BLA31AG121SN4L
更新时间：2024-09-18 16:58:14
品牌：MURATA
描述：Ferrite Chip, 4 Function(s), 0.15A, EIA STD PACKAGE SIZE 1206
概述
规格参数
数据手册
替代型号BLA31AG121SN4L 概述
Ferrite Chip, 4 Function(s), 0.15A, EIA STD PACKAGE SIZE 1206 数据线路滤波器
BLA31AG121SN4L 规格参数
| 是否无铅： | 不含铅 | 是否Rohs认证： | 符合 |
| 生命周期： | Obsolete | 包装说明： | EIA STD PACKAGE SIZE 1206 |
| Reach Compliance Code： | compliant | ECCN代码： | EAR99 |
| HTS代码： | 8504.50.80.00 | 风险等级： | 5.3 |
| 其他特性： | ARRAY TYPE | 最大直流电阻： | 0.3 Ω |
| 滤波器类型： | FERRITE CHIP | 高度： | 0.8 mm |
| JESD-609代码： | e3 | 长度： | 3.2 mm |
| 安装类型： | SURFACE MOUNT | 功能数量： | 4 |
| 最高工作温度： | 125 °C | 最低工作温度： | -55 °C |
| 输出阻抗： | 120 OHM Ω | 包装方法： | TAPE AND REEL |
| 物理尺寸： | L3.2XB1.6XH0.8 (mm) | 额定电流： | 0.15 A |
| 端子面层： | Tin (Sn) | 宽度： | 1.6 mm |
| Base Number Matches： | 1 |
BLA31AG121SN4L 数据手册
通过下载BLA31AG121SN4L数据手册来全面了解它。这个PDF文档包含了所有必要的细节，如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
On-Board Type (DC) EMI Suppression Filters(EMIFILr)
Chip Ferrite Beads Arrays BLA31A/BLA31B Series
3
The miniaturize of electronic equipment requires high
performance EMI filters which enables high density
mounting. BLA31A/B series consists of 4 circuit of
ferrite bead inductor.
BLA31A/B is suitable for EMi suppression in smaller
digital equipment.
0.8±0.1
0.4±0.2
1.6±0.2
■ Features
3.2±0.2
1. BLA31A/B have 4 circuits in 3.2x1.6mm body with 0.8mm
pitch.
in mm
2. Provides attenuation across a broad frequency range.
Two types of impedance are available which meets
general signal line and high speed signal line.
3. Original inner electrode structure enables extra low
crosstalk.
4. The nickel barrier structure of the extermal
electrodes provides excellent solder heat resistance.
Both flow and reflow soldering methods can employed.
Impedance (at 100MHz)
Rated Current
(mA)
DC Resistance(max.)
(ohm)
Operating Temperature Range
Part Number
(ohm)
(°C)
BLA31AG300SN4
BLA31AG600SN4
BLA31AG121SN4
BLA31AG221SN4
BLA31AG601SN4
BLA31AG102SN4
BLA31BD121SN4
BLA31BD221SN4
BLA31BD471SN4
BLA31BD601SN4
BLA31BD102SN4
30 ±25%
60 ±25%
200
200
150
150
100
50
0.10
0.25
0.30
0.30
0.50
0.70
0.40
0.45
0.55
0.65
0.55
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
120 ±25%
220 ±25%
600 ±25%
1000 ±25%
120 ±25%
220 ±25%
470 ±25%
600 ±25%
1000 ±25%
150
150
100
100
50
Number of Circuit : 4
■ Equivalent Cirucit
■ Impedance-Frequency (Typical)
BLA31A Series
1200
AG600SN4
AG102SN4
900
AG601SN4
AG300SN4
AG221SN4
600
AG121SN4
300
There are no polarity.
0
1
10
100
1000
Frequency (MHz)
Continued on the following page.
63
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
Continued from the preceding page.
