MMQA5V6T1 [MOTOROLA]
SC-59 QUAD TRANSIENT VOLTAGE SUPPRESSOR 5.6 VOLTS; SC- 59 QUAD瞬态电压抑制器5.6伏
| 型号： | MMQA5V6T1 |
| 厂家： | 
MOTOROLA |
| 描述： | SC-59 QUAD TRANSIENT VOLTAGE SUPPRESSOR 5.6 VOLTS |
| 文件： | 总8页 (文件大小：140K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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by MMQA5V6T1/D
SEMICONDUCTOR TECHNICAL DATA
Motorola Preferred Devices
Transient Voltage Suppressor
for ESD Protection
SC-59 QUAD
TRANSIENT VOLTAGE
SUPPRESSOR
This quad monolithic silicon voltage suppressor is designed for applications
requiring transient overvoltage protection capability. It is intended for use in
voltage and ESD sensitive equipment such as computers, printers, business
machines, communication systems, medical equipment, and other applica-
tions. Its quad junction common anode design protects four separate lines
using only one package. These devices are ideal for situations where board
space is at a premium.
5.6 VOLTS (4)
24 WATTS PEAK POWER
6
5
4
Specification Features:
1
2
3
•
•
•
•
•
SC-59 Package Allows Four Separate Unidirectional Configurations
Peak Power — 24 Watts @ 1.0 ms (Unidirectional), per Figure 7 Waveform
Maximum Clamping Voltage @ Peak Pulse Current
CASE 318F-01
STYLE 1
SC-59 PLASTIC
Low Leakage < 2.0 µA
ESD Rating of Class N (exceeding 16 kV) per the Human Body Model
Mechanical Characteristics:
1
•
•
•
•
•
Void Free, Transfer-Molded, Thermosetting Plastic Case
Corrosion Resistant Finish, Easily Solderable
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
Available in 8 mm Tape and Reel
3
4
2
5
6
PIN 1. CATHODE
2. ANODE
Use the Device Number to order the 7 inch/3,000 unit reel. Replace
with “T3” in the Device Number to order the 13 inch/10,000 unit reel.
3. CATHODE
4. CATHODE
5. ANODE
6. CATHODE
THERMAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
Characteristic
Symbol
Value
Unit
Peak Power Dissipation @ 1.0 ms (1)
P
pk
24
Watts
@ T ≤ 25°C
A
Total Power Dissipation on FR-5 Board (2) @ T = 25°C
Derate above 25°C
°P
D
°
°225
1.8
°mW°
mW/°C
A
Thermal Resistance Junction to Ambient
R
556
°C/W
θJA
Total Power Dissipation on Alumina Substrate (3) @ T = 25°C
Derate above 25°C
°P
D
°
°300
2.4
°mW
mW/°C
A
Thermal Resistance Junction to Ambient
Junction and Storage Temperature Range
R
417
°C/W
°C
θJA
T
T
°– 55 to +150°
J
stg
Lead Solder Temperature — Maximum (10 Second Duration)
T
L
260
°C
1. Non-repetitive current pulse per Figure 7 and derate above T = 25°C per Figure 8.
A
2. FR-5 = 1.0 x 0.75 x 0.62 in.
3. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina
4. Other voltages are available
Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value.
Rev 3
Motorola, Inc. 1996
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
UNIDIRECTIONAL (Circuit tied to pins 1, 2, and 5; Pins 2, 3, and 5; Pins 2, 4, and 5; or Pins 2, 5, and 6) (V = 0.9 V Max @ I = 10 mA)
F
F
Max Reverse
Voltage @
Max Reverse
Leakage Current
Max
Reverse
Surge
Breakdown Voltage
Max Zener Impedance (5)
Maximum
Temperature
Coefficient of
I (4)
RSM
V
(3)
(V)
(Clamping
Voltage)
ZT
Current
I
@ V
Z
@ I
ZT
@ I
V
Z
R
R
ZT
(Ω)
ZT
I
RSM(4)
(A)
(µA)
(V)
(mA)
(mA)
1
(mV/°C)
V
RSM
(V)
Min
Nom
Max
5.32
19
5.6
20
5.88
21
1.0
1.0
2.0
0.1
3.0
15
400
125
3.0
8.0
1.26
0.84
28.6
20.07
(3)
V measured at pulse test current I at an ambient temperature of 25°C.
Z T
(4) Surge current waveform per Figure 5 and derate per Figure 6.
(5)
Z
is measured by dividing the AC voltage drop across the device by the AC current supplied. The specfied limits are I
= 0.1 I
, with AC frequency = 1 kHz.
