MPX2202 [MOTOROLA]
200 kPa On-Chip Temperature Compensated & Calibrated Pressure Sensors; 200千帕片上温度补偿和校准的压力传感器
| 型号： | MPX2202 |
| 厂家： | 
MOTOROLA |
| 描述： | 200 kPa On-Chip Temperature Compensated & Calibrated Pressure Sensors |
| 文件： | 总12页 (文件大小：320K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
M
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T
O
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Freescale Semiconductor, Inc.
Order this document
by MPX2202/D
SEMICONDUCTOR TECHNICAL DATA
2
C
P
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m
s
k
e
P
a
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n
-
C
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i
p
Te mpe r a t ure
Ca lib r at e d
M
P
P
X
2
2
0
2
2
p
s
n
s
t
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d
&
S en so r s
M
X
V
2
2
0
G
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S E RI E S
Motorola Preferred Device
The MPX2202/MPXV2202G device series is a silicon piezoresistive pressure sensor
providing a highly accurate and linear voltage output — directly proportional to the
applied pressure. The sensor is a single monolithic silicon diaphragm with the strain
gauge and a thin–film resistor network integrated on–chip. The chip is laser trimmed for
precise span and offset calibration and temperature compensation. They are designed
for use in applications such as pump/motor controllers, robotics, level indicators, medical
diagnostics, pressure switching, barometers, altimeters, etc.
0 to 200 kPa (0 to 29 psi)
40 mV FULL SCALE SPAN
(TYPICAL)
Features
UNIBODY PACKAGE
•
•
•
Temperature Compensated Over 0°C to +85°C
Easy–to–Use Chip Carrier Package Options
Available in Absolute, Differential and Gauge Con-
figurations
SMALL OUTLINE PACKAGE
SURFACE MOUNT
Application Examples
•
•
•
•
•
•
•
Pump/Motor Controllers
Robotics
Level Indicators
Medical Diagnostics
Pressure Switching
Barometers
MPX2202A/D
CASE 344
MPXV2202GP
CASE 1369
Altimeters
Figure 1 illustrates a block diagram of the internal
circuitry on the stand–alone pressure sensor chip.
V
S
3
MPX2202AP/GP
CASE 344B
T HIN F IL M
T EM PER AT URE
CO M PENS AT IO N
AND
2
4
V
o
u
u
t
t
+
-
S EN SI N G
E L EME NT
MPXV2202DP
CASE 1351
V
o
CA LI BRAT IO N
CI RCUI TRY
PIN NUMBER
1
1
2
3
4
Gnd
N/C
N/C
N/C
N/C
5
6
7
+V
out
G
N
D
Figure 1. Temperature Compensated Pressure
Sensor Schematic
V
S
MPX2202DP
CASE 344C
–V
out
8
VOLTAGE OUTPUT versus
APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the sensor is
NOTE: Pin 1 is noted by the notch in
the lead.
directly proportional to the differential pressure applied.
The absolute sensor has a built–in reference vacu-
um. The output voltage will decrease as vacuum,
relative to ambient, is drawn on the pressure (P1) side.
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the
pressure (P1) side relative to the vacuum (P2) side.
Similarly, output voltage increases as increasing vacu-
um is applied to the vacuum (P2) side relative to the
pressure (P1) side.
MPX2202ASX/GSX
CASE 344F
PIN NUMBER
1
2
Gnd
+V
3
4
V
S
MPX2202GVP
CASE 344D
Preferred devices are Motorola recommended choices for future use
and best overall value.
–V
out
out
NOTE: Pin 1 is noted by the notch in
the lead.
Replaces MPX2200/D
REV 2
For More Information On This Product,
Go to: www.freescale.com
Motorola, Inc. 2002
SFE RrIeEeS scale Semiconductor, Inc.
M
P
X
2
2
0
2
M
P
X
V
2
2
0
2
G
MAXIMUM RATINGS(NOTE)
Rating
Symbol
Value
800
Unit
kPa
°C
Maximum Pressure (P1 > P2)
Storage Temperature
Operating Temperature
P
max
T
stg
–40 to +125
–40 to +125
T
A
°C
NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.
