MPXV4006G7U [MOTOROLA]
INTEGRATED PRESSURE SENSOR; 集成压力传感器
| 型号： | MPXV4006G7U |
| 厂家： | 
MOTOROLA |
| 描述： | INTEGRATED PRESSURE SENSOR |
| 文件： | 总12页 (文件大小：314K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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Freescale Semiconductor, Inc.
Order this document
by MPXV4006G/D
SEMICONDUCTOR TECHNICAL DATA
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The MPXV4006G series piezoresistive transducer is a state–of–the–art monolithic
silicon pressure sensor designed for a wide range of applications, but particularly those
employing a microcontroller or microprocessor with A/D inputs. This sensor combines a
highly sensitive implanted strain gauge with advanced micromachining techniques,
thin–film metallization, and bipolar processing to provide an accurate, high level analog
output signal that is proportional to the applied pressure.
INTEGRATED
PRESSURE SENSOR
0 to 6 kPa (0 to 0.87 psi)
0.2 to 4.7 V OUTPUT
Features
SMALL OUTLINE PACKAGE
SMALL OUTLINE PACKAGE
THROUGH–HOLE
•
•
Temperature Compensated over 10° to 60°C
SURFACE MOUNT
Ideally Suited for Microprocessor or Microcontroller–
Based Systems
•
•
Available in Gauge Surface Mount (SMT) or Through–
hole (DIP) Configurations
Durable Thermoplastic (PPS) Package
MPXV4006G6U
CASE 482
MPXV4006G7U
CASE 482B
V
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MPXV4006GC6U
CASE 482A
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#
1
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MPXV4006GC7U
CASE 482C
P
I
N
S
1
,
5
,
6
,
7
,
A
N
D
8
A
R
N
O
C
O
N
N
E
C
T
S
F
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P
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K
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Figure 1. Fully Integrated Pressure Sensor
Schematic
PIN NUMBER
1
2
3
4
N/C
5
6
7
8
N/C
N/C
N/C
N/C
MPXV4006GP
CASE 1369
V
S
Gnd
V
out
NOTE: Pins 1, 5, 6, 7, and 8 are
internal device connections. Do not
connect to external circuitry or
ground. Pin 1 is noted by the notch
in the lead.
MPXV4006DP
CASE 1351
Replaces MPXT4006D/D
REV 4
For More Information On This Product,
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Motorola, Inc. 2002
Freescale Semiconductor, Inc.
MP
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MAXIMUM RATINGS(NOTE)
Parametrics
Maximum Pressure (P1 > P2)
Storage Temperature
Symbol
Value
24
Unit
kPa
°C
P
max
T
stg
–30 to +100
+10 to +60
Operating Temperature
T
A
°C
NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.
OPERATING CHARACTERISTICS (V = 5.0 Vdc, T = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3
S
A
required to meet electrical specifications.)
Characteristic
Symbol
Min
0
Typ
—
Max
6.0
Unit
kPa
Pressure Range
P
OP
(1)
Supply Voltage
Supply Current
Full Scale Span
V
4.75
—
5.0
—
5.25
10
Vdc
S
I
S
mAdc
V
(2)
(RL = 51kΩ)
(RL = 51kΩ)
V
FSS
—
4.6
0.225
766
—
—
(3)(5)
Offset
V
off
0.100
—
0.430
—
V
Sensitivity
V/P
—
mV/kPa
(4)(5)
Accuracy
(10 to 60°C)
—
±5.0
%V
FSS
NOTES:
1. Device is ratiometric within this specified excitation range.
2. Full Scale Span (V ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
FSS
minimum rated pressure.
3. Offset (V ) is defined as the output voltage at the minimum rated pressure.
off
4. Accuracy (error budget) consists of the following:
•
•
Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
•
•
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
Offset Stability:
Output deviation, after 1000 temperature cycles, *30 to 100°C, and 1.5 million pressure cycles, with
minimum rated pressure applied.
•
•
TcSpan:
TcOffset:
Output deviation over the temperature range of 10 to 60°C, relative to 25°C.
Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60°C,
relative to 25°C.
•
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of V
, at 25°C.
FSS
5. Auto Zero at Factory Installation: Due to the sensitivity of the MPXV4006G, external mechanical stresses and mounting position can affect
the zero pressure output reading. To obtain the 5% FSS accuracy, the device output must be “autozeroed’’ after installation. Autozeroing
is defined as storing the zero pressure output reading and subtracting this from the device’s output during normal operations.
2
Motorola Sensor Device Data
For More Information On This Product,
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Freescale Semiconductor, Inc.
