DFE21CCN2R2MEL#_技术文档

Reference Only

Spec No. JETE243A-0052A-01

P 1/9

CHIP COIL（CHIP INDUCTORS） DFE21CCN□□□□EL□

REFERENCE SPECIFICATION

1. Scope

This reference specification applies to Chip Coil (Chip Inductor) DFE21CCN_EL series for general electronic equipment.

2. Part Numbering

(ex)

DF

Product

ID

E

21

CC

N

R47

M

E

L

Special

specifications

Type Dimension Applications Category Inductance Tolerance Dimension

Packaging

(L×W)

And

(T)

Characteristics

3. Part Number and Rating

Operating temperature range

(ambient temperature not including self-temperature rise)

Storage temperature range

Maximum voltage

-40°C to +125°C

20V

*3 Rated current (mA)

Inductance

Customer

Part number

Murata

Part number

DC resistance

*1 Based on

inductance change temperature rise

*2 Based on

Nominal

value

(μH)

(Ω max)

Tolerance

(%)

DFE21CCNR24MELL

DFE21CCNR33MELL

DFE21CCNR47MELL

DFE21CCN1R0MELL

DFE21CCN2R2MELL

0.24

0.33

0.47

1.0

±20

0.020

0.023

0.029

0.060

0.138

6500

5400

4800

3300

2100

5200

4600

4100

2700

1800

2.2

*1︓The saturation allowable DC current value is specified when the decrease of the initial Inductance value at 30%.

*2︓The rated current (Based on the temperature rise) is the current value that reaches 40°C.

*3︓Keep the temperature (ambient temperature plus self-generation of heat) under 125°C.

The rated current is the rated current based on inductance change and the rated current based on temperature rise,

whichever is smaller one.

4. Testing Conditions

< Unless otherwise specified >

< In case of doubt >

Temperature

Humidity

: ordinary temperature (15°C to 35°C)

: ordinary humidity[25% to 85%(RH)]

:20°C ± 2°C

Humidity

:60% to 70%(RH)

:86kPa to 106kPa

Atmospheric pressure

5. Appearance and Dimensions

■Unit mass (typical value): 0.013 g

MURATA MFG.CO., LTD

Reference Only

Spec No. JETE243A-0052A-01

6. Marking

P 2/9

No marking.

7. Electrical Performance

No.

Specification

Item

7.1 Inductance

Inductance shall meet item 3.

Measuring Equipment︓KEYSIGHT 4284A or equivalent

Measurement signal level︓0.5V

Measuring Frequency: 1MHz

7.2 DC Resistance

DC Resistance shall meet item 3.

Measuring Equipment︓HIOKI 3541 or equivalent

7.3 Rated Current

(Inductance

change)

The saturation allowable DC current The rated current based on inductance change specified in

value is specified when the decrease Chapter 3 is applied.

of the initial Inductance value at 30%.

7.4 Rated Current

(temperature

rise)

The temperature rise due to self- The rated current based on temperature rise specified in

heating of the product is 40°C or less. Chapter 3 is applied.

7.5 Maximum

voltage

20V

The voltage is applied in the impulse test.

8. Mechanical Performance

The product is soldered on a substrate for test.(Except Resistance to soldering heat, Solderability)

It shall be soldered on the single Layer substrate (t=1.0mm). (Except Resistance to soldering heat, Solderability)

(Test shall be done using Flux, Solder and Soldering condition which are specified in chapter 12 except the case of being specified

special condition.)

No.

Item

Specification

Test method

8.1 Shear test

No significant mechanical damage or Applying force:10N

no sign of electrode peeling off shall

be observed.

Holding time:5s

Force application direction:

8.2 Bending test

No significant mechanical damage or Test substrate: glass-epoxy substrate

no sign of electrode peeling off shall

be observed.