OPERATING CHARACTERISTICS (V = 10 Vdc, T = 25°C unless otherwise noted, P1 > P2)
S
A
Characteristics
Symbol
Min
0
Typ
—
Max
200
16
Unit
kPa
Vdc
mAdc
mV
(1)
Pressure Range
Supply Voltage
Supply Current
P
OP
V
S
—
10
I
o
—
6.0
40
—
(3)
Full Scale Span
V
FSS
38.5
–1.0
—
41.5
1.0
—
(4)
Offset
V
off
—
mV
Sensitivity
∆V/∆P
0.2
mV/kPa
(5)
Linearity
MPX2202D Series
MPX2202A Series
—
–0.6
–1.0
—
—
0.4
1.0
%V
FSS
(5)
Pressure Hysteresis (0 to 200 kPa)
—
—
—
—
±0.1
±0.5
—
—
—
%V
%V
%V
FSS
FSS
FSS
(5)
Temperature Hysteresis (–40°C to +125°C)
(5)
Temperature Effect on Full Scale Span
TCV
–2.0
–1.0
1000
1400
—
2.0
1.0
2500
3000
—
FSS
(5)
Temperature Effect on Offset
TCV
—
mV
off
Input Impedance
Z
in
—
Ω
Ω
Output Impedance
Z
out
—
(6)
Response Time (10% to 90%)
t
R
1.0
20
ms
ms
Warm–Up
—
—
—
—
(7)
Offset Stability
—
±0.5
—
%V
FSS
NOTES:
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self–heating.
3. Full Scale Span (V
) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
FSS
minimum rated pressure.
4. Offset (V ) is defined as the output voltage at the minimum rated pressure.
off
5. Accuracy (error budget) consists of the following:
•
•
Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
•
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
•
•
TcSpan:
TcOffset:
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative
to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
2
Motorola Sensor Device Data
For More Information On This Product,
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Freescale Semiconductor, MInPcX2.2 0 2
M P XV2 2 0 2G SE R I ES
LINEARITY
L
E
A
S
T
Linearity refers to how well a transducer’s output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 2) or (2)
a least squares best line fit. While a least squares fit gives
the “best case” linearity error (lower numerical value), the
calculations required are burdensome.
SQ U AR E
D EVI ATIO N
L EA S T S Q UA RE S FI T
E X AG G E RATE D
P E RFO RMA NC E
CU RV E
S TR AIG H T L IN E
DEV IATIO N
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola’s
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
E ND P O IN T
S TRA I G HT L I NE FI T
O
F
F
S
E
T
5 0
P RE SS UR E (% FUL L SC AL E )
1 00
0
Figure 2. Linearity Specification Comparison
ON–CHIP TEMPERATURE COMPENSATION and CALIBRATION
Figure 3 shows the output characteristics of the
MPX2202/MPXV2202G series at 25°C. The output is directly
proportional to the differential pressure and is essentially a
straight line.
The effects of temperature on Full Scale Span and Offset
are very small and are shown under Operating Characteristics.
V
T
=
1 0 V dc
S
40
35
30
25
20
15
10
5
= °C25
>
A
P 1
P
2
TY P
S PA N
RA NG E
(T YP )
MA X
M
I
N
0
-
ā
O
F
F
S
E
T
k
P
a
0
25
5 0
7 . 25
7
5
1 00
1 4. 5
1 25 1 50 1 75 2 00
2 1. 7 5 2 9
P
S
I
P RE S SU RE
Figure 3. Output versus Pressure Differential
SIL IC O N E G EL DI FF ER EN TI AL /G AU G E
D IE CO AT DI E
S I LI CO NE G E L
DI E CO AT
A B SO L UTE
DI E
S TA I NL ES S S TE EL
M ETA L CO V E R
S TA I NL E SS STE EL
ME TAL C O VER
P 1
P 1
EP O XY
C ASE
E P OX Y
CA S E
WI R E BON D
W IR E B O ND
L EA D FRA M E
DI E
B O ND
L EAD F R AM E
D IE
BO N D
D IFF ER EN TI AL/ G A UG E E LEM E NT
P 2
A B SO L UTE E LE M EN T
P 2
Figure 4. Cross–Sectional Diagrams (Not to Scale)
Figure 4 illustrates an absolute sensing die (right) and the
differential or gauge die in the basic chip carrier (Case 344).