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SE R I ES
ON–CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by inte-
grating the shear–stress strain gauge, temperature com-
pensation, calibration and signal conditioning circuitry onto a
single monolithic chip.
Figure 2 illustrates the gauge configuration in the basic chip
carrier (Case 482). A fluorosilicone gel isolates the die surface
and wire bonds from the environment, while allowing the pres-
sure signal to be transmitted to the silicon diaphragm.
The MPXV4006G series sensor operating characteristics
are based on use of dry air as pressure media. Media, other
than dry air, may have adverse effects on sensor performance
and long–term reliability. Internal reliability and qualification
test for dry air, and other media, are available from the factory.
Contact the factory for information regarding media tolerance
in your application.
Figure 3 shows the recommended decoupling circuit for in-
terfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 4 shows the sensor output signal relative to pres-
sure input. Typical, minimum and maximum output curves
are shown for operation over a temperature range of 10°C to
60°C using the decoupling circuit shown in Figure 3. The
output will saturate outside of the specified pressure range.
D
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T
A
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S
S
F LU O RO S ILI C ON E
G EL D IE C OAT
+
5
V
S
T
E
E
L
C
A
P
P 1
O U TPU T
V
o
u
t
WI R E BO ND
THE RM O PL A S TIC
CA S E
V s
I P S
L
E
A
D
F
R
A
M
E
1 . 0
F
m
0 . 01
Fm
G
N
D
4 7 0 p F
P
2
D IF FE RE NTI A L S EN SI NG
EL EMEN T
DI E B O ND
Figure 2. Cross–Sectional Diagram (Not to Scale)
Figure 3. Recommended power supply decoupling
and output filtering recommendations.
For additional output filtering, please refer to
Application Note AN1646.
5
.
0
TR AN SFE R F UNCTI O N:
4. 5
V
o ut
= * [ (V0 .1 53 3* P )
S
+
0 . 0±4 5] 5 % V
F S S
V
=
5.±0 0V.2 5 V dc
= 10 °Ct o 6 0
S
TE MP
4. 0
3. 5
3. 0
2. 5
2. 0
1. 5
1. 0
0. 5
0
TY P I CAL
M
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N
M
A
X
0
3
DI FFE RE NT IA L P RE SS UR E (kP a )
6
Figure 4. Output versus Pressure Differential
(See Note 5 in Operating Characteristics)
Motorola Sensor Device Data
3
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MP
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PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The Motorola pres-
sure sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the table
below:
Part Number
MPXV4006G6U/T1
Case Type
482
Pressure (P1) Side Identifier
Stainless Steel Cap
MPXV4006GC6U/T1
MPXV4006G7U
MPXV4006GC7U
MPXV4006GP
482A
Side with Port Attached
Stainless Steel Cap
482B
482C
1369
Side with Port Attached
Side with Port Attached
Side with Part Marking
MPXV4006DP
1351
ORDERING INFORMATION
MPXV4006G series pressure sensors are available in the basic element package or with pressure ports. Two packing options
are offered for the 482 and 482A case configurations.
Device Type
Options
Element Only
Case No.
482
MPX Series Order No.
MPXV4006G6U
MPXV4006G6T1
MPXV4006G7U
MPXV4006GC6U
MPXV4006GC6T1
MPXV4006GC7U
MPXV4006GP
Packing Options
Rails
Marking
MPXV4006G
MPXV4006G
MPXV4006G
MPXV4006G
MPXV4006G
MPXV4006G
MPXV4006G
MPXV4006G
Basic Element
Element Only
Element Only
Axial Port
482
Tape and Reel
Rails
482
Ported Element
482A
482A
482A
1369
1351
Rails
Axial Port
Tape and Reel
Rails
Axial Port
Side Port
Trays
Dual Port
MPXV4006DP
Trays
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must
be the correct size to ensure proper solder connection inter-
face between the board and the package. With the correct
footprint, the packages will self align when subjected to a sol-
der reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and short-
ing between solder pads.
0 .1 0 0 ꢀTY Pꢀ 8 X
2 . 54
0 .6 6 0
1 6. 7 6
0. 06 0ꢀTY Pꢀ 8X
1. 52
0 . 30 0
7 . 62
i
n
c
h
0 .1 0 0 ꢀTY Pꢀ 8 X
2 .5 4
mm S CA LE ꢀ 2 :1
Figure 5. SOP Footprint (Case 482)
4
Motorola Sensor Device Data
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Freescale Semiconductor, Inc.
