DFE2MCAHR47MJ0# [MURATA]
;型号: | DFE2MCAHR47MJ0# |
厂家: | muRata |
描述: | |
文件: | 总9页 (文件大小:444K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Reference Only
Chip Coil (Chip Inductors) DFE2MCAH□□□□J0L REFERENCE SPECIFICATION
Spec No. JETE243A-9107E-01
P 1/9
Murata Standard Specification【AEC-Q200】
1. Scope
This reference specification applies to DFE2MCAH□□□□J0L, Chip Coil (Chip Inductors) for Automotive
Electronic based on AEC-Q200.
2.Part Numbering
(ex)
DF
Product
ID
E
2M
CA
H
1R0
M
J
0
L
Structure Dimension Applications
Category
Inductance Tolerance Dimension Other Packaging
(T)
(L×W)
and
Characteristics
3.Rating
Operating Temperature Range
(Ambient temperature; Self-temperture rise is not included)
(Product temperature; Self- temperature rise is included)
Storage Temperature Range.
-40°C to +110°C
-40°C to +150°C
-40°C to +110°C
It can be considered for use with DCDC converters with a maximum voltage of 40 V or less.
*3 Rated Current
DC
Resistance
(A)
Inductance
Tolerance
Customer
Part Number
Murata
Part Number
ESD
Level
∗1 Based on
∗2 Based on
Inductance change Temperature rise
(µH)
Max. (Ω)
(%)
DFE2MCAHR15MJ0L
DFE2MCAHR24MJ0L
0.15
0.24
0.33
0.47
0.68
1.0
0.021
0.025
0.029
0.033
0.042
0.068
0.109
0.169
6.1
5.0
4.2
3.6
3.1
2.5
2.1
1.7
4.8
4.2
3.9
3.5
3.0
2.4
1.8
1.4
DFE2MCAHR33MJ0L
DFE2MCAHR47MJ0L
DFE2MCAHR68MJ0L
DFE2MCAH1R0MJ0L
DFE2MCAH1R5MJ0L
DFE2MCAH2R2MJ0L
±20
<±0.5kV
1.5
2.2
∗1: The saturation allowable DC current value is specified when the decrease of the initial Inductance value at 30%.
*2: Rated current (Based on Temperature rise) is the current value at which the product temperature rises to 40°C when
direct current is applied to the inductor with the product mounted on our designated board.
∗3: Value defined when DC current flows and Rated Current (Based on Inductance change) or when DC current flows
and Rated Current (Based on Temperature rise) whichever is smaller.
4. Testing Conditions (Standard atmospheric conditions)
<Unless otherwise specified>
<In case of doubt>
Temperature
Temperature : Ordinary Temperature (15 to 35°C)
: 20 ± 2°C
Humidity
: Ordinary Humidity (25 to 85% (RH))
Humidity
Atmospheric Pressure
: 65±5% (RH)
: 86 to 106 kPa
5.Appearance and Dimensions
0.5±0.2
■Unit Mass (Typical value)
※no marking
0.0188g
2.0±0.2
1.2max.
(in mm)
MURATA MFG.CO., LTD
Reference Only
Spec No. JETE243A-9107E-01
P 2/9
6. Electrical Performance
No.
No.
Item
Specification
Measuring Equipment:
KEYSIGHT 4284A or equivalent (0.5V)
Measuring Frequency: 1MHz
6.1 Inductance
Meet item 3
6.2 DC Resistance
Measuring Equipment: Resistance Hitester 3541(HIOKI) or
equivalent
6.3 Withstand
voltage
machine: impulse testing machine
applied voltage: 60-70V
Inductance:Meet item 3
7. Q200 Requirement
AEC-Q200 Rev.D issued June 1. 2010
AEC-Q200
Murata Specification / Deviation
Stress
Test Method
No.
3
High
Temperature
Exposure
Meet Table A after testing.
Table A
1000±12h at 150±2 deg C
Set for 24±2hours
at room temperature,
then measured.