A silicone gel isolates the die surface and wire bonds from
the environment, while allowing the pressure signal to be
transmitted to the silicon diaphragm.
ating characteristics and internal reliability and qualification
tests are based on use of dry air as the pressure media. Me-
dia other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
The MPX2202/MPXV2202G series pressure sensor oper-
Motorola Sensor Device Data
3
For More Information On This Product,
Go to: www.freescale.com
SFE RrIeEeS scale Semiconductor, Inc.
MP X2 20 2 M P XV 2 2 02 G
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
tial pressure applied, P1 > P2. The absolute sensor is
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing the silicone gel
which isolates the die from the environment. The differential
or gauge sensor is designed to operate with positive differen-
designed for vacuum applied to P1 side.
The Pressure (P1) side may be identified by using the
table below:
Part Number
Case Type
344
Pressure (P1) Side Identifier
Stainless Steel Cap
MPX2202A
MPX2202D
MPX2202DP
MPX2202AP
MPX2202GVP
MPX2202ASX
MPXV2202GP
MPXV2202DP
344C
344B
344D
344F
Side with Part Marking
Side with Port Attached
Stainless Steel Cap
MPX2202GP
MPX2202GSX
Side with Port Attached
Side with Port Attached
Side with Part Marking
1369
1351
ORDERING INFORMATION — UNIBODY PACKAGE (MPX2202 SERIES)
MPX Series
Order Number
Device Marking
Device Type
Options
Case Type
Basic Element
Absolute, Differential
344
MPX2202A
MPX2202D
MPX2202A
MPX2202D
Ported Elements
Differential, Dual Port
Absolute, Gauge
344C
344B
MPX2202DP
MPX2202DP
MPX2202AP
MPX2202GP
MPX2202AP
MPX2202GP
Absolute, Gauge Axial
Gauge, Vacuum
344F
344D
MPX2202ASX
MPX2202GSX
MPX2202A
MPX2202D
MPX2202GVP
MPX2202GVP
ORDERING INFORMATION — SMALL OUTLINE PACKAGE (MPXV2202G SERIES)
Device Type
Options
Case No.
1369
MPX Series Order No.
MPXV2202GP
Packing Options
Trays
Marking
MPXV2202G
MPXV2202G
Ported Elements
Gauge, Side Port, SMT
Differential, Dual Port, SMT
1351
MPXV2202DP
Trays
4
Motorola Sensor Device Data
For More Information On This Product,
Go to: www.freescale.com
Freescale Semiconductor, MInPcX2.2 0 2
M P XV2 2 0 2G SE R I ES
SMALL OUTLINE PACKAGE DIMENSIONS
2 PLACES 4 TIPS
0 .0 08ꢀ ( 0. 20 ) C A
B
E
A
GAGE
PLANE
e
5
4
e/2
.014 (0.35)
θ
L
A1
D
F
DETAIL G
8
1
N O TE S :
1. C O N TR O LL IN G D I MEN S I ON : I N CH .
2. I N TE R PR E T D I MEN S I ON S A ND TO L ER AN C ES PE R
A SME Y 14. 5M-1 994.
3. D I MEN S I ON S "D " A N D "E 1" D O N O T IN C L U D E M O LD
F LAS H O R P R OT R U SI O N S . MO LD FL ASH O R
P RO T R U SI O N S S HA LL N O T E XC EED 0 .0 06 (0 .1 52 )
P ER S ID E .
