R3-ND3-L3/CE [MSYSTEM]
Remote I/O R3 Series DeviceNet INTERFACE MODULE;型号: | R3-ND3-L3/CE |
厂家: | M-SYSTEM |
描述: | Remote I/O R3 Series DeviceNet INTERFACE MODULE |
文件: | 总7页 (文件大小:173K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MODEL: R3-ND3
Remote I/O R3 Series
SPECIFICATIONS OF OPTION: Q (multiple selections)
COATING (For the detail, refer to M-System's web site.)
/C01: Silicone coating
DeviceNet INTERFACE MODULE
(for 64-point analog signals)
/C02: Polyurethane coating
/C03: Rubber coating
27.5 [1.08]
EX-FACTORY SETTING
/SET: Preset according to the Ordering Information Sheet
(No. ESU-8353)
130
[5.12]
RELATED PRODUCTS
• EDS file
(downloadable at M-System’s web site.)
109
[4.29]
mm [inch]
GENERAL SPECIFICATIONS
Connection
DeviceNet: Euro type connector terminal
MODEL: R3-ND3-[1][2]
(applicable wire size: 0.2 to 2.5 mm , stripped length 7 mm)
2
Internal bus: Via the Installation Base
(model: R3-BSx)
ORDERING INFORMATION
• Code number: R3-ND3-[1][2]
Specify a code from below for each of [1] and [2].
(e.g. R3-ND3-R/CE/Q)
Internal power: Via the Installation Base (model: R3-BSx)
Power input, RUN contact output: M3 separable screw
terminal (torque 0.5 N·m)
• Specify the specification for option code /Q
(e.g. /C01/SET)
Screw terminal: Nickel-plated steel
Isolation: DeviceNet to internal bus or internal power to
power input to RUN contact output to FG
Input error data setting: Input value setting at input module
error with side DIP SW
[1] POWER INPUT
N: No power supply
Dual communication setting: Set with the side DIP switch
Data allocation setting: Set with the side DIP switch
■ RUN CONTACT OUTPUT
AC Power
K3: 100 – 120 V AC
(Operational voltage range 85 - 132 V, 47 - 66 Hz) *
(CE not available)
RUN contact: Turns ON when both MS and NS LEDs are
green (DeviceNet in normal communication).
Rated load: 250 V AC @ 0.5 A (cos ø = 1)
30 V DC @ 0.5 A (resistive load)
L3: 200 – 240 V AC
(Operational voltage range 170 - 264 V, 47 - 66 Hz) *
(CE not available)
(Less than 50 V AC to conform with EU Directive)
Maximum switching voltage: 250 V AC or 30 V DC
Maximum switching power: 250 VA or 150 W
Minimum load: 1 V DC @ 1 mA
DC Power
R: 24 V DC
(Operational voltage range 24 V ±10 %, ripple 10 %p-p max.) *
* Not selectable for use with independent power modules or
network modules with the internal power input options.
Mechanical life: 2 × 10 cycles (300 cycles/min.)
7
When driving an inductive load, external contact protection
and noise quenching recommended.
[2] OPTIONS (multiple selections)
Standards & Approvals
blank: Without CE
/CE: CE marking
Other Options
blank: none
/Q: Option other than the above (specify the specification)
R3-ND3 SPECIFICATIONS
ES-8382 Rev.17 Page 1/7
https://www.m-system.co.jp/
MODEL: R3-ND3
DeviceNet COMMUNICATION
Transmission cable: Approved for DeviceNet
Node address setting: DIP switch; 00 – 63
Baud rate: 125 kbps, 250 kbps, 500 kbps DIP switch
NS (Network Status) indicator: Bi-color (green/red) LED
indicates status of the communication link.
MS (Module Status) indicator: Bi-color (green/red) LED
indicates device status.
Data allocation: 64 words for input data 67 words for output
data
INSTALLATION
Power consumption
•AC: Approx. 20 VA
•DC: Approx. 12 W
Current consumption (no power supply): 80 mA
Output current (power supply): 270 mA continuous at 20 V
DC; 420 mA for 10 minutes
Supply voltage to network: 11 – 25 V DC supplied through
the network terminal block
Supply current to network: 50 mA max.
Operating temperature: -10 to +55°C (14 to 131°F)
Operating humidity: 30 to 90 %RH (non-condensing)
Atmosphere: No corrosive gas or heavy dust
Mounting: Installation Base (model: R3-BSx)
Weight: 200 g (0.44 lb)
PERFORMANCE
Insulation resistance: ≥ 100 MΩ with 500 V DC
Dielectric strength: 1500 V AC @ 1 minute
(DeviceNet to internal bus or internal power to power input
to RUN contact output to FG)
STANDARDS & APPROVALS
EU conformity:
EMC Directive
EMI EN 61000-6-4
EMS EN 61000-6-2
RoHS Directive
R3-ND3 SPECIFICATIONS
ES-8382 Rev.17 Page 2/7
https://www.m-system.co.jp/
MODEL: R3-ND3
EXTERNAL VIEW
■ FRONT VIEW
■ SIDE VIEW
Node Address & Baud Rate
DR1
DR0
NA5
NA4
8
MS Indicator LED
Baud Rate
Setting
NA3
NA2
NA1
NA0
7
6
5
4
3
2
Node
Address
Setting
NS Indicator LED
Configuration Jack
DIP SW
SW3
ON
SW2
SW1
1
4
3
2
1
8
7
6
5
4
3
2
1
8
7
6
5
4
3
2
1
ON
Euro Type
Connector Terminal
1
2
3
4
ON
ON
5
6
R3-ND3 SPECIFICATIONS
ES-8382 Rev.17 Page 3/7
https://www.m-system.co.jp/
MODEL: R3-ND3
TRANSMISSION DATA DESCRIPTIONS
The DIP SW located at the side of the module specifies each I/O module's data allocation (occupied data area).
