MPX5050GSX [MOTOROLA]
OPERATING OVERVIEW INTEGRATED PRESSURE SENSOR 0 to 50 kPa (0 to 7.25 psi) 0.2 to 4.7 Volts Output; 操作概述集成压力传感器0到50千帕( 0至7.25磅) 0.2至4.7伏特输出型号: | MPX5050GSX |
厂家: | MOTOROLA |
描述: | OPERATING OVERVIEW INTEGRATED PRESSURE SENSOR 0 to 50 kPa (0 to 7.25 psi) 0.2 to 4.7 Volts Output |
文件: | 总10页 (文件大小:192K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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by MPX5050/D
SEMICONDUCTOR TECHNICAL DATA
OPERATING OVERVIEW
INTEGRATED
PRESSURE SENSOR
0 to 50 kPa (0 to 7.25 psi)
0.2 to 4.7 Volts Output
The MPX5050 series piezoresistive transducer is a state–of–the–art monolithic silicon
pressure sensor designed for a wide range of applications, but particularly those
employing a microcontroller or microprocessor with A/D inputs. This patented, single
element transducer combines advanced micromachining techniques, thin–film metalliza-
tion, and bipolar processing to provide an accurate, high level analog output signal that
is proportional to the applied pressure.
Features
•
•
•
•
•
•
2.5% Maximum Error over 0° to 85°C
Ideally suited for Microprocessor or Microcontroller–Based Systems
Temperature Compensated Over – 40° to +125°C
Patented Silicon Shear Stress Strain Gauge
Durable Epoxy Unibody Element
BASIC CHIP CARRIER
ELEMENT
CASE 867–08, STYLE 1
Easy–to–Use Chip Carrier Option
V
S
3
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
X–ducer
SENSING
ELEMENT
1
V
out
DIFFERENTIAL PORT OPTION
CASE 867C–05, STYLE 1
GAIN STAGE #1
NOTE: Pin 1 is the notched pin.
2
PINS 4, 5 AND 6 ARE NO CONNECTS
PIN NUMBER
GND
1
2
3
V
4
5
6
N/C
N/C
N/C
out
Grd
Figure 1. Fully Integrated Pressure Sensor Schematic
V
S
NOTE: Pins 4, 5, and 6 are internal
device connections. Do not connect
to external circuitry or ground.
(1)
MAXIMUM RATINGS
Parametrics
(2)
Symbol
Value
200
Unit
kPa
kPa
°C
Overpressure (P1 > P2)
P
max
(2)
Burst Pressure (P1 > P2)
P
burst
700
Storage Temperature
Operating Temperature
T
stg
–40° to +125°
–40° to +125°
T
A
°C
1. T = 25°C unless otherwise noted.
C
2. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Senseon and X–ducer are trademarks of Motorola, Inc.
REV 3
Motorola, Inc. 1997
OPERATING CHARACTERISTICS (V = 5.0 Vdc, T = 25°C unless otherwise noted, P1 > P2)
S
A
Characteristic
Symbol
Min
0
Typ
—
Max
50
Unit
kPa
(1)
Pressure Range
P
OP
(2)
Supply Voltage
V
4.75
—
5.0
7.0
0.20
5.25
10.0
0.313
Vdc
S
Supply Current
I
o
mAdc
Vdc
(3)
Minimum Pressure Offset
@ V = 5.0 Volts
(0 to 85°C)
V
off
0.088
S
(4)
Full Scale Output
(0 to 85°C)
(0 to 85°C)
V
4.587
—
4.70
4.50
4.813
—
Vdc
Vdc
FSO
@ V = 5.0 Volts
S
(5)
Full Scale Span
V
FSS
@ V = 5.0 Volts
S
(6)
Accuracy
—
—
—
—
—
—
—
—
90
2.5
—
%V
FSS
Sensitivity
V/P
mV/kPa
(7)
Response Time
t
R
1.0
0.1
20
—
mS
Output Source Current at Full Scale Output
(8)
I +
o
—
mAdc
mSec
Warm–Up Time
(9)
—
—
—
Offset Stability
0.5
—
%V
FSS
Decoupling circuit shown in Figure 4 required to meet electrical specifications.