Appearance
Inductance
No damage
Change from
an initial value
within ± 10%
4
Temperature Cycling 1000cycles
-40 deg C for 30 min and 150 deg C for
30 min with the transit period of
2min or less
Measured within 24±2hours
at room temperature.
7
8
Biased Humidity
Operational Life
1000±12h at 85±2 deg C, 85%RH
Measured within 24±2hours
at room temperature.
Apply 110±2 deg C 1000±12h
Measured within 24±2h
at room temperature.
10 Physical Dimension
Measures using digital slide calipers and
an optical microscope.
According to specification
MURATA MFG.CO., LTD
Reference Only
Spec No. JETE243A-9107E-01
P 3/9
Murata Specification / Deviation
Meet Table A after testing.
AEC-Q200
Stress
13 Mechanical Shock
Test Method
No.
Peak acceleration:
981 m/s2 (≒100G)
Duration of pulse: 6 ms
3 times in each of 6(±X, ±Y, ±Z) axes
Three successive shock shall be applied in
the perpendicular direction of each surface
of the specimen.
14 Vibration
5G for 20 min,
for 4 hours in each of 3(X, Y, Z) axes
Test from 10-2000Hz
15 Resistance
Pre-heating:150 to 180 deg C / 90±30sec
Reflow soldering method
to Soldering Heat
above 220 deg C, 60±30 sec
Temperature condition
above 255 deg C, above 30sec
Peak:above 260deg C
The specimen shall be subjected to the
reflow process under the above condition 3
times. Test board shall be 1.6 mm thick.
Base material shall be glass epoxy resin.
The specimen shall be stored at standard
atmospheric conditions for 1 h in prior to the
measurement.
17 ESD
Per AEC-Q200-002
Meet Table A after testing.
1 time in each of terminals
ESD level: Meet Item 3 (Rating)
18 Solderability
Per J-STD-002 Condition SMD)C Method D New solder shall cover 90% minimum of
Electrode shall be immersed in flux at
room temperature and then shall be
immersed in solder bath after preheat.
Soldering 245±5 deg C, 5sec
Measured: inductance
the surface immersed.
19 Electrical
No defects
characterization
21 Board Flex
Board : 40 × 100mm
Meet Table A after testing.
Thickness 1.6mm
Apply pressure gradually in the direction of
the arrow at a rate of about 0.5mm/s until
bent depth reaches 2mm and hold
for 60 sec.
22 Terminal Strength
A static load using a R0.5 pressing tool shall
be applied to the body of the specimen in the
direction of the arrow and shall be hold for
60s. Measure afte r removing pressure.
Pressure 18N
MURATA MFG.CO., LTD
Reference Only
Spec No. JETE243A-9107E-01
8. Specification of Packaging
P 4/9
8.1 Appearance and Dimensions of plastic tape
A
B
P0
P1
P2
T1
T2
W
±0.1
±0.1
±0.1
±0.1
±0.05
±0.05
±0.1
±0.2
1.90
2.30
φ1.5
φ1.0
1.75
3.5
4.0
4.0
+0.1
- 0
+0.1
- 0
D0
D1
E
2.0
0.25
1.3
±0.1
F
±0.05
8.0
Unreeling direction
(in mm)
8.2 Specification of Taping
(1) Packing quantity (standard quantity)
3,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
8.3 Pull Strength
Embossed carrier tape
9.8N min.
10N min.
Cover tape
8.4 Peeling off force of cover tape
165 to 180 degree
Speed of Peeling off
Peeling off force
300mm/min
F
Cover tape
Plastic tape
0.1 to 0.7N
(minimum value is typical)
8.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape(cover tape) and trailer-tape (empty tape) as follows.
(in mm)
MURATA MFG.CO., LTD
Reference Only
Spec No. JETE243A-9107E-01
8.6 Marking for reel
P 5/9
Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ・・・
∗1) <Expression of Inspection No.>
LLOOOO ×××
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
Second digit
: Year / Last digit of year
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D
Third, Fourth digit : Day
(3) Serial No.
