BLM31PG500SZ1B [MURATA]
This reference specification applies to Chip Ferrite Bead for Automotive Electronics BLM31_SZ Series based on AEC-Q200 except for Power train and Safety.;
| 型号： | BLM31PG500SZ1B |
| 厂家： | 
muRata |
| 描述： | This reference specification applies to Chip Ferrite Bead for Automotive Electronics BLM31_SZ Series based on AEC-Q200 except for Power train and Safety. |
| 文件： | 总9页 (文件大小：211K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Spec. No. JENF243A-9115E-01
P.1/9
Reference Only
Chip Ferrite Bead BLM31□□□□□SZ1□
Murata Standard Reference Specification [AEC-Q200]
1. Scope
This reference specification applies to Chip Ferrite Bead for Automotive Electronics BLM31_SZ Series based on
AEC-Q200 except for Power train and Safety.
2. Part Numbering
(ex.)
BL
M
31
(3)
PG
(4)
601
(5)
S
Z
1
L
(1)
(2)
(6) (7) (8) (9)
(1)Product ID
(2)Type
(3)Dimension (L×Ｗ)
(4)Characteristics
(5)Typical Impedance at 100MHz
(6)Performance
(7)Category (for Automotive Electronics)
(8)Numbers of Circuit
(9)Packaging (L: Taping)
3. Rating
Rated
Current
(mA)
DC
Resistance
(Ω max.)
Impedance (Ω)
(at 100MHz, Under Standard
Testing Condition)
Customer
Part Number
MURATA
Part Number
ESD Rank
2:2kV
(Note1)
Values
After
Testing
Initial
Values
at 85℃ at 125℃
BLM31PG330SZ1L
BLM31PG330SZ1B
BLM31PG500SZ1L
BLM31PG500SZ1B
BLM31PG121SZ1L
BLM31PG121SZ1B
BLM31PG391SZ1L
BLM31PG391SZ1B
BLM31PG601SZ1L
BLM31PG601SZ1B
BLM31SN500SZ1L
BLM31SN500SZ1B
33±25%
35 min.
6000
3500
3500
2000
1500
3500
2300
2000
1250
1000
0.009
0.015
0.02
0.018
0.03
120±25%
390±25%
600±25%
50±12.5Ω
0.04
2
0.05
0.10
0.08
0.16
12000 10000 0.0016
0.0021
• Operating Temperature: -55°C to +125°C • Storage Temperature: -55°C to +125°C
Standard Testing Conditions
< Unless otherwise specified >
< In case of doubt >
Temperature : Ordinary Temp. (15 °C to 35 °C )
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
Temperature : 20°C±2 °C
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
85℃
(Note1)Rated Current is derated as right figure
depending on the operating temperature.
125℃
0
85
125
Operating Temperature (°C)
MURATA MFG.CO., LTD.
Spec. No. JENF243A-9115E-01
P.2/9
Reference Only
4. Style and Dimensions
■ Equivalent Circuit
3.2±0.2
1.6±0.2
Resistance element becomes
dominant at high frequencies.
(
)
0.7±0.3
■ Unit Mass (Typical value)
0.025 g
: Electrode
(in mm)
(in mm)
5.Marking
No marking.
6. Specifications
6-1. Electrical
No.
Item
Specification
Meet item 3.
Test Method
6-1-1 Impedance
Measuring Frequency : 100MHz±1MHz
Measuring Equipment : KEYSIGHT4291A or the equivalent
Test Fixture : KEYSIGHT16192A or the equivalent
Measuring Equipment : Digital multi meter
6-1-2 DC Resistance
Meet item 3.
*Except resistance of the Substrate and Wire
6-2. Mechanical Performance (based on Table 13 for FILTER EMI SUPPRESSORS/ FILTERS)
AEC-Q200 Rev.D issued June. 1 2010
AEC-Q200
Murata Specification / Deviation
No.
3
Stress
Test Method
1000hours at 125 deg C
Set for 24hours at room
temperature, then
measured.
High
Meet Table A after testing.
Table A
Temperature
Exposure
Appearance
Impedance
Change
(at 100MHz)
DC
No damage
Within ±30%
(for BLM31SN within±50%)
Meet item 3.
Resistance
4
Temperature Cycling 1000cycles
-55 deg C to +125 deg C
Meet Table A after testing.