4. D I MEN S I ON "b " D O ES N O T I N C LU D E D AM BAR
P RO T R U SI O N . A LLO WA BLE D AM BAR PR O T RU S IO N
S HA LL B E 0. 008 (0 .20 3) MA XI M U M.
8X b
M
0. 00 4ꢀ (0 . 1)
C
A
B
E1
B
INCHES
DIM MIN MAX
0. 300
A1 0. 002
MILLIMETERS
MIN
7. 11
MAX
7 .6 2
0.2 5
1.0 7
12. 32
N
T
A
0. 330
0. 010
0. 042
0. 485
K
0. 05
0. 96
11. 81
b
D
E
0. 038
0. 465
0. 717 ꢀB SC
1
8
.
2
1
ꢀ
B
S
C
E1 0. 465
0. 485
11. 81
2. 54ꢀ B SC
12. 32
A
M
e
F
0. 100 ꢀB SC
0. 245
0. 120
0. 061
0. 270
0. 080
0. 009
0. 115
0. 255
0. 130
0. 071
0. 290
0. 090
0. 011
0. 125
6. 22
3. 05
1. 55
6. 86
2. 03
0. 23
2. 92
6.4 7
3.3 0
1.8 0
7.3 6
2.2 8
0 .2 8
3.1 7
K
L
8X
0. 00 4ꢀ ( 0.1 )
M
N
P
T
P
DETAIL G
SEATING
PLANE
C
°
0ꢀ ꢀ
°
7ꢀ ꢀ
°
0ꢀ ꢀ
°
7 ꢀꢀ
θ
CASE 1369–01
ISSUE O
Motorola Sensor Device Data
5
For More Information On This Product,
Go to: www.freescale.com
SFE RrIeEeS scale Semiconductor, Inc.
MP X2 20 2 M P XV 2 2 02 G
SMALL OUTLINE PACKAGE DIMENSIONS—CONTINUED
2 PLACES 4 TIPS
0 .0 06 ꢀ( 0. 15 ) C A
B
E
A
GAGE
PLANE
e
5
4
e/2
.014 (0.35)
θ
L
A1
D
F
DETAIL G
8
1
N O TE S :
8X b
1. C O N TR O LL IN G D I MEN S I ON : I N CH .
2. I N TE R PR E T D I MEN S I ON S A ND TO LE R AN C ES PE R
A SME Y 14. 5M-1 994.
3. D I MEN S I ON S "D " A N D "E 1" D O N O T IN C L U D E M O LD
F LAS H O R P R OT R U SI O N S . MO LD F LASH O R
P RO T R U SI O N S S HA LL N O T E XC E ED 0 .0 06 (0 .1 52 )
P ER S ID E .
4. D I MEN S I ON "b " D O ES N O T I N CL U D E D AM BAR
P RO T R U SI O N . A LLO WA BLE D AM BA R PR O TR U S IO N
S HA LL B E 0. 008 (0 .20 3) MA XI MU M .
S TY LE 1:
P IN 1. G N D
S TY LE 2:
P IN 1. N / C
2. V s
M
0. 00 4ꢀ (0 . 1)
C A B
2. +Vout
3. V s
3. G N D
4. Vout
5. N / C
6. N / C
7. N / C
8. N / C
4. -Vout
5. N / C
6. N / C
7. N / C
8. N / C
E1
B
INCHES
DIM MIN MAX
0. 370
A1 0. 002
MILLIMETERS
N
MIN
9. 39
MAX
9. 91
T
A
0. 390
0. 010
0. 042
0. 485
0. 700
0. 485
0. 05
0. 96
0. 25
1. 07
b
D
E
0. 038
0. 465
0. 680
11. 81
17. 27
11. 81
12. 32
17. 78
12. 32
E1 0. 465
M
A
e
F
0
.
