one clock before the end of the last DMA bus cycle of a burst to prevent another DMA transfer from
being generated. Also, DREQx must be negated two clocks before the end of the last DMA bus cycle to prevent
an idle clock between that transfer and the following CPU access.
42. Additional Note on Cycle steal DMA arbitration overhead
Add to the External Cycle Steal Mode description on page 6-6: In general, DMA arbitration occurs transpar-
ently. However, for some 2-clock accesses using cycle steal an idle clock can follow the DMA transfer due to
incomplete overlap of the DMA transfer with internal IMB arbitration. Specifically, an idle clock can follow 1)
single address 2-clock transfers and 2) dual address transfers from memory to 2-clock devices. Arbitration is
completely overlapped for all other cases.
MOTOROLA
MC68341 USER’S MANUAL ADDENDUM
11
43. Additional Note on Cycle Steal
For the external cycle steal mode description on page 6-6, the initial DREQx assertion does not have to be
held off until after the channel is started. If DREQx is already asserted when the channel is started by setting
the channel start bit, an internal DREQx assertion is generated, providing the edge needed for the DMA cycle
to start.
44. DREQx Negation on Burst
On page 6-8, Figure 6-5, and on page 6-10, Figure 6-7, DREQx should negate before the falling edge of S2
(one clock earlier than shown) to prevent another DMA transfer from occurring. See the note above for page
6-5 on Burst Transfer DREQx Negation.
45. DREQ Assert Time
On page 6-21, Figure 6-13: The second DREQx assertion should be shown held for an additional clock to guar-
antee recognition on 2 consecutive clock falling edges. The figure shows it as just being 1 clock period. Note
1 should be deleted.
46. Fast Termination and Burst Request Mode
On the last paragraph of page 6-21, delete the reference to Figure 6-14. Figure 6-14 on page 6-22 is labeled
incorrectly - it actually shows operation with fast termination, cycle steal, and dual address transfers. Also, the
second DREQx signal should be held for 2 consecutive falling edges - the figure shows it being held for only
1 clock edge. Note 1 of Figure 6-14 should be deleted.
47. Typo in DAPI
On page 6-26, for DAPI = 1, the DAR is incremented according to the destination size (not the source size).
48. Additional note on DMA limited rate operation
On page 6-27, in the BB-Bus Bandwidth Field: The DMA “active” count increments only when the DMA channel
is the bus master (each channel has its own counter). If a higher priority bus master forces the channel to
relinquish the bus before completion of the active count, the counter stops until the channel regains the bus.
Higher priority requests could come from 1) the other DMA channel (if it has a higher MAID level), 2) the
CPU32 core (if either the interrupt mask level in the SR or the interrupt request level is higher than the DMA
channel's ISM level), or 3) an external bus request. When the active count is exhausted, the DMA channel
releases the bus, and the “idle” count increments regardless of bus activity.
49. Configuration Error
The Configuration Error description paragraph at the top of page 6-29 should be replaced with “A configuration
error results when 1) either the SAR or DAR contains an address that does not match the port size specified
in the CCR, or 2) the BTC register does not match the larger port size or is zero.”
50. Additional Note on DMA Interrupt Prioritization
Add to the Interrupt Register description on page 6-31: When both DMA channels are programmed to the same
interrupt level, channel 1 is higher priority than channel 2.
MOTOROLA
MC68341 USER’S MANUAL ADDENDUM
12
51. Single Address Enable
6-33 SE-Single Address Enable: The note “used for intermodule DMA” should be for the SE=1 case. The
68341 does not support intermodule single address transfers, so the SE bit should always be programmed to
“0”.
52. Code Examples - Immediate Addressing Mode
On pages 6-40 through 6-44 make the following change as shown for each occurrence of SARADD, DARADD,
and NUMBYTE (change to immediate addressing mode for source operand):
MOVE.L SARADD,DMASAR1(A0) should be MOVE.L #SARADD,DMASAR1(A0).
MOVE.L DARADD,DMADAR1(A0) should be MOVE.L #DARADD,DMADAR1(A0).
MOVE.L NUMBYTE,DMABTC1(A0) should be MOVE.L #NUMBYTE,DMABTC1(A0).
53. Serial Oscillator Problems with DMA activity
Add to the Crystal Input or External Clock (X1) section on page 7-5: A high DREQ1 request rate (greater than
1MHz) with excessive undershoot on DREQ1 can result in internal signal coupling to the serial module oscil-
lator X1 pin, damping out oscillation. Avoid routing DREQ1 near the serial oscillator external components, and
use termination techniques such as series termination of the DREQ1 driver (start with 33Ω) to limit edge rate
of the signal and accompanying undershoot.
