MPX5100GP [MOTOROLA]
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated; 集成硅压力传感器片上信号调节，温度补偿和校准
| 型号： | MPX5100GP |
| 厂家： | 
MOTOROLA |
| 描述： | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
| 文件： | 总12页 (文件大小：398K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Freescale Semiconductor, Inc.
MOTOROLA
Order number: MPX5100/D
Rev 9, 3/2004
SEMICONDUCTOR TECHNICAL DATA
MPX5100/MPXV5100
SERIES
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated
and Calibrated
INTEGRATED PRESSURE SENSOR
Differential 0 to 100 kPa (0 to 14.5 psi)
Absolute
15 to 115 kPa (2.18 to 16.68 psi)
0.2 to 4.7 Volts Output
The MPX5100/MPXV5100 series piezoresistive transducer is a state-of-
the-art monolithic silicon pressure sensor designed for a wide range of appli-
cations, but particularly those employing a microcontroller or microprocessor
with A/D inputs. This patented, single element transducer combines advanced
micromachining techniques, thin-film metallization, and bipolar processing to
provide an accurate, high level analog output signal that is proportional to the
applied pressure.
SMALL OUTLINE
PACKAGE
UNIBODY PACKAGE
Features
MPX5100D
CASE 867
•
•
2.5% Maximum Error over 0° to 85°C
Ideally suited for Microprocessor or Microcontroller-Based
Systems
MPXV5100GC6U
CASE 482A
•
•
•
Patented Silicon Shear Stress Strain Gauge
Available in Absolute, Differential and Gauge Configurations
Ideal for Automotive and Non-Automotive Applications
VS
MPX5100DP
CASE 867C
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
MPXV5100GC7U
SENSING
ELEMENT
CASE 482C
Vout
GAIN STAGE #1
PINS 1 AND 5 THROUGH 8 ARE NO CONNECTS
FOR SMALL OUTLINE PACKAGE
MPX5100GSX
CASE 867F
GND
PINS 4, 5, AND 6 ARE NO CONNECTS FOR
UNIBODY PACKAGE
PIN NUMBER
PIN NUMBER
Figure 1. Fully Integrated Pressure Sensor Schematic
1
Vout
4
N/C
1
2
N/C
VS
5
6
N/C
N/C
2
3
GND
VS
5
6
N/C
N/C
3
4
GND
Vout
7
8
N/C
N/C
NOTE: Pins 4, 5, and 6
are internal device
connections. Do not
connect to external
circuitry or ground. Pin1 is
noted by the notch in the
lead.
NOTE: Pins 1, 5, 6, 7, and
8 are internal device
connections. Do not
connect to external
circuitry or ground. Pin1 is
noted by the notch in the
lead.
© Motorola, Inc. 2004
For More Information On This Product,
Go to: www.freescale.com
Freescale Semiconductor, Inc.
MPX5100/MPXV5100 SERIES
Table 1. MAXIMUM RATINGS(NOTE)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
P
400
kPa
max
Storage Temperature
Operating Temperature
T
–40° to +125°
–40° to +125°
°C
°C
stg
T
A
NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Table 2. OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit
shown in Figure 4 required to meet electrical specifications.)
Characteristic
Symbol
Min
Typ
Max
Unit
(1)
Pressure Range
P
0
15
—
—
100
115
kPa
Gauge, Differential: MPX5100D/MPX5100G/MPXV5100G
Absolute: MPX5100A
OP
(2)
V
4.75
—
5.0
7.0
5.25
10
Vdc
mAdc
Vdc
Supply Voltage
S
Supply Current
I
o
(3)
V
0.088
0.20
0.313
Minimum Pressure Offset
@ V = 5.0 Volts
(0 to 85°C)
off
S
(4)
V
4.587
—
4.700
4.500
—
4.813
—
Vdc
Vdc
Full Scale Output
Differential and Absolute (0 to 85°C)
FSO
@ V = 5.0 Volts
S
(5)
V
Full Scale Span
Differential and Absolute (0 to 85°C)
FSS
@ V = 5.0 Volts
S
(6)
—
—
± 2.5
%V
Accuracy
FSS
Sensitivity
V/P
—
—
45
—
—
mV/kPa
ms
(7)
t
1.0
Response Time
R
Output Source Current at Full Scale Output
I
—
—
—
0.1
20
—
—
—
mAdc
ms
o+
(8)
—
—
Warm-Up Time
(9)
± 0.5
%V
Offset Stability
FSS
NOTES:
1. 1.0kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6.
Accuracy (error budget) consists of the following:
•
•
Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
•
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from
minimum or maximum rated pressure at 25°C.
•
•
•
TcSpan:
TcOffset:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C.