MECHANICAL CHARACTERISTICS
Characteristic
Weight, Basic Element (Case 867)
(10)
Symbol
Min
—
Typ
4.0
—
Max
—
Unit
—
—
Grams
kPa
Common Mode Line Pressure
NOTES:
—
690
1. 1.0kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (V ) is defined as the output voltage at the minimum rated pressure.
off
4. Full Scale Output (V
) is defined as the output voltage at the maximum or full rated pressure.
FSO
) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
5. Full Scale Span (V
FSS
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
•
•
Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
•
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from
minimum or maximum rated pressure at 25°C.
•
•
TcSpan:
TcOffset:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative
to 25°C.
•
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of V
at 25°C.
FSS
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
8. Warm–up is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
10. Common mode pressures beyond what is specified may result in leakage at the case–to–lead interface.
2
Motorola Sensor Device Data
Figure 3 illustrates the Differential/Gauge Sensing Chip in
the basic chip carrier (Case 867). A fluorosilicone gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm.
The MPX5050 series pressure sensor operating charac-
teristics, and internal reliability and qualification tests are
based on use of dry air as the pressure media. Media, other
than dry air, may have adverse effects on sensor perfor-
mance and long–term reliability. Contact the factory for in-
formation regarding media compatibility in your application.
Figure 4 shows a typical decoupling circuit for interfacing
the integrated sensor to the A/D input of a microprocessor.
Proper decoupling of the power supply is recommended.
Figure 2 shows the sensor output signal relative to pres-
sure input. Typical, minimum, and maximum output curves
are shown for operation over a temperature range of 0° to
85°C using the decoupling circuit below. (The output will sat-
urate outside of the specified pressure range.)
5.0
TRANSFER FUNCTION:
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
V
= V *(0.018*P+0.04) ± ERROR
S
out
V
= 5.0 Vdc
S
TEMP = 0 to 85°C
TYPICAL
MIN
30
MAX
0
5
10
15
20
25
35
40
45
50
55
DIFFERENTIAL PRESSURE (kPa)
Figure 2. Output versus Pressure Differential
MPX5050
FLUORO SILICONE
GEL DIE COAT
STAINLESS STEEL
OUPUT
A/D
DIE
METAL COVER
(PIN 1)
P1
EPOXY
50 pF
51 k
WIRE BOND
PLASTIC
µ
PROCESSOR
CASE
DIE
LEAD FRAME
BOND
DIFFERENTIAL/GAUGE ELEMENT
P2
Figure 3. Cross–Sectional Diagram
(Not to Scale)
Figure 4. Typical Decoupling Filter for Sensor to
Microprocessor Interface
Motorola Sensor Device Data
3
Transfer Function
Nominal Transfer Value: V
= V (P x 0.018 + 0.04)
S
out
+/– (Pressure Error x Temp. Factor x 0.018 x V )
S
V
= 5.0 V ± 0.25 Vdc
S
Temperature Error Band
MPX5050D Series
4.0
Temp
Multiplier
3.0
– 40
0 to 85
+125
3
1
3
Temperature
Error
2.0
Factor
1.0
0.0
–40
–20
0
20
40
60
80
100
120
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C.
Pressure Error Band
Error Limits for Pressure
3.0
2.0
1.0
0.0
Pressure (in kPa)
0
10
20
30
40
50
60
–1.0
– 2.0
– 3.0
Pressure
Error (Max)
± 1.25 kPa
0 to 50 kPa
4
Motorola Sensor Device Data
PRESSURE (P1) / VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
pressure sensor is designed to operate with positive differen-
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel
which protects the die from harsh media. The Motorola MPX
tial pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
Pressure (P1)
Side Identifier
Part Number
Case Type
MPX5050D
867–08
Stainless Steel Cap
MPX5050DP
MPX5050GP
MPX5050GVP
MPX5050GS
MPX5050GVS
MPX5050GSX
MPX5050GVSX
867C–05
867B–04
867D–04
867E–03
867A–04
867F–03
867G–03
Side with Part Marking
Side with Port Attached
Stainless Steel Cap
Side with Port Attached
Stainless Steel Cap
Side with Port Attached
Stainless Steel Cap
ORDERING INFORMATION
The MPX5050 pressure sensor is available in differential and gauge configurations. Devices are available in the basic
element package or with pressure port fittings that provide printed circuit board mounting ease and barbed hose pressure
connections.