54. Additional Note on RTSx operation details
Add to the RTSA and RTSB descriptions on page 7-6: The RTSx outputs are active low signals - they drive a
logic “0” when set, and a logic “1” when cleared.
RTSx can be set (output logic level 0) by any of the following:
• Writing a “1” to the corresponding bit in the OPSET register $71E
• Issuing an “Assert RTS” command using command register CR
• If RxRTS=1, set by receiver FIFO transition from FULL to not-FULL
RTSx can be cleared (output logic level 1) by any of the following:
• Hardware reset of the serial module
• Writing a “1” to the corresponding bit in the OPRESET register $71F
• Issuing a “Negate RTS” command using command register CR
• If RxRTS=1, cleared by receiver FIFO transition from not-FULL to FULL
• If TxRTS=1, cleared by completion of last character, including transmission of stop bits
55. Serial Frequency Restriction
On page 7-8, place the following notes at the end of Section 7.3.1 Baud Rate Generator:
The current implementation of the serial module restricts the minimum CLKOUT frequency at which the baud
rate generators can be used to approximately 8.3MHz. Operation below this frequency results in a synchro-
nized internal clock which is at a lower frequency than the X1 input, which then results in incorrect baud rates.
One method to extend the minimum CLKOUT frequency is to reduce the X1 frequency by powers of 2 as
shown in the table below. The corresponding baud rates selected by the clock select register programming are
MOTOROLA
MC68341 USER’S MANUAL ADDENDUM
13
scaled by the same factor. This method preserves most of the standard baud rates (19200, 9600, 4800, etc.).
Serial XTAL Frequency
CLKOUT F
min
Max Availabile Baud
Rate
3.6864MHz
1.8432
8.29MHz
4.15
76.8k
38.4k
19.2k
0.9216
2.07
CLKOUT min = 2.25*XTAL frequency
Alternatively, the baud rate clock can be supplied directly through the SCLK input. Since there is a single SCLK
input, both serial channels must use the same baud rate clock, although one could be clocked in the 1x mode
and the other in the 16x mode. When using this method, the X1 input can be tied to ground - no crystal is re-
quired.
56. 68341 Serial Module RTS Difference from 68681
Add to the description for receiver-controlled RTS operation in the next-to-last paragraph on page 7-13: Unlike
the 68681, the RTSx signal does not have to be manually asserted the first time in the mode to support control-
flow capability on the receiver.
57. Additional Note on Serial multidrop operation
Add to the Multidrop Mode section beginning on page 7-15: For multidrop mode, it is not necessary to disable
the transmitter to manipulate the A/D bit, as generally implied in the manual, nor is it necessary to wait until
the previous character completes transmission (i.e. TxEMP). The serial module logic latches this bit and ap-
pends it to the data character when the character is transferred from the transmit buffer to the serial output
shift register. Once this transfer occurs (as indicated by the TxRDY assertion), the A/D bit in MR1 can be
changed without affecting the character in progress. The proper programming sequence to change the A/D
bit for the next character would be:
1.) poll TxRDY until asserted (or interrupt on TxRDY)
2.) set/clear A/D bit in MR1 for new character
3.) write character to transmit buffer (TB)
4.) A/D bit can be changed only after TxRDY asserts again
No other bits in MR1 should be modified when changing the A/D bit.
58. Typo in CPE Description
The CPE bit header on page 8-20 should be "Counter/Prescaler Enable".
59. Typo in Status Register Configuration
On page 8-26, Section 8.5.1, the Status Register (SR) description should say: "• Clear the TO, TG, and TC
bits to reset the interrupts."
60. Typos in Timer Initialization Examples
On pages 8-27 and 8-29, the Timer register offsets should be from the timer base address, not from the SIM41
base address. The correct equates for the Timer register offsets are:
MOTOROLA
MC68341 USER’S MANUAL ADDENDUM
14
* Timer register offsets from timer1 base address
IR
CR
SR
CNTR
PRLD1
COM
EQU
EQU
EQU
EQU
EQU
EQU
$4
$6
$8
$A
$C
interrupt register
control register
status register
counter register
preload register 1
$10 compare register
On page 8-27, change the last code line from "CLR.W SR(A0)" to "ORI.W #$7000,SR(A0)". The TO, TG, and
TC interrupt status bits are cleared by writing a "1" to the corresponding bit, allowing individual bits to be
cleared without affecting the other bits.
