MPX5050GSX [MOTOROLA]

OPERATING OVERVIEW INTEGRATED PRESSURE SENSOR 0 to 50 kPa (0 to 7.25 psi) 0.2 to 4.7 Volts Output; 操作概述集成压力传感器0到50千帕( 0至7.25磅) 0.2至4.7伏特输出
MPX5050GSX
型号: MPX5050GSX
厂家: MOTOROLA    MOTOROLA
描述:

OPERATING OVERVIEW INTEGRATED PRESSURE SENSOR 0 to 50 kPa (0 to 7.25 psi) 0.2 to 4.7 Volts Output
操作概述集成压力传感器0到50千帕( 0至7.25磅) 0.2至4.7伏特输出

传感器 换能器 压力传感器
文件: 总10页 (文件大小:192K)
中文:  中文翻译
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by MPX5050/D  
SEMICONDUCTOR TECHNICAL DATA  
OPERATING OVERVIEW  
INTEGRATED  
PRESSURE SENSOR  
0 to 50 kPa (0 to 7.25 psi)  
0.2 to 4.7 Volts Output  
The MPX5050 series piezoresistive transducer is a state–of–the–art monolithic silicon  
pressure sensor designed for a wide range of applications, but particularly those  
employing a microcontroller or microprocessor with A/D inputs. This patented, single  
element transducer combines advanced micromachining techniques, thin–film metalliza-  
tion, and bipolar processing to provide an accurate, high level analog output signal that  
is proportional to the applied pressure.  
Features  
2.5% Maximum Error over 0° to 85°C  
Ideally suited for Microprocessor or Microcontroller–Based Systems  
Temperature Compensated Over – 40° to +125°C  
Patented Silicon Shear Stress Strain Gauge  
Durable Epoxy Unibody Element  
BASIC CHIP CARRIER  
ELEMENT  
CASE 867–08, STYLE 1  
Easy–to–Use Chip Carrier Option  
V
S
3
THIN FILM  
TEMPERATURE  
COMPENSATION  
AND  
GAIN STAGE #2  
AND  
GROUND  
REFERENCE  
SHIFT CIRCUITRY  
X–ducer  
SENSING  
ELEMENT  
1
V
out  
DIFFERENTIAL PORT OPTION  
CASE 867C–05, STYLE 1  
GAIN STAGE #1  
NOTE: Pin 1 is the notched pin.  
2
PINS 4, 5 AND 6 ARE NO CONNECTS  
PIN NUMBER  
GND  
1
2
3
V
4
5
6
N/C  
N/C  
N/C  
out  
Grd  
Figure 1. Fully Integrated Pressure Sensor Schematic  
V
S
NOTE: Pins 4, 5, and 6 are internal  
device connections. Do not connect  
to external circuitry or ground.  
(1)  
MAXIMUM RATINGS  
Parametrics  
(2)  
Symbol  
Value  
200  
Unit  
kPa  
kPa  
°C  
Overpressure (P1 > P2)  
P
max  
(2)  
Burst Pressure (P1 > P2)  
P
burst  
700  
Storage Temperature  
Operating Temperature  
T
stg  
40° to +125°  
40° to +125°  
T
A
°C  
1. T = 25°C unless otherwise noted.  
C
2. Exposure beyond the specified limits may cause permanent damage or degradation to the device.  
Senseon and X–ducer are trademarks of Motorola, Inc.  