1
0
0
ꢀ
B
S
C
2. 54ꢀ B SC
0. 240
0. 115
0. 040
0. 270
0. 160
0. 009
0. 110
0. 260
0. 135
0. 060
0. 290
0. 180
0. 011
0. 130
6. 10
2. 92
1. 02
6. 86
4. 06
0. 23
2. 79
6. 60
3. 43
1. 52
7. 37
4. 57
0. 28
3. 30
K
L
8X
0. 00 4ꢀ ( 0.1 )
M
N
P
T
K
P
DETAIL G
SEATING
PLANE
°
0ꢀ ꢀ
°
7ꢀ ꢀ
°
0ꢀ ꢀ
°
7ꢀ ꢀ
θ
C
CASE 1351–01
ISSUE O
6
Motorola Sensor Device Data
For More Information On This Product,
Go to: www.freescale.com
Freescale Semiconductor, MInPcX2.2 0 2
M P XV2 2 0 2G SE R I ES
UNIBODY PACKAGE DIMENSIONS
N O TE S :
C
1. D I MEN S I ON I N G A ND TO LE R AN C IN G PE R AS ME
Y 14. 5M, 199 4.
2. C O N TR O LL IN G D I MEN S I ON : I N C H .
R
3. D I MEN S I ON -A - I S I N CL U SI V E O F TH E
S TO P R I NG . MO LD S TO P RI N G N O T TO EX C EED
16. 00 (0 .63 0).
M O LD
M
Z
1
4
2
3
INCHES
DIM MIN MAX
MILLIMETERS
B
–A–
MIN
15. 11
13. 06
5. 08
MAX
1 6. 00
1 3. 56
5 .5 9
A
B
C
D
F
0. 595
0. 514
0. 200
0. 016
0. 048
0. 630
0. 534
0. 220
0. 020
0. 064
N
L
1
2
3
4
PIN 1
0. 41
1. 22
0 .5 1
1 .6 3
–T–
SEATING
PLANE
G
J
0. 100 ꢀB SC
2
.
5
4
ꢀ
B
S
C
F
0. 014
0. 695
0. 016
0. 725
0. 36
17. 65
0 .4 0
1 8. 42
G
J
L
F
Y
M
N
R
Y
Z
3
0
ꢀ
ꢀ
ꢀ
ꢀ
N
O
M
30ꢀ ꢀ ꢀꢀ N O M
_
_
D 4 PL
0
.
4
7
5
0. 495
0. 450
0. 052
0. 118
12. 07
1 2. 57
11 .4 3
1 .3 2
0. 430
0. 048
0. 106
10. 92
1. 22
2. 68
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. “F” 8 PL
M
M
T A
0. 13 6ꢀ ( 0.0 05)
3
.
0
0
S
T
Y
L
E
1
:
S TY LE 2:
P IN 1. V
S TY LE 3:
PIN 1. G R OU N D
2. + O U TPU T
3. + SU PPLY
4. - O U TPU T
P IN 1. G N D
2. -V O U T
3. V S
C C
2. - S U PP LY
3. + S UP P LY
4. G R O U N D
4
.
+
V
O
U
T
CASE 344–15
ISSUE Z
N O TE S :
–A–
SEATING
PLANE
1. D I MEN S I ON I N G A ND TO LE R AN C IN G PE R AN S I
Y 14. 5, 198 2.
2. C O N TR O LL IN G D I MEN S I ON : I N C H .
–T–
U
L
R
INCHES
DIM MIN MAX
MILLIMETERS
H
MIN
29. 08
17. 40
7. 75
MAX
2 9. 85
1 8. 16
8 .2 6
A
B
C
D
F
1. 145
0. 685
0. 305
0. 016
0. 048
1. 175
0. 715
0. 325
0. 020
0. 064
N
B
PORT #1
POSITIVE
PRESSURE
(P1)
–Q–
0. 41
1. 22
0 .5 1
1 .6 3
G
H
J
0. 100 ꢀB SC
2. 54ꢀ B SC
0. 182
0. 014
0. 695
0. 290
0. 420
0. 153
0. 153
0. 230
0. 220
0. 194
0. 016
0. 725
0. 300
0. 440
0. 159
0. 159
0. 250
0. 240
4. 62
0. 36
17. 65
7. 37
10. 67
3. 89
3. 89
5. 84
5. 59
4 .9 3
0 .4 1
1 8. 42
7 .6 2
11 .1 8
4 .0 4
4 .0 4
6 .3 5
6 .1 0
K
L
1
2
3 4
PIN 1
N
P
Q
R
S
U
K
–P–
S
M
S
0. 25 ꢀ( 0 .0 10)
T Q
J
F
0. 910 ꢀB SC
2
3
.