(100×40×1.0mm)

Pressurizing speed:0.08mm/s

Pressure jig:R340

Amount of bending:2mm

Holding time:20s

8.3 Vibration

No significant mechanical damage or Oscillation frequency:10 Hz to 55 Hz to 10 Hz/1min.

no sign of electrode peeling off shall Total amplitude: total amplitude of 1.5mm or acceleration

be observed.

amplitude of 98m/s²whichever is smaller

Test time:3 directions perpendicular to each other, 2 h for

each direction (6 h in total)

8.4 Solderability

90% or more of the outer electrode

shall be covered with new solder

seamlessly.

Flux:Ethanol solution of rosin,25(wt)%

Solder : Sn-3.0Ag-0.5Cu

Pre-Heating:150±10°C / 60 to 90s

Solder Temperature:245±5°C

Immersion Time:3±0.5 s

8.5 Resistance to Appearance: No significant

Flux: Ethanol solution of rosin,25(wt)%

Solder: Sn-3.0Ag-0.5Cu

Pre-Heating: 150~180°C / 60 to 120s

Soldering

Heat

mechanical damage shall be

observed.

Inductance change rate: within ±10% Solder Temperature: 230°C min / 30 to 90s

Peak Temperature: 260+5/-0°C

Reflow times: 2 times max

Post-treatment: left for 1 to 2 hours at room temperature.

MURATA MFG.CO., LTD

Reference Only

Spec No. JETE243A-0052A-01

P 3/9

9. Environmental Performance

The product is soldered on a substrate for test.

It shall be soldered on the single Layer substrate (t=1.0mm).

(Test shall be done using Flux, Solder and Soldering condition which are specified in chapter 12 except the case of being specified

special condition.)

No.

Item

Specification

Test Method

9.1 Heat

Appearance: No significant mechanical Temperature: +125±2°C

resistance

damage shall be observed.

Test time: 500 h (±12 h)

Post-treatment: left for 1 hours over at ordinary

temperature.

Inductance change rate:±10％

9.2 Cold

Appearance: No significant mechanical Temperature:-40±2°C

resistance

damage shall be observed.

Test time: 500 h (±12 h)

Post-treatment: left for 1 hours over at ordinary

temperature.

Inductance change rate:±10％

9.3 Humidity

Appearance: No significant mechanical Temperature:+40±2°C

damage shall be observed.

Humidity︓90％ to 95％(RH)

Test time: 500 h (±12 h)

Inductance change rate:±10％

Post-treatment: left for 1 hours over at ordinary

temperature.

9.4 Temperature

cycle

Appearance: No significant mechanical Single cycle conditions:

damage shall be observed.

Step 1:-40±2°C／30±3min

Inductance change rate:±10％

Step 2: ordinary temperature, 3 min max.

Step 3:+125±2°C／30±3min

Step 4: ordinary temperature, 3 min max.

Number of testing: 100 cycles

Post-treatment: left for 1 hours over at ordinary

temperature.

10. Specification of Packaging

10.1 Appearance and dimensions of tape (8 mm width/plastic tape)

A

B

D0

D1

E

1.60±0.1

2.33±0.1

φ1.5+0.1/-0

φ1.0+0.1/-0

1.75±0.1

P0

P1

P2

T1

T2

W

4.0±0.1

2.0±0.05

0.25±0.05

0.9±0.1

8.0±0.2

F

3.5±0.05

(in mm)

Direction of Feed

10.2 Taping specifications

Packing quantity

(Standard quantity)

Packing method

Feed hole position

3000pcs/reel

The products are placed in cavities of a carrier tape and sealed by a cover tape.

The feed holes on the carrier tape are on the right side when the cover tape is pulled

toward the user.

Joint

The carrier tape and cover tape are seamless.

Number of missing

products

Number of missing products within 0.1% of the number per reel or 1 pcs, whichever is

greater, and are not continuous. The specified quantity per reel is kept.

10.3 Break down force of tape

cover tape

10 N min.

MURATA MFG.CO., LTD

Reference Only

Spec No. JETE243A-0052A-01

10.4 Peeling off force of tape

P 4/9

165 to 180 degree

Speed of peeling off

Peeling off force

300mm/min

F

Cover tape

0.1 to 1.0N

(The lower limit is

for typical value.)

Plastic tape

10.5 Dimensions of leader section, trailer section and reel

A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the

product. The leader section is further provided with an area consisting only of the cover tape.