REV 3  
Motorola, Inc. 1997  
OPERATING CHARACTERISTICS (V = 5.0 Vdc, T = 25°C unless otherwise noted, P1 > P2)  
S
A
Characteristic  
Symbol  
Min  
0
Typ  
Max  
50  
Unit  
kPa  
(1)  
Pressure Range  
P
OP  
(2)  
Supply Voltage  
V
4.75  
5.0  
7.0  
0.20  
5.25  
10.0  
0.313  
Vdc  
S
Supply Current  
I
o
mAdc  
Vdc  
(3)  
Minimum Pressure Offset  
@ V = 5.0 Volts  
(0 to 85°C)  
V
off  
0.088  
S
(4)  
Full Scale Output  
(0 to 85°C)  
(0 to 85°C)  
V
4.587  
4.70  
4.50  
4.813  
Vdc  
Vdc  
FSO  
@ V = 5.0 Volts  
S
(5)  
Full Scale Span  
V
FSS  
@ V = 5.0 Volts  
S
(6)  
Accuracy  
90  
2.5  
%V  
FSS  
Sensitivity  
V/P  
mV/kPa  
(7)  
Response Time  
t
R
1.0  
0.1  
20  
mS  
Output Source Current at Full Scale Output  
(8)  
I +  
o
mAdc  
mSec  
Warm–Up Time  
(9)  
Offset Stability  
0.5  
%V  
FSS  
Decoupling circuit shown in Figure 4 required to meet electrical specifications.  
MECHANICAL CHARACTERISTICS  
Characteristic  
Weight, Basic Element (Case 867)  
(10)  
Symbol  
Min  
Typ  
4.0  
Max  
Unit  
Grams  
kPa  
Common Mode Line Pressure  
NOTES:  
690  
1. 1.0kPa (kiloPascal) equals 0.145 psi.  
2. Device is ratiometric within this specified excitation range.  
3. Offset (V ) is defined as the output voltage at the minimum rated pressure.  
off  
4. Full Scale Output (V  
) is defined as the output voltage at the maximum or full rated pressure.  
FSO  
) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the  
5. Full Scale Span (V  
FSS  
minimum rated pressure.  
6. Accuracy (error budget) consists of the following:  
Linearity:  
Output deviation from a straight line relationship with pressure over the specified pressure range.  
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is  
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure  
applied.  
Pressure Hysteresis:  
Output deviation at any pressure within the specified range, when this pressure is cycled to and from  
minimum or maximum rated pressure at 25°C.  
TcSpan:  
TcOffset:  
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.  
Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative  
to 25°C.  
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of V  
at 25°C.  
FSS  
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to  
a specified step change in pressure.  
8. Warm–up is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.  
9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.  
10. Common mode pressures beyond what is specified may result in leakage at the case–to–lead interface.  
2
Motorola Sensor Device Data  
Figure 3 illustrates the Differential/Gauge Sensing Chip in  
the basic chip carrier (Case 867). A fluorosilicone gel isolates  
the die surface and wire bonds from the environment, while  
allowing the pressure signal to be transmitted to the sensor  
diaphragm.  
The MPX5050 series pressure sensor operating charac-  
teristics, and internal reliability and qualification tests are  
based on use of dry air as the pressure media. Media, other  
than dry air, may have adverse effects on sensor perfor-  
mance and long–term reliability. Contact the factory for in-  
formation regarding media compatibility in your application.  
Figure 4 shows a typical decoupling circuit for interfacing  
the integrated sensor to the A/D input of a microprocessor.  
Proper decoupling of the power supply is recommended.  
Figure 2 shows the sensor output signal relative to pres-  
sure input. Typical, minimum, and maximum output curves  
are shown for operation over a temperature range of 0° to  
85°C using the decoupling circuit below. (The output will sat-  
urate outside of the specified pressure range.)  
5.0  
TRANSFER FUNCTION:  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
V
= V *(0.018*P+0.04) ± ERROR  
S
out  
V
= 5.0 Vdc  
S
TEMP = 0 to 85°C  
TYPICAL  
MIN  
30  
MAX  
0
5
10  
15  
20  
25  
35  
40  
45  
50  
55  
DIFFERENTIAL PRESSURE (kPa)  
Figure 2. Output versus Pressure Differential  
MPX5050  
FLUORO SILICONE  
GEL DIE COAT  
STAINLESS STEEL  
OUPUT  
A/D  
DIE  
METAL COVER  
(PIN 1)  
P1  
EPOXY  
50 pF  
51 k  
WIRE BOND  
PLASTIC  
µ
PROCESSOR  
CASE  
DIE  
LEAD FRAME  
BOND  
DIFFERENTIAL/GAUGE ELEMENT  
P2  
Figure 3. Cross–Sectional Diagram  
(Not to Scale)  
Figure 4. Typical Decoupling Filter for Sensor to  
Microprocessor Interface  
Motorola Sensor Device Data  
3
Transfer Function  
Nominal Transfer Value: V  
= V (P x 0.018 + 0.04)  
S
out  
+/– (Pressure Error x Temp. Factor x 0.018 x V )  
S
V
= 5.0 V ± 0.25 Vdc  
S
Temperature Error Band  
MPX5050D Series  
4.0  
Temp  
Multiplier  
3.0  
– 40  
0 to 85  
+125  
3
1
3
Temperature  
Error  
2.0  
Factor  
1.0  
0.0  
–40  
–20  
0
20  
40  
60  
80  
100  
120  
140  
Temperature in °C  
NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C.  