On page 8-28, second code line down, the "MOVE.W #$020F,IR(A0)" initializes the interrupt vector to the Un-
initialized vector - change the $0F to a user-definable vector number. Repeat this correction on page 8-29,
just past mid-page.
61. MC68341 BSDL File
An electronic copy of the BSDL file for the MC68341 is maintained on the AESOP BBS - refer to the beginning
of this document for information on accessing AESOP.
62. Additional Note on Oscillator Layout Guidelines
Add to the Processor Clock Circuitry (page 11-1) and Serial Interface (page 11-4) sections: In general, use
short connections and place external oscillator components close to the processor. Do not route other signals
through or near the oscillator circuit, especially high frequency signals like CLKOUT, AS, and DREQ1 (see
note above on DREQ1 and serial oscillator for page7-5). Place a ground shield around the oscillator logic; use
a separate trace for ground to the oscillator so that it does not carry any of the digital switching noise.
63. Recommended 32KHz Oscillator Circuit
On page 11-2, Figure 11-2, a 10M resistor can be substituted for the 20M R2 bias resistor as shown below.
C1
R1
22 pF
330 k
XTAL
R2
10 M
X1
MC683xx
32.768 kHz
EXTAL
C2
15 pF
Figure 11-2. Sample Crystal Circuit
64. SRAM Interface
The SRAM interface shown in Figure 11-5 on page 11-4 does not support 2-clock accesses, since UWE and
LWE do not assert for 2-clock writes.
MOTOROLA
MC68341 USER’S MANUAL ADDENDUM
15
65. Corrections to 8/16-Bit DMA Control Logic
On page 11-10, the logic driving OE on the 74F245 in Figure 11-14 should be corrected as shown below. Al-
though not detailed, the byte enables for the memory block should be controlled during reads to prevent con-
tention between the upper and lower bytes of the data bus when D7-D0 is muxed to the upper data byte.
DEVICE
D15–D8
B
74F245
A
T/R
OE
R/W
A0
MEMORY
MC68341
DACKx
D7–D0
Figure 11-14. Circuit For Interfacing 8-Bit Device to 16-Bit Memory
in Single-Address DMA Mode
66. X1 and BSW Input Levels
On page 12-5, the Clock Input High Voltage spec also applies to the X1 and BSW inputs.
67. Operating IDD Limits
On page 12-5, the spec operating (RUN) currents are shown in the following table:
Product
68341FT16V
68341FT16
68341FT25
Frequency
16.78MHz
Max Idd
95mA@3.6V
Typical IDD (25°C)
68mA@3.3V
16.78MHz
25.16MHz
150mA@5.25V
210mA@5.25V
121mA@5.0V
175mA@5.0V
68. Input Clock Duty Cycle in External Clock w/PLL mode
On page 12-7, External Clock With PLL Mode: The input clock 20/80% duty cycle for external clock with PLL
mode can be used when the VCO is not turned off during LPSTOP. During LPSTOP with the VCO turned off,
the input clock is used for clocking the SIM, and must meet the tighter duty cycle requirements outlined for
External Clock Mode Without PLL.
69. Clock Skew Notes
12-7, External Clock With PLL Mode, Clock Input to CLKOUT Skew: Clock skew is measured from the falling
MOTOROLA
MC68341 USER’S MANUAL ADDENDUM
16
edges of the clock signals - the PLL phase locks the falling edge of CLKOUT to the falling edge on EXTCLK.
70. Data Setup Time for 3.3V
On page 12-9, electrical specification #27 (Data Setup to CLKOUT Low) for 3.3V product only has been
changed from 5ns to 8ns.
71. UWE and LWE Signals
In Figure 12-3 on page 12-12, UWE and LWE will assert for the write buys cycle with the same timing as DS.
In the fast termination write cycle in Figure 12-5 on page 12-14, UWE and LWE (not shown) remain negated
like DS.
72. Serial Module Specs
Note 1 on page 12-25 should reference synchronous operation, not asynchronous.
73. Ordering Information
Replace the the ordering information table in Section 11 with the following ordering information.
