MC74HC4514DWD [MOTOROLA]

Decoder/Driver, CMOS, PDSO24;
MC74HC4514DWD
型号: MC74HC4514DWD
厂家: MOTOROLA    MOTOROLA
描述:

Decoder/Driver, CMOS, PDSO24

解码器 解复用器
文件: 总9页 (文件大小:247K)
中文:  中文翻译
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SEMICONDUCTOR TECHNICAL DATA  
High–Performance Silicon–Gate CMOS  
N SUFFIX  
PLASTIC PACKAGE  
CASE 724–03  
The MC74HC4514 is identical in pinout to the MC14514B metal–gate  
CMOS device. The device inputs are compatible with standard CMOS  
outputs, with pullup resistors; they are compatible with LSTTL outputs.  
This device consists of a 4–bit storage latch with a Latch Enable and Chip  
Select input. When a low signal is applied to the Latch Enable input, the  
Address is stored, and decoded. When the Chip Select input is high, all  
sixteen outputs are forced to a low level.  
24  
1
DW SUFFIX  
SOIC PACKAGE  
CASE 751E–04  
24  
1
The Chip Select input is provided to facilitate the chip–select, demultiplex-  
ing, and cascading functions.  
ORDERING INFORMATION  
The demultiplexing function is accomplished by using the Address inputs  
to select the desired device output, and then by using the Chip Select as a  
data input.  
MC74HCXXXXN  
MC74HCXXXXDW  
Plastic  
SOIC  
Output Drive Capability: 10 LSTTL Loads  
Outputs Directly Interface to CMOS, NMOS, and TTL  
Operating Voltage Range: 2 to 6 V  
PIN ASSIGNMENT  
Low Input Current: 1 µA  
LATCH  
1
2
3
4
5
6
24  
23  
22  
21  
20  
19  
V
CC  
ENABLE  
High Noise Immunity Characteristic of CMOS Devices  
In Compliance with the Requirements Defined by JEDEC Standard  
No. 7A  
CHIP  
A0  
A1  
Y7  
Y6  
Y5  
SELECT  
A3  
Chip Complexity: 268 FETs or 67 Equivalent Gates  
A2  
Y10  
Y11  
LOGIC DIAGRAM  
Y4  
Y3  
7
18  
17  
16  
15  
14  
13  
Y8  
8
Y9  
11  
Y1  
9
Y14  
Y15  
Y12  
Y13  
Y0  
9
Y1  
Y2  
10  
11  
12  
10  
Y2  
8
Y0  
Y3  
7
Y4  
6
GND  
2
3
Y5  
Y6  
Y7  
Y8  
Y9  
A0  
A1  
A2  
A3  
5
4
BINARY  
ADDRESS  
INPUTS  
4–BIT  
STORAGE  
LATCH  
4–TO–16  
LINE  
DECODER  
ACTIVE–HIGH  
OUTPUTS  
18  
17  
20  
19  
14  
13  
16  
21  
Y10  
Y11  
Y12  
LATCH  
1
Y13  
Y14  
Y15  
ENABLE  
15  
CHIP  
SELECT  
PIN 24 = V  
CC  
PIN 12 = GND  
10/95  
REV 6  
Motorola, Inc. 1995  
MC74HC4514  
MAXIMUM RATINGS*  
Symbol  
Parameter  
Value  
Unit  
V
This device contains protection  
circuitry to guard against damage  
due to high static voltages or electric  
fields. However, precautions must  
be taken to avoid applications of any  
voltage higher than maximum rated  
voltages to this high–impedance cir-  
V
DC Supply Voltage (Referenced to GND)  
DC Input Voltage (Referenced to GND)  
DC Output Voltage (Referenced to GND)  
DC Input Current, per Pin  
– 0.5 to + 7.0  
CC  
V
– 1.5 to V  
+ 1.5  
V
in  
CC  
V
out  
– 0.5 to V  
+ 0.5  
V
CC  
I
± 20  
mA  
mA  
mA  
mW  
in  
cuit. For proper operation, V and  
in  
I
I
DC Output Current, per Pin  
± 25  
± 50  
out  
V
should be constrained to the  
out  
range GND (V or V  
)
V
CC  
.