(See the diagram below.)

A

B

C

D

E

F

φ180+0/-3

9±0.3

11.4±1

φ60±1

φ13±0.2

φ21±0.8

2.0±0.5

G

（in mm）

10.6 Marking for reel

Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.

*1 Expression of inspection No.:

(1) Factory code

□□

○○○○



(2) Date

First digit: year/last digit of year

Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D

Third, Fourth digit: day

(1)

(2)

(3)

(3) Serial No.

*2 Expression of RoHS marking: (1) RoHS regulation conformity

ROHS-

Y

()

(2) Murata classification number

(1)

(2)

10.7 Marking on outer box (corrugated box)

Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity,

etc

10.8 Specification of outer box

Dimensions of outer box (mm)

Standard reel quantity in

outer box (reel)

W

D

H

Label

186

195

63

*5

H

*Above Outer Case size is typical. It depends on a quantity of an

order.

D

W

MURATA MFG.CO., LTD

Reference Only

Spec No. JETE243A-0052A-01

P 5/9

11.

Caution

11.1 Restricted applications

Please contact us before using our products for the applications listed below which require especially high reliability

for the prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment

(6) Transportation equipment (vehicles, trains, ships, etc.)

(7) Traffic signal equipment

(2) Aerospace equipment

(3) Undersea equipment

(4) Power plant control equipment

(5) Medical equipment

(8) Disaster/crime prevention equipment

(9) Data-processing equipment

(10) Applications of similar complexity and/or reliability requirements to the

applications listed in the above

11.2 Precautions on rating

Do not use over the rated temperature range, rated voltage, or rated current.

If used beyond the rating, serious defects such as wire breakage and burnout may occur.

11.3 Inrush current

If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the

product, overheating could occur, resulting in wire breakage, burning, or other serious fault.

11.4 Corrosive gas

Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur

dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the

previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration

due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments.

12. Precautions for Use

This product is designed to be mounted by soldering. If you want to use other mounting method, for example, using a

conductive adhesive, please consult us beforehand.

Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal

expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.

The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and the

heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.

This product has a lower insulation resistance than conventional ferrite products, so care must be paid to its use.

a)

b)

Do not make any through holes and copper pattern under the coil except a copper pattern to

the electrode.

Design/mount any components not to contact this product.

12.1 Land dimensions

The following diagram shows the recommended land dimensions for reflow soldering.

a

b

c

1.4

2.4

0.8

(in mm)

12.2 Flux and solder used

・Use a rosin-based flux.

Flux

・Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).

・Do not use a water-soluble flux.

・Use Sn-3.0Ag-0.5Cu solder.

Solder

・Standard thickness of solder paste: 100 μm to 150 μm

If you want to use a flux other than the above, please consult our technical department.

MURATA MFG.CO., LTD

Reference Only

Spec No. JETE243A-0052A-01

12.3 Soldering conditions (reflow)

P 6/9

• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited

to 100°C max.

Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C

max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.

• Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of

product quality.

Temp.

(℃)

260℃

230℃

Limit Profile

245℃±3℃

220℃

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard Profile

Limit Profile

Pre-heating

150℃ to 180℃/90±30s

Above 220℃/30s to 60s

150℃ to 180℃/90±30s

Above 230℃/60s max

Heating

Peak temperature

Number of reflow cycles

245℃±3℃

2 times

260℃/10s

2 times

12.4 Reworking with soldering iron

The following requirements must be met to rework a soldered product using a soldering iron.

Item

Requirement

150°C/approx. 1 min

350°C max.

Pre-heating

Tip temperature of soldering iron

Power consumption of soldering iron

Tip diameter of soldering iron

Soldering time

60 W max.

ø3 mm max.

3 s (+1 s, -0 s)

1 time at each terminal

Number of reworking operations

* Avoid a direct contact of the tip of the soldering iron with the product. Such a direction

contact may cause cracks in the ceramic body due to thermal shock.

12.5 Solder volume

Solder shall be used not to increase the volume too much.

An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the

failure of mechanical or electrical performance.