ZT
Z(AC)
Z(DC)
Typical Characteristics
23
8
V
@ I
T
Z
MMQA20VT1
22
21
20
19
MMQA5V6T1
7
6
5
UNIDIRECTIONAL
18
17
4
– 50
0
50
100
C)
150
– 40
0
25
150
T , AMBIENT TEMPERATURE (
°
T , AMBIENT TEMPERATURE (°C)
A
A
Figure 1. Typical Breakdown Voltage
versus Temperature
Figure 2. Typical Breakdown Voltage
versus Temperature
70
60
10000
1000
50
40
30
20
MMQA20VT1
UNIDIRECTIONAL
10
0
100
0
2
4
6
8
10
12
14
16
– 50
0
50
100
C)
150
T , AMBIENT TEMPERATURE (
°
REVERSE VOLTAGE (V)
A
Figure 3. Typical Leakage Current
versus Temperature
Figure 4. Typical Capacitance versus
Reverse Voltage
MOTOROLA
2
MMQA5V6T1 MMQA20VT1
Typical Characteristics
300
275
250
300
MMQA5V6T1
250
200
ALUMINA SUBSTRATE
225
200
175
150
125
100
UNIDIRECTIONAL
150
100
50
FR-5 BOARD
75
50
25
0
0
0
0.5
1
1.5
2
2.5
3
0
25
50
75
100
125
C)
150
175
REVERSE VOLTAGE (V)
T , AMBIENT TEMPERATURE (
°
A
Figure 5. Typical Capacitance versus
Reverse Voltage
Figure 6. Steady State Power Derating Curve
100
90
80
70
60
50
40
30
20
10
0
PULSE WIDTH (t ) IS DEFINED
P
AS THAT POINT WHERE THE
t
r
PEAK CURRENT DECAYS TO 50%
OF I
.
PEAK VALUE — I
RSM
RSM
100
t
≤ 10 µs
r
I
RSM
2
HALF VALUE —
50
0
t
P
0
1
2
3
4
0
25
50
75
100
125
150
C)
175 200
t, TIME (ms)
T , AMBIENT TEMPERATURE (
°
A
Figure 7. Pulse Waveform
Figure 8. Pulse Derating Curve
100
RECTANGULAR
WAVEFORM, TA = 25°C
10
UNIDIRECTIONAL
1.0
0.1
1.0
10
PW, PULSE WIDTH (ms)
100
1000
Figure 9. Maximum Non-repetitive Surge
Power, Ppk versus PW
PowerisdefinedasV
RSM
xI (pk)whereV
Z RSM
Z
is the clamping voltage at I (pk).
MOTOROLA
MMQA5V6T1 MMQA20VT1
3
TYPICAL COMMON ANODE APPLICATIONS
A quad junction common anode design in a SC-59 pack-
age protects four separate lines using only one package.
This adds flexibility and creativity to PCB design especially
when board space is at a premium. Two simplified examples
of MMQA5V6T1 and MMQA20VT1 applications are illus-
trated below.
Computer Interface Protection
A
B
C
D
KEYBOARD
TERMINAL
PRINTER
ETC.
FUNCTIONAL
DECODER
I/O
GND
MMQA5V6T1
MMQA20VT1
Microprocessor Protection
V
V
DD
GG
ADDRESS BUS
RAM
ROM
DATA BUS
CPU
I/O
CLOCK
CONTROL BUS
GND
MMQA5V6T1
MMQA20VT1
MOTOROLA
MMQA5V6T1 MMQA20VT1
4
INFORMATION FOR USING THE SC-59 6 LEAD SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to ensure proper solder connection inter-
face between the board and the package. With the correct
pad geometry, the packages will self-align when subjected to
a solder reflow process.
0.094
2.4
0.037
0.95
0.074
1.9
0.037
0.95
0.028
0.7
0.039
1.0
inches
mm
SC-59 6 LEAD
SC-59 6 LEAD POWER DISSIPATION
The power dissipation of the SC-59 6 Lead is a function of
calculate the power dissipation of the device which in this
case is 225 milliwatts.
the pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power dissipation.
Power dissipation for a surface mount device is determined
150°C – 25°C
556°C/W
P
=
= 225 milliwatts
D
by T
, the maximum rated junction temperature of the
, the thermal resistance from the device junction to
J(max)
die, R
θJA
The 556°C/W for the SC-59 6 Lead package assumes the
use of the recommended footprint on a glass epoxy printed
circuit board to achieve a power dissipation of 225 milliwatts.