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
Table 3. MECHANICAL CHARACTERISTICS
Characteristics
Typ
4.0
Unit
Weight, Basic Element (Case 867)
Weight, Basic Element (Case 482)
grams
grams
1.5
2
Motorola Sensor Device Data
MOTOROLA
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Freescale Semiconductor, Inc.
MPX5100/MPXV5100 SERIES
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
Figure 2 shows the sensor output signal relative to pressure
input. Typical, minimum, and maximum output curves are
shown for operation over a temperature range of 0° to 85°C
using the decoupling circuit shown in Figure 4. The output will
saturate outside of the specified pressure range.
Figure 3 illustrates both the Differential/Gauge and the Abso-
lute Sensing Chip in the basic chip carrier (Case 867). A fluoro-
silicone gel isolates the die surface and wire bonds from the
environment, while allowing the pressure signal to be transmit-
ted to the sensor diaphragm.
The MPX5100/MPXV5100 series pressure sensor operating
characteristics, and internal reliability and qualification tests are
based on use of dry air as the pressure media. Media, other
than dry air, may have adverse effects on sensor performance
and long-term reliability. Contact the factory for information re-
garding media compatibility in your application.
Figure 4 shows the recommended decoupling circuit for in-
terfacing the output of the integrated sensor to the A/D input of
a microprocessor or microcontroller. Proper decoupling of the
power supply is recommended.
Figure 1.
Transfer Function MPX5100D/MPX5100G/MPXV5100G Series
= V x (0.009 x P + 0.04)
5
4
3
2
1
0
V
out
S
± (Pressure Error x Temperature Factor x 0.009 x V )
S
V
= 5.0 V ± 0.25 Vdc
S
PE = 2.5
TM = 1
Temperature = 0–85°C
TYPICAL
MAX
MIN
0
10
20
30
40
50
60
70
80
90
100 110
OFFSET
(TYP)
PRESSURE (kPa)
Figure 2. Output versus Pressure Differential
STAINLESS STEEL
FLUORO SILICONE
METAL COVER
GEL DIE COAT
STAINLESS STEEL
METAL COVER
FLUORO SILICONE
GEL DIE COAT
DIE
DIE
EPOXY PLASTIC
CASE
EPOXY PLASTIC
WIRE BOND
CASE
WIRE BOND
LEAD FRAME
DIE
BOND
LEAD FRAME
DIE
BOND
DIFFERENTIAL/GAUGE ELEMENT
ABSOLUTE ELEMENT
Figure 3. Cross-Sectional Diagrams
(Not to Scale)
+5 V
OUTPUT
V
out
V
S
IPS
470 pF
1.0 µF
0.01 µF
GND
Figure 4. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646)
MOTOROLA
Motorola Sensor Device Data
3
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MPX5100/MPXV5100 SERIES
Transfer Function (MPX5100D, MPX5100G, MPXV5100G)
Nominal Transfer Value: Vout = VS (P x 0.009 + 0.04)
± (Pressure Error x Temp. Mult. x 0.009 x VS)
VS = 5.0 V ± 5% P kPa
Temperature Error Multiplier
MPX5100D/MPX5100G/MPXV5100G Series
Temp Multiplier
4.0
–40
3
1
3
0 to 85
+125
3.0
2.0
1.0
0.0
–40
–20
0
20
40
60
80
100
120
130
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C.
Pressure Error Band
MPX5100D/MPX5100G/MPXV5100G Series
Error Limits for Pressure
3.0
2.0
1.0
Pressure in kPa
0.0
0
20
40
60
80
100
120
–1.0
–2.0
–3.0
Pressure
Error (max)
0 to 100 kPa ± 2.5 kPa
4
Motorola Sensor Device Data
MOTOROLA
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Freescale Semiconductor, Inc.
MPX5100/MPXV5100 SERIES
Transfer Function (MPX5100A)
Nominal Transfer Value: Vout = VS (P x 0.009 – 0.095)
± (Pressure Error x Temp. Mult. x 0.009 x VS)
VS = 5.0 V ±5% P kPa
Temperature Error Multiplier
MPX5100A Series
Temp Multiplier
4.0
–40
3
1
3
0 to 85
+125
3.0
2.0
1.0
0.0
–40
–20
0
20
40
60
80
100
120
130
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C.
Pressure Error Band
MPX5100A Series
Error Limits for Pressure
3.0
2.0
1.0
Pressure in kPa
0.0
0
20
40
60
80
100
130
-1.0
-2.0
-3.0
Pressure
Error (max)
15 to 115 kPa ± 2.5 kPa
MOTOROLA
Motorola Sensor Device Data
5
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Freescale Semiconductor, Inc.
MPX5100/MPXV5100 SERIES
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor as
is designed to operate with positive differential pressure
the Pressure (P1) side and the Vacuum (P2) side. The Pressure
(P1) side is the side containing fluoro silicone gel which protects
the die from harsh media. The Motorola MPX pressure sensor
applied, P1 > P2.
