MPXY8020A_技术文档

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Freescale Semiconductor, Inc.

Order this document

by MPXY8020A/D

SEMICONDUCTOR TECHNICAL DATA

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GENERAL DESCRIPTION

The Motorola MPXY8020A is an 8–pin tire monitoring sensor which is

comprised of a variable capacitance pressure sensing element, a temperature

sensing element, and an interface circuit (with a wake–up feature) all on a

single chip. It is housed in a Super–Small Outline Package (SSOP), which

includes a media protection filter. Specifically designed for the low power

consumption requirements of tire pressure monitoring systems, it can combine

with a Motorola remote keyless entry (RKE) system to facilitate a low–cost

highly integrated system.

TIRE PRESSURE MONITORING

SENSOR

OPTIMIZED FOR 250 kPa – 450 kPa

Detailed Description

The block diagram of the MPXY8020A is shown in Figure 1. The pressure

sensor is a capacitive transducer constructed using surface micromachining,

the temperature sensor is constructed using a diffused resistor, and the

interface circuit is integrated onto the same die as the sensors using a standard

silicon CMOS process.

SUPER SMALL OUTLINE PACKAGE

CASE 1352

The conditioning of the pressure signal begins with a capacitance to voltage

conversion (C to V) followed by a switched capacitor amplifier. This amplifier

has adjustable offset and gain trimming. The offset and gain are factory

calibrated, with calibration values stored in the EEPROM trim register. This

amplifier also has temperature compensation circuits for both sensitivity and

offset, which also are factory–adjusted using the EEPROM trim register.

The pressure is monitored by a voltage comparator, which compares the

measured value against an 8–bit threshold adjusted by a serial input. By

adjusting the threshold and monitoring the state of the OUT pin the external

device can check whether a low–pressure threshold has been crossed, or

perform up to 8–bit A/D conversions.

ORDERING INFORMATION

Shipped in Rails Shipped in Tape & Reel

MPXY8020A6U

MPXY8020A6T1

The temperature is measured by a diffused resistor with a positive

temperature coefficient driven by a current source, thereby creating a voltage.

The room temperature value of this voltage is factory–calibrated using the

EEPROM trim register. A two–channel multiplexer can route either the

pressure or temperature signal to a sampling capacitor that is monitored by a

voltage comparator with variable threshold adjust, providing a digital output for

temperature.

An internal low frequency, low power 5.4 kHz oscillator with a 14–stage

divider provides a periodic pulse to the OUT pin (divide by 16384 for 3

seconds). This pulse can be used to wake up an external MCU to begin an

interface with the device. An additional 10–stage divider will provide a pulse

every 52 minutes which can be used to reset an external MCU.

The power consumption can be controlled by several operational modes

selected by external pins.

REV 1.0

Motorola Sensor Device Data

1

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Motorola, Inc. 2003

Freescale Semiconductor, Inc.

M

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Figure 1. MPXY8020A Block Diagram

Package Pinout

The pinout for this 8–pin SSOP device is shown in Figure 2.

S

1

-

1

2

3

4

8

7

6

5

-

S

O

V

D

CL K

DATA

RS T

D

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Figure 2. MPXY8020A Device Pinout

2

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Operating Modes

The device has several operating modes dependent on

the applied voltages to the S1 and S0 pins as shown in Table

1. In all the modes listed the channel multiplexers, D/A Reg-

ister, LFO, and the output pulse dividers will always be pow-

ered up as long as there is a voltage source connected to the

sample capacitor before powering down the measuring cir-

cuitry.

NOTE: All of the EEPROM trim bits will be powered up re-

gardless of whether the pressure or temperature measuring

circuitry is activated.

V

_DDpin.

NOTE: If the voltage on the S1 pin exceeds 2.5 times the

voltage on the V_DDpin the device will be placed into its Trim/

Test Mode.

When only the S0 pin is at a logic one the pressure mea-

suring circuit in the device is powered up and the pressure

output signal is connected to the sample capacitor through a

multiplexer. When the S0 pin returns to the low state the mul-

tiplexer will first turn off to store the signal on the sample ca-

pacitor before powering down the measuring circuitry.