1
1
ꢀ
B
S
C
G
C
D 4 PL
M
S
S
Q
0
.
1
3
ꢀ
(
0
.
0
0
5
)
T
S
S TY LE 1:
P IN 1. G R O U N D
2. + O U TP U T
3. + S UP P LY
4. - O U TP U T
CASE 344B–01
ISSUE B
Motorola Sensor Device Data
7
For More Information On This Product,
Go to: www.freescale.com
SFE RrIeEeS scale Semiconductor, Inc.
MP X2 20 2 M P XV 2 2 02 G
UNIBODY PACKAGE DIMENSIONS — CONTINUED
N O TE S :
–A–
1. D I MEN S I ON I N G A ND TO LE R AN C I N G PE R AN S I
Y 14. 5M, 198 2.
2. C O N TR O LL IN G D I MEN S I ON : I N CH .
V
U
PORT #1
W
L
R
H
INCHES
DIM MIN MAX
MILLIMETERS
PORT #2
MIN
29. 08
17. 40
10. 29
0. 41
MAX
29. 85
18. 16
11. 05
0. 51
PORT #1
POSITIVE PRESSURE
(P1)
PORT #2
VACUUM
(P2)
A
B
C
D
F
1. 145
0. 685
0. 405
0. 016
0. 048
1. 175
0. 715
0. 435
0. 020
0. 064
N
–Q–
1. 22
1
.
6
3
G
H
J
0
.
1
0
0
ꢀ
B
S
C
2. 54ꢀ B SC
SEATING
PLANE
SEATING
PLANE
B
0. 182
0. 014
0. 695
0. 290
0. 420
0. 153
0. 153
0. 063
0. 220
0. 194
0. 016
0. 725
0. 300
0. 440
0. 159
0. 159
0. 083
0. 240
4. 62
0. 36
17. 65
7. 37
10. 67
3. 89
3. 89
1. 60
5. 59
4. 93
0. 41
18. 42
7. 62
11. 18
4. 04
4. 04
2. 11
1
2 3 4
K
L
PIN 1
K
–P–
N
P
Q
R
S
U
V
W
M
S
0. 25 ꢀ( 0 .0 10)
T Q
–T–
–T–
S
F
J
6. 10
G
C
0. 910 ꢀB SC
23. 11ꢀ BS C
D 4 PL
0. 248
0. 310
0. 278
0. 330
6. 30
7. 87
7. 06
8. 38
M
S
S
0. 13 ꢀ( 0 .0 05)
T S
Q
S TY LE 1:
P IN 1. G R O U N D
2. + O U TP U T
3. + S UP P LY
4. - O U TP U T
CASE 344C–01
ISSUE B
N O TE S :
1. D I MEN S IO N I N G A ND TO LE R AN C I N G PE R AN S I
Y 14. 5, 198 2.
2. C O N TR O LL IN G D I MEN S I ON : I N CH .
–A–
U
L
SEATING
PLANE
INCHES
DIM MIN MAX
MILLIMETERS
–T–
MIN
29. 08
17. 40
7. 75
MAX
29. 85
18. 16
8. 26
PORT #2
VACUUM
(P2)
A
B
C
D
F
1. 145
0. 685
0. 305
0. 016
0. 048
1. 175
0. 715
0. 325
0. 020
0. 064
H
R
POSITIVE
PRESSURE
(P1)
0. 41
1. 22
0. 51
1. 63
N
B
–Q–
G
H
J
0. 100 ꢀB SC
2
.