The Pressure (P1) side may be identified by using the Table
below:
Part Number
MPX5100A, MPX5100D
Case Type
Pressure (P1) Side Identifier
Stainless Steel Cap
867
MPX5100DP
Side with Part Marking
867C
867B
867F
482A
482C
MPX5100AP, MPX5100GP
MPX5100GSX
Side with Port Attached
Side with Port Attached
Side with Port Attached
Side with Port Attached
MPXV5100GC6U
MPXV5100GC7U
ORDERING INFORMATION
The MPX5100/MPXV5100 pressure sensor is available in absolute, differential, gauge, and vacuum configurations.
Devices are available in the basic element package or with pressure port fittings that provide printed circuit board mount-
ing ease and barbed hose pressure connections.
MPX Series
Device Name
Basic Element
Options
Case Type
Order Number
MPX5100A
Device Marking
MPX5100A
Absolute
867
867
Differential
MPX5100D
MPX5100D
MPX5100DP
MPX5100AP
MPX5100GP
MPX5100D
MPXV5100G
MPXV5100G
Ported Elements
Differential Dual Ports
Absolute, Single Port
Gauge, Single Port
MPX5100DP
867C
867B
867B
867F
482A
482C
MPX5100AP
MPX5100GP
MPX5100GSX
MPXV5100GC6U
MPXV5100GC7U
Gauge, Axial PC Mount
Gauge, Axial Port, SMT
Gauge, Axial Port, DIP
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct footprint,
the packages will self align when subjected to a solder reflow
process. It is always recommended to design boards with a
solder mask layer to avoid bridging and shorting between solder
pads.
0.100 TYP 8X
2.54
0.660
16.76
0.060 TYP 8X
1.52
0.300
7.62
inch
0.100 TYP 8X
2.54
mm
SCALE 2:1
Figure 5. SOP Footprint (Case 482)
6
Motorola Sensor Device Data
MOTOROLA
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Freescale Semiconductor, Inc.
MPX5100/MPXV5100 SERIES
PACKAGE DIMENSIONS
C
NOTES:
R
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
POSITIVE PRESSURE
(P1)
M
B
-A-
INCHES
DIM MIN MAX MIN
MILLIMETERS
N
L
MAX
16.00
13.56
5.59
A
B
C
D
F
0.595
0.630 15.11
0.534 13.06
PIN 1
1
2
3
4
5
6
0.514
0.200
0.027
0.048
SEATING
PLANE
-T-
0.220
0.033
0.064
5.08
0.68
1.22
0.84
1.63
G
J
S
G
J
L
0.100 BSC
2.54 BSC
F
0.014
0.695
0.016 0.36
0.725 17.65
0.40
18.42
D 6 PL
M
N
R
S
30˚ NOM
30˚ NOM
M
M
0.136 (0.005)
T A
0.475
0.430
0.090
0.495 12.07
0.450 10.92
12.57
11.43
2.66
0.105
2.29
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
CASE 867-08
ISSUE N
BASIC ELEMENT
NOTES:
A
1. DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
SEATING PLANE
T
U
L
R
MILLIMETERS
V
DIM MIN
MAX
29.85
18.16
8.26
A
B
C
D
F
G
J
K
L
N
P
Q
R
S
U
V
29.08
17.4
7.75
0.68
1.22
Q
N
0.84
1.63
Q
2.54 BSC
0.36
17.65
7.37
10.67
3.89
3.89
5.84
5.59
0.41
18.42
7.62
11.18
4.04
4.04
6.35
6.1
B
1
6
2
5
3
4
K
P
PIN 1
S
23.11 BSC
P
C
4.62
4.93
G
6X
D
0.173
M
M
Q
0.25
T
J
F
M
S
S
Q
T
P
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
CASE 867B-04
ISSUE F
PRESSURE SIDE PORTED (AP, GP)
MOTOROLA
Motorola Sensor Device Data
7
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Freescale Semiconductor, Inc.