When only the S1 pin is at a logic one the temperature

measuring circuit in the device is powered up and the tem-

perature output signal is connected to the sample capacitor

through a multiplexer. When the S1 pin returns to the low

state the multiplexer will first turn off to store the signal on the

NOTE: If the V_DDsupply source is switched off in order to

reduce current consumption, it is important that all input pins

be driven LOW to avoid powering up the device.

If any input pin (S1, S0, DATA, or CLK) is driven HIGH

while the V_DDsupply is switched off, the device may be pow-

ered up through an ESD protection diode. In such a case, the

effective V_DDvoltage will be about 0.3 V less than the voltage

applied to the input pin, and the full device I_DDcurrent will be

drawn from the device driving input.

Table 1. Operating Modes

Circuitry Powered

Serial Data

Counter

Pressure

Measure

System

Temp

Measure

System

A/D

Output

Comp.

LFO

Oscill.

S1

S0

Operating Mode

0

1

0

1

0

1

Standby/Reset

OFF

ON

OFF

ON

OFF

ON

ACTIVE

RESET

ACTIVE

Measure Pressure

Measure Temperature

Output Read

OFF

Pin Functions

The following paragraphs give a description of the general

function of each pin.

ground. The control IC operates from a single power supply.

Therefore, the conductors to the power supply should be

connected to the V_DDand V_SSpins and locally decoupled as

shown in Figure 3.

V_DDand V_SSPins

Power is supplied to the control IC through V_DDand V_SS

.

V

_DDis the positive supply and V_SSis the digital and analog

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To O t he r V L oa d s

D D

V

D

V

D D

D

0 .1 µF

T

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V

S

V

S S

S

To O t he r V Re t ur ns

S

Figure 3. Recommended Power Supply Connections

Motorola Sensor Device Data

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OUT Pin

The OUT pin normally provides a digital signal related to

the voltage applied to the voltage comparator and the

threshold level shifted into an 8–bit register from an external

device. When the device is placed in the standby mode the

OUT pin is driven high and will be clocked low when an over-

flow is detected from a clock divider (divide by 16384) driven

by the LFO. This allows the OUT pin to wake up an external

device such as an MCU.

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2/ f

3

2 / f

LF

L

F

O

Op e r at io n

M easu r e

S tan d by

Me a sur e

S ec

Wa ke U p

Figure 4. Pulse on OUT Pin During Standby Mode

RST Pin

The RST pin is normally driven high and will be clocked

low when an overflow is detected from total clock divider (di-

vide by 16,777,216) driven by the LFO. This allows the RST

pin to reset an external device such as an MCU. This pulse

will appear on the RST pin approximately every 52 minutes

regardless of the operating mode of the device. The pulse

lasts for two cycles of the LFO oscillator as shown in Figure

5. Since the RST pin is clocked from the same divider string

as the OUT pin, there will also be a pulse on the OUT pin

when the RST pin pulses every 52 minutes.

2/ f

L F O

OU T

R ST

2/ f

L

F

O

Sta n db y

≈

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≈

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Figure 5. Pulse on RST Pin

S0 Pin

DATA Pin

The S0 pin is used to select the mode of operation as

shown in Table 1.

The DATA pin is the serial data in (SDI) function for setting

the threshold of the voltage comparator.

The S0 pin contains an internal Schmitt trigger as part of

its input to improve noise immunity. The S0 pin has an inter-

nal pull–down device in order to provide a low level when the

pin is left unconnected.

The DATA pin contains an internal Schmitt trigger as part

of its input to improve noise immunity. This pin has an inter-

nal pull–down device to provide a low level when the pin is

left unconnected.

S1 Pin

CLK Pin

The S1 pin is used to select the mode of operation, as

shown in Table 1.

The S1 pin contains an internal Schmitt trigger as part of

its input to improve noise immunity. This pin has an internal

pulldown device to provide a low level when the pin is left un-

connected.

The S1 pin also serves the purpose of enabling factory trim

and test of the device.

The higher V_PPprogramming voltage for the internal EE-

PROM trim register is also supplied through the S1 pin.

The CLK pin is used to provide a clock used for loading

and shifting data into the DATA pin. The data on the DATA pin

is clocked into a shift register on the rising edge of the CLK

pin signal. The data is transferred to the D/A Register on the

eighth falling edge of the CLK pin. This protocol may be han-

dled by the SPI or SIOP serial I/O function found on some

MCU devices.