Pressure Error Band  
Error Limits for Pressure  
3.0  
2.0  
1.0  
0.0  
Pressure (in kPa)  
0
10  
20  
30  
40  
50  
60  
–1.0  
– 2.0  
– 3.0  
Pressure  
Error (Max)  
± 1.25 kPa  
0 to 50 kPa  
4
Motorola Sensor Device Data  
PRESSURE (P1) / VACUUM (P2) SIDE IDENTIFICATION TABLE  
Motorola designates the two sides of the pressure sensor  
pressure sensor is designed to operate with positive differen-  
as the Pressure (P1) side and the Vacuum (P2) side. The  
Pressure (P1) side is the side containing fluorosilicone gel  
which protects the die from harsh media. The Motorola MPX  
tial pressure applied, P1 > P2.  
The Pressure (P1) side may be identified by using the  
table below:  
Pressure (P1)  
Side Identifier  
Part Number  
Case Type  
MPX5050D  
867–08  
Stainless Steel Cap  
MPX5050DP  
MPX5050GP  
MPX5050GVP  
MPX5050GS  
MPX5050GVS  
MPX5050GSX  
MPX5050GVSX  
867C–05  
867B–04  
867D–04  
867E–03  
867A–04  
867F–03  
867G–03  
Side with Part Marking  
Side with Port Attached  
Stainless Steel Cap  
Side with Port Attached  
Stainless Steel Cap  
Side with Port Attached  
Stainless Steel Cap  
ORDERING INFORMATION  
The MPX5050 pressure sensor is available in differential and gauge configurations. Devices are available in the basic  
element package or with pressure port fittings that provide printed circuit board mounting ease and barbed hose pressure  
connections.  
MPX Series  
Device Type  
Basic Element  
Ported Elements  
Options  
Case Type  
Order Number  
MPX5050D  
Device Marking  
MPX5050D  
Differential  
867–08  
Differential Dual Ports  
Gauge  
867C–05  
867B–04  
867D–04  
867E–03  
867A–04  
867F–03  
867G–03  
MPX5050DP  
MPX5050GP  
MPX5050GVP  
MPX5050GS  
MPX5050GVS  
MPX5050GSX  
MPX5050GVSX  
MPX5050DP  
MPX5050GP  
MPX5050GVP  
MPX5050D  
Gauge Vacuum Port  
Gauge, Axial  
Gauge Vacuum Axial  
Gauge, Axial PC Mount  
Gauge Vacuum Axial PC Mount  
MPX5050D  
MPX5050D  
MPX5050D  
Motorola Sensor Device Data  
5
PACKAGE DIMENSIONS  
C
R
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION –A– IS INCLUSIVE OF THE MOLD  
STOP RING. MOLD STOP RING NOT TO EXCEED  
16.00 (0.630).  
