BLM15PX800SN1D [MURATA]
Ferrite Chip, 1 Function(s), 1.3A,;
| 型号： | BLM15PX800SN1D |
| 厂家： | 
muRata |
| 描述： | Ferrite Chip, 1 Function(s), 1.3A, |
| 文件： | 总11页 (文件大小：230K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Reference Only
Reference Spec.No.JENF243A-0018AJ-01
P1/11
Chip Ferrite Bead BLM15□□□□□SN1□ REFERENCE SPECIFICATION
1.Scope
This reference specification applies to Chip Ferrite Bead BLM15_SN series.
2.Part Numbering
(ex.)
BL
M
(2)
15
(3)
AG
(4)
100
(5)
S
N
1
D
(9)
(1)
(6) (7) (8)
(1)Product ID (2)Type (3)Dimension(L×Ｗ) (4)Characteristics (5)Typical Impedance at 100MHz
(6)Performance (7)Category (8)Numbers of Circuit (9)Packaging(D:Taping / B:Bulk)
3.Rating
Impedance ()
(at 100MHz,Under Standard
Testing Condition)
DC Resistance
( max.)
Customer
Part Number
MURATA
Part Number
Rated Current
(mA)
Remark
Initial
Values
Values After
Typical
Testing
0.05
BLM15AG100SN1D
BLM15AG100SN1B
BLM15AG700SN1D
BLM15AG700SN1B
BLM15AG121SN1D
BLM15AG121SN1B
BLM15AG221SN1D
BLM15AG221SN1B
BLM15AG601SN1D
BLM15AG601SN1B
5～15
10
70
1000
600
550
450
300
0.025
0.15
0.19
0.29
0.52
40～100
120±25%
220±25%
600±25%
0.20
0.29
0.39
0.62
120
220
600
BLM15AG102SN1D
BLM15AG102SN1B
BLM15AX100SN1D
BLM15AX100SN1B
BLM15AX300SN1D
BLM15AX300SN1B
BLM15AX700SN1D
BLM15AX700SN1B
BLM15AX121SN1D
BLM15AX121SN1B
BLM15AX221SN1D
BLM15AX221SN1B
BLM15AX601SN1D
BLM15AX601SN1B
BLM15AX102SN1D
BLM15AX102SN1B
1000±25%
1000
300
0.65
0.75
For
general
use
5～15
10
30
1740
1100
780
0.015
0.06
0.10
0.13
0.18
0.34
0.49
0.025
0.11
0.15
0.18
0.23
0.39
0.54
30±25％
70±25％
120±25％
220±25％
600±25%
1000±25%
70
120
220
600
1000
700
600
500
350
BLM15BA050SN1D
BLM15BA050SN1B
BLM15BB050SN1D
BLM15BB050SN1B
BLM15BA100SN1D
BLM15BA100SN1B
BLM15BB100SN1D
BLM15BB100SN1B
BLM15BA220SN1D
BLM15BA220SN1B
BLM15BB220SN1D
BLM15BB220SN1B
BLM15BA330SN1D
BLM15BA330SN1B
5±25%
5±25%
5
5
300
500
300
300
300
300
300
0.10
0.08
0.20
0.10
0.30
0.20
0.40
0.15
0.15
0.25
10±25%
10±25%
22±25%
22±25%
33±25%
10
10
22
22
33
For
0.15 high speed
signal line
0.35
0.30
0.45
MURATA MFG.CO.,LTD.
Reference Only
Reference Spec.No.JENF243A-0018AJ-01
P2/11
Impedance ()
(at 100MHz,Under Standard
Testing Condition)
DC Resistance
( max.)
