GCJ31BR72J103KXJ1 [MURATA]
Chip Monolithic Ceramic Capacitor Soft Termination Type for Automotive;
| 型号： | GCJ31BR72J103KXJ1 |
| 厂家： | 
muRata |
| 描述： | Chip Monolithic Ceramic Capacitor Soft Termination Type for Automotive |
| 文件： | 总23页 (文件大小：847K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Chip Monolithic Ceramic Capacitor Soft Termination Type for Automotive
GCJ31BR72J103KXJ1_ (1206, X7R, 10000pF, DC630V)
_: packaging code
Reference Sheet
1.Scope
This product specification is applied to Chip Monolithic Ceramic Capacitor Soft Termination Type used for Automotive Electronic equipment.
ꢀꢀ
2.MURATA Part NO. System
(Ex.)
GCJ
31
B
R7
2J
103
K
XJ1
L
(7)Murata’s
Control Code
(6)Capacitance
Tolerance
(2)T
Dimensions
(3)Temperature
Characteristics
(4)Rated
Voltage
(5)Nominal
Capacitance
(8)Packaging
Code
(1)L/W
Dimensions
3. Type & Dimensions
(Unit:mm)
(1)-1 L
3.2±0.2
(1)-2 W
1.6±0.2
(2) T
1.25+0.0/-0.3
e
g
0.3 min.
1.2 min.
4.Rated value
(3) Temperature Characteristics
(Public STD Code):X7R(EIA)
Specifications and Test
(4)
Rated
Voltage
(6)
(5) Nominal
Capacitance
Methods
(Operating
Temp. Range)
Capacitance
Tolerance
Temp. coeff
orꢀCap. Change
Temp. Range
(Ref.Temp.)
-55 to 125 °C
(25 °C)
DC 630 V 10000 pF
±10 %
-15 to 15 %
-55 to 125 °C
・Soldering Method
Flow / Reflow
5.Package
mark
(8) Packaging
Packaging Unit
f180mm Reel
EMBOSSED W8P4
f330mm Reel
L
3000 pcs./Reel
10000 pcs./Reel
K
EMBOSSED W8P4
Product specifications in this catalog are as of Oct.11,2014,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GCJ31BR72J103KXJ1-01
1
■AEC-Q200 Murata Standard Specification and Test Methods
AEC-Q200
Test Item
No.
1
Specification
AEC-Q200 Test Method
Pre-and Post-Stress Electrical
Test
-
2
High Temperature Exposure
The measured and observed characteristics should
satisfy the specifications in the following table.
No marking defects
Sit the capacitor for 1,00012h at 1503C. Let sit for 242h at
room temperature, then measure.
(Storage)
Appearance
Capacitance Change
D.F.
within ±10%
0.05 max.
I.R.
More than 10,000MW or 100 MWF
(Whichever is smaller)
3
Temperature Cycling
The measured and observed characteristics should
satisfy the specifications in the following table.
No marking defects
Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (19). Perform the 1,000 cycles
according to the four heat treatments listed in the following table.
Let sit for 24±2h at room condition*, then measure.
Appearance
Capacitance Change
within ±10%
D.F.
I.R.
0.05 max.
Step
1
2
3
4
More than 10,000MW or 100 MWF
(Whichever is smaller)
Temp.(C)
Time(min.)
-55+0/-3 Room Temp. 125+3/-0 Room Temp.
153 153
1
1
•Pretreatment
Perform the heat treatment at 150+0/-10°C for 60±5 min and
then let sit for 24±2h at room condition*.
4
5
Destructive Phisical Analysis No defects or abnormalities
Per EIA-469
Moisture Resistance
Appearance
The measured and observed characteristics should
satisfy the specifications in the following table.
No marking defects
Apply the 24h heat (25 to 65C) and humidity (80 to 98%)
treatment shown below, 10 consecutive times.
Let sit for 24±2h at room condition*, then measure.
Capacitance Change
within ±12.5%
D.F.
I.R.
0.05 max.
More than 10,000MW or 100 MWF
(Whichever is smaller)
Humidity
80～98%
Humidity
80～98%
Temperature
Humidity
90～98%
Humidity
90～98%
Humidity
90～98%
(℃)
70
65
60
55
50
45
40
35
30
25
20
15
10
5
+10
- 2 ℃
Initial measuremt
0
-5
-10
One cycle 24hours
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Hours
6
7
Biased Humidity
Appearance
The measured and observed characteristics should
satisfy the specifications in the following table.
No marking defects
within ±12.5%
0.05 max.
Apply the rated voltage and DC1.3+0.2/-0 V (add 6.8kW resistor)
at 85±3°C and 80 to 85% humidity for 1,000±12h.
Remove and let sit for 24±2h at room condition*, then measure.
The charge/discharge current is less than 50mA.
•Pretreatment
Capacitance Change
D.F.
I.R.
Perform the heat treatment at 150+0/-10°C for 60±5 min and
then let sit for 24±2h at room condition*.
More than 1,000MW or 10 MWF
(Whichever is smaller)
The measured and observed characteristics should
satisfy the specifications in the following table.
No marking defects
Operational Life
Appearance
Apply 120% of the rated voltage for 1,00012h at 1253C.