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SMALL OUTLINE PACKAGE DIMENSIONS
SURFACE MOUNT
–A–
D 8 PL
N O TE S :
4
M
S
S
A
0 .2 5 ꢀ (0 . 01 0 )
T B
1. D I MEN S I ON I N G A N D TO LE R AN C I N G PE R AN S I
Y 14. 5M, 198 2.
2. C O N TR O LL IN G D I MEN S I ON : I N CH .
5
3. D I MEN S I ON
P RO T R U SI O N .
A
A N D
B
D O N O T IN C L U D E M O LD
–B–
4. MA XI MU M MO LD P R OT R U SI O N 0. 15 (0 .0 06 ).
5. A LL V ERT IC A L S UR FA CE_S T5YP IC A L D R AF T.
G
8
1
INCHES
DIM MIN MAX
MILLIMETERS
MIN
10. 54
10. 54
5. 38
MAX
10. 7 9
10. 7 9
5. 8 4
S
N
A
B
C
D
G
H
J
0. 415
0. 415
0. 212
0. 038
0. 425
0. 425
0. 230
0. 042
0. 96
1. 0 7
0
.
1
0
0
ꢀ
B
S
C
2
.
5
4
ꢀ
B
S
C
0. 002
0. 009
0. 061
0ꢀ ꢀ
0. 010
0. 011
0. 071
7ꢀ ꢀ
0. 05
0. 23
1. 55
0ꢀ ꢀ
0. 2 5
0. 2 8
1. 8 0
7ꢀꢀ
K
M
N
S
H
C
_
_
_
_
J
–T–
0. 405
0. 709
0. 415
0. 725
10. 29
18. 01
10. 5 4
18. 4 1
SEATING
PLANE
PIN 1 IDENTIFIER
M
K
CASE 482–01
ISSUE O
–A–
D 8 PL
N O TE S :
1. D I MEN S IO N I N G A ND TO LE R AN C I N G PE R AN S I
Y 14. 5M, 198 2.
2. C O N TR O LL IN G D I MEN S I ON : I N CH .
4
M
S
S
A
0 . 25 ꢀ (0 . 01 0 )
T B
5
3. D I MEN S IO N
P R OT R U SI O N .
4. MA XI MU M MO LD P RO T R U SI O N 0 .1 5 (0 .0 06 ).
5. A LL V ERT IC A L S U RFA C E_S T5YP IC AL D R AF T.
A
A ND
B
D
O
N
O
T
I
N
C
L
U
D
E
M
O
L
D
N
–B–
G
INCHES
MILLIMETERS
8
1
DIM MIN MAX
MIN
10. 54
10. 54
12. 70
0. 96
MAX
10 .7 9
10 .7 9
13 .2 1
1 .0 7
A
B
C
D
G
H
J
0. 415
0. 415
0. 500
0. 038
0. 425
0. 425
0. 520
0. 042
S
W
0
.
1
0
0
ꢀ
B
S
C
2. 54ꢀ B SC
0. 002
0. 009
0. 061
0ꢀ ꢀ
0. 010
0. 011
0. 071
7ꢀ ꢀ
0. 05
0. 23
1. 55
0ꢀ ꢀ
0 .2 5
0 .2 8
1 .8 0
7 ꢀꢀ
K
M
N
S
V
_
_
_
_
0. 444
0. 709
0. 245
0. 115
0. 448
0. 725
0. 255
0. 125
11. 28
18. 01
6. 22
11 .3 8
18 .4 1
6 .4 8
C
V
W
2
.
9
2
3
.
1
7
H
J
–T–
SEATING
PLANE
PIN 1 IDENTIFIER
M
K
CASE 482A–01
ISSUE A
Motorola Sensor Device Data
5
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M
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SMALL OUTLINE PACKAGE DIMENSIONS – CONTINUED
SURFACE MOUNT
2 PLACES 4 TIPS
0 .0 08 ꢀ( 0. 20 ) C A
B
E
A
GAGE
PLANE
e
5
4
e/2
.014 (0.35)
θ
L
A1
D
F
DETAIL G
8
1
N O TE S :
1. C O N TR O LL IN G D I MEN S I ON : I N CH .
2. I N TE R PR E T D I MEN S I ON S A ND TO LE R AN C ES PE R
A SME Y 14. 5M- 1994.
3. D I MEN S I ON S " D " A N D " E1" D O N O T IN C L U D E M O LD
F LAS H O R P R OT R U SI O N S . MO LD F LASH O R
P RO T R U SI O N S S H ALL N O T E XC E ED 0 .0 06 (0 .1 52 )
P ER S ID E .
4. D I MEN S I ON " b" D O ES N O T I N CL U D E D AM BAR
P RO T R U SI O N . A LLO WA BLE D AM BA R PR O TR U S IO N
S HA LL B E 0. 008 ( 0.2 03) MA XI MU M .
