DLM11SN900HY2L [MURATA]
Data Line Filter, 2 Function(s), 5V, 0.1A, EIA STD PACKAGE SIZE 0504, 4 PIN;
| 型号： | DLM11SN900HY2L |
| 厂家： | 
muRata |
| 描述： | Data Line Filter, 2 Function(s), 5V, 0.1A, EIA STD PACKAGE SIZE 0504, 4 PIN LTE |
| 文件： | 总5页 (文件大小：69K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Soldering and Mounting
DLp Chip Common Mode Choke Coil
1. Standard Land Pattern Dimensions
Land Pattern
+ Solder Resist
Land Pattern
Solder Resist
(in mm)
DLM11S
DLM11G
DLP0QS
DLP0NS
DLP11S
DLP11R
DLP11T
DLP1ND
DLP2AD
DLP31S
DLP31D
DLW21S
DLW21H
DLW31SN
DLW43S
DLW44S
DLW5A
oReflow and Flow
DLP31S
DLP31D
2.8
0.8 Pitch
0.4
1.0 0.6 1.0
oReflow Soldering
DLP0QS
DLP0NS
DLP11S/DLM11S
DLP11R/11T
0.90
1.95
1.55
0.20
(4)
(3)
(2)
(4) (3)
(1) (2)
DLW5B
(1)
0.55
0.55
0.30
0.80
DLP1ND
DLP2AD
DLM11G
DLW21S/21H/31SN/43S
1.75
0.25
1.4
0.2
0.5
1.5
3
a∗
0.4
0.5
b
DLW44S
Series
a
b
c
d
DLW21S/H
0.8
1.6
3.0
3.2
2.6
3.7
5.9
5.9
0.4
0.4
1.6
1.6
1.2
DLW31SN
1.6
3.4
3.4
DLW43SH110/220/510
DLW43SH101
1
∗ : If the pattern is made with wider than 1.2mm (DLW21) /
1.6mm (DLW31S) it may result in components turning
around, because melting speed is different. In the worst
case, short circuit between lines may occur.
0.8
2.5
5.6
2
∗ : If the pattern is made with less than specified dimensions,
in the worst case, short circuit between lines may occur
due to spread of soldering paste or mount placing
accuracy.
DLW5A/5B (Except for DLW5AT_MQ2)
∗3: If the pattern is made with wider than 0.8mm (DLW21) /
1.6mm (DLW31SN), the bending strength will be reduced.
Do not use gild pattern; excess soldering heat may dissolve
metal of a copper wire.
0.9
2.9
5.5
DLp Chip Common Mode Choke Coil Soldering and Mounting
Land Pattern
+ Solder Resist
Land Pattern
Solder Resist
(in mm)
DLW5AT_MQ2
oReflow Soldering Chip Mounting Side
oFlow Soldering Chip Mounting Side
DLW5AT_MQ2
DLW5AT_MQ2
0.9
1.9
6.9
2.9
5.5
o PCB Warping
Products should be located in the sideways direction
(Length: a<b) to the mechanical stress.
PCB should be designed so that products are not
subjected to the mechanical stress caused by warping
the board.
a
b
Poor example
Good example
DLp Chip Common Mode Choke Coil Soldering and Mounting
2. Solder Paste Printing and Adhesive Application
When flow soldering the chip common mode choke coils,
apply the adhesive in accordance with the following
conditions.
When reflow soldering the chip common mode choke
coils, the printing must be conducted in accordance with
the following cream solder printing conditions.
If too much solder is applied, the chip will be prone to
damage by mechanical and thermal stress from the PCB
and may crack.
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
Standard land dimensions should be used for resist and
copper foil patterns.
become detached during flow soldering process.
(in mm)
Series
Solder Paste Printing
Adhesive Application
DLP
DLW
DLM
oGuideline of solder paste thickness:
80-100μm: DLP0QS
100-150μm: DLW21S/21H/31S, DLP0NS/11S/11R/11T/1ND/2AD/
DLM11S/11G
DLP31S/DLP31D/
DLW5AT_MQ2
Apply 0.3mg of bonding
agent at each chip.
150μm: DLW43S
DLP31D
150-200μm: DLP31D/31S, DLW44S/5A/5B
*Solderability is subject to reflow conditions and thermal conductivity.
Please make sure that your product has been evaluated in view of your
specifications with our product being mounted to your product.