Let sit for 24±2h at room condition*, then measure.
The charge/discharge current is less than 50mA.
•Pretreatment
Capacitance Change
within ±12.5%
D.F.
I.R.
0.05 max.
Apply test voltage for 60±5 min at test temperature.
Remove and let sit for 24±2h at room condition*.
More than 1,000MW or 10 MWF
(Whichever is smaller)
8
9
10
External Visual
Phisical Dimension
Resistance to Appearance No marking defects
Solvents
No defects or abnormalities
Within the specified dimensions
Visual inspection
Using calipers and micrometers.
Per MIL-STD-202 Method 215
Solvent 1 : 1 part (by volume) of isopropyl alcohol
3 parts (by volume) of mineral spirits
Solvent 2 : Terpene defluxer
Solvent 3 : 42 parts (by volume) of water
1part (by volume) of propylene glycol
monomethyl ether
Capacitance Within the specified tolerance
Change
D.F.
I.R.
0.025 max.
More than 10,000MW or 100 MWF
(Whichever is smaller)
1 part (by volume) of monoethanolamine
* “room condition” Temperature:15 to 35°C, Relative humidity:45 to 75%, Atmosphere pressure:86 to 106kPa
JEMCGS-03026A
2
■AEC-Q200 Murata Standard Specification and Test Methods
AEC-Q200
Test Item
No.
11
Specification
AEC-Q200 Test Method
Mechanical
Appearance No marking defects
Three shocks in each direction should be applied along 3
mutually perpendicular axes of the test specimen (18 shocks).
The specified test pulse should be Half-sine and should have a
duration :0.5ms, peak value:1,500g and velocity change: 4.7m/s.
Solder the capacitor to the test jig (glass epoxy board) in the
same manner and under the same conditions as (19). The
capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 2,000Hz.
The frequency range, from 10 to 2,000Hz and return to 10Hz,
should be traversed in approximately 20 min. This motion
should be applied for 12 items in each 3 mutually perpendicular
directions (total of 36 times).
Shock
Capacitance Within the specified tolerance
Change
D.F.
0.025 max.
12
Vibration
Appearance No defects or abnormalities
Capacitance Within the specified tolerance
Change
D.F.
0.025 max.
13
Resistance to
Soldering Heat
The measured and observed characteristics should
satisfy the specifications in the following table.
No marking defects
Immerse the capacitor in a solder solution at 2605C
for 101s.. Let sit for 24±2h at room condition*, then measure.
•Pretreatment
Appearance
Capacitance
Change
D.F.
within ±10%
Perform the heat treatment at 150+0/-10°C for 60±5 min and
then let sit for 24±2h at room condition*.
0.025 max.
I.R.
More than 10,000MW or 100 MWF
(Whichever is smaller)
14
Thermal Shock
The measured and observed characteristics should
satisfy the specifications in the following table.
No marking defects
Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (19). Perform the 300 cycles
according to the two heat treatments listed in the following
table(Maximum transfer time is 20s.). Let sit for 24±2 h at room
condition*, then measure.
Appearance
Capacitance
Change
D.F.
within ±10%
0.025 max.
Step
1
2
I.R.
More than 10,000MW or 100 MWF
(Whichever is smaller)
Temp.(C)
Time(min.)
-55+0/-3
153
125+3/-0
153
•Pretreatment
Perform the heat treatment at 150+0/-10°C for 60±5 min and
then let sit for 24±2h at room condition*.
Per AEC-Q200-004
15
16
ESD Appearance
No marking defects
Within the specified tolerance
0.025 max.
Capacitance Change
D.F.
I.R.
More than 10,000MW or 100 MWF
(Whichever is smaller)
95% of the terminations is to be soldered evenly and
continuously.
Solderability
(a) Preheat at 155C for 4h. After preheating, immerse
the capacitor in a solution of ethanol(JIS K 8101) and rosin
(JIS K 5902) (25% rosin in weight propotion). Immerse in
eutectic solder solution for 5+0/-0.5s at 2355C.
(b) Should be placed into steam aging for 8h15 min.
After preheating, immerse the capacitor in a solution of
Ethanol (JIS K 8101) and rosin (JIS K 5902) (25% rosin in
weight propotion). Immerse in eutectic solder solution for
5+0/-0.5s at 2355C.
(c) Should be placed into steam aging for 8h15 min.
After preheating, immerse the capacitor in a solution of
Ethanol (JIS K 8101) and rosin (JIS K 5902) (25% rosin in
weight propotion). Immerse in eutectic solder solution for
1205s at 2605C.
* “room condition” Temperature:15 to 35°C, Relative humidity:45 to 75%, Atmosphere pressure:86 to 106kPa
JEMCGS-03026A
3
■AEC-Q200 Murata Standard Specification and Test Methods
AEC-Q200
Test Item
No.
17
Specification
No defects or abnormalities
AEC-Q200 Test Method
Electrical
Apperance
Visual inspection.
Characte-
rization
Capacitance Within the specified tolerance
Change
The capacitance/D.F. should be measured at 25C at the
frequency and voltage shown in the table.
D.F.
0.025 max.