■ Impedance-Frequency Characteristics
BLA31AG300SN4
BLA31AG600SN4
40
80
Z
Z
30
60
40
R
R
3
20
X
X
10
20
0
0
1
10
100
Frequency (MHz)
1000
1
10
100
1000
Frequency (MHz)
BLA31AG121SN4
BLA31AG221SN4
200
300
150
100
225
150
Z
Z
R
R
X
X
50
0
75
0
1
10
100
1000
1
10
100
Frequency (MHz)
1000
Frequency (MHz)
BLA31AG601SN4
BLA31AG102SN4
1200
800
900
600
600
400
Z
Z
R
R
X
X
300
0
200
0
1
10
100
Frequency (MHz)
1000
1
10
100
1000
Frequency (MHz)
■ Impedance-Frequency (Typical)
BLA31B Series
2000
1500
BD102SN4
1000
500
0
BD601SN4
BD471SN4
BD221SN4
BD121SN4
1
10
100
1000
Frequency (MHz)
64
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
■ Impedance-Frequency Characteristics
BLA31BD121SN4
BLA31BD221SN4
500
300
375
250
225
Z
Z
3
R
X
R
150
X
125
0
75
0
1
10
100
1000
1
10
100
1000
Frequency (MHz)
Frequency (MHz)
BLA31BD471SN4
BLA31BD601SN4
1000
800
750
500
600
400
Z
Z
R
R
X
X
250
0
200
0
1
10
100
Frequency (MHz)
1000
1
10
100
1000
Frequency (MHz)
BLA31BD102SN4
2000
1500
1000
Z
R
500
0
X
1
10
100
Frequency (MHz)
1000
65
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
BLA Series Notice (Soldering and Mounting)
1. Standard Land Pattern Dimensions
For Reflow and Flow Soldering
Land
Solder Resist
3
2.8
0.8Pitch
0.4
• If there are high amount of self-heating on pattern, the
contact point of PCB and part may become damaged.
(in mm)
2. Solder Paste Printing and Adhesive Application
When reflow soldering the chip EMI suppression filter, the
printing must be conducted in accordance with the
following cream solder printing conditions. If too much
solder is applied, the chip will prone to be damaged by
mechanical and thermal stress from the PCB and may
crack. In contrast, if too little solder is applied, there is the
potential that the termination strength will be insufficient,
creating the potential for detachment. Standard land
dimensions should be used for resist and copper foil
patterns.
When flow soldering the EMI suppression filter, apply the
adhesive in accordance with the following conditions. If
too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering process.
(1) Solder Paste Printing
BLA31Series
Ensure that solder is applied to a minimum height of
0.2mm to 0.3mm at the end surface of the part.
Coat the solder paste a thickness of 100µm to 200µm.
(2) Adhesive Application
BLA31Series
Coating amount is illustrated in the following diagram.
a:20µm−70µm
b:30µm−35µm
c:50µm−105µm
Chip Solid Inductor
a
c
b
Bonding agent
PCB
Land
Continued on the following page.
66
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
BLA Series Notice (Soldering and Mounting)
Continued from the preceding page.
3. Standard Soldering Conditions
(1) SOLDERING METHODS
Allowable Flow Soldering Temperature and Time
Use flow and reflow soldering methods only.
Use standard soldering conditions when soldering chip
EMI suppression filters.
3
280
270
260
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
BLA31
250
(2) SOLDERING TEMPERATURE AND TIME
240
230
To prevent external electrode solder leaching and
performance deterioration, solder within the temperature
and time combinations illustrated by the slanted lines in
the following graphs. If soldering is repeated, please note
that the allowed time is the accumulated time.
0
5
10
15
20
25
30
Time [s]
Allowable Reflow Soldering Temperature and Time
Solder: H60A H63A solder(JIS Z 3238)
Flux :
280
270
260
250
Use Rosin-based fulx(when using RA type solder, clean
products sufficiently to avoid residual fulx.)
Do not use strong acidic fulx(with chlorine content
exceeding 0.20wt%)
Do not use water-soluble fulx.