∗2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity
(2) MURATA classification number
8.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking
(∗2) ,Quantity, etc ・・・
8.8 Specification of Outer Case
Outer Case Dimensions (mm)
Standard Reel Quantity
in Outer Case (Reel)
W
D
H
Label
200
185
67
5
H
Above Outer Case size is typical. It depends on a quantity of an order.
D
W
9.
Caution
9.1 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment
(6) Transportation equipment ( trains, ships, etc.)
(7) Traffic signal equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
9.2 Caution(Rating)
Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product
and short/open circuit of the product or falling off the product may be occurred.
9.3 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage
that may be caused by the abnormal function or the failure of our product.
9.4 Corrosive gas
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur
dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the
previously stated corrosive gas environment will result in deterioration of product quality or an open from
deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these
environments.
10. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
This product employs a core with low insulation resistance, Pay strict attention when use it.
a) Do not make any through holes and copper pattern under the coil except a copper pattern to the electrode.
b) Design/mount any components not to contact this product.
MURATA MFG.CO., LTD
Reference Only
Spec No. JETE243A-9107E-01
P 6/9
10.1 Land pattern designing (Reflow Soldering)
Recommended land pattern for reflow soldering is as follows:
It has been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
UNIT : mm
10.2 Flux, Solder
・Use rosin-based flux.
Flux
・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
・Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder
・Standard thickness of solder paste : 100μm to 150μm
Solder
Other flux (except (above) Please contact us for details, then use.
10.3 soldering conditions (Reflow)
・Pre-heating should be in such a way that the temperature difference between solder and product surface is
limited to 100°C max. Cooling into solvent after soldering also should be in such a way that the temperature
difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
・Standard soldering profile profile is as follows.
Standard Profile
Pre-heating
Heating
150℃~180℃ 、90s±30s
above 230℃ 、20s~40s
Peak
temperature
250+5/-0°C
2 times
Cycle of reflow
MURATA MFG.CO., LTD
Reference Only
Spec No. JETE243A-9107E-01
10.4 Solder Volume
P 7/9
・Solder shall be used not to be exceeded the upper limits as shown below.
・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
Recommendable
1/3T≦t≦T
t
T: thickness of electrode
10.5 Product's location
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
[Products direction]
a
Products shall be located in the sideways
b
direction to the mechanical stress.
Poor example
〈
〉
Good example
〈
〉
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to
the board separation surface.
A
A
A
>
>
>
D ∗1
B
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from
the board separation surface.
C
C
Perforation
∗1 A > D is valid when stress is added vertically to
the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to
the PCB, therefore A > D is invalid.
B
D
A
Slit
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole,
it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component
in a position as far away from the screw holes as possible.
Recommended
Screw Hole
10.6 Resin coating
The inductance value may change and/or it may affect on the product's performance due to high cure-stress
of resin to be used for coating/molding products. So please pay your careful attention when you select resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
10.7 Temperature rating of the circuit board and components located around
Temperature may rise up to max. 40 ℃ when applying the rated current to the Products.
Be careful of the temperature rating of the circuit board and components located around.
10.8 Caution for use
There is possibility that the Impedance value change due to magnetism. Don‘t use a magnet or a pair of tweezers
with magnetism when chip coil are handled. (The tip of the tweezers should be molded with resin or pottery.)
MURATA MFG.CO., LTD
Reference Only
Spec No. JETE243A-9107E-01
10.9 Magnetic Saturation
P 8/9
When the excessive current over rated current is applied, the Impedance value may change due to magnetism.
10.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting
to the substrate when cropping the substrate, inserting and removing a connector from the substrate or
tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
10.11 Storage and Handing Requirements
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of
electrode, resulting in poor solderability.
・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
・Avoid storing the product by itself bare (i.e. exposed directly to air).
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical
shock.
10.12 Derating
Max. current (DC, AC) as function of product temperature (derating curve)
IOP
IR
:
:
Loaded Current
Rated Current
MURATA MFG.CO., LTD
Reference Only
Spec No. JETE243A-9107E-01
P 9/9
11. Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
MURATA MFG.CO., LTD
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