Frequency
1±0.1kHz
Voltage
AC1±0.2V(r.m.s.)
The insulation resistance should be measured with a
I.R. 25 C
I.R. 125C
More than 10,000MW or 100 MWF
(Whichever is smaller)
More than 1,000MW or 10 MWF
(Whichever is smaller)
No failure
DC 500V±50V at 25 C and 125 C within 2 min. of charging.
Dielectric
Strength
No failure should be observed when voltage in Table is applied
between the terminations for 1 to 5s., provided the
charge/discharge current is less than 50mA.
Rated Voltage
DC630V
Test Voltage
150% of the rated voltage
18
Board
Flex
Appearance
Capacitance within ±12.5%
Change
No marking defects
Solder the capacitor on the test jig (glass epoxy board) shown
in Fig1 using a eutectic solder. Then apply a force in the
direction shown in Fig 2 for 51s. The soldering should be done
by the reflow method and should be conducted with care so that
the soldering is uniform and free of defects such as heat shock.
Type
a
b
c
GCJ31
GCJ32
GCJ43
GCJ55
2.0
2.0
3.0
4.2
4.4
4.4
6.0
7.2
1.7
2.6
3.3
5.1
(in mm)
20 50
Pressurizing
speed:1.0mm/s
Pressurize
R4
Flexure: 3mm
Capacitance meter
45
45
Fig.1
Fig.2
19
Terminal
Strength
Appearance
Capacitance Within specified tolerance
Change
No marking defects
Solder the capacitor to the test jig (glass epoxy board) shown
in Fig.3 using a eutectic solder. Then apply 18N force in parallel
with the test jig for 60s.
D.F.
I.R.
0.025 max.
The soldering should be done by the reflow method and should
be conducted with care so that the soldering is uniform and free
of defects such as heat shock.
More than 10,000MW or 100 MWF
(Whichever is smaller)
Type
a
b
c
GCJ31
GCJ32
GCJ43
GCJ55
2.2
2.2
3.5
4.5
5.0
5.0
7.0
8.0
2.0
2.9
3.7
5.6
(in mm)
c
(t : 1.6mm)
Solder resist
Baked electrode or
copper foil
Fig.3
JEMCGS-03026A
4
■AEC-Q200 Murata Standard Specification and Test Methods
AEC-Q200
Test Item
No.
20
Specification
AEC-Q200 Test Method
Beam Load Test
Destruction value should be exceed following one.
Place the capacitor in the beam load fixture as Fig 4.
Apply a force.
Chip thickness < 1.25mm rank : 15N
Chip thickness 1.25mm rank : 54.5N
L
0.6L
Fig.4
Speed supplied the Stress Load : 2.5mm / s
The capacitance change should be measured after 5min. at
each specified temperature stage.
Capacitance Capacitance within ±15%
21
Temperature Change
Characteris-
tics
Step
Temperature(°C)
252
1
2
3
4
5
-553
252
1253
252
The ranges of capacitance change compared with the above
25°C value over the temperature ranges shown in the table
should be within the specified ranges.
•Pretreatment
Perform the heat treatment at 150+0/-10°C for 60±5 min and
then let sit for 24±2h at room condition*.
Perform the initial measurement.
* “room condition” Temperature:15 to 35°C, Relative humidity:45 to 75%, Atmosphere pressure:86 to 106kPa
JEMCGS-03026A
5
Package
(1) Appearance of taping
(a) Paper Tape
Bottom Tape (Thickness: Around 50m) is attached below Base Tape with sprocket and put Top Tape
(Thickness: Around 50m) on capacitor.
(b) Plastic Tape
Cover Tape (Thickness: Around 60m) is put on capacitor on Base Tape (Blister carrier Tape).
(c) The sprocket holes are to the right as the Tape is pulled toward the user.
(2) Packed chips
Capacitor
(3) Dimensions of Tape
(a) Type A (Dimensions of chip : Apply to 1.6x0.8 , 2.0x1.25 , 3.2x1.6 , 3.2x2.5)
f1.5+0.1/-0
(Plastic Tape)
(Paper Tape)
4.0±0.1
4.0±0.1
0.25±0.1
2.0±0.05
2.5max.
1.1max.
A
(Unit : mm)
Dimensions of chip
A*
B*
[L×W]
1.6×0.8
2.0×1.25
3.2×1.6
3.2×2.5
1.05
1.45
2.0
1.85
2.25
3.6
Dimensions of A,B : Nominal value
2.9
3.6
(b) Type B (Dimensions of chip : Apply to 4.5x2.0)
f1.5+0.1/-0
4.0±0.1
4.0±0.1
0.3±0.1
2.0±0.05
3.7max.
A
(Unit : mm)
Dimensions of chip
[L×W]
A*
B*
Dimensions of A,B : Nominal value
4.5×2.0
2.5
5.1
JEMCGP-03074
6
Package
(c) Type C (Dimensions of chip : Apply to 4.5x3.2 to 5.7x5.0)
2.0±0.05
0.3±0.1
f1.5+0.1/-0
8.0±0.1
4.0±0.1
3.7max.