MPX Series
Device Type
Basic Element
Ported Elements
Options
Case Type
Order Number
MPX5050D
Device Marking
MPX5050D
Differential
867–08
Differential Dual Ports
Gauge
867C–05
867B–04
867D–04
867E–03
867A–04
867F–03
867G–03
MPX5050DP
MPX5050GP
MPX5050GVP
MPX5050GS
MPX5050GVS
MPX5050GSX
MPX5050GVSX
MPX5050DP
MPX5050GP
MPX5050GVP
MPX5050D
Gauge Vacuum Port
Gauge, Axial
Gauge Vacuum Axial
Gauge, Axial PC Mount
Gauge Vacuum Axial PC Mount
MPX5050D
MPX5050D
MPX5050D
Motorola Sensor Device Data
5
PACKAGE DIMENSIONS
C
R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION –A– IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
POSITIVE PRESSURE
(P1)
M
B
–A–
INCHES
MILLIMETERS
N
L
DIM
A
B
C
D
F
MIN
MAX
0.630
0.534
0.220
0.033
0.064
MIN
15.11
13.06
5.08
MAX
16.00
13.56
5.59
0.595
0.514
0.200
0.027
0.048
PIN 1
1
2
3
4
5
6
SEATING
PLANE
–T–
0.68
0.84
1.22
1.63
G
J
S
G
J
L
M
N
R
S
0.100 BSC
2.54 BSC
F
0.014
0.695
0.016
0.725
0.36
0.40
D6 PL
17.65
18.42
30 NOM
30 NOM
M
M
0.136 (0.005)
T A
0.475
0.430
0.090
0.495
0.450
0.105
12.07
10.92
2.29
12.57
11.43
2.66
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
CASE 867–08
ISSUE N
6. VEX
BASIC ELEMENT (D)
A
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
POSITIVE
PRESSURE
(P1)
INCHES
MILLIMETERS
–B–
V
DIM
A
B
C
D
E
MIN
MAX
0.720
0.255
0.820
0.033
0.186
0.064
MIN
17.53
6.22
19.81
0.69
MAX
18.28
6.48
20.82
0.84
0.690
0.245
0.780
0.027
0.178
0.048
PIN 1
PORT #2
VACUUM
(P2)
4.52
1.22
4.72
1.63
1
2
3
4
5
6
F
G
J
K
N
S
0.100 BSC
2.54 BSC
K
S
0.014
0.345
0.300
0.220
0.182
0.016
0.375
0.310
0.240
0.194
0.36
8.76
7.62
5.59
4.62
0.41
9.53
7.87
6.10
4.93
G
J
V
F
N
E
D6 PL
STYLE 1:
PIN 1. VOUT
2. GROUND
M
M
0.13 (0.005)
T B
–T–
3. VCC
4. V1
5. V2
6. VEX
CASE 867A–04
ISSUE E
VACUUM SIDE PORTED (GVS)
6
Motorola Sensor Device Data
PACKAGE DIMENSIONS–CONTINUED
A
U
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
SEATING
PLANE
–T–
R
PORT #1
POSITIVE
PRESSURE (P1)
INCHES
MILLIMETERS
V
DIM
A
B
C
D
F
MIN
MAX
1.175
0.715
0.325
0.033
0.064
MIN
29.08
17.40
7.75
0.68
1.22
MAX
29.85
18.16
8.26
0.84
1.63
1.145
0.685
0.305
0.027
0.048
–Q–
N
G
J
K
L
N
P
Q
R
S
0.100 BSC
2.54 BSC
0.014
0.695
0.290
0.420
0.153
0.153
0.230
0.220
0.016
0.725
0.300
0.440
0.159
0.159
0.250
0.240
0.36
17.65
7.37
0.41
18.42
7.62
B
10.67
3.89
11.18
4.04
K
1
2
3
4
5
6
3.89
4.04
5.84
6.35
PIN 1
S
5.59
6.10
U
V
0.910 BSC
23.11 BSC
–P–
C
0.182
0.194
4.62
4.93
G
D6 PL
0.13 (0.005)
M
M
0.25 (0.010)
T
Q
F
J
M
S
S
T
P
Q
STYLE 1:
PIN 1.