Initial
(Note)
Customer
Part Number
MURATA
Part Number
Rated Current
Remark
Values
(mA)
Values After
Typical
Testing
0.65
BLM15BA470SN1D
BLM15BA470SN1B
BLM15BB470SN1D
BLM15BB470SN1B
BLM15BA750SN1D
BLM15BA750SN1B
BLM15BB750SN1D
BLM15BB750SN1B
BLM15BD750SN1D
BLM15BD750SN1B
BLM15BB121SN1D
BLM15BB121SN1B
BLM15BD121SN1D
BLM15BD121SN1B
BLM15BB221SN1D
BLM15BB221SN1B
BLM15BC121SN1D
BLM15BC121SN1B
BLM15BD221SN1D
BLM15BD221SN1B
BLM15BD471SN1D
BLM15BD471SN1B
BLM15BC241SN1D
BLM15BC241SN1B
BLM15BD601SN1D
BLM15BD601SN1B
BLM15BD102SN1D
BLM15BD102SN1B
BLM15BD152SN1D
BLM15BD152SN1B
BLM15BD182SN1D
47±25%
47±25%
47
47
200
300
200
300
300
300
300
200
350
300
200
0.60
0.35
0.80
0.40
0.20
0.55
0.30
0.80
0.45
0.40
0.60
0.45
0.85
0.50
0.30
0.65
0.4
75±25%
75
75±25%
75
75±25%
75
120±25%
120±25%
220±25%
120±25％
220±25%
470±25%
120
120
220
120
220
470
0.90
0.50
0.50
0.70
For
high speed
signal line
240±25％
600±25%
1000±25%
1500±25%
1800±25%
75±25%
240
600
250
200
200
190
100
600
600
450
350
350
300
250
0.70
0.65
0.90
1.0
0.75
0.75
1.0
1000
1500
1800
75
1.1
1.4
1.5
BLM15BD182SN1B
BLM15BX750SN1D
BLM15BX750SN1B
BLM15BX121SN1D
BLM15BX121SN1B
BLM15BX221SN1D
BLM15BX221SN1B
BLM15BX471SN1D
BLM15BX471SN1B
BLM15BX601SN1D
BLM15BX601SN1B
BLM15BX102SN1D
BLM15BX102SN1B
BLM15BX182SN1D
BLM15BX182SN1B
0.15
0.17
0.27
0.41
0.46
0.65
0.90
0.20
0.22
0.32
0.46
0.51
0.75
1.0
120±25%
220±25%
470±25%
600±25%
1000±25%
1800±25%
120
220
470
600
1000
1800
MURATA MFG.CO.,LTD.
Reference Only
Reference Spec.No.JENF243A-0018AJ-01
P3/11
Impedance ()
(at 100MHz,Under Standard
Testing Condition)
DC Resistance
(Note)
( max.)
Initial
Rated Current
(mA)
Customer
Part Number
MURATA
Part Number
Remark
Values
Values After
Typical at 85℃ at 125℃
Testing
0.05
BLM15PG100SN1D
BLM15PG100SN1B
BLM15PD300SN1D
BLM15PD300SN1B
BLM15PD600SN1D
BLM15PD600SN1B
BLM15PD800SN1D
BLM15PD800SN1B
BLM15PD121SN1D
BLM15PD121SN1B
BLM15PX330SN1D
BLM15PX330SN1B
BLM15PX600SN1D
BLM15PX600SN1B
BLM15PX800SN1D
BLM15PX800SN1B
BLM15PX121SN1D
BLM15PX121SN1B
BLM15PX181SN1D
BLM15PX181SN1B
BLM15PX221SN1D
BLM15PX221SN1B
BLM15PX331SN1D
BLM15PX331SN1B
BLM15PX471SN1D
BLM15PX471SN1B
BLM15PX601SN1D
BLM15PX601SN1B
BLM15KD200SN1D
BLM15KD200SN1B
BLM15KD300SN1D
BLM15KD300SN1B
BLM15KD121SN1D
BLM15KD121SN1B
5～15
10
30
1000
0.025
0.035
0.06
2200*1 1400*1
1700*1 1100*1
1500*1 1000*1
1300*1 900*1
30±25%
0.05
0.075
0.085
0.105
0.037
0.047
0.053
0.070
0.105
0.115
0.165
0.22
60±25%
60
80±25%
80
0.07
120±25%
33±25％
60±25％
80±25％
120±25％
180±25％
220±25％
330±25％
470±25％
600±25％
120
33
0.09
3000*1 1700*1 0.022
2500*1 1400*1 0.032
2300*1 1300*1 0.038
2000*1 1100*1 0.055
60
80
For DC
power line
120
180
220
330
470
600
20
1500*1 800*1
1400*1 800*1
1200*1 700*1
1000*1 600*1
0.090
0.10
0.15
0.20
0.23
900*1
500*1
0.25
20±25%
30±25%
120±25%
3800*1 2350*1 0.011
3100*1 1900*1 0.017
0.016
0.022
0.085
30
120
1500*1 930*1
0.070
■Operating Temperature : -55°C to +125°C
■Storage Temperature : -55°C to +125°C
Rated current
at 85°C
(Note) As for the Rated current marked with *1,
Rated Current is derated as right figure
depending on the operating temperature.
Rated current
at 125°C
0
85
125
Operating Temperature (°C)
MURATA MFG.CO.,LTD.
Reference Onl
■ Equivalent Circuit
Reference Spec.No.JENF243A-0018AJ-01
4.Style and Dimensions
P4/11
1.0±0.05
0.5±0.05
0.25±0.1
Resistance element becomes
dominant at high frequencies.