(Unit : mm)
A
Dimensions of chip
[L×W]
A*
B*
4.5×3.2
3.6
3.2
5.4
4.9
6.1
6.1
Dimensions of A,B : Nominal value
5.7×2.8
5.7×5.0
(4) Dimensions of Reel
13.0±1.0 : Tape width 8mm
17.0±1.0 : Tape width 12mm
2.0±0.5
f21±0.8
f13±0.2
9.0+1.0/-0 : Tape width 8mm
13.0+1.0/-0 : Tape width 12mm
(Unit : mm)
(5) Part of the leader and part of the empty tape shall be attached to the end of the tape as follows.
Vacant section : 160 min. Chip-mounting unit Vacant section : 190 min.
210 min.
(Unit : mm)
Direction of feed
(6) The top tape or cover tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
(7) Missing capacitors number within 0.1% of the number per reel or 1pc, whichever is greater, and not continuous.
(8) The top tape or cover tape and bottom tape shall not protrude beyond the edges of the tape and shall not
cover sprocket holes.
(9) Cumulative tolerance of sprocket holes, 10 pitches : ±0.3mm.
(10) Peeling off force : 0.1 to 0.6N in the direction shown on the follows.
165 to 180°
Top Tape or Cover Tape
Base Tape
JEMCGP-03074
7
CAUTION
!
!
■Storage and Operation Conditions
1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions.
1-1. Store the capacitors in the following conditions:
Room Temperature of +5C to +40°C and a Relative Humidity of 20% to 70%.
(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere, or high temperature
and humidity conditions during storage may affect solderability and packaging performance.
Therefore, please maintain the storage temperature and humidity. Use the product within six months,
as prolonged storage may cause oxidation of the electrodes.
(2) Please confirm solderability before using after six months. Store the capacitors without opening the
original bag. Even if the storage period is short, do not exceed the specified atmospheric conditions.
1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result in
poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas
(e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas, etc.).
1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused by
direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and electrical
performance may deteriorate. Do not store capacitors under direct sunlight or in high humidity conditions.
■Rating
1. Temperature Dependent Characteristics
1. The electrical characteristics of a capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature
changes.
The following actions are recommended in order to ensure suitable capacitance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature.
When you use a high dielectric constant type capacitor in a circuit that needs a tight (narrow)
capacitance tolerance (e.g., a time-constant circuit), please carefully consider the temperature
characteristics, and carefully confirm the various characteristics in actual use conditions and the
actual system.
2. Measurement of Capacitance
1. Measure capacitance with the voltage and frequency specified in the product specifications.
1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high.
Please confirm whether a prescribed measured voltage is impressed to the capacitor.
1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage
applied. Please consider the AC voltage characteristics when selecting a capacitor to be used in an AC
circuit.
3. Applied Voltage
1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications.
1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.
(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the
rated DC voltage.
When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated
DC voltage.
(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated
DC voltage.
Typical Voltage Applied to the DC Capacitor
DC Voltage
DC Voltage + AC
AC Voltage
Pulse Voltage
E
E
E
E
0
0
0
0
(E:Maximum possible applied voltage.)
JEMCGC-02985
8
CAUTION
!
1-2. Influence of over voltage
Over voltage that is applied to the capacitor may result in an electrical short circuit caused by the
breakdown of the internal dielectric layers.
The time duration until breakdown depends on the applied voltage and the ambient temperature.
2. Use a safety standard certified capacitor in a power supply input circuit (AC filter), as it is also necessary to
consider the withstand voltage and impulse withstand voltage defined for each device.
4. Type of Applied Voltage and Self-heating Temperature
1. Confirm the operating conditions to make sure that no large current is flowing into the capacitor due to the
continuous application of an AC voltage or pulse voltage.
When a DC rated voltage product is used in an AC voltage circuit or a pulse voltage circuit, the AC current
or pulse current will flow into the capacitor; therefore check the self-heating condition.
Please confirm the surface temperature of the capacitor so that the temperature remains within the upper
limits of the operating temperature, including the rise in temperature due to self-heating. When the
capacitor is used with a high-frequency voltage or pulse voltage, heat may be generated by dielectric loss.
1-1. Applicable to Temperature Characteristic X7R, X7T
The load should be contained so that the self-heating of the capacitor body remains below 20°C, when
measuring at an ambient temperature of 25°C. In addition, use a K thermocouple of 0.1mm with less
heat capacity when measuring, and measure in a condition where there is no effect from the radiant
heat of other components or air flow caused by convection. Excessive generation of heat may cause
deterioration of the characteristics and reliability of the capacitor. (Absolutely do not perform
measurements while the cooling fan is operating, as an accurate measurement may not be performed.)
5. DC Voltage and AC Voltage Characteristics
1. The capacitance value of a high dielectric constant type capacitor changes depending on the DC voltage
applied. Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit.
1-1. The capacitance of ceramic capacitors may change sharply depending on the applied voltage (see figure).
Please confirm the following in order to secure the capacitance.
(1) Determine whether the capacitance change caused by the applied voltage is within the allowed range.
(2) In the DC voltage characteristics, the rate of capacitance change becomes larger as voltage increases,
even if the applied voltage is below the rated voltage. When a high dielectric constant type capacitor
is used in a circuit that requires a tight (narrow) capacitance tolerance (e.g., a time constant circuit),
please carefully consider the voltage characteristics, and confirm the various characteristics in actual
operating conditions in an actual system.