Supply
Voltage
Package Type
Frequency
(MHz)
Temperature
Order Number
5.0 V Plastic Quad Flat Pack
FT Suffix
0 – 25
0°C to +70°C
-40° to 85°C
XC68341FT25
XC68341CFT25
5.0 V Plastic Quad Flat Pack
FT Suffix
0 – 16.78
0 – 16.78
0°C to +70°C
-40° to 85°C
XC68341FT16
XC68341CFT16
3.3 V Plastic Quad Flat Pack
FT Suffix
0°C to +70°C
XC68341FT16V
74. Upper and Lower Data Strobes
In paragraph 3.2.8 page 3-6, change (D15–D0) to (D15–D8) and (D8–D0) to (D7–D0).
75. Figure 3-2
Change Note 1 to reference MC68341 instead of MC68340.
76. Figure 4-8
The Periodic Interrupt Control Register (PICR) and Periodic Interrupt Timing Register (PITR) should be 1 word
instead of 2 bytes. Disregard the Scale Select Register.
77. Page 4-24
Refer to 4-17 for more information on the AVEC-Automatic Vector Responsibility.
78. Page 4-48
The lake at the start of the code should be INIT341 instead of INIT340.
MOTOROLA
MC68341 USER’S MANUAL ADDENDUM
17
79. Page 6-5, Paragraph 6.3.1.2
The table reference in the last sentence should be 6-4 not 6-5.
80. Page 9-19,
The timing diagrams reference as Figures 9-24 — 9-27 should be changes to 12-22–12-25.
81. Page 9-29, DT–Delay
A value of 1 enable this bit and 0 disables it.
82. Package Dimensions
The package dimension drawing on page 13-3 should be discarded and replaced with the following drawing.
MOTOROLA
MC68341 USER’S MANUAL ADDENDUM
18
Y
L
–A–, –B–, –D–
–B–
–A–
B
B
L
B
V
P
DETAIL A
G
DETAIL A
Z
–D–
A
BASE
METAL
M
S
S
D
0.20 (0.008)
H
A-B
A-B
0.20 (0.008) A-B
N
J
S
M
S
S
D
0.20 (0.008)
C
F
D
M
DETAIL C
–H–
S
S
D
0.13 (0.005)
C
A-B
SECTION B–B
MILLIMETERS
INCHES
MIN
DIM MIN
MAX
28.10
28.10
3.85
MAX
1.106
1.106
0.152
0.015
0.138
0.013
_
M
A
B
C
D
E
F
27.90
27.90
3.35
0.22
3.20
0.22
1.098
1.098
0.132
0.009
0.126
0.009
TOP &
NOTES:
BOTTOM
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
0.38
3.50
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS -A-, -B- AND -D- TO BE DETERMINED AT
DATUM PLANE -H-.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE -C-.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
0.33
_
U
G
H
J
0.65 BSC
0.026 REF
T
0.25
0.11
0.70
0.35
0.23
0.90
0.010
0.004
0.028
0.014
0.009
0.035
E
C
–H–
K
L
R
25.35 REF
0.998 REF
M
N
P
Q
R
S
T
5
0.11
16
0.19
5
0.004
16
0.007
_
_
_
_
_
Q
0.325 BSC
0
0.013 BSC
0
7
0.30
7
_
_
_
_
W
–C–
SEATING
PLANE
0.13
31.00
0.13
0
0.005
1.220
0.005
0
0.012
1.236
---
K
31.40
---
---
H
X
U
V
W
X
Y
Z
---
1.236
---
_
_
0.10 (0.004)
31.00
0.40
31.40
---
1.220
0.016
1.60 REF
1.33 REF
1.33 REF
0.063 REF
0.052 REF
0.052 REF
DETAIL C
Case 864A-03
MOTOROLA
MC68341 USER’S MANUAL ADDENDUM
19
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different
applications. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not
convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems
intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola
product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or
unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims,
costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and
registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
are
µ
Literature Distribution Centers:
USA: Motorola Literature Distribution; P.O. Box 20912, Arizona 85036.
EUROPE: Motorola Ltd.; European Literature Centre; 88 Tanners Drive, Blakelands, Milton Keynes, MK14 5BP, England.
JAPAN: Nippon Motorola Ltd.; 4-32-1, Nishi-Gotanda, Shinagawa-ku, Tokyo 141 Japan.
ASIA-PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Center, No. 2 Dai King Street, Tai Po Industrial Estate,
Tai Po, N.T., Hong Kong.
SEMICONDUCTOR PRODUCT INFORMATION
相关型号:
©2020 ICPDF网 联系我们和版权申明