The CLK pin contains an internal Schmitt trigger as part of

its input to improve noise immunity. The CLK pin has an inter-

nal pulldown device to provide a low level when the pin is left

unconnected.

4

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Output Threshold Adjust

The state of the OUT pin is driven by a voltage comparator

whose output state depends on the level of the input voltage

on the sample capacitor and the level of an adjustable 8–bit

threshold voltage. The threshold is adjusted by shifting data

bits into the D/A Register (DAR) via the DATA pin while

clocking the CLK pin. The timing of this data is shown in Fig-

ure 6. Data is transferred into the serial shift register on the

rising edge of the CLK pin. On the falling edge of the 8th

clock the data in the serial shift register is latched into the

parallel DAR register. The DAR remains powered up when-

ever V_DDis present. The serial data is clocked into the DATA

pin starting with the MSB first. This sequence of threshold

select bits is shown in Table 2.

Table 2. D/A Threshold Bit Assignments

Function

Bit Weight

Data Bit

D0

LSB

1

2

D1

4

D2

8

D3

Voltage Comparator Threshold Adjust (8 bits)

16

32

64

128

D4

D5

D6

MSB

D7

An analog to digital (A/D) conversion can be accomplished

with eight (8) different threshold levels in a successive

approximation algorithm; or the OUT pin can be set to trip at

some alarm level. The voltage on the sample capacitor will

maintain long enough for a single 8–bit conversion, but may

need to be refreshed with a new measured reading if the

clock stream is corrupted during a transmission. In these two

modes the DATA and CLK pins should not be clocked to re-

duce noise in the captured pressure or temperature data.

Any change in the DAR contents should be done during the

Standby or Output Read Modes.

Both the serial bit counter and the state of the DAR are un-

defined following power up of the device. The serial bit count-

er can be reset by cycling either the SO pin or the S1 pin to a

high level and then back low. The DAR can then be reset to

the lowest level by holding the DATA pin low while bursting

the CLK pin with eight (8) clock pulses.

read interval is longer than the specified hold time, t_SH

.

The counter that determines the number of clock pulses

into the device is reset whenever the device is placed into the

Measure Pressure or Measure Temperature Modes. This

provides a means to reset the data transfer count in case the

1

2

3

4

5

6

7

8

CL K

D ata

M

S

B

I

T

6

B

I

T

5

B

I

T

4

B

I

T

3

B

I

T

2

B

I

T

1

L

S

B

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S

B

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6

B

I

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5

B

I

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4

B

I

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3

B

I

T

2

B

I

T

1

L

S

B

D AR Lo ad

D A R

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Figure 6. Serial Data Timing

Pressure Sensor Output

Temperature Sensor Output

The pressure channel compares the output of its analog

measurement circuit to the D/A reference voltage. The de-

vice is calibrated at two different nominal values depending

on the calibration option.

The temperature channel compares the output of a posi-

tive temperature coefficient (PTC) resistor driven by a

switched current source. The current source is only active

when the temperature channel is selected.

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APPLICATIONS

Suggested application example is shown in Figure 7.

Mo t io n

S en se

O p ti on a l

+

S 1

S 0

V

D

RF

Tra n smi tt e r

3 .0

V

D ata

C LK

R ST

S t at e Ma ch in e

o r MC U

M PX Y8 020 A

S enso r

0 .1 µF

O UT

V

S

Figure 7. Application Example

ELECTRICAL SPECIFICATIONS

Maximum Ratings

Maximum ratings are the extreme limits to which the device can be exposed without permanently damaging it. The device

contains circuitry to protect the inputs against damage from high static voltages; however, do not apply voltages higher than

those shown in the table below. Keep V_INand V_OUTwithin the range V_SS≤ (V_INor V_OUT) ≤ V_DD

.

Rating

Symbol

Value

Unit

Supply Voltage

V

DD

–0.3 to +4.0

V

Short Circuit Capability (all pins excluding V and V

)

DD

SS

Maximum High Voltage for 5 minutes

Minimum Low Voltage for 5 minutes

V

SC

V

SC

V

DD

SS

Substrate Current Injection

I

600

µA

SUB

Current from any pin to V – 0.3 VDC)

SS

Electrostatic Discharge

Human Body Model (HBM)

Charged Device Model (CDM)

Machine Model (MM)

V

ESD

V

ESD

V

ESD

±1000

±200

V

Storage Temperature Range

Standard Temperature Range

T

stg

–40 to +150

°C

6

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Operating Range

The limits normally expected in the application which define range of operation.