V
OUT
2. GROUND
3.
V
CC
4. V1
5. V2
CASE 867B–04
ISSUE E
6.
V
EX
PRESSURE SIDE PORTED (GP)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
P
–A–
U
M
M
0.25 (0.010)
T Q
X
INCHES
MILLIMETERS
L
W
DIM
A
B
C
D
F
MIN
MAX
1.175
0.715
0.435
0.033
0.064
MIN
29.08
17.40
10.29
0.68
MAX
29.85
18.16
11.05
0.84
R
N
1.145
0.685
0.405
0.027
0.048
V
PORT #1
POSITIVE
PRESSURE
(P1)
PORT #2 VACUUM (P2)
PORT #1 POSITIVE
PRESSURE (P1)
1.22
1.63
G
J
K
L
N
P
Q
R
S
0.100 BSC
2.54 BSC
–Q–
PORT #2
VACUUM
(P2)
0.014
0.695
0.290
0.420
0.153
0.153
0.063
0.220
0.016
0.725
0.300
0.440
0.159
0.159
0.083
0.240
0.36
17.65
7.37
10.67
3.89
0.41
18.42
7.62
11.18
4.04
4.04
2.11
B
PIN 1
3.89
1.60
K
1
2
3
4
5
6
5.59
6.10
U
V
W
X
0.910 BSC
23.11 BSC
C
0.182
0.310
0.248
0.194
0.330
0.278
4.62
7.87
6.30
4.93
8.38
7.06
S
SEATING
PLANE
SEATING
PLANE
–T–
–T–
J
6 PL
D
G
STYLE 1:
PIN 1.
F
M
M
0.13 (0.005)
A
V
OUT
2. GROUND
3.
V
CC
4. V1
5. V2
CASE 867C–05
ISSUE F
6.
V
EX
PRESSURE AND VACUUM SIDES PORTED (DP)
Motorola Sensor Device Data
7
PACKAGE DIMENSIONS–CONTINUED
–P–
M
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
0.25 (0.010)
T Q
A
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
U
PORT #2
SEATING
PLANE
L
INCHES
MILLIMETERS
–T–
R
VACUUM (P2)
DIM
A
B
C
D
F
MIN
MAX
1.175
0.715
0.325
0.033
0.064
MIN
29.08
17.40
7.75
0.68
1.22
MAX
29.85
18.16
8.26
0.84
1.63
V
1.145
0.685
0.305
0.027
0.048
POSITIVE PRESSURE (P1)
–Q–
N
B
G
J
K
L
N
P
Q
R
S
0.100 BSC
2.54 BSC
0.014
0.695
0.290
0.420
0.153
0.153
0.230
0.220
0.016
0.725
0.300
0.440
0.159
0.159
0.250
0.240
0.36
17.65
7.37
0.41
18.42
7.62
PIN 1
10.67
3.89
11.18
4.04
3.89
4.04
K
5.84
6.35
1
2
3
4
5
6
5.59
6.10
U
V
0.910 BSC
23.11 BSC
S
0.182
0.194
4.62
4.93
C
G
6 PL
D
STYLE 1:
PIN 1.
J
V
F
OUT
M
S
S
0.13 (0.005)
T
P
Q
2. GROUND
3.
4. V1
5. V2
V
CC
CASE 867D–04
ISSUE F
6.