2. The capacitance values of high dielectric constant type capacitors changes depending on the AC voltage
applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in an AC circuit.
6. Capacitance Aging
1. The high dielectric constant type capacitors have the characteristic in which the capacitance value decreases
with the passage of time.
When you use high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance
tolerance (e.g., a time-constant circuit), please carefully consider the characteristics of these capacitors,
such as their aging, voltage, and temperature characteristics. In addition, check capacitors using your
actual appliances at the intended environment and operating conditions.
JEMCGC-02985
9
注意
CAUTION
!
7. Vibration and Shock
1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.
Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.
2. Mechanical shock due to being dropped may cause damage or a crack in the dielectric material of the
capacitor.
Do not use a dropped capacitor because the quality and reliability may be deteriorated.
Crack
Floor
3. When printed circuit boards are piled up or handled, the corner of another printed circuit board should not
be allowed to hit the capacitor, in order to avoid a crack or other damage to the capacitor.
Mounting printed circuit board
Crack
■Soldering and Mounting
1. Mounting Position
1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during
flexing or bending the printed circuit board.
1-1. Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of
the board.
ꢀ[Component Direction]
ꢀ[Chip Mounting Close to Board Separation Point]
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as
possible to reduce stress.
Contents of Measures
Stress Level
A > D
C
D
Perforation
A
(1) Turn the mounting direction of the component
parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component
away from the board separation surface.
B
A > B
A > C
Slit
ꢀ[Mounting Capacitors Near Screw Holes]
When a capacitor is mounted near a screw hole, it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the capacitor in a position as far away from the screw holes
as possible.
Screw Hole
Recommended
JEMCGC-02985
10
!
CAUTION
2. Information before Mounting
1. Do not re-use capacitors that were removed from the equipment.
2. Confirm capacitance characteristics under actual applied voltage.
3. Confirm the mechanical stress under actual process and equipment use.
4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.
5. Prior to use, confirm the solderability of capacitors that were in long-term storage.
6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.
7. The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.
Please contact our sales representative or product engineers on the use of Sn-Zn based solder in
advance.
8. We have also produced a DVD which shows a summary of our opinions, regarding the precautions for
mounting. Please contact our sales representative to request the DVD.
3. Maintenance of the Mounting (pick and place) Machine
1. Make sure that the following excessive forces are not applied to the capacitors.
1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept
to a minimum to prevent them from any bending damage or cracking. Please take into account the
following precautions and recommendations for use in your process.
(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.
(2) Adjust the nozzle pressure within a static load of 1N to 3N during mounting.
2. Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent the
nozzle from moving smoothly. This imposes greater force upon the chip during mounting, causing
cracked chips. Also, the locating claw, when worn out, imposes uneven forces on the chip when
positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained,
checked, and replaced periodically.
JEMCGC-02985
11
注
注
!
CAUTION
4-1. Reflow Soldering
[Standard Conditions for Reflow Soldering]
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components.
Reflow
Temperature (℃)
Soldering
Peak Temperature
Gradual
Cooling
220℃(200℃)
In order to prevent mechanical damage to the
components preheating is required for both the
components and the PCB.
Δ T
190℃(170℃)
170℃(150℃)
150℃(130℃)
Preheating
Preheating conditions are shown in table 1. It is
required to keep the temperature differential
between the solder and the components surface
(T) as small as possible.
Time
Temperature
60 - 120 s 30 - 60 s
Incase of Lead Splder
):In case of Pb-Sn Solder
(
2. Solderability of tin plating termination chips might be
deteriorated when a low temperature soldering profile
where the peak solder temperature is below the melting
point of tin is used. Please confirm the solderability
of tin plated termination chips before use.
3. When components are immersed in solvent after
mounting, be sure to maintain the temperature
difference (T) between the component and the
solvent within the range shown in the table 1.
Vapor Reflow
Temperature (℃)
Soldering
Peak Temperature
Gradual
Cooling
Δ T
190℃ (170℃)
170℃ (150℃)
150℃ (130℃)
Preheating
Time
60 - 120 s 20 s max.
Table 1
Part Number
G□□18/21/31
[Allowable Soldering Temperature and Time]
Temperature Differential
T≦190°C
280
270
260
T≦130°C
G□□32/42/43/52/55
250
240
230
220
Recommended Conditions
Pb-Sn Solder
Lead Free
Solder
Reflow
Vapor Reflow
230 to 240°C
0
30
60
90
120
Peak Temperature
Atmosphere
230 to 250°C
240 to 260°C
Air or N2
Soldering Time (s)
Saturated vapor of
inactive solvent
Air
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Pb-Sn Solder : Sn-37Pb
Lead Free Solder : Sn-3.0Ag-0.5Cu
4. Optimum Solder Amount for Reflow Soldering
4-1. Overly thick application of solder paste results in a
excessive solder fillet height.
0.2mm min.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause the
chips to crack.
4-2. Too little solder paste results in a lack of adhesive
strength on the outer electrode, which may result in chips
breaking loose from the PCB.