Characteristic

Symbol

Min

Typ

Max

Units

Supply Voltage

V

DD

2.1

3.0

3.6

V

Operating Temperature Range

Standard Temperature Range

T

–40

T

H

+125

L

T

A

—

°C

Supply Current Drain

Standby Mode

–40°C to +85°C

I

—

0.6

0.8

1.5

0.9

1.2

2.2

µA

stby

+85°C to +100°C

+100°C to +125°C

Read Mode

–40°C to +125°C

Measure Temperature Mode

–40°C to +125°C

Measure Pressure Mode

–40°C to +10°C

I

—

400

600

µA

read

I

temp

I

—

1400

1300

1200

1800

1700

µA

press

+10°C to +60°C

+60°C to +125°C

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M

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Electrical Characteristics

+2.1 V ≤ V_DD≤ +3.6 V, T_L≤ T_A≤ T_H, unless otherwise specified.

Characteristic

Symbol

Min

Typ

Max

—

Units

V

Output High Voltage

DATA, OUT, RST (I

= 100 µA)

V

OH

V –0.8

DD

—

Load

Output Low Voltage

DATA, OUT, RST (I

= –100 µA)

V

0.4

V

—

Load

OL

Input High Voltage

S1, S0, DATA, CLK

V

0.7 x V

V

—

IH

DD

Input Low Voltage

S1, S0, DATA, CLK

V

IL

V

SS

0.3 x V

DD

V

—

Input Hysteresis (V – V )

IH

IL

S1, S0, DATA, CLK

V

100

–5

200

–25

–35

mV

µA

—

HYS

Input Low Current (at V )

S1, S0, DATA, CLK

IL

I

IL

–100

–140

Input High Current (at V

S1, S0, DATA, CLK

)

IH

I

–5

IH

Temperature Measurement (+2.5V≤Vdd≤3.0V)

D/A Conversion Code at –40°C

D/A Conversion Code at –20°C

D/A Conversion Code at 25°C

D/A Conversion Code at 70°C

D/A Conversion Code at 100°C

D/A Conversion Code at 120°C

D/A Conversion Code at 125°C

T

36

52

97

155

204

241

249

42

57

47

62

counts

–40

–20

102

163

214

252

255

107

171

224

255

25

70

T

100

T

120

T

125

Temperature Measurement (+2.1V≤Vdd≤3.6V)

D/A Conversion Code at –40°C

D/A Conversion Code at –20°C

D/A Conversion Code at 25°C

D/A Conversion Code at 70°C

D/A Conversion Code at 100°C

D/A Conversion Code at 120°C

D/A Conversion Code at 125°C

T

36

52

97

154

203

240

249

42

57

49

64

counts

–40

–20

102

163

214

252

255

107

172

225

255

25

70

T

100

T

120

T

125

Temperature Sensitivity at 25°C

0.80

°C/bit

—

Approximate Temperature Output Response

OUT = 74.7461 +0.9752 x Ta + 0.0041 x Ta^2

counts

Temperature Error vs. Temperature (V_DD= 3 V)

8

7

6

5

4

3

2

1

0

–40

–20

0

20

40

60

80

100

120

Temperature (5C)

8

Motorola Sensor Device Data

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M P XY 8 020 A

Control Timing

+2.1 V ≤ V_DD≤ +3.6 V, T_L≤ T_A≤ T_H, unless otherwise specified.