BLA31
240
230
0
20
30
40
50
60
70
80
90
Time [s]
(3) SOLDERING CONDITION
Flow Solder
Gradual cooling
Soldering
(in air)
Pre-heating
300
250
200
150
100
50
Max. Temp. 250°C
0
60s Min.
10s Max.
Reflow Solder
Gradual cooling
Pre-heating
Soldering
(in air)
300
250
Max. Temp. 230°C
230°C
183°C
200
150
100
50
0
20s Max.
60s Max.
60s Min.
Continued on the following page.
67
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
BLA Series Notice (Soldering and Mounting)
Continued from the preceding page.
(4) REWORKING WITH SOLDER IRON
The following conditions must be strictly followed when
using a soldering iron.
3
Pre-heating
: 150°C 60 second Min.
Soldering iron power output
: 30W Max.
Temperature of soldering iron tip : 280°C Max.
Soldering time : 10 second Max.
Do not allow the tip of the soldering iron directly to
contact the chip.
For additional methods of reworking with soldering iron,
please contact Murata engineering.
4. Cleaning
Following conditions should be observed when cleaning
chip EMI filter.
b) Aqueous cleaning agent
Surface active agent (Clean Thru 750H)
Hydrocarbon (Techno Cleaner 335)
(1) Cleaning Temperature : 60degree C max. (40degree C
max. for CFC alternatives and alcohol cleaning agents)
(2) Ultrasonic
High grade alcohol (Pine Alpha ST-100S)
Alkaline saponifier ( Aqua Cleaner 240 -cleaner should
be diluted within 20% using deionized water.)
(4) Ensure that flux residue is completely removed.
Component should be thoroughly dried after aqueous
agent has been removed with deionized water.
(5) Some products may become slightly whitened.
However, product performance or usage is not affected.
For additional cleaning methods, please contact Murata
engineering.
Output
: 20W/liter max.
Duration : 5 minutes max.
Frequency : 28kHz to 40kHz
(3) Cleaning agent
The following list of cleaning agents have been tested on
the individual components. Evaluation of final assembly
should be completed prior to production.
a) CFC alternatives and alcohol cleaning agents
Isopropyl alcohol (IPA)
HCFC-225
68
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
Outlines of EMI Suppression Filter (EMIFILr) for DC Line
oChip Ferrite Bead
oFerrite Bead Inductor
Chip Ferrite Bead .............P.24–65
Ferrite Bead Inductor ..........P.129–130
BLM15
BLM18
BLM21
BL01
BL02RN1R3J2B
BL02RN2R3J2B
BLA31
BLM31
BLM41
BL02RN1
BL02RN2R1M2B BL03RN2R1M1B
"ꢀInductor type EMI suppression filters are effective for fre-
quencies ranging from a few MHz to a few GHz. Inductor
type filters are widely used as a low noise
[Equivalent Circuit]
R(f)
countermeasure, as well as a universal noise
suppression component.
" The inductor type EMIFILr produce a micro inductance in
the low frequency range. At high frequencies, however,
the resistive component of the inductor produces the
primary impedance. When inserted in series in the noise
producing circuit, the resistive impedance of the inductor
prevents noise propagation.
[Impedance-Frequency Characteristics(typical)]
1000
800
600
Z
400
200
0
R
X
1
10
100
1000
Frequency [MHz]
R : Real Part (Resistive Portion) X : Imaginary Part (Inductive Portion)
17
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
The structure of the "Global Part Numbers" that have been adopted since June 2001 and the meaning of each code are described herein.
If you have any questions about details, inquire at your usual Murata sales office or distributor.
o Part Numbering
(
)
Chip EMIFILr Inductor Type
(Global Part Number)
N
1 D
BL
M
18 AG 102
S
q
w
e
r
t
y
u
i o
qProduct ID
tImpedance
Expressed by three figures. The unit is in ohm (Ω). The first and
second figures are significant digits, and the third figure
expresses the number of zeros which follow the two figures.