POSITIVE PRESSURE  
(P1)  
M
B
–A–  
INCHES  
MILLIMETERS  
N
L
DIM  
A
B
C
D
F
MIN  
MAX  
0.630  
0.534  
0.220  
0.033  
0.064  
MIN  
15.11  
13.06  
5.08  
MAX  
16.00  
13.56  
5.59  
0.595  
0.514  
0.200  
0.027  
0.048  
PIN 1  
1
2
3
4
5
6
SEATING  
PLANE  
–T–  
0.68  
0.84  
1.22  
1.63  
G
J
S
G
J
L
M
N
R
S
0.100 BSC  
2.54 BSC  
F
0.014  
0.695  
0.016  
0.725  
0.36  
0.40  
D6 PL  
17.65  
18.42  
30 NOM  
30 NOM  
M
M
0.136 (0.005)  
T A  
0.475  
0.430  
0.090  
0.495  
0.450  
0.105  
12.07  
10.92  
2.29  
12.57  
11.43  
2.66  
STYLE 1:  
PIN 1. VOUT  
2. GROUND  
3. VCC  
4. V1  
5. V2  
CASE 867–08  
ISSUE N  
6. VEX  
BASIC ELEMENT (D)  
A
C
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
POSITIVE  
PRESSURE  
(P1)  
INCHES  
MILLIMETERS  
–B–  
V
DIM  
A
B
C
D
E
MIN  
MAX  
0.720  
0.255  
0.820  
0.033  
0.186  
0.064  
MIN  
17.53  
6.22  
19.81  
0.69  
MAX  
18.28  
6.48  
20.82  
0.84  
0.690  
0.245  
0.780  
0.027  
0.178  
0.048  
PIN 1  
PORT #2  
VACUUM  
(P2)  
4.52  
1.22  
4.72  
1.63  
1
2
3
4
5
6
F
G
J
K
N
S
0.100 BSC  
2.54 BSC  
K
S
0.014  
0.345  
0.300  
0.220  
0.182  
0.016  
0.375  
0.310  
0.240  
0.194  
0.36  
8.76  
7.62  
5.59  
4.62  
0.41  
9.53  
7.87  
6.10  
4.93  
G
J
V
F
N
E
D6 PL  
STYLE 1:  
PIN 1. VOUT  
2. GROUND  
M
M
0.13 (0.005)  
T B  
–T–  
3. VCC  
4. V1  
5. V2  
6. VEX  
CASE 867A–04  
ISSUE E  
VACUUM SIDE PORTED (GVS)  
6
Motorola Sensor Device Data  
PACKAGE DIMENSIONS–CONTINUED  
A
U
L
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
SEATING  
PLANE  
–T–  
R
PORT #1  
POSITIVE  
PRESSURE (P1)  
INCHES  
MILLIMETERS  
V
DIM  
A
B
C
D
F
MIN  
MAX  
1.175  
0.715  
0.325  
0.033  
0.064  
MIN  
29.08  
17.40  
7.75  
0.68  
1.22  
MAX  
29.85  
18.16  
8.26  
0.84  
1.63  
1.145  
0.685  
0.305  
0.027  
0.048  
–Q–  
N
G
J
K
L
N
P
Q
R
S
0.100 BSC  
2.54 BSC  
0.014  
0.695  
0.290  
0.420  
0.153  
0.153  
0.230  
0.220  
0.016  
0.725  
0.300  
0.440  
0.159  
0.159  
0.250  
0.240  
0.36  
17.65  
7.37  
0.41  
18.42  
7.62  
B
10.67  
3.89  
11.18  
4.04  
K
1
2
3
4
5
6
3.89  
4.04  
5.84  
6.35  
PIN 1  
S
5.59  
6.10  
U
V
0.910 BSC  
23.11 BSC  
–P–  
C
0.182  
0.194  
4.62  
4.93  
G
D6 PL  
0.13 (0.005)  
M
M
0.25 (0.010)  
T
Q
F
J
M
S
S
T
P
Q
STYLE 1:  
PIN 1.  
V
OUT  
2. GROUND  
3.  
V
CC  
4. V1  
5. V2  
CASE 867B–04  
ISSUE E  
6.  