DC Supply Current, V  
CC  
and GND Pins  
in out  
CC  
Unused inputs must always be  
tied to an appropriate logic voltage  
P
D
Power Dissipation in Still Air  
Plastic DIP†  
SOIC Package†  
750  
500  
level (e.g., either GND or V ).  
CC  
Unused outputs must be left open.  
T
stg  
Storage Temperature  
– 65 to + 150  
C
C
T
L
Lead Temperature, 1 mm from Case for 10 Seconds  
(Plastic DIP)  
260  
* Maximum Ratings are those values beyond which damage to the device may occur.  
Functional operation should be restricted to the Recommended Operating Conditions.  
†Derating — Plastic DIP: – 10 mW/ C from 65 to 125 C  
SOIC Package: – 7 mW/ C from 65 to 125 C  
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
2
Max  
Unit  
V
V
CC  
DC Supply Voltage (Referenced to GND)  
DC Input Voltage, Output Voltage (Referenced to GND)  
Operating Temperature, All Package Types  
6.0  
V , V  
in out  
0
V
CC  
V
T
A
– 55 + 125  
C
t , t  
r f  
Input Rise and Fall Time  
(Figure 1)  
V
CC  
V
CC  
V
CC  
= 2.0 V  
= 4.5 V  
= 6.0 V  
0
0
0
1000  
500  
400  
ns  
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)  
Guaranteed Limit  
– 55 to  
V
CC  
V
25 C  
Symbol  
Parameter  
Test Conditions  
Unit  
85 C  
125 C  
V
IH  
Minimum High–Level Input  
Voltage  
V
= 0.1 V or V  
– 0.1 V  
2.0  
4.5  
6.0  
1.5  
3.15  
4.2  
1.5  
3.15  
4.2  
1.5  
3.15  
4.2  
V
out  
CC  
|I  
|
20 µA  
out  
V
Maximum Low–Level Input  
Voltage  
V
= 0.1 V or V  
– 0.1 V  
2.0  
4.5  
6.0  
0.3  
0.9  
1.2  
0.3  
0.9  
1.2  
0.3  
0.9  
1.2  
V
V
IL  
out  
CC  
|I  
|
20 µA  
out  
V
OH  
Minimum High–Level Output  
Voltage  
V
= V or V  
IH IL  
2.0  
4.5  
6.0  
1.9  
4.4  
5.9  
1.9  
4.4  
5.9  
1.9  
4.4  
5.9  
in  
|I  
|
20 µA  
out  
V
in  
= V or V  
|I  
|I  
|
|
4.0 mA  
5.2 mA  
4.5  
6.0  
3.98  
5.48  
3.84  
5.34  
3.70  
5.20  
IH IL out  
out  
V
OL  
Maximum Low–Level Output  
Voltage  
V
= V or V  
IH IL  
2.0  
4.5  
6.0  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
V
in  
|I  
|
20 µA  
out  
V
= V or V  
|I  
|I  
|
|
4.0 mA  
5.2 mA  
4.5  
6.0  
0.26  
0.26  
0.33  
0.33  
0.40  
0.40  
in  
in  
IH IL out  
out  
I
Maximum Input Leakage Current  
V
V
= V  
= V  
or GND  
6.0  
6.0  
± 0.1  
± 1.0  
± 1.0  
µA  
µA  
in  
CC  
I
Maximum Quiescent Supply  
Current (per Package)  
or GND  
8
80  
160  
CC  
in  
CC  
I
= 0 µA  
out  
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).  