4-3. Make sure the solder has been applied smoothly to the
end surface to a height of 0.2mm min.
Inverting the PCB
Make sure not to impose any abnormal mechanical shocks to the PCB.
JEMCGC-02985
12
!
CAUTION
4-2. Flow Soldering
1. Do not apply flow soldering to chips not listed in table 2.
[Standard Conditions for Flow Soldering]
Temperature (℃)
Table 2
Soldering
Soldering
Peak
Temperature
Δ Ｔ
Part Number
Temperature Differential
Gradual
Cooling
G□□18/21/31
T≦150°C
Preheating
Peak
Temperature
Preheating
2. When sudden heat is applied to the components,
the mechanical strength of the components will
decrease because a sudden temperature change
causes deformation inside the components.
In order to prevent mechanical damage to the
components, preheating is required for both of the
components and the PCB. Preheating conditions
are shown in table 2. It is required to keep the
temperature differential between the solder and
the components surface ( T) as low as possible.
3. Excessively long soldering time or high soldering
temperature can result in leaching of the outer
electrodes, causing poor adhesion or a reduction in
capacitance value due to loss of contact between
the electrodes and end termination.
Time
30 - 90 s
5 s max.
[Allowable Soldering Temperature and Time]
280
270
260
250
240
230
220
0
10
20
30
40
Soldering Time (s)
In case of repeated soldering, the accumulated
soldering time must be within the range shown
4. When components are immersed in solvent after
mounting, be sure to maintain the temperature
differential ( T) between the component and solvent
within the range shown in the table 2.
above.
Recommended Conditions
Lead Free
Solder
Pb-Sn Solder
Preheating Peak
90 to 110°C 100 to 120°C
Temperature
Soldering Peak
240 to 250°C 250 to 260°C
Temperature
Atmosphere
Air
N2
Pb-Sn Solder : Sn-37Pb
Lead Free Solder : Sn-3.0Ag-0.5Cu
5. Optimum Solder Amount for Flow Soldering
5-1. The top of the solder fillet should be lower than the
thickness of the components. If the solder amount is
excessive, the risk of cracking is higher during board
bending or any other stressful condition.
Up to Chip Thickness
Adhesive
JEMCGC-02985
13
注意
4-3. Correction of Soldering Portion
CAUTION
!
When sudden heat is applied to the capacitor, distortion caused by the large temperature difference occurs
internally, and can be the cause of cracks. Capacitors also tend to be affected by mechanical and thermal
stress depending on the board preheating temperature or the soldering fillet shape, and can be the cause of
cracks. Please refer to "1. PCB Design" or "3. Optimum solder amount" for the solder amount and the fillet shapes.
1. Correction with a Soldering Iron
1-1. In order to reduce damage to the capacitor, be sure to preheat the capacitor and the mounting board.
Preheat to the temperature range shown in Table 3. A hot plate, hot air type preheater, etc. can be used
for preheating.
1-2. After Soldering, do not allow the component/PCB to cool down repidly.
1-3. Perform the corrections with a soldering iron as quickly as possible. If the soldering iron is applied too
long, there is a possibility of causing solder leaching on the terminal electrodes, which will cause
deterioration of the adhesive strength and other problems.
Table 3
Temperature of
Soldering Iron tip
Preheating
Temperature
Temperature
Differential (T)
Part Number
Atmosphere
G□□18/21/31
G□□32/42/43/52/55
350°C max.
280°C max.
150°C min.
150°C min.
T≦190°C
T≦130°C
air
air
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder : Sn-37Pb
Lead Free Solder : Sn-3.0Ag-0.5Cu
2. Correction with Spot Heater
Compared to local heating with a soldering iron, hot air heating by a spot heater
component and board, therefore, it tends to lessen the thermal shock. In the cas
mounted board, a spot heater can also prevent concerns of the soldering iron ma
the component.
2-1. If the distance from the hot air outer of the spot heater to the component is too close, cracks may occur
due to thermal shock. To prevent this problem, follow the conditions shown in Table 4.
2-2. In order to create an appropriate solder fillet shape, it is recommended that hot air be applied at the
angle shown in Figure 1.
Table 4
Distance
Hot Air Application angle
5mm or more
45° *Figure 1
[Figure 1]
Hot Air Temperature Nozzle Outlet 400°C max.
Less than 10 seconds
(1206 (3216 in mm) size or smaller)
Less than 30 seconds
One-hole
Application Time
An Angle of 45°
(1206 (3225 in mm) size or larger)
3. Optimum solder amount when re-working with a soldering Iron
3-1. In the case of sizes smaller than 0603, (G□□18),
the top of the solder fillet should be lower than 2/3 of
the thickness of the component or 0.5mm, whichever
is smaller. In the case of 0805 and larger sizes,
(G□□21/31/32/42/43/52/55 seizes), the top of the
solder fillet should be lower than 2/3's of the thickness
of the component. If the solder amount is excessive,
the risk of cracking is higher during board bending or
under any other stressful conditions.
Solder Amount
3-2. A soldering iron with a tip ofφ3mm or smaller should be used. It is also necessary to keep the
soldering iron from touching the components during the re-work.