Set for 24hours at room
temperature, then
measured.
5
7
Destructive
Physical Analysis
Per EIA469
No electrical tests
No defects
Biased Humidity
1000hours at 85 deg C,
85%RH
Meet Table A after testing.
Apply max rated current.
Meet Table A after testing.
If the rated current of parts exceed 1A,
the operating temperature should be 85 deg C.
8
9
Operational Life
Apply 125 deg C
1000hours
Set for 24hours at room
temperature, then
measured
External Visual
Visual inspection
No abnormalities
MURATA MFG.CO., LTD.
Spec. No. JENF243A-9115E-01
AEC-Q200
P.3/9
Reference Only
Murata Specification / Deviation
No.
Stress
Test Method
10 Physical Dimension
Meet ITEM 4
No defects
（Style and Dimensions）
12 Resistance to Solvents Per MIL-STD-202 Method Not Applicable
215
13 Mechanical Shock
Per MIL-STD-202 Method Meet Table B after testing.
213
Table
B
Condition F:
1500g’s(14.7N)/0.5ms/
Half sine
Appearance
Impedance
Change
No damage
Within ±30%
(at 100MHz)
DC
Resistance
Meet item 3.
14 Vibration
5g's(0.049N) for 20
minutes, 12cycles each of
3 orientations
Meet Table B after testing.
Test from 10-2000Hz.
Solder temperature
260C+/-5 deg C
15 Resistance
Pre-heating:150C +/-10 deg,60s to 90s
Meet Table A after testing.
to Soldering Heat
Immersion time 10s
17 ESD
Per AEC-Q200-002
Meet Table A after testing.
ESD Rank: Refer to Item 3. Rating
18 Solderability
Per J-STD-002
Measured : Impedance
Per UL-94
Method b : Not Applicable
95% of the terminations is to be soldered.
19 Electrical
Characterization
20 Flammability
No defects
Not Applicable
21 Board Flex
Epoxy-PCB(1.6mm)
Deflection 2mm(min)
60s minimum holding time
Per AEC-Q200-006
Meet Table B after testing.
22 Terminal Strength
No defects
30 Electrical
Transient
Per ISO-7637-2
Not Applicable
Conduction
7. Specification of Packaging
7-1. Appearance and Dimensions (8mm-wide plastic tape)
2.0±0.05
4.0±0.1 4.0±0.1
1.3±0.1
0.2±0.1
+0.1
φ
1.5
-0
1.9±0.1
Direction of feed
1.0+0.3
-
0
(in mm)
φ
*Dimension of the Cavity is measured at the bottom side.
MURATA MFG.CO., LTD.
Spec. No. JENF243A-9115E-01
(1) Taping
P.4/9
Reference Only
Products shall be packaged in the each embossed cavity of 8mm-wide, 4mm-pitch and plastic tape
continuously and sealed by cover tape.
(2) Sprocket hole : Sprocket hole shall be located on the left hand side toward the direction of feed.
(3) Spliced point : The cover tape has no spliced point.
(4) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
7-2. Tape Strength
(1) Pull Strength
Plastic tape
Cover tape
5N min.
10N min.
165 to 180 degree
F
Cover tape
Plastic tape
(2) Peeling off force of Cover tape
0.2N to 0.7N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
7-3. Taping Condition
(1) Standard quantity per reel
Quantity per 180mm reel : 3000 pcs. / reel
(2) There shall be leader-tape (cover tape only and empty tape ) and trailer- tape (empty tape) as follows.
(3) Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity, etc)
∗1) « Expression of Inspection No. »
□□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D
Third, Fourth digit : Day
(3) Serial No.
∗2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(4) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (∗2), Quantity, etc)
(5) Dimensions of reel and taping (leader-tape, trailer-tape)
Trailer
Leader
160 min.
2.0±0.5
Label
190 min.
210 min.
Empty tape
Cover tape
13.0±0.2
φ
60+1
φ
-
0
Direction of feed
21.0±0.8
φ
+1
-0
9.0
13.0±1.4
180 +0
φ
-3
(in mm)
MURATA MFG.CO., LTD.
Spec. No. JENF243A-9115E-01
P.5/9
Reference Only
7-4. Specification of Outer Case
Outer Case Dimensions
Label
Standard Reel Quantity in Outer Case
(Reel)
(mm)
H
W
D
H
186
186
93
5
D
∗ Above Outer Case size is typical. It depends on a quantity of an
order.