MOTOROLA  
2
MC74HC4514  
AC ELECTRICAL CHARACTERISTICS (C = 50 pF, Input t = t = 6 ns)  
L
r
f
Guaranteed Limit  
– 55 to  
V
CC  
V
25 C  
Symbol  
Parameter  
Unit  
85 C  
125 C  
t
t
,
Maximum Propagation Delay, Chip Select to Output Y  
(Figures 1 and 5)  
2.0  
4.5  
6.0  
175  
35  
30  
220  
44  
37  
265  
53  
45  
ns  
PLH  
PHL  
t
Maximum Propagation Delay, Input A to Output Y  
(Figures 2 and 5)  
2.0  
4.5  
6.0  
230  
46  
39  
290  
58  
49  
345  
69  
59  
ns  
ns  
PLH  
t
t
t
2.0  
4.5  
6.0  
175  
35  
30  
220  
44  
37  
265  
53  
45  
PHL  
PLH  
PHL  
Maximum Propagation Delay, Latch Enable to Output Y  
(Figures 3 and 5)  
2.0  
4.5  
6.0  
230  
46  
39  
290  
58  
49  
345  
69  
59  
2.0  
4.5  
6.0  
175  
35  
30  
220  
44  
37  
265  
53  
45  
t
t
,
Maximum Output Transition Time, Any Output  
(Figures 1 and 5)  
2.0  
4.5  
6.0  
75  
15  
13  
95  
19  
16  
110  
22  
19  
ns  
TLH  
THL  
C
Maximum Input Capacitance  
10  
10  
10  
pF  
in  
NOTES:  
1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).  
2. Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).  
Typical @ 25°C, V  
= 5.0 V  
CC  
C
Power Dissipation Capacitance (Per Package)*  
pF  
70  
PD  
2
* Used to determine the no–load dynamic power consumption: P = C  
D
Motorola High–Speed CMOS Data Book (DL129/D).  
V
f + I  
V
. For load considerations, see Chapter 2 of the  
PD CC  
CC CC  
TIMING REQUIREMENTS (Input t = t = 6 ns)  
r
f
Guaranteed Limit  
– 55 to  
V
CC  
V
25 C  
Symbol  
Parameter  
Unit  
85 C  
125 C  
t
su  
Minimum Setup Time, Input A to Latch Enable  
(Figure 4)  
2.0  
4.5  
6.0  
100  
20  
17  
125  
25  
21  
150  
30  
26  
ns  
t
Minimum Hold Time, Latch Enable to Input A  
(Figure 4)  
2.0  
4.5  
6.0  
5
5
5
5
5
5
5
5
5
ns  
ns  
ns  
h
t
w
Minimum Pulse Width, Latch Enable  
(Figure 3)  
2.0  
4.5  
6.0  
80  
16  
14  
100  
20  
17  
120  
24  
20  
t , t  
r
Maximum Input Rise and Fall Times  
(Figure 1)  
2.0  
4.5  
6.0  
1000  
500  
400  
1000  
500  
400  
1000  
500  
400  
f
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).  
3
MOTOROLA  
MC74HC4514  
SWITCHING WAVEFORMS  
t
t
r
f
V
CC  
90%  
VALID  
VALID  
CHIP  
SELECT  
50%  
10%  
V
CC  
GND  
INPUT A  
50%  
t
t
PHL  
PLH  
GND  
90%  
50%  
10%  
t
t
PHL  
PLH  
OUTPUT Y  
50%  
OUTPUT Y  
t
t
THL  
TLH  
Figure 1.  
Figure 2.  
VALID  
t
w
V
CC  
V
CC  
INPUT A  
50%  
LATCH  
ENABLE  
50%  
50%  
GND  
t
GND  
t
su  
h
t
t
PHL  
PLH  
V
CC  
LATCH  
ENABLE  
50%  
50%  
OUTPUT Y  
GND  
Figure 3.  
Figure 4.  
TEST POINT  
OUTPUT  
DEVICE  
UNDER  
TEST  
C *  
L
* Includes all probe and jig capacitance  
Figure 5. Test Circuit  
MOTOROLA  
4
MC74HC4514  
FUNCTION TABLE  
Address Inputs  
PIN DESCRIPTIONS  
Selected  
Output  
(High)  
ADDRESS INPUTS  
Latch  
Chip  
Enable Select  
A0, A1, A2, A3 (Pins 2, 3, 21, 22)  
A3 A2 A1 A0  
Address Inputs. These inputs are decoded to produce a  
high level on one of 16 outputs. The inputs are arranged  
such that A3 is the most–significant bit and A0 is the least–  
significant bit. The decimal equivalent of the binary input  
address indicates which of the 16 data outputs, Y0Y15, is  
selected.  