MPX5100/MPXV5100 SERIES
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
P
0.25 (0.010)
-A-
M
M
T Q
INCHES
DIM MIN MAX
MILLIMETERS
U
MIN
29.08
17.40
10.29
0.68
MAX
29.85
18.16
11.05
0.84
X
A
B
C
D
F
1.145
0.685
0.405
0.027
0.048
1.175
0.715
0.435
0.033
0.064
L
V
W
R
PORT #1
POSITIVE
PRESSURE
(P1)
PORT #2 VACUUM (P2)
1.22
1.63
PORT #1 POSITIVE
PRESSURE (P1)
G
J
K
L
N
P
Q
R
S
U
V
W
X
0.100 BSC
2.54 BSC
N
0.014
0.695
0.290
0.420
0.153
0.153
0.063
0.220
0.016
0.725
0.300
0.440
0.159
0.159
0.083
0.240
0.36
17.65
7.37
10.67
3.89
3.89
1.60
5.59
0.41
18.42
7.62
11.18
4.04
4.04
2.11
6.10
-Q-
PORT #2
VACUUM
(P2)
B
PIN 1
0.910 BSC
23.11 BSC
K
1
2
3
4
5
6
0.182
0.310
0.248
0.194
0.330
0.278
4.62
7.87
6.30
4.93
8.38
7.06
C
S
SEATING
PLANE
SEATING
PLANE
-T-
-T-
6 PL
D
STYLE 1:
PIN 1. VOUT
2. GROUND
G
J
M
M
0.13 (0.005)
A
F
3. VCC
4. V1
5. V2
6. VEX
CASE 867C-05
ISSUE F
PRESSURE AND VACUUM SIDES PORTED (DP)
-T-
NOTES:
C
A
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
E
-Q-
U
INCHES
MILLIMETERS
DIM MIN MAX
MIN
27.43
18.80
16.00
0.68
MAX
28.45
19.30
16.51
0.84
A
B
C
D
E
F
1.080 1.120
0.740 0.760
0.630 0.650
0.027 0.033
0.160 0.180
0.048 0.064
0.100 BSC
N
S
V
4.06
1.22
4.57
1.63
B
G
J
2.54 BSC
R
0.014 0.016
0.220 0.240
0.070 0.080
0.150 0.160
0.150 0.160
0.440 0.460
0.695 0.725
0.840 0.860
0.182 0.194
0.36
5.59
0.41
6.10
PIN 1
PORT #1
POSITIVE
PRESSURE
(P1)
K
N
P
Q
R
S
U
V
1.78
3.81
2.03
4.06
-P-
6
5
4
3
2
1
M
M
T Q
0.25 (0.010)
3.81
4.06
11.18
17.65
21.34
4.62
11.68
18.42
21.84
4.93
K
6 PL
D
S
Q
J
G
STYLE 1:
PIN 1. VOUT
M
S
0.13 (0.005)
T
P
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
F
CASE 867F-03
ISSUE D
PRESSURE SIDE AXIAL PORT (GSX)
8
Motorola Sensor Device Data
MOTOROLA
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MPX5100/MPXV5100 SERIES
-A-
D 8 PL
4
1
M
S
S
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
0.25 (0.010)
T
B
5
8
N
-B-
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
G
INCHES
MIN MAX
MILLIMETERS
DIM
A
B
C
D
G
H
J
K
M
N
MIN
10.54
10.54
12.70
0.96
MAX
10.79
10.79
13.21
1.07
S
0.415 0.425
0.415 0.425
0.500 0.520
0.038 0.042
0.100 BSC
W
2.54 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0.05
0.23
1.55
0˚
0.25
0.28
1.80
7˚
V
0˚
7˚
C
0.444 0.448
0.709 0.725
0.245 0.255
0.115 0.125
11.28
18.01
6.22
2.92
11.38
18.41
6.48
3.17
S
V
W
H
J
-T-
SEATING
PLANE
PIN 1 IDENTIFIER
M
K
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE SURFACE MOUNT
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
-A-
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4
5
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
N
-B-
D 8 PL
G
M
S
S
A
INCHES
MILLIMETERS
8
0.25 (0.010)
T B
1
DIM MIN MAX MIN
MAX
10.79
10.79
13.21
0.864
A
B
C
D
G
J
K
M
N
S
0.415
0.425 10.54
0.425 10.54
0.520 12.70
DETAIL X
0.415
0.500
0.026
S
W
0.034
0.66
0.100 BSC
2.54 BSC
0.009
0.100
0˚
0.444
0.540
0.245
0.115
0.011
0.120
15˚
0.23
2.54
0˚
0.28
3.05
15˚
11.38
14.22
6.48
3.17
V
PIN 1
IDENTIFIER
0.448 11.28
0.560 13.72
C
V
W
0.255
0.125
6.22
2.92
SEATING
PLANE
-T-
K
M
J
DETAIL X
CASE 482C-03
ISSUE B
SMALL OUTLINE PACKAGE THROUGH-HOLE
MOTOROLA
Motorola Sensor Device Data
9
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MPX5100/MPXV5100 SERIES
NOTES
10
Motorola Sensor Device Data
MOTOROLA
For More Information On This Product,
Go to: www.freescale.com
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MPX5100/MPXV5100 SERIES
NOTES
MOTOROLA
Motorola Sensor Device Data
11
For More Information On This Product,
Go to: www.freescale.com
Freescale Semiconductor, Inc.
Information in this document is provided solely to enable system and software implementers to use Motorola products. There are no express or implied
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Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee
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© Motorola, Inc. 2004
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MPX5100/D
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