Product ID
BL
Chip Ferrite Beads
wType
yPerformance
Expressed by an alphabet.
Code
A
Type
Ex.)
Array Type
Code
Performance
M
Monolithic Type
Monoblock Type
S
Sn Plating
D
uCategory
eDimension (LgW)
Code
N
Category
Standard Type
Code
15
Dimension (LgW)
1.00g0.50mm
1.60g0.80mm
2.00g1.25mm
3.20g1.60mm
3.20g2.50mm
4.50g1.60mm
EIA
0402
0603
0805
1206
1210
1806
H
for Automotive Electoronics
18
iNumbers of Circuit
21
31
Code
Numbers of Circuit
1Circuit
32
1
4
6
8
41
4Circuit
6Circuit
rCharacteristics
8Circuit
Code
Ap *1
Bp *2
Pp *3
RK
Characteristics
for General Use
oPackaging
for High-speed Signal Lines
for Power Supplies
Code
K
Packaging
Plastic Taping (ø330mm Reel)
Plastic Taping (ø180mm Reel)
Bulk
for Digital Interface
L
HG
for GHz Band General Use
for GHz Band High-speed Signal Line
B
HD
J
Paper Taping (ø330mm Reel)
Paper Taping (ø180mm Reel)
Bulk Case
D
*1 For standard type, is expressed by "G".
p
*2
*3
is expressed by "A", "B" or "D".
is expressed by "G", "M", "B", "F".
p
p
C
2
BLA31AG121SN4L 替代型号
| 型号 | 制造商 | 描述 | 替代类型 | 文档 |
| BLA31AG121SN4D | MURATA | EMIFIL (Inductor type) Chip Ferrite Bead (Array) BLA31A/BLA31B Series (1206 Size) | 功能相似 |
|
| BLA31AG121SN4 | MURATA | EMI Suppression Filters | 功能相似 |
|
| BLA31AG121SN4K | MURATA | 暂无描述 | 功能相似 |
|
BLA31AG121SN4L 相关器件
| 型号 | 制造商 | 描述 | 价格 | 文档 |
| BLA31AG221SN4 | MURATA | EMI Suppression Filters | 获取价格 |
|
| BLA31AG221SN4# | MURATA | 民用设备,植入式、手术、自动输药应用以外的医疗器械设备[GHTF A/B/C],运输、重工、商用能源相关应用除外的工业设备 | 获取价格 |
|
| BLA31AG221SN4B | MURATA | EMIFIL (Inductor type) Chip Ferrite Bead (Array) BLA31A/BLA31B Series (1206 Size) | 获取价格 |
|
| BLA31AG221SN4C | MURATA | Ferrite Chip, 4 Function(s), 0.15A, EIA STD PACKAGE SIZE 1206 | 获取价格 |
|
| BLA31AG221SN4D | MURATA | EMIFIL (Inductor type) Chip Ferrite Bead (Array) BLA31A/BLA31B Series (1206 Size) | 获取价格 |
|
| BLA31AG221SN4J | MURATA | EMIFIL (Inductor type) Chip Ferrite Bead (Array) BLA31A/BLA31B Series (1206 Size) | 获取价格 |
|
| BLA31AG221SN4K | MURATA | Ferrite Chip, 4 Function(s), 0.15A, EIA STD PACKAGE SIZE 1206 | 获取价格 |
|
| BLA31AG221SN4L | MURATA | Ferrite Chip, 4 Function(s), 0.15A, EIA STD PACKAGE SIZE 1206 | 获取价格 |
|
| BLA31AG300SN4 | MURATA | EMI Suppression Filters | 获取价格 |
|
| BLA31AG300SN4# | MURATA | 民用设备,植入式、手术、自动输药应用以外的医疗器械设备[GHTF A/B/C],运输、重工、商用能源相关应用除外的工业设备 | 获取价格 |
|
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