(
)
: Electrode
(in mm)
■ Unit Mass(Typical value)
0.001g
5.Marking
No marking.
6.Standard Testing Conditions
Unless otherwise specified
In case of doubt
Temperature : Ordinary Temp. (15 °C to 35 °C )
Temperature : 20°C±2 °C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
7.Specifications
7-1.Electrical Performance
No. Item
Specification
Meet item 3.
Test Method
7-1-1 Impedance
Measuring Frequency : 100MHz±1MHz
Measuring Equipment : KEYSIGHT4291A or the equivalent
Test Fixture : KEYSIGHT16192A or the equivalent
Measuring Equipment : Digital multi meter
7-1-2 DC Resistance
Meet item 3.
*Except resistance of the Substrate and Wire
7-2.Mechanical Performance
No. Item
Specification
Meet item 4.
Test Method
7-2-1 Appearance
And
Visual Inspection and measured with Slide Calipers.
Dimensions
7-2-2 Bonding
Strength
Meet Table 1.
Table 1
It shall be soldered on the substrate.
Applying Force(F) : 5N
Applying Time : 5s±1s
Appearance No damage
Impedance
Applying Direction: Parallel to the substrate.
Side view
Change
(at 100MHz)
DC
Within ±30%
Ｆ
Ｆ
R0.5
Meet item 3.
Resistance
Substrate
7-2-3 Bending
Strength
It shall be soldered on the substrate.
Substrate: Glass-epoxy 100mm40mm0.8mm
Deflection : 2.0mm
Speed of Applying Force : 0.5mm/s
Keeping Time : 30s
Pressure jig
R340
F
Deflection
Product
45mm
45mm
MURATA MFG.CO.,LTD.
Reference Only
Reference Spec.No.JENF243A-0018AJ-01
P5/11
No.
Item
Specification
Meet Table 1.
Test Method
7-2-4 Vibration
It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 h)
Pre-Heating : 150°C±10°C, 60s～90s
Solder : Sn-3.0Ag-0.5Cu
7-2-5 Resistance
to Soldering
Heat
Solder Temperature : 270°C±5°C
Immersion Time : 10s±0.5s
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room conditionfor 48h±4h.
It shall be dropped on concrete or steel board.
Method : free fall
7-2-6 Drop
Products shall be no failure
after tested.
Height : 75cm
Attitude from which the product is dropped : 3 direction
The number of times : 3 times for each direction(Total 9 times)
Flux : Ethanol solution of rosin,25(wt)%
7ｰ2-7 Solderability The electrodes shall be at
least 95% covered with new Pre-Heating : 150°C±10°C, 60s～90s
solder coating.
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240°C±5°C
Immersion Time : 3s±1s
Immersion and emersion rates : 25mm/s
7-3.Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
Test Method
7-3-1 Temperature Meet Table 1.
Cycle
1 cycle :
1 step : -55 °C(+0 °C,-3 °C) / 30min±3min
2 step : Ordinary temp. / 10min to 15min
3 step : +125 °C(+3 °C,-0 °C) / 30min±3min
4 step : Ordinary temp. / 10min to 15min
Total of 100 cycles
Then measured after exposure in the room condition for
48h±4h.
7-3-2 Humidity
Temperature : 40°C±2°C
Humidity : 90%RH to 95%RH
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for
48h±4h.
7-3-3 Heat Life
Meet Table 2.
Temperature : 125°C±3°C
Applying Current : Rated Current(at 125°C)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for
48h±4h.
Table 2
Appearance No damage
Impedance
Change
(at 100MHz)
DC
Resistance
Within ±30%
(for BLM15PD
Within ±40%)
Meet item 3.
7-3-4 Cold
Resistance
Meet Table 1.
Temperature : -55±2°C
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for
48h±4h.
MURATA MFG.CO.,LTD.
Reference Only
Reference Spec.No.JENF243A-0018AJ-01
P6/11
8.Specification of Packaging
8-1.Appearance and Dimensions (8mm-wide paper tape)
2.0±0.05
4.0±0.1
2.0±0.05
1.5+0.1
-0
0.8max.
0.65(Typ.)
(in mm)
Direction of Feed
(1) Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide, 2mm-pitch continuously and sealed
by top tape and bottom tape.
(2) Sprocket hole:Sprocket hole shall be located on the right hand side toward the direction of feed.
(3) Spliced point:The base tape and top tape have no spliced point
(4) Cavity:There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
8-2.Tape Strength
(1)Pull Strength
Top tape
Bottom tape
5N min.
Top tape
165 to 180 degree
F
(2)Peeling off force of Cover tape
0.1N to 0.6N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
Bottom tape
Base tape
8-3.Taping Condition
(1)Standard quantity per reel
Quantity per 180mm reel
10000 pcs. / reel
(2)There shall be leader-tape(top tape and empty tape) and trailer- tape(empty tape) as follows.