H
H
H
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
H
L
H
L
Y0  
Y1  
Y2  
Y3  
H
H
H
H
H
L
L
L
L
L
L
L
L
H
H
H
H
L
L
H
H
L
H
L
Y4  
Y5  
Y6  
Y7  
OUTPUTS  
H
Y0 – Y15 (Pins 11, 9, 10, 8, 7, 6, 5, 4, 18, 17, 20, 19, 14,  
13, 16, 15)  
H
H
H
H
L
L
L
L
H
H
H
H
L
L
L
L
L
L
H
H
L
H
L
Y8  
Y9  
Y10  
Y11  
Active–High Outputs. These outputs produce a high level  
when selected (Latch Enable = H, Chip Select = L) and are at  
a low level when not selected.  
H
H
H
H
H
L
L
L
L
H
H
H
H
H
H
H
H
L
L
H
H
L
H
L
Y12  
Y13  
Y14  
Y15  
CONTROL INPUTS  
Latch Enable (Pin 1)  
H
Latch Enable Input. A low level on this input stores the  
data on the Address data inputs in the 4–bit latch. A high  
level on the Latch Enable input makes the latch transparent  
and allows the outputs to follow the inputs. Note that the data  
is latched only while the Latch Enable input is at a low level.  
All  
Outputs = L  
X
L
H
L
X
X
X
X
X
X
X
X
Latched  
Data  
Chip Select (Pin 23)  
Chip Select Input. A high on this input produces a low level  
on all outputs, regardless of what appears at the address or  
Latch Enable inputs. A low level on the Chip Select input  
allows the selected output to produce a high level.  
TIMING DIAGRAM  
INPUT A  
LATCH ENABLE  
CHIP SELECT  
OUTPUT Y  
5
MOTOROLA  
MC74HC4514  
EXPANDED LOGIC DIAGRAM  
Y0  
11  
ABCD  
ABCD  
ABCD  
ABCD  
ABCD  
ABCD  
ABCD  
ABCD  
ABCD  
ABCD  
ABCD  
ABCD  
ABCD  
ABCD  
ABCD  
ABCD  
Y1  
9
Y2  
10  
2
A0  
DATA  
Q
Y3  
8
Y4  
7
LE  
Q
Q
Y5  
6
3
A1  
DATA  
Y6  
5
Y7  
4
Q
Q
LE  
Y8  
18  
21  
A2  
DATA  
Y9  
17  
Y10  
20  
Q
Q
LE  
Y11  
19  
22  
A3  
DATA  
Y12  
14  
Y13  
13  
LATCH  
ENABLE  
1
Q
LE  
Y14  
16  
Y15  
15  
CHIP  
23  
SELECT  
MOTOROLA  
6
MC74HC4514  
MICROPROCESSOR MEMORY DECODING  
Y0  
Y1  
Y2  
Y3  
Y4  
Y5  
Y6  
Y7  
Y8  
0000–00FF  
0100–01FF  
0200–02FF  
0300–03FF  
0400–04FF  
0500–05FF  
0600–06FF  
0700–07FF  
0800–08FF  
0900–09FF  
0A00–0AFF  
0B00–0BFF  
0C00–0CFF  
0D00–0DFF  
CHIP  
SELECT  
A12  
A11  
A10  
A9  
A3  
A2  
A1  
A0  
Y9  
Y10  
Y11  
Y12  
Y13  
A8  
LATCH  
ENABLE  
+ V  
Y14  
Y15  
0E00–0EFF  
0F00–0FFF  
TO DEVICE SELECTS  
Y0  
Y1  
Y2  
Y3  
Y4  
Y5  
Y6  
Y7  
Y8  
1000–10FF  
1100–11FF  
1200–12FF  
1300–13FF  
1400–14FF  
1500–15FF  
1600–16FF  
1700–17FF  
1800–18FF  
1900–19FF  
1A00–1AFF  
1B00–1BFF  
1C00–1CFF  
1D00–1DFF  
1E00–1EFF  
1F00–1FFF  
HC04  
CHIP  
SELECT  
A3  
A2  
A1  
A0  
Y9  
Y10  
Y11  
Y12  
Y13  