3-3. Solder wire withφ0.5mm or smaller is required for soldering.
JEMCGC-02985
14
注意
CAUTION
!
5. Washing
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked
chips or broken solder joints. Take note not to vibrate PCBs.
6. Electrical Test on Printed Circuit Board
1. Confirm position of the backup pin or specific jig, when inspecting the electrical performance of a
capacitor after mounting on the printed circuit board.
1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc.
The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder joints.
Provide backup pins on the back side of the PCB to prevent warping or flexing. Install backup pins as
close to the capacitor as possible.
1-2. Avoid vibration of the board by shock when a test-probe contacts a printed circuit board.
7. Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that causes
bending or twisting the board.
1-1. In cropping the board, the stress as shown at right may cause the capacitor to crack.
Cracked capacitors may cause deterioration of the insulation resistance, and result in a short.
Avoid this type of stress to a capacitor.
[Twisting]
[Bending]
2. Check the cropping method for the printed circuit board in advance.
2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disk separator ,
router type separator, etc.) to prevent the mechanical stress that can occur to the board.
*When a board separation jig or disk separator is used, if the following precautions are not observed, a large board
deflection stress will occur and the capacitors may crack. Use router type separator if at all possible.
JEMCGC-02985
15
CAUTION
注意
!
(1) Example of a suitable jig
[In the case of Single-side Mounting]
An outline of the board separation jig is shown as follows. Recommended example : Stress on the
component mounting position can be minimized by holding the portion close to the jig, and bend in
the direction towards the side where the capacitors are mounted. Not recommended example : The risk
of cracks occurring in the capacitors increases due to large stress being applied to the
component mounting position, if the portion away from the jig is held and bent in the direction
opposite the side where the capacitors are mounted.
Recommended
Not recommended
Direction of Load
Components
Load Point
Direction of Load
[Outline of jig]
Print circut Board
Print circuit Board
V-groove
Print circuit
Board
Load Point
Components
Board Cropping Jig
[In the case of Double-sided Mounting]
Since components are mounted on both sides of the board, the risk of cracks occurring can not be avoided
with the above method.
Therefore, implement the following measure to prevent stress from being applied to the components. (Measures)
(1) Consider introducing a router type separator.
If it is difficult to introduce a router type separator, implement the following measures. (Refer to item 1.
Mounting Position)
(2) Mount the components at a right angle to the board separation surface.
(3) When mounting components near the board separation point, add slits in the separation position near the
component.
(4) Keep the mounting position of the components away from the board separation point.
(2) Example of a Disk Separator
An outline of a disk separator is shown as follows. As shown in the Principle of Operation, the top blade and
bottom blade are aligned with the V-grooves on the printed circuit board to separate the board.
In the following case, board deflection stress will be applied and cause cracks in the capacitors.
(1) When the adjustment of the top and bottom blades are misaligned, such as deviating in the
top-bottom, left-right or front-rear directions
(2) The angle of the V groove is too low, depth of the V groove is too shallow, or the V groove is misaligned top-bottom
If V grove is too deep, it is possible to brake when you handle and carry it. Carefully design depth of the V
groove with consideration about strength of material of the printed circuit board.
[Outline of
[Principle of
[Cross-section
Top Blade
Top Blade
Printed Circuit Board
Bottom Blade
Print Circuit Board
Top Blade
V-groove
V-groove
Not Recommended
Top-bottom Misalignment Left-right Misalignment
Recommended
Top Blade
Front-rear Misalignment
Top Blade Top Blade
Top Blade
Bottom Blade
Bottom Blade
Bottom Blade
Bottom Blade
JEMCGC-02985
16
CAUTION
!
Not Recommended
Depth too Shallow
Example of Recommended
V-groove Design
Left-right Misalignment
Low-Angle
Depth too Deep
(3) Example of Router Type Separator
The router type separator performs cutting by a router rotating at a high speed. Since the board does
not bend in the cutting process, stress on the board can be suppressed during board separation.
When attaching or removing boards to/from the router type separator, carefully handle the boards
to prevent bending.
Router
[Outline Drawing]
8. Assembly
1. Handling
If a board mounted with capacitors is held with one hand, the board may bend. Firmly hold the edges
of the board with both hands when handling.
If a board mounted with capacitors is dropped, cracks may occur in the capacitors.
Do not use dropped boards, as there is a possibility that the quality of the capacitors may be impaired.
2. Attachment of Other Components
2-1. Mounting of Other Components
Pay attention to the following items, when mounting other components on the back side of the
board after capacitors have been mounted on the opposite side. When the bottom dead point of
the suction nozzle is set too low, board deflection stress may be applied to the capacitors on the
back side (bottom side), and cracks may occur in the capacitors.
After the board is straightened, set the bottom dead point of the nozzle on the upper surface of
the board.
Periodically check and adjust the bottom dead point.
Suction Nozzle
JEMCGC-02985
17
!
CAUTION
2-2. Inserting Components with leads into Boards
When inserting components (transformers, IC, etc.) into boards, bending the board may cause
cracks in the capacitors or cracks in the solder.
Pay attention to the following.
Increase the size of the holes to insert the leads, to reduce the stress on the board during insertion.