MURATA MFG.CO., LTD

Reference Only

Spec No. JETE243A-0052A-01

12.6 Product's location

P 7/9

The following shall be considered when designing and laying out P.C.B.’s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.

［Products direction］

a

Products shall be located in the sideways

direction to the mechanical stress.

b

Poor example

〈

〉

Good example

〈

〉

(2) Components location on P.C.B. separation.

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures

as possible to reduce stress.

Contents of Measures

Stress Level

A > D^*1

A > B

(1) Turn the mounting direction of the component parallel to

the board separation surface.

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from

the board separation surface.

A > C

*1 A > D is valid when stress is added vertically to the perforation as with hand

separation. If a cutting disc is used, stress will be diagonal to the PCB,

therefore A > D is invalid.

(3) Mounting components near screw holes

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs

during the tightening of the screw.

Mount the component in a position as far away from the screw holes as possible.

Recommended

Screw Hole

12.7 Handling of substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the

substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw

to the substrate.

Excessive mechanical stress may cause cracking in the product.

MURATA MFG.CO., LTD

Reference Only

Spec No. JETE243A-0052A-01

12.8 Cleaning

P 8/9

Bending

Twisting

During ultrasonic cleaning, depending on the cleaning conditions, the substrate may resonate and vibrate, causing

chip cracks and cracked head. Be sure to check the quality of this product by cleaning with a cleaning device in

advance.

12.9 Storage and transportation

Storage period

Use the product within 6 months after delivery.

If you do not use the product for more than 12 months, check solderability before using it.

・ The products shall be stored in a room not subject to rapid changes in temperature and humidity.

The recommended temperature range is -10°C to +40°C. The recommended relative humidity

range is 15% to 85%.

Storage

conditions

Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the poor

solderability.

・ Do not place the products directly on the floor; they should be placed on a palette so that they are

not affected by humidity or dust.

・ Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.

・ Do not keep products in bulk packaging. Doing so may cause collision between the products or

between the products and other products, resulting in chipping or wire breakage.

・ Avoid storing the product by itself bare (i.e. exposed directly to air).

Excessive vibration and impact reduce the reliability of the products. Exercise caution when handling

the products.

Transportation

12.10 Resin coating (including moistureproof coating)

Coating/molding the product with resin may change electrical characteristics.

A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin,

or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by

hydrolysis under some operating condition may cause corrosion of conductor, leading to wire breakage.

Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products

mounted on your board.

12.11 Mounting Conditions

・Please check the mounting condition before using.

・Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products

may lead to pick up errors, misalignment, or damage to the product.

12.12 Operating Environment

Do not use under the following environmental conditions as it may lead to property deterioration or deterioration to

open due to corrosion of product electrodes, etc.

Please note that we do not take any responsibility or liability for any damage or loss caused through in this

environment.

(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and

etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc)

(2) When in contact with oil exposed under the corrosive gas environment (cutting oil, silicone oil, etc.)

(3) in the atmosphere where liquid such as organic solvent, may splash on the products.

(4) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.

12.13 Implementation density

When placing this product near parts with heat generation, take sufficient heat radiation countermeasures.

If the heat received from other parts is large, the characteristics of this product may deteriorate, causing circuit

operational failure or deterioration of the joints.

Be sure to use this product below the maximum rated operating temperature even when heat received from other

parts is applied.

12.14 Handling of product

Inductance could change due to the effect of magnetism. Do not use magnetized tweezers, magnets, or other

similar tools when handling the product (instead, use tweezers with resin or ceramic tips).

MURATA MFG.CO., LTD

Reference Only

Spec No. JETE243A-0052A-01

P 9/9

13． Note

(1)Please make sure that your product has been evaluated in view of your specifications with our product being

mounted to your product.

(2)You are requested not to use our product deviating from the reference specifications.

(3)The contents of this reference specification are subject to change without advance notice.

Please approve our product specifications or transact the approval sheet for product specifications

before ordering.

MURATA MFG.CO., LTD


型号：	DFE21CCN2R2MEL#
厂家：	muRata
描述：
文件：	总9页 (文件大小：395K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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