Y14  
Y15  
LATCH  
ENABLE  
+ V  
7
MOTOROLA  
MC74HC4514  
CODE TO CODE CONVERSION — HEXADECIMAL TO BCD  
+ V  
Y0  
Y1  
Y2  
Y3  
COMMON CATHODE LEDs  
A3  
A2  
A1  
A0  
Y4  
Y5  
Y6  
Y7  
Y8  
Y9  
LATCH  
Y10  
Y11  
Y12  
Y13  
Y14  
Y15  
ENABLE  
R = 2 k  
CHIP  
SELECT  
GND  
A3  
A2  
A1  
A0  
ALL DIODES GENERAL  
PURPOSE GERMANIUM  
R = 10 k  
R = 2 kΩ  
HC4050  
HC4050  
MOTOROLA  
8
MC74HC4514  
OUTLINE DIMENSIONS  
N SUFFIX  
PLASTIC PACKAGE  
CASE 724–03  
ISSUE D  
–A–  
NOTES:  
1. CHAMFERED CONTOUR OPTIONAL.  
2. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
3. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
24  
1
13  
12  
–B–  
4. CONTROLLING DIMENSION: INCH.  
INCHES  
MILLIMETERS  
L
DIM  
A
B
C
D
E
MIN  
MAX  
1.265  
0.270  
0.175  
0.020  
MIN  
31.25  
6.35  
3.69  
0.38  
MAX  
32.13  
6.85  
4.44  
0.51  
C
1.230  
0.250  
0.145  
0.015  
NOTE 1  
–T–  
SEATING  
PLANE  
K
0.050 BSC  
1.27 BSC  
F
G
J
K
L
M
N
0.040  
0.100 BSC  
0.007  
0.110  
0.300 BSC  
0.060  
1.02  
2.54 BSC  
0.18  
2.80  
7.62 BSC  
1.52  
N
M
E
0.012  
0.140  
0.30  
3.55  
G
J 24 PL  
F
M
M
0.25 (0.010)  
T
B
D 24 PL  
0
15  
0.040  
0
0.51  
15  
1.01  
0.020  
M
M
0.25 (0.010)  
T A  
DW SUFFIX  
PLASTIC SOIC PACKAGE  
CASE 751E–04  
ISSUE E  
–A–  
NOTES:  
24  
13  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
–B– 12X P  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
M
M
0.010 (0.25)  
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN  
EXCESS OF D DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
1
12  
24X D  
J
MILLIMETERS  
INCHES  
M
S
S
0.010 (0.25)  
T
A
B
DIM  
A
B
C
D
MIN  
15.25  
7.40  
2.35  
0.35  
0.41  
MAX  
15.54  
7.60  
2.65  
0.49  
0.90  
MIN  
MAX  
0.612  
0.299  
0.104  
0.019  
0.035  
0.601  
0.292  
0.093  
0.014  
0.016  
F
R X 45  
F
G
J
K
M
P
R
1.27 BSC  
0.050 BSC  
0.23  
0.13  
0
0.32  
0.29  
8
0.009  
0.005  
0
0.013  
0.011  
8
C
K
–T–  
SEATING  
M
10.05  
0.25  
10.55  
0.75  
0.395  
0.010  
0.415  
0.029  
PLANE  
22X G  
Motorolareserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representationorguaranteeregarding  
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,  
andspecifically disclaims any and all liability, includingwithoutlimitationconsequentialorincidentaldamages. “Typical” parameters can and do vary in different  
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MC74HC4514/D  

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