DLP0QS/0NS/11S/11R/11T/31S/DLM11S/11G
Series
DLP0QS
a
b
c
d
0.3
0.3
0.7
0.5
1.0
0.5
0.2
0.23
0.3
0.3
0.3
0.7
0.4
0.48
0.5
Coating Position of
Bonding Agent
DLP0NS
0.3
DLM11S/DLP11S
DLP11R/T
DLP31S
0.55
0.55
0.6
0.55
0.55
2.1
a
b
a
DLP31S
DLM11G
0.5
0.7
DLW21S/21H/31S
Series
DLW21S/H
DLW31S
a
b
c
d
Coating Position of
Bonding Agent
0.8
1.6
2.6
3.7
0.5
0.4
1.2
1.6
a
b
DLW5AT_MQ2
DLP1ND/2AD/31D
c
Series
DLP1ND
DLP2AD
DLP31D
a
b
c
d
0.3
0.55
1.0
0.3
0.4
0.8
0.2
0.25
0.4
0.4
0.5
0.8
d
DLW43S
Coating Position of
Bonding Agent
Series
a
b
c
d
3.0 (110/220/510)
3.2 (101)
5.9 1.6 3.4
DLW43S
a
b
DLW44S/5A/5B
Series
DLW44S
a
b
c
d
e
f
0.8 2.5 5.6 0.9 1.9 3.9
0.9 2.9 5.5 1.3 3.3 4.7
DLW5A/5B
a
b
c
DLp Chip Common Mode Choke Coil Soldering and Mounting
3. Standard Soldering Conditions
(1) Soldering Methods
Flux:
Use flow and reflow soldering methods only.
Use standard soldering conditions when soldering chip
common mode choke coils.
o Use Rosin-based flux.
In case of DLW21/31 series, use Rosin-based flux with
converting chlorine content of 0.06 to 0.1wt%.
In case of using RA type solder, products should be
cleaned completely with no residual flux.
o Do not use strong acidic flux (with chlorine content
exceeding 0.20wt%)
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
Solder: Use Sn-3.0Ag-0.5Cu solder. Use of Sn-Zn based
solder will deteriorate performance of products.
If using DLP/DLM series with Sn-Zn based solder,
please contact Murata in advance.
o Do not use water-soluble flux.
For additional mounting methods, please contact Murata.
(2) Soldering Profile
oFlow Soldering Profile
(Sn-3.0Ag-0.5Cu Solder)
T3
T2
t2
Heating
Limit Profile
T1
Standard Profile
Pre-heating
t1
Time (s)
Standard Profile
Heating
Limit Profile
Heating
Pre-heating
Series
Cycle
Cycle
of Flow
of Flow
Temp. (T1)
Time. (t1)
Temp. (T2) Time. (t2)
Temp. (T3)
Time. (t2)
DLW5AT_MQ2
DLP31D/31S
2 times
max.
2 times
max.
150°C
60s min.
250°C
4 to 6s
265 3°C
5s max.
oReflow Soldering Profile
(Sn-3.0Ag-0.5Cu Solder)
T4
T3
T2
T1
180
150
Limit Profile
t1
t2
Pre-heating
90s 30s
Standard Profile
time (s)
Standard Profile
Peak
Limit Profile
Peak
Temperature
(T4)
Series
Heating
Heating
Temp. (T3) Time. (t2)
Cycle
of Reflow
Cycle
of Reflow
Temperature
(T2)
Temp. (T1)
Time. (t1)
DLM/DLP
DLW21/31
2 times
max.
2 times
max.
220°C min. 30 to 60s
220°C min. 30 to 60s
220°C min. 30 to 60s
245 3°C
230°C min. 60s max. 260°C/10s
240°C min. 30s max. 260°C/10s
230°C min. 60s max. 260°C/10s
2 times
max.
2 times
max.
DLW43S
245 3°C
250 3°C
2 times
max.
2 times
max.
DLW44S/5A/5B
DLp Chip Common Mode Choke Coil Soldering and Mounting
(3) Reworking with Solder Iron
The following conditions must be strictly followed when
using a soldering iron.
Do not allow the tip of the soldering iron to directly
contact the chip.
Pre-heating: 150°C 60s min.
For additional methods of reworking with a soldering iron,
please contact Murata engineering.
Soldering iron power output / Tip diameter:
30W max. / ø3mm max.
Temperature of soldering iron tip / Soldering time / Times:
350°C max. / 3-4s / 2 times*1
*1 DLP0QS, DLP0NS, DLP11S, DLP11T, DLP1ND,
DLP2AD: 380°C max. / 3-4s / 2 times
DLW43S: 350°C max. / 3s / 2 times
4. Cleaning
Following conditions should be observed when cleaning
chip EMI filter.
Before cleaning, please contact Murata engineering.
(a) Alcohol cleaning agent
(1) Cleaning Temperature: 60°C max. (40°C max. for
alcohol type cleaner)
Isopropyl alcohol (IPA)
(b) Aqueous cleaning agent
(2) Ultrasonic
Pine Alpha ST-100S
Output: 20W/liter max.
(4) Ensure that flux residue is completely removed.
Component should be thoroughly dried after aqueous
agent has been removed with deionized water.
Duration: 5 minutes max.
Frequency: 28 to 40kHz
(3) Cleaning agent
The following list of cleaning agents have been tested on
the individual components. Evaluation of final assembly
should be completed prior to production.
Do not clean DLW (Except for DLW21H) series.
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