V
EX  
PRESSURE SIDE PORTED (GP)  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
P
–A–  
U
M
M
0.25 (0.010)  
T Q  
X
INCHES  
MILLIMETERS  
L
W
DIM  
A
B
C
D
F
MIN  
MAX  
1.175  
0.715  
0.435  
0.033  
0.064  
MIN  
29.08  
17.40  
10.29  
0.68  
MAX  
29.85  
18.16  
11.05  
0.84  
R
N
1.145  
0.685  
0.405  
0.027  
0.048  
V
PORT #1  
POSITIVE  
PRESSURE  
(P1)  
PORT #2 VACUUM (P2)  
PORT #1 POSITIVE  
PRESSURE (P1)  
1.22  
1.63  
G
J
K
L
N
P
Q
R
S
0.100 BSC  
2.54 BSC  
–Q–  
PORT #2  
VACUUM  
(P2)  
0.014  
0.695  
0.290  
0.420  
0.153  
0.153  
0.063  
0.220  
0.016  
0.725  
0.300  
0.440  
0.159  
0.159  
0.083  
0.240  
0.36  
17.65  
7.37  
10.67  
3.89  
0.41  
18.42  
7.62  
11.18  
4.04  
4.04  
2.11  
B
PIN 1  
3.89  
1.60  
K
1
2
3
4
5
6
5.59  
6.10  
U
V
W
X
0.910 BSC  
23.11 BSC  
C
0.182  
0.310  
0.248  
0.194  
0.330  
0.278  
4.62  
7.87  
6.30  
4.93  
8.38  
7.06  
S
SEATING  
PLANE  
SEATING  
PLANE  
–T–  
–T–  
J
6 PL  
D
G
STYLE 1:  
PIN 1.  
F
M
M
0.13 (0.005)  
A
V
OUT  
2. GROUND  
3.  
V
CC  
4. V1  
5. V2  
CASE 867C–05  
ISSUE F  
6.  
V
EX  
PRESSURE AND VACUUM SIDES PORTED (DP)  
Motorola Sensor Device Data  
7
PACKAGE DIMENSIONS–CONTINUED  
–P–  
M
M
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
0.25 (0.010)  
T Q  
A
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
U
PORT #2  
SEATING  
PLANE  
L
INCHES  
MILLIMETERS  
–T–  
R
VACUUM (P2)  
DIM  
A
B
C
D
F
MIN  
MAX  
1.175  
0.715  
0.325  
0.033  
0.064  
MIN  
29.08  
17.40  
7.75  
0.68  
1.22  
MAX  
29.85  
18.16  
8.26  
0.84  
1.63  
V
1.145  
0.685  
0.305  
0.027  
0.048  
POSITIVE PRESSURE (P1)  
–Q–  
N
B
G
J
K
L
N
P
Q
R
S
0.100 BSC  
2.54 BSC  
0.014  
0.695  
0.290  
0.420  
0.153  
0.153  
0.230  
0.220  
0.016  
0.725  
0.300  
0.440  
0.159  
0.159  
0.250  
0.240  
0.36  
17.65  
7.37  
0.41  
18.42  
7.62  
PIN 1  
10.67  
3.89  
11.18  
4.04  
3.89  
4.04  
K
5.84  
6.35  
1
2
3
4
5
6
5.59  
6.10  
U
V
0.910 BSC  
23.11 BSC  
S
0.182  
0.194  
4.62  
4.93  
C
G
6 PL  
D
STYLE 1:  
PIN 1.  
J
V
F
OUT  
M
S
S
0.13 (0.005)  
T
P
Q
2. GROUND  
3.  
4. V1  
5. V2  
V
CC  
CASE 867D–04  
ISSUE F  
6.  
V
EX  
VACUUM SIDE PORTED (GVP)  
NOTES:  
C
A
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
INCHES  
MILLIMETERS  
DIM  
A
B
C
D
E
MIN  
MAX  
0.720  
0.255  
0.820  
0.033  
0.186  
0.064  
MIN  
17.53  
6.22  
19.81  
0.69  
MAX  
18.28  
6.48  
20.82  
0.84  
0.690  
0.245  
0.780  
0.027  
0.178  
0.048  
–B–  
V
PIN 1  
4.52  
1.22  
4.72  
1.63  
F
PORT #1  
POSITIVE  
PRESSURE  
(P1)  
6
5
4
3
2
1
G
J
K
N
S
0.100 BSC  
2.54 BSC  
0.014  
0.345  
0.300  
0.220  
0.182  
0.016  
0.375  
0.310  
0.240  
0.194  
0.36  
8.76  
7.62  
5.59  
4.62  
0.41  
9.53  
7.87  
6.10  
4.93  
K
S
V
J
G
STYLE 1:  
PIN 1.  