5
4
ꢀ
B
S
C
0. 182
0. 014
0. 695
0. 290
0. 420
0. 153
0. 153
0. 230
0. 220
0. 194
0. 016
0. 725
0. 300
0. 440
0. 159
0. 158
0. 250
0. 240
4. 62
0. 36
17. 65
7. 37
10. 67
3. 89
3. 89
5. 84
5. 59
4. 93
0. 41
18. 42
7. 62
11. 18
4. 04
4. 04
6. 35
6. 10
K
L
N
P
Q
R
S
U
1
2
3 4
K
PIN 1
S
0
.
9
1
0
ꢀ
B
S
C
2
3
.
1
1
ꢀ
B
S
C
C
F
–P–
G
S
T
Y
L
E
1
:
J
M
S
T Q
P IN 1. G R O U N D
2. + O U TP U T
3. + S U PP LY
4. - O U TP U T
0
.
2
5
ꢀ
(
0
.
0
1
0
)
D 4 PL
M
S
S
Q
0
.
1
3
ꢀ
(
0
.
0
0
5
)
T
S
CASE 344D–01
ISSUE B
8
Motorola Sensor Device Data
For More Information On This Product,
Go to: www.freescale.com
Freescale Semiconductor, MInPcX2.2 0 2
M P XV2 2 0 2G SE R I ES
UNIBODY PACKAGE DIMENSIONS — CONTINUED
N O TE S :
–T–
1. D I MEN S I ON I N G A N D TO LER A N C IN G PE R
A NS I Y 14. 5M, 198 2.
2. C O N TR O LL IN G D I MEN S I ON : IN C H .
C
A
U
–Q–
E
INCHES
DIM MIN MAX
MILLIMETERS
MIN
27 .4 3
18 .8 0
16 .0 0
0.4 1
MAX
2 8. 45
1 9. 30
1 6. 51
0 .5 1
A
B
C
D
E
F
1. 080
0. 740
0. 630
0. 016
0. 160
0. 048
1. 120
0. 760
0. 650
0. 020
0. 180
0. 064
N
S
B
R
4.0 6
1.2 2
4 .5 7
1 .6 3
V
G
J
0. 100 ꢀB SC
2 .5 4ꢀB SC
0. 014
0. 220
0. 070
0. 150
0. 150
0. 440
0. 695
0. 840
0. 182
0. 016
0. 240
0. 080
0. 160
0. 160
0. 460
0. 725
0. 860
0. 194
0.3 6
5.5 9
0 .4 1
6 .1 0
K
N
P
Q
R
S
U
V
PORT #1
POSITIVE
PRESSURE
(P1)
PIN 1
1.7 8
3.8 1
2 .0 3
4 .0 6
–P–
M
M
T Q
0
.
2
5
ꢀ
(
0
.
0
1
0
)
4
3
2
1
3.8 1
4 .0 6
11 .1 8
17 .6 5
21 .3 4
4.6 2
11 .6 8
1 8. 42
2 1. 84
4 .9 2
K
F
J
G
S TY LE 1:
P IN 1. G R O U N D
D 4 PL
0 .1 3 ꢀ (0 . 00 5 )
2. V (+ ) O U T
3. V S U PP LY
4. V (- ) O U T
M
S
S
Q
T
P
CASE 344F–01
ISSUE B
Motorola Sensor Device Data
9
For More Information On This Product,
Go to: www.freescale.com
SFE RrIeEeS scale Semiconductor, Inc.
MP X2 20 2 M P XV 2 2 02 G
NOTES
10
Motorola Sensor Device Data
For More Information On This Product,
Go to: www.freescale.com
Freescale Semiconductor, MInPcX2.2 0 2
M P XV2 2 0 2G SE R I ES
NOTES
Motorola Sensor Device Data
11
For More Information On This Product,
Go to: www.freescale.com
SFE RrIeEeS scale Semiconductor, Inc.
MP X2 20 2 M P XV 2 2 02 G
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owners.
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