(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape
for more than 5 pitch.
(4)Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(1) , RoHS marking(2) , Quantity, etc)
1) « Expression of Inspection No. »
□□ OOOO
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O,N,D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(5)Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is sticked on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking(2) ,Quantity, etc)
MURATA MFG.CO.,LTD.
Reference Onl
Reference Spec.No.JENF243A-0018AJ-01
P7/11
(6)Dimensions of reel and taping(leader-tape, trailer-tape)
Trailer
Leader
160 min.
2.0±0.5
Label
190 min.
Empty tape
210 min.
Top tape
13.0±0.2
60+1
-
0
Direction of feed
21.0±0.8
+1
-0
9.0
13.0±1.4
180 +0
-3
(in mm)
8-4. Specification of Outer Case
Outer Case Dimensions
(mm)
Standard Reel Quantity in Outer Case
(Reel)
Label
W
D
H
H
186
186
93
5
D
Above Outer Case size is typical. It depends on a quantity of an order.
W
9. ！ Caution
9-1. Surge current
Excessive surge current ( pulse current or rush current) than specified rated current applied to the product may cause
a critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
9-2.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment
(2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment
(5)Medical equipment (6)Transportation equipment(automobiles,trains,ships,etc.) (7)Traffic signal equipment
(8)Disaster prevention / crime prevention equipment (9)Data-processing equipment
(10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
10.Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1.Land pattern designing
Standard land dimensions (Reflow soldering)
< For BLM15 series (except BLM15P□, BLM15AX, BLM15KD type) >
Chip Ferrite Bead
0.5
Solder Resist
Pattern
0.4
1.2～1.4
(in mm)
MURATA MFG.CO.,LTD.
Reference Only
Reference Spec.No.JENF243A-0018AJ-01
P8/11
< For BLM15P
□,
BLM15AX, BLM15KD type >
Chip Ferrite Bead
Land pad thickness
and dimension d
18µm 35µm 70µm
Rated
Current
(A)
a
b
c
ｃ
ｄ
1.5 Max
2.2 Max 0.4
3.0 Max
0.5
1.2
2.4
0.5
0.7
1.2
0.5
0.5
0.5
1.2 to 1.4
0.5
Solder Resist
Pattern
(in mm)
ａ
ｂ
The excessive heat by land pads may cause
deterioration at joint of products with substrate.
10-2.Soldering Conditions
Products can be applied to reflow soldering.
(1) Flux,Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 m
(2) Soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100℃ max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
(3) Soldering profile
Temp.
(℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time.(s)
Standard Profile
150～180°C 、90s±30s
above 220°C、30s～60s
245±3°C
Limit Profile
Pre-heating
Heating
above 230°C、60s max.
260°C,10s
Peak temperature
Cycle of reflow
2 times
2 times
10-3. Reworking with soldering iron
Pre-heating: 150°C, 1 min
Soldering iron output: 80W max.
Tip temperature: 350°C max.
Tip diameter:φ3mm max.
Soldering time : 3(+1,-0) seconds.
Times : 2times max.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
MURATA MFG.CO.,LTD.
Reference Onl
Reference Spec.No.JENF243A-0018AJ-01
10-4.Solder Volume
P9/11
Solder shall be used not to be exceed as shown below.
Upper Limit
Recommendable
t
1/3T≦t≦T
(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
10-5.Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
<Products direction>
a
Products shall be located in the sideways
b
direction (Length:ab) to the mechanical
stress.
Poor example
〈
〉
Good example
〈
〉
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
A
A
A
>
>
>
D *1
B
C
C
Perforation
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Recommended
Screw Hole
10-6.Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
MURATA MFG.CO.,LTD.
Reference Only
Reference Spec.No.JENF243A-0018AJ-01
10-7.Operating Environment
P10/11
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases
and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
10-8.Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to
use, please make the reliability evaluation with the product mounted in your application set.
10-9.Cleaning Conditions
Products shall be cleaned on the following conditions.
(1)Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2)Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max.
(3)Cleaner
1.Alternative cleaner
Isopropyl alcohol (IPA)
2.Aqueous agent
PINE ALPHA ST-100S
(4)There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5)Other cleaning
Please contact us.
10-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
10-11.Storage Conditions
(1)Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2)Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity
No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be stored under the airtight packaged condition.
(3)Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
MURATA MFG.CO.,LTD.
Reference Only
Reference Spec.No.JENF243A-0018AJ-01
11. Note
P11/11
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
MURATA MFG.CO.,LTD.
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