V
EX
VACUUM SIDE PORTED (GVP)
NOTES:
C
A
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES
MILLIMETERS
DIM
A
B
C
D
E
MIN
MAX
0.720
0.255
0.820
0.033
0.186
0.064
MIN
17.53
6.22
19.81
0.69
MAX
18.28
6.48
20.82
0.84
0.690
0.245
0.780
0.027
0.178
0.048
–B–
V
PIN 1
4.52
1.22
4.72
1.63
F
PORT #1
POSITIVE
PRESSURE
(P1)
6
5
4
3
2
1
G
J
K
N
S
0.100 BSC
2.54 BSC
0.014
0.345
0.300
0.220
0.182
0.016
0.375
0.310
0.240
0.194
0.36
8.76
7.62
5.59
4.62
0.41
9.53
7.87
6.10
4.93
K
S
V
J
G
STYLE 1:
PIN 1.
F
N
E
D 6 PL
V
OUT
2. GROUND
3.
4. V1
5. V2
V
–T–
M
M
0.13 (0.005)
T B
CC
6.
V
EX
CASE 867E–03
ISSUE D
PRESSURE SIDE PORTED (AS, GS)
8
Motorola Sensor Device Data
PACKAGE DIMENSIONS–CONTINUED
–T–
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
C
A
U
E
–Q–
INCHES
MILLIMETERS
DIM
A
B
C
D
E
MIN
MAX
1.120
0.760
0.650
0.033
0.180
0.064
MIN
27.43
18.80
16.00
0.68
MAX
28.45
19.30
16.51
0.84
1.080
0.740
0.630
0.027
0.160
0.048
N
V
4.06
1.22
4.57
1.63
B
F
G
J
K
N
P
Q
R
S
U
V
0.100 BSC
2.54 BSC
R
0.014
0.220
0.070
0.150
0.150
0.440
0.695
0.840
0.182
0.016
0.240
0.080
0.160
0.160
0.460
0.725
0.860
0.194
0.36
5.59
0.41
6.10
PIN 1
PORT #1
POSITIVE
PRESSURE
(P1)
1.78
2.03
–P–
3.81
4.06
6
5
4
3
2
1
M
M
0.25 (0.010)
T Q
3.81
4.06
S
11.18
17.65
21.34
4.62
11.68
18.42
21.84
4.93
K
J
D6 PL
G
STYLE 1:
PIN 1.
M
S
S
0.13 (0.005)
T
P
Q
V
OUT
2. GROUND
3.
V
F
CC
4. V1
5. V2
6.
V
EX
CASE 867F–03
ISSUE D
PRESSURE SIDE PORTED (GSX)
–T–
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
C
A
U
E
–Q–
INCHES
MILLIMETERS
DIM
A
B
C
D
E
F
G
J
K
N
P
Q
R
S
MIN
MAX
1.120
0.760
0.650
0.033
0.180
0.064
MIN
27.43
18.80
16.00
0.68
4.06
1.22
2.54 BSC
0.36
5.59
1.78
3.81
3.81
11.18
17.65
21.34
4.62
MAX
28.45
19.30
16.51
0.84
1.080
0.740
0.630
0.027
0.160
0.048
POSITIVE
PRESSURE
(P1)
N
S
4.57
1.63
V
B
0.100 BSC
R
0.014
0.220
0.070
0.150
0.150
0.440
0.695
0.840
0.182
0.016
0.240
0.080
0.160
0.160
0.460
0.725
0.860
0.194
0.41
6.10
2.03
4.06
4.06
11.68
18.42
21.84
4.93
PORT #2
VACUUM
(P2)
PIN 1
–P–
1
2
3
4
5
6
M
M
0.25 (0.010)
T Q
U
V
K
J
D6 PL
STYLE 1:
PIN 1.
G
V
M
S
S
0.13 (0.005)
T
P
Q
OUT
2. GROUND
3.
V
CC
4. V1
5. V2
F
6.
V
EX
CASE 867G–03
ISSUE D
VACUUM SIDE PORTED (GVSX)
Motorola Sensor Device Data
9
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