W
8. ！ Caution
8-1. Rating
Do not use products beyond the Operating Temperature Range and Rated Current.
8-2. Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product
may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
8-3. Fail Safe
Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage
that may be caused by the abnormal function or the failure of our products.
8-4. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment
(6)Disaster prevention / crime prevention equipment
(7)Traffic signal equipment
(8)Transportation equipment (trains,ships,etc.)
(9) Data-processing equipment
(10)Applications of similar complexity and /or reliability requirements
to the applications listed in the above
(2)Aerospace equipment
(3)Undersea equipment
(4)Power plant control equipment
(5)Medical equipment
9. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
9-1. Land pattern designing
• Standard land dimensions (Flow and Reflow soldering)
Chip Ferrite Bead
Rated
Current
(A)
Land pad thickness and
dimension d
Type
18µm
1.8
2.4
6.4
-
35µm
1.8
1.8
3.3
9.8
70µm
1.8
1.8
1.8
4.9
c
d
1.5/2
3.5
6
BLM31PG
BLM31SN
10～12
a
b
(in mm)
*The excessive heat by land pads may cause
deterioration at joint of products with substrate.
Solder Resist
Pattern
Type
BLM31PG
BLM31SN
Soldering
Flow
Reflow
a
2.4
2.0
b
4.7
4.3
c
1.2
1.8
MURATA MFG.CO., LTD.
Spec. No. JENF243A-9115E-01
P.6/9
Reference Only
• Land dimensions on Flow soldering for 2.5mm pitch mounting
Chip Ferrite Bead
*As for BLM31PG type, taking land pad thickness
and rated current into account.
a
b
c
d
e
2.4
4.7
1.2
1.3
1.35
(in mm)
e
e
a
b
*The pattern shall be designed to above drawing to
prevent causing the solder bridge when products
are mounted by 2.5mm pitch flow soldering.
c
d
c
Solder Resist
Pattern
e
e
a
b
d
9-2. Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux,Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 μm
(2) Soldering conditions
• Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100℃ max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
(3) soldering profile
□Flow soldering profile
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time.(s)
Standard Profile
150℃、60s min.
250℃、4～6s
2 times
Limit Profile
Pre-heating
Heating
265℃±3℃、5s max.
Cycle of flow
2 times
MURATA MFG.CO., LTD.
Spec. No. JENF243A-9115E-01
P.7/9
Reference Only
□Reflow soldering profile
Temp.
(℃)
260℃
245℃±3℃
230℃
220℃
Limit Profile
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150～180°C 、90s±30s
above 220°C、30s～60s above 230°C、60s max.
Heating
Peak temperature
Cycle of reflow
245±3°C
260°C,10s
2 times
2 times
9-3. Reworking with soldering iron
• Pre-heating: 150°C, 1 min
• Soldering iron output: 80W max.
• Tip diameter:φ3mm max.
• Tip temperature: 350°C max.
• Soldering time : 3 (+1, -0) seconds. • Times : 2times max.
Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
9-4. Solder Volume
Solder shall be used not to be exceed as shown below.
Upper Limit
Recommendable
1/3T≦t≦T
(T: Chip thickness)
t
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
9-5. Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
<Products direction>
a
Products shall be located in the sideways
b
direction (Length: a<b) to the mechanical
stress.
Poor example
〈
〉
Good example
〈
〉
MURATA MFG.CO., LTD.
Spec. No. JENF243A-9115E-01
P.8/9
Reference Only
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
A
A
A
>
D *1
B
C
>
>
C
Perforation
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Recommended
Screw Hole
9-6. Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
9-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc
(the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
9-8. Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior
to use, please make the reliability evaluation with the product mounted in your application set.
MURATA MFG.CO., LTD.
Spec. No. JENF243A-9115E-01
P.9/9
Reference Only
9-9.Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max.
(3) Cleaner
1.Alternative cleaner
•Isopropyl alcohol (IPA)
2.Aqueous agent
•PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5) Other cleaning
Please contact us.
9-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
9-11. Storage Conditions
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
• Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity
No rapid change on temperature and humidity
• Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
• Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
• Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
• Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
10.
!
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the agreed specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD.
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