There are other alternatives to achieving higher power
dissipation from the SC-59 6 Lead package. Another alterna-
tive would be to use a ceramic substrate or an aluminum
core board such as Thermal Clad . Using a board material
such as Thermal Clad, an aluminum core board, the power
dissipation can be doubled using the same footprint.
ambient, and the operating temperature, T . Using the
values provided on the data sheet for the SC-59 6 Lead
A
package, P can be calculated as follows:
D
T
– T
A
J(max)
P
=
D
R
θJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature T of 25°C, one can
A
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads.
Solder stencils are used to screen the optimum amount.
These stencils are typically 0.008 inches thick and may be
made of brass or stainless steel. For packages such as the
SC-59, SC-59 6 Lead, SC-70/SOT-323, SOD-123, SOT-23,
SOT-143, SOT-223, SO-8, SO-14, SO-16, and SMB/SMC
diode packages, the stencil opening should be the same as
the pad size or a 1:1 registration.
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to mini-
mize the thermal stress to which the devices are subjected.
•
When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference should be a maximum of 10°C.
•
•
Always preheat the device.
The delta temperature between the preheat and
soldering should be 100°C or less.*
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
MOTOROLA
5
MMQA5V6T1 MMQA20VT1
•
•
•
The soldering temperature and time should not exceed
260°C for more than 10 seconds.
When shifting from preheating to soldering, the
maximum temperature gradient should be 5°C or less.
After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used since the use of forced
cooling will increase the temperature gradient and will
result in latent failure due to mechanical stress.
Mechanical stress or shock should not be applied during
cooling.
•
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of control
actual temperature that might be experienced on the surface
of a test board at or near a central solder joint. The two
profiles are based on a high density and a low density board.
The Vitronics SMD310 convection/infrared reflow soldering
system was used to generate this profile. The type of solder
used was 62/36/2 Tin Lead Silver with a melting point
between 177–189°C. When this type of furnace is used for
solder reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
settings that will give the desired heat pattern. The operator
must set temperatures for several heating zones and a figure
for belt speed. Taken together, these control settings make
up a heating “profile” for that particular circuit board. On
machines controlled by a computer, the computer remem-
bers these profiles from one operating session to the next.
Figure 8 shows a typical heating profile for use when
soldering a surface mount device to a printed circuit board.
This profile will vary among soldering systems, but it is a
good starting point. Factors that can affect the profile include
the type of soldering system in use, density and types of
components on the board, type of solder used, and the type
of board or substrate material being used. This profile shows
temperature versus time. The line on the graph shows the
STEP 1
STEP 2 STEP 3
VENT HEATING
“SOAK” ZONES 2 & 5
“RAMP”
STEP 4
HEATING
ZONES 3 & 6 ZONES 4 & 7
“SOAK” “SPIKE”
STEP 5
HEATING
STEP 6
VENT
STEP 7
COOLING
PREHEAT
ZONE 1
“RAMP”
205
PEAK AT
SOLDER JOINT
° TO 219°C
170°C
200
°
C
C
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
160°C
150°C
150°
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
140°C
100°C
MASS OF ASSEMBLY)
100
°
C
C
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°
TIME (3 TO 7 MINUTES TOTAL)
T
MAX
Figure 10. Typical Solder Heating Profile
MOTOROLA
6
MMQA5V6T1 MMQA20VT1
OUTLINE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
A
Y14.5M, 1982.
L
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
6
5
2
4
B
S
1
3
INCHES
MIN MAX
MILLIMETERS
DIM
A
B
C
D
G
H
J
K
L
M
S
MIN
2.70
1.30
MAX
3.10
1.70
0.1063 0.1220
0.0512 0.0669
0.0394 0.0511
0.0138 0.0196
0.0335 0.0413
D
1.00
0.35
0.85
1.30
0.50
1.05
0.100
0.26
0.60
1.65
10
G
0.0005 0.0040 0.013
M
J
0.0040 0.0102
0.0079 0.0236
0.0493 0.0649
0.10
0.20
1.25
0
C
0.05 (0.002)
0
10
0.0985 0.1181
2.50
3.00
K
H
STYLE 1:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. ANODE
CASE 318F-01
ISSUE A
6. CATHODE
SC-59 6 LEAD
MOTOROLA
7
MMQA5V6T1 MMQA20VT1
Motorolareserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representationorguaranteeregarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
andspecifically disclaims any and all liability, includingwithoutlimitationconsequentialorincidentaldamages. “Typical” parameters can and do vary in different
applications. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does
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associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part.
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MMQA5V6T1/D
◊
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