8X b
M
0. 00 4ꢀ (0 . 1)
C
A
B
E1
B
INCHES
DIM MIN MAX
0. 300
A1 0. 002
MILLIMETERS
MIN
7. 11
MAX
7. 62
0. 25
1. 07
12. 32
N
T
A
0. 330
0. 010
0. 042
0. 485
K
0. 05
0. 96
11. 81
b
D
E
0. 038
0. 465
0. 717 ꢀB SC
18. 21 ꢀB SC
E1 0. 465
0. 485
11. 81
2. 54ꢀ B SC
1
2
.
3
2
A
M
e
F
0. 100 ꢀB SC
0. 245
0. 120
0. 061
0. 270
0. 080
0. 009
0. 115
0. 255
0. 130
0. 071
0. 290
0. 090
0. 011
0. 125
6. 22
3. 05
1. 55
6. 86
2. 03
0. 23
2. 92
6. 47
3. 30
1. 80
7. 36
2. 28
0. 28
3. 17
K
L
8X
0. 00 4ꢀ ( 0.1 )
M
N
P
T
P
DETAIL G
SEATING
PLANE
C
°
0ꢀ ꢀ
°
7ꢀ ꢀ
°
0ꢀ ꢀ
°
7ꢀ ꢀ
θ
CASE 1369–01
ISSUE O
6
Motorola Sensor Device Data
For More Information On This Product,
Go to: www.freescale.com
Freescale Semiconductor, Inc.
M
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SMALL OUTLINE PACKAGE DIMENSIONS – CONTINUED
SURFACE MOUNT
2 PLACES 4 TIPS
0 .0 06ꢀ ( 0. 15 ) C A
B
E
A
GAGE
PLANE
e
5
4
e/2
.014 (0.35)
θ
L
A1
D
F
DETAIL G
8
1
N O TE S :
1. C O N TR O LL IN G D I MEN S I ON : I N CH .
2. I N TE R PR E T D I MEN S I ON S A ND TO L ER AN C ES PE R
A SME Y 14. 5M- 1994.
3. D I MEN S I ON S " D " A N D " E1" D O N O T IN C L U D E M O LD
F LAS H O R P R OT R U SI O N S . MO LD FL ASH O R
P RO T R U SI O N S S H ALL N O T E XC EED 0 .0 06 (0 .1 52 )
P ER S ID E .
4. D I MEN S I ON " b" D O ES N O T I N C LU D E D AM BAR
P RO T R U SI O N . A LLO WA BLE D AM BAR PR O T RU S IO N
S HA LL B E 0. 008 ( 0.2 03) MA XI MU M .
8X b
S TY LE 1:
P IN 1. G N D
S TY LE 2:
P IN 1. N / C
2. V s
M
0. 00 4ꢀ (0 . 1)
C A B
2. +Vout
3. V s
3. G N D
4. Vout
5. N / C
6. N / C
7. N / C
8. N / C
4. -Vout
5. N / C
6. N / C
7. N / C
8. N / C
E1
B
INCHES
DIM MIN MAX
0. 370
A1 0. 002
MILLIMETERS
N
MIN
9. 39
MAX
9.9 1
T
A
0. 390
0. 010
0. 042
0. 485
0. 700
0. 485
0. 05
0. 96
0.2 5
1.0 7
b
D
E
0. 038
0. 465
0. 680
11. 81
17. 27
11. 81
12. 32
17. 78
12. 32
E1 0. 465
M
A
e
F
0. 100 ꢀB SC
2. 54ꢀ B SC
0. 240
0. 115
0. 040
0. 270
0. 160
0. 009
0. 110
0. 260
0. 135
0. 060
0. 290
0. 180
0. 011
0. 130
6. 10
2. 92
1. 02
6. 86
4. 06
0. 23
2. 79
6.6 0
3.4 3
1.5 2
7.3 7
4.5 7
0 .2 8
3.3 0
K
L
8X
0. 00 4ꢀ ( 0.1 )
M
N
P
T
K
P
DETAIL G
SEATING
PLANE
°
0ꢀ ꢀ
°
7ꢀ ꢀ
°
0ꢀ ꢀ
°
7 ꢀꢀ
θ
C
CASE 1351–01
ISSUE O
Motorola Sensor Device Data
7
For More Information On This Product,
Go to: www.freescale.com
Freescale Semiconductor, Inc.