For example, when the data areas are assigned as shown below:
Module 1
Module 2
Module 3
Module 4
Module 5
Module 6
Module 7
4
4
4
1
1
1
1
Then the I/O data are assigned as in the figures below:
■ OUTPUT DATA
■ INPUT DATA
The figure below shows the allocation of the data sent from
the network module to the master.
The figure below shows the allocation of the data sent from
the master to the network module.
15
0
15
0
Begin
Address +0
Begin
Address +0
Module 1
Module 2
Module 3
Module 1
Module 2
Module 3
+2
+4
+2
+4
+6
+6
+8
+8
+10
+12
+14
+16
+10
+12
+14
+16
Module 4
Module 5
Module 6
Module 7
Module 4
Module 5
Module 6
Module 7
+63
+64
+66
Module Status
Error Status
Data Error Status
Module Status, Error Status and Data Error Status are assigned to +64, +65 and +66 respectively.
Each module can handle either input or output data. Input and output cannot be mixed in one module.
Input data from the master device is transferred to the module's output data area. The master device can read from the output
data area the data it has set.
• Module Status indicates whether individual I/O modules are mounted or not. The bit corresponding to the mounted slot
turns to “1,” and the unmounted slot to “0.”
• Error Status indicates error status for each module as described below. The bit corresponding to such module turns to “1.”
R3-TSx, R3-RSx, R3-US4: Input burnout
R3-DA16A:
R3-YSx:
Power input in error or disconnected
Output current error (e.g. load unconnected)
External power supply in error or disconnected
R3-PC16A:
• Data Error Status indicates overrange (R3-US4: out of -10% to +110%; the other types: out of -15% to +115%) status for each
module. The bit corresponding to such module turns to “1.”
R3-ND3 SPECIFICATIONS
ES-8382 Rev.17 Page 4/7
https://www.m-system.co.jp/
MODEL: R3-ND3
MODULE STATUS, ERROR STATUS, DATA ERROR STATUS
Shows each module's availability and error status.
15
0
Module 1
Module 2
Module 3
:
Module 16
I/O DATA DESCRIPTIONS
The data allocations for typical I/O modules are shown below.
Refer to the manual for each module for detailed data allocations.
■ ANALOG DATA (16-bit data, models: R3-SV4, YV4, DS4, YS4, US4, etc.)
16-bit binary data.
Basically, 0 to 100% of the selected I/O range is converted into 0 to 10000 (binary).
-15 to 0 % is a negative range represented in 2’s complement.
In case of R3-US4, -10 to 0% is a negative range represented in 2's complement.
15
0
■ TEMPERATURE DATA (16-bit data, models: R3-RS4, TS4, US4, etc.)
16-bit binary data.
With °C temperature unit, raw data is multiplied by 10. For example, 25.5°C is converted into 255.
With °F temperature unit, the integer section of raw data is directly converted into the data.
For example, 135.4°F is converted into 135.
Minus temperature is converted into negative values, represented in 2’s complements.
15
0
■ ANALOG DATA (16-bit data, models: R3-CT4A, CT4B, etc.)
16-bit binary data.
Integer obtained by multiplying unit value (A) by 100.
In case of CLSE-R5, integer obtained by multiplying unit value (A) by 1000.
15
0
■ ACCUMULATED COUNT DATA (32-bit data, models: R3-PA2, PA4A, WT1, WT4, etc.)
32-bit binary data is used for accumulated counts and encoder positions.
Lower 16 bits are allocated from the lowest address to higher ones, higher 16 bits in turn.
15
0
0
+0
+1
Lower 16 bits
Higher 16 bits
15
R3-ND3 SPECIFICATIONS
ES-8382 Rev.17 Page 5/7
https://www.m-system.co.jp/
MODEL: R3-ND3
■ BCD DATA (32-bit data, models: R3-BA32A, BC32A, etc.)
32-bit binary data is used for BCD.
Lower 16 bits are allocated from the lowest address to higher ones, higher 16 bits in turn.
15
15
0
+0
+1
Lower 16 bits
Higher 16 bits
0
■ 16-POINT DISCRETE DATA (models: R3-DA16, DC16, etc.)
15
0
Input 1 (Output 1)
Input 2 (Output 2)
Input 3 (Output 3)
:
:
Input 16 (Output 16)
0 : OFF
1 : ON
EXTERNAL DIMENSIONS & TERMINAL ASSIGNMENTS unit: mm [inch]
27.5 [1.08]
109 [4.29]
POSITIONING
GUIDE
6–M3
SCREW
1
4
2
5
3
6
TERMINAL
COVER
R3-ND3 SPECIFICATIONS
ES-8382 Rev.17 Page 6/7
https://www.m-system.co.jp/
MODEL: R3-ND3
SCHEMATIC CIRCUITRY & CONNECTION DIAGRAM
Note: In order to improve EMC performance, bond the FG terminal to ground.
Caution: FG terminal is NOT a protective conductor terminal.
LED
DIP SW
V+
Isolation
CAN_H
Drain
CAN_L
V–
To Other
DeviceNet
Devices
Control
Circuit
Communication
Circuit
INTERNAL BUS
DIP SW
RUN +
1
4
2
3
6
INTERNAL POWER
RUN CONTACT OUTPUT
RUN –
*
U (+)
V (–)
5
*
POWER INPUT
*
FG
JACK
*Not provided with ‘No Power Supply’ type module.
CONFIGURATION JACK
Specifications are subject to change without notice.
R3-ND3 SPECIFICATIONS
ES-8382 Rev.17 Page 7/7
https://www.m-system.co.jp/
相关型号:
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