Characteristic

Symbol

Min

Typ

Max

Units

HFO Measurement Clock Frequency

f

HF

100

135

150

kHz

LFO Wake Up Clock Frequency

Ta = –40°C, +2.1V ≤ Vdd ≤ +3.6

Ta = +25°C, +2.1V ≤ Vdd ≤ +3.6

Ta = +125°C, +2.1V ≤ Vdd ≤ +3.6

f

LF

f

LF

f

LF

3300

3900

3800

5400

5300

8000

7700

7000

Hz

Wake Up Pulse

Pulse Timing

Pulse Width

t

—

16384

2

—

LFO clocks

WAKE

WPW

Reset Pulse

Pulse Timing

Pulse Width

t

—

16,777,216

2

LFO clocks

—

RESET

t

RPW

Minimum Setup Time (DATA edge to CLK rise)

Minimum Hold Time (CLK rise to DATA change)

100

—

nSec

SETUP

t

HOLD

Measurement Response Time

Recommended time to hold

device in measurement mode

Temperature

t

—

200

500

—

µSec

TMEAS

t

PMEAS

Pressure

Read Response Time (see Figure 8)

From 90% V on S0

DD

To OUT less than V or greater than V

t

READ

—

50

—

100

—

µSec

OL

OH

Sample Capacitor Discharge Time

From initial full scale D/A count (255)

to drop 2 counts (253)

t

20

mSec

SH

V

D

6 .3 2 Ωk

T

e

s

t

P

o

i

n

t

1 0. 9 1 Ωk

5

0

p

F

Figure 8. Control Timing Test Load for OUT and RST Pins

Motorola Sensor Device Data

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MP XY 80 20A

SENSOR CHARACTERISTICS (MPXY8020A)

Pressure Transfer Function

kPa = 2.5 × Output ± (Pressure Error)

Output = 8–bit digital pressure measurement (between 0–255)

Pressure Error (+kPa): 50 kPa v P t 250 kPa

T[°C] \ V [V]

2.1

2.5

2.7

3.0

3.3

3.6

DD

–40

–20

0

72.5

57.5

72.5

95.0

72.5

57.5

72.5

92.5

32.5

25.0

27.5

37.5

57.5

32.5

25.0

37.5

47.5

32.5

25.0

37.5

47.5

35.0

27.5

37.5

47.5

25

70

100

125

Pressure Error (+kPa): 250 kPa v P v 450 kPa

T[°C] \ V [V]

2.1

2.5

2.7

3.0

25.0

15.0

10.0

7.5

3.3

25.0

15.0

10.0

7.5

3.6

DD

–40

–20

0

40.0

32.5

30.0

35.0

40.0

62.5

40.0

25.0

40.0

60.0

25.0

15.0

10.0

7.5

30.0

20.0

15.0

30.0

35.0

25

70

10.0

25.0

35.0

7.5

100

125

25.0

35.0

25.0

35.0

Pressure Error (+kPa): 450 kPa t P v 600 kPa

T[°C] \ V [V]

2.1

2.5

2.7

3.0

3.3

3.6

DD

–40

–20

0

70.0

55.0

70.0

90.0

70.0

55.0

70.0

90.0

37.5

25.0

22.5

25.0

32.5

47.5

37.5

25.0

22.5

25.0

32.5

47.5

37.5

25.0

22.5

25.0

32.5

47.5

40.0

35.0

40.0

52.5

25

70

100

125

Areas marked in grey indicate the typical operating range.

10

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M P XY 8 020 A

SENSOR CHARACTERISTICS (MPXY8020A)

Pressure Error

30.0

25.0

20.0

15.0

10.0

5.0

0.0

50

100

400

450

500

550

600

150

200

250

300

350

Pressure [kPa]

Figure 9. Pressure Error vs Pressure at T= 255C, 2.7 3 V_DD3 +3.3 V

35

30

25

20

15

10

5

0

2.1

2.7

2.9

3.1

3.3

2.3

2.5

3.5

Vdd [V]

Figure 10. Pressure Error vs V_DDat 255C, 250 kPa 3 P 3 450 kPa

35.0

30.0

25.0

20.0

15.0

10.0

5.0

0.0

120

–40.0

–20.0

60.0

80.0

0.0

20.0

40.0

100.0

Temperature [C]

Figure 11. Pressure Error vs. Temperature at V_DD= 3 V, 250 kPa 3 P 3 450 kPa

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MP XY 80 20A

MECHANICAL SPECIFICATIONS

Maximum Ratings

Maximum ratings are the extreme limits to which the device can be exposed without permanently damaging it. Keep V_INand

V_OUTwithin the range V_SS≤ (V_INor V_OUT) ≤ V_DD

.