MP
XV
40
06
G
SE R IE S
SMALL OUTLINE PACKAGE DIMENSIONS – CONTINUED
THROUGH–HOLE
–A–
N O TE S :
1. D I MEN S IO N I N G A ND TO LE R AN C I N G P ER AN S I
Y 14. 5M, 198 2.
2. C O N TR O LL IN G D I MEN S I ON : I N CH .
4
5
3. D I MEN S IO N
P R OT R U SI O N .
A
A ND
B
D O N O T I N CLU D E M O LD
–B–
4. MA XI MU M MO LD P RO T R U SI O N 0. 15 ( 0. 00 6 ).
5. A LL V ERT IC A L S U RFA C E_S T5YP IC A L D R A FT.
F O RM ED PA RA LL EL.
G
8
6
.
D
I
M
E
N
S
I
O
N
S
TO C E NT E R O F LE AD W H EN
D 8 PL
1
M
S
S
A
0. 25 ꢀ( 0 .0 10 )
T B
INCHES
MILLIMETERS
DIM MIN
MAX
0. 425
0. 425
0. 220
0. 034
MIN
10. 54
10. 54
5. 33
MAX
10. 79
10. 79
5. 59
DETAIL X
A
B
C
D
G
J
0. 415
0. 415
0. 210
0. 026
S
N
PIN 1 IDENTIFIER
0. 66
0. 864
0. 100 ꢀB SC
2. 54ꢀ B SC
0. 009
0. 100
0ꢀ ꢀ
0. 011
0. 120
15ꢀ ꢀ
0. 23
2. 54
0ꢀ ꢀ
0. 28
3. 05
15ꢀ ꢀ
K
M
N
S
_
_
_
_
C
0. 405
0. 540
0. 415
0. 560
10. 29
13. 72
10. 54
14. 22
SEATING
PLANE
–T–
K
M
J
DETAIL X
CASE 482B–03
ISSUE B
N O TE S :
1. D I MEN S IO N I N G A ND TO LE R AN C I N G PE R AN S I
Y 14. 5M, 198 2.
2. C O N TR O LL IN G D I MEN S I ON : I N CH .
–A–
4
3. D I MEN S IO N
P R OT R U SI O N .
A
A ND
B
D O N O T I N C LU D E M O LD
5
4. MA XI MU M MO LD P RO T R U SI O N 0. 15 (0 .0 06 ).
5. A LL V ERT IC A L S U RFA C E_S T5YP IC A L DR A FT.
F O RM ED PA RA LL EL.
N
–B–
6. D I MEN S IO N
S
T
O
C
E
N
T
E
R
O
F
L
E
A
D
W
H
E
N
D 8 PL
G
M
S
S
A
INCHES
MILLIMETERS
8
0
.
2
5
ꢀ
(
0
.
0
1
0
)
T
B
1
DIM MIN
MAX
0. 425
0. 425
0. 520
0. 034
MIN
10. 54
10. 54
12. 70
0. 66
MAX
10. 79
10. 79
13. 21
0. 864
A
B
C
D
G
J
0. 415
0. 415
0. 500
0. 026
DETAIL X
S
W
0
.
1
0
0
ꢀ
B
S
C
2
.
5
4
ꢀ
B
S
C
0. 009
0. 100
0ꢀ ꢀ
0. 011
0. 120
15ꢀ ꢀ
0. 23
2. 54
0ꢀ ꢀ
0. 28
3. 05
15ꢀ ꢀ
K
M
N
S
PIN 1
IDENTIFIER
V
_
_
_
_
0. 444
0. 540
0. 245
0. 115
0. 448
0. 560
0. 255
0. 125
11. 28
13. 72
6. 22
11. 38
14. 22
6. 48
C
V
W
2
.
9
2
3
.
1
7
SEATING
PLANE
–T–
K
M
J
DETAIL X
CASE 482C–03
ISSUE B
8
Motorola Sensor Device Data
For More Information On This Product,
Go to: www.freescale.com
Freescale Semiconductor, Inc.
M
P
XV
4
0
0
6G
SE R I ES
NOTES
Motorola Sensor Device Data
9
For More Information On This Product,
Go to: www.freescale.com
Freescale Semiconductor, Inc.
MP
XV
40
06
G
SE R IE S
NOTES
10
Motorola Sensor Device Data
For More Information On This Product,
Go to: www.freescale.com
Freescale Semiconductor, Inc.
M
P
X
V
4
0
0
6G
S
E
R
I
E
S
NOTES
Motorola Sensor Device Data
11
For More Information On This Product,
Go to: www.freescale.com
Freescale Semiconductor, Inc.
M
P
XV
40
0
6
G
SE R IE S
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MPXV4006G/D
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