F
N
E
D 6 PL  
V
OUT  
2. GROUND  
3.  
4. V1  
5. V2  
V
–T–  
M
M
0.13 (0.005)  
T B  
CC  
6.  
V
EX  
CASE 867E–03  
ISSUE D  
PRESSURE SIDE PORTED (AS, GS)  
8
Motorola Sensor Device Data  
PACKAGE DIMENSIONS–CONTINUED  
–T–  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
C
A
U
E
–Q–  
INCHES  
MILLIMETERS  
DIM  
A
B
C
D
E
MIN  
MAX  
1.120  
0.760  
0.650  
0.033  
0.180  
0.064  
MIN  
27.43  
18.80  
16.00  
0.68  
MAX  
28.45  
19.30  
16.51  
0.84  
1.080  
0.740  
0.630  
0.027  
0.160  
0.048  
N
V
4.06  
1.22  
4.57  
1.63  
B
F
G
J
K
N
P
Q
R
S
U
V
0.100 BSC  
2.54 BSC  
R
0.014  
0.220  
0.070  
0.150  
0.150  
0.440  
0.695  
0.840  
0.182  
0.016  
0.240  
0.080  
0.160  
0.160  
0.460  
0.725  
0.860  
0.194  
0.36  
5.59  
0.41  
6.10  
PIN 1  
PORT #1  
POSITIVE  
PRESSURE  
(P1)  
1.78  
2.03  
–P–  
3.81  
4.06  
6
5
4
3
2
1
M
M
0.25 (0.010)  
T Q  
3.81  
4.06  
S
11.18  
17.65  
21.34  
4.62  
11.68  
18.42  
21.84  
4.93  
K
J
D6 PL  
G
STYLE 1:  
PIN 1.  
M
S
S
0.13 (0.005)  
T
P
Q
V
OUT  
2. GROUND  
3.  
V
F
CC  
4. V1  
5. V2  
6.  
V
EX  
CASE 867F–03  
ISSUE D  
PRESSURE SIDE PORTED (GSX)  
–T–  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
C
A
U
E
–Q–  
INCHES  
MILLIMETERS  
DIM  
A
B
C
D
E
F
G
J
K
N
P
Q
R
S
MIN  
MAX  
1.120  
0.760  
0.650  
0.033  
0.180  
0.064  
MIN  
27.43  
18.80  
16.00  
0.68  
4.06  
1.22  
2.54 BSC  
0.36  
5.59  
1.78  
3.81  
3.81  
11.18  
17.65  
21.34  
4.62  
MAX  
28.45  
19.30  
16.51  
0.84  
1.080  
0.740  
0.630  
0.027  
0.160  
0.048  
POSITIVE  
PRESSURE  
(P1)  
N
S
4.57  
1.63  
V
B
0.100 BSC  
R
0.014  
0.220  
0.070  
0.150  
0.150  
0.440  
0.695  
0.840  
0.182  
0.016  
0.240  
0.080  
0.160  
0.160  
0.460  
0.725  
0.860  
0.194  
0.41  
6.10  
2.03  
4.06  
4.06  
11.68  
18.42  
21.84  
4.93  
PORT #2  
VACUUM  
(P2)  
PIN 1  
–P–  
1
2
3
4
5
6
M
M
0.25 (0.010)  
T Q  
U
V
K
J
D6 PL  
STYLE 1:  
PIN 1.  
G
V
M
S
S
0.13 (0.005)  
T
P
Q
OUT  
2. GROUND  
3.  
V
CC  
4. V1  
5. V2  
F
6.  
V
EX  
CASE 867G–03  
ISSUE D  
VACUUM SIDE PORTED (GVSX)  
Motorola Sensor Device Data  
9
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and  
specificallydisclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola  
datasheetsand/orspecificationscananddovaryindifferentapplicationsandactualperformancemayvaryovertime. Alloperatingparameters,includingTypicals”  
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of  
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applicationsintended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury  
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MPX5050/D  

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