Rating

Symbol

Value

Unit

(1)

Maximum Pressure

p

max

1400

kPa

Centrifugal Force Effects (3 axis)

Pressure measurement change less than 1% FSS

g

2000

g

CENT

Unpowered Shock (three sides, 0.5 mSec duration)

g

shock

NOTES:

1. Tested for 5 min at 25°C

Media Compatibility

Media compatibility is as specified in Motorola document “SPD TPM Media Test.”

12

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M P XY 8 020 A

PACKAGE DIMENSIONS

2 PLACES 4 TIPS

N O TE S :

0

.

0

6

ꢀ

(

0

.

1

5

)

C

A

B

1. C O N TR O LL IN G D I MEN S I ON : I N CH .

2. I N TE R PR E T D I MEN S I ON S A ND TO LE R AN C ES PE R

A SME Y 14. 5M-1 994.

3. D I MEN S I ON S "D " A N D "E 1" D O N O T IN C L U D E M O LD

F LAS H O R P RO T R U SI O N S. MO LD FL ASH O R

P R OT R U SI O N S S HA LL N O T E XC E ED 0 .0 06 (0 .1 52 )

P ER S ID E .

4. A LL V ERT IC A L S UR FA CE S TO° MB EA X IM5 U M.

5. D I MEN S I ON "b " D O ES N O T I N CL U DE D AM BAR

P R OT R U SI O N . A LLO WA BLE D AM BA R PR O T RU S IO N

S H ALL B E 0. 008 (0 .20 3) MA XI MU M .

A

D

E

e

5

4

e/2

INCHES

DIM MIN MAX

0. 155

A1 0. 002

MILLIMETERS

MIN

3. 93

0. 05

0. 35

7. 11

MAX

4. 44

0. 25

0. 48

7. 62

10. 67

7. 62

A

0. 175

0. 010

0. 019

0. 300

0. 420

0. 300

8

1

b

D

E

0. 014

0. 280

0. 400

8X b

10. 16

7. 11

M

E1 0. 280

0 . 00 4ꢀ ( 0. 1 )

C

A B

e

L

N

P

R

θ

0. 050 ꢀB SC

1. 27ꢀ B SC

0. 013

0. 272

0. 009

0. 140

0. 023

0. 292

0. 011

0. 160

0. 33

6. 91

0. 23

3. 55

0. 58

7. 41

0. 28

4. 06

B

E1

N

R

°

0ꢀ ꢀ

°

0ꢀ ꢀ

°

7ꢀ ꢀ

A

GAGE

PLANE

P

A1

8X

0 .0 04ꢀ ( 0. 1)

.014 (0.35)

θ

DETAIL G

L

SEATING

C

DETAIL G

PLANE

CASE 1352–01

ISSUE O

Motorola Sensor Device Data

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MP XY 80 20A

NOTES

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M P XY 8 020 A

NOTES

Motorola Sensor Device Data

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MP XY 80 20A

Information in this document is provided solely to enable system and software implementers to use Motorola products. There are no express or implied copyright

licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document.

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and

specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Motorola

data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including

“Typicals”, must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the

rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other

applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury

or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola

and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees

arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that

Motorola was negligent regarding the design or manufacture of the part.

MOTOROLA and the Stylized M Logo are registered in the US Patent and Trademark Office. All other product or service names are the property of their respective

owners. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.

E Motorola Inc. 2003

HOW TO REACH US:

USA/EUROPE/LOCATIONS NOT LISTED:

Motorola Literature Distribution

P.O. Box 5405, Denver, Colorado 80217

1–800–521–6274 or 480–768–2130

JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center,

3–20–1, Minami–Azabu, Minato–ku, Tokyo 106–8573, Japan

81–3–3440–3569

ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre,

2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong

852–26668334

HOME PAGE: http://motorola.com/semiconductors

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◊

MPXY8020A/D

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型号：	MPXY8020A
厂家：	MOTOROLA
描述：	TIRE PRESSURE MONITORING SENSOR TEMPERATURE COMPENSATED AND CALIBRATED FULLY INTEGRATED DIGITAL OUTPUT 胎压监测传感器温度补偿和校准完全集成的数字输出传感器温度补偿输出元件监视器
文件：	总16页 (文件大小：284K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MPXY8020A [MOTOROLA]

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