Fix the board with backup pins or a dedicated jig before insertion.
Support below the board so that the board does not bend, periodically confirm that there is no difference
in the height of each backup pin.
Component with Leads
2-3. Attaching/Removing Sockets
When the board itself is a connector, the board may bend when a socket is attached or removed.
Plan the work so that the board does not bend when a socket is attached or removed.
Socket
2-4. Tightening Screws
The board may be bent, when tightening screws, etc. during the attachment of the board to a shield
or chassis.
Pay attention to the following items before performing the work.
Plan the work to prevent the board from bending.
Use a torque screwdriver, to prevent over-tightening of the screws.
The board may bend after mounting by reflow soldering, etc. Please note, as stress may be
applied to the chips by forcibly flattening the board when tightening the screws.
Screwdriver
JEMCGC-02985
18
CAUTION
!
■Other
1. Under Operation Equipment
1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of
an electric shock.
1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit).
Do not expose a capacitor to a conductive liquid, including any acid or alkali solutions.
1-3. Confirm the environment in which the equipment will operate is under the specified conditions.
Do not use the equipment under the following environments.
(1) Being spattered with water or oil.
(2) Being exposed to direct sunlight.
(3) Being exposed to ozone, ultraviolet rays, or radiation.
(4) Being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas, etc.)
(5) Any vibrations or mechanical shocks exceeding the specified limits.
(6) Moisture condensing environments.
1-4. Use damp proof countermeasures if using under any conditions that can cause condensation.
2. Other
2-1. In an Emergency
(1) If the equipment should generate smoke, fire, or smell, immediately turn off or unplug the equipment.
If the equipment is not turned off or unplugged, the hazards may be worsened by supplying
continuous power.
(2) In this type of situation, do not allow face and hands to come in contact with the capacitor or burns
may be caused by the capacitor's high temperature.
2-2. Disposal of Waste
When capacitors are disposed of, they must be burned or buried by an industrial waste vendor with
the appropriate licenses.
2-3. Circuit Design
(1) Addition of Fail Safe Function
Capacitors that are cracked by dropping or bending of the board may cause deterioration of the
insulation resistance, and result in a short. If the circuit being used may cause an electrical shock
smoke or fire when a capacitor is shorted, be sure to install fail-safe function, such as a fuse, to
prevent secondary accidents.
(2) Capacitors used to prevent electromagnetic interference in the primary AC side circuit, or as a
connection/insulation, must be a safety standard certified product, or satisfy the contents
stipulated in the Electrical Appliance and Material Safety Law. Install a fuse for each line in case of
a short.
(3) This series is not safety standard certified products.
2-4. Remarks
Failure to follow the cautions may result, worst case, in a short circuit and smoking when the
product is used.
The above notices are for standard applications and conditions. Contact us when the products are
used in special mounting conditions.
Select optimum conditions for operation as they determine the reliability of the product after assembly.
The data herein are given in typical values, not guaranteed ratings.
3. LIMITATION OF APPLICATIONS
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment
(4) Power plant control equipment
(2) Aerospace equipment
(5) Medical equipment
(3) Undersea equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention/crime prevention equipment
(9) Data-processing equipment exerting influence on public
(10) Application of similar complexity and/or reliability requirements to the applications listed in the above.
JEMCGC-02985
19
NOTICE
■Rating
1. Operating Temperature
1. The operating temperature limit depends on the capacitor.
1-1. Do not apply temperatures exceeding the upper operating temperature.
It is necessary to select a capacitor with a suitable rated temperature that will cover the operating
temperature range.
It is also necessary to consider the temperature distribution in equipment and the seasonal
temperature variable factor.
1-2. Consider the self-heating factor of the capacitor.
The surface temperature of the capacitor shall be the upper operating temperature or less when
including the self-heating factors.
2. Atmosphere Surroundings (gaseous and liquid)
1. Restriction on the operating environment of capacitors.
1-1. Capacitors, when used in the above, unsuitable, operating environments may deteriorate due to the
corrosion of the terminations and the penetration of moisture into the capacitor.
1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor
are subject to moisture condensation.
1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of
terminal electrodes may result in breakdown when the capacitor is exposed to corrosive or volatile
gases or solvents for long periods of time.
3. Piezo-electric Phenomenon
1. When using high dielectric constant type capacitors in AC or pulse circuits, the capacitor itself vibrates
at specific frequencies and noise may be generated.
Moreover, when the mechanical vibration or shock is added to the capacitor, noise may occur.
■Soldering and Mounting
1. PCB Design
1. Notice for Pattern Forms
1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are
mounted directly on the substrate.
They are also more sensitive to mechanical and thermal stresses than leaded components.
Excess solder fillet height can multiply these stresses and cause chip cracking. When designing
substrates, take land patterns and dimensions into consideration to eliminate the possibility of
excess solder fillet height.
1-2. There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because
stress on a chip is different depending on PCB material and structure. When the thermal expansion
coefficient greatly differs between the board used for mounting and the chip, it will cause cracking of
the chip due to the thermal expansion and contraction.
Prohibited
Correct
Chassis
Solder Resist
Solder (ground)
Placing Close to chassis
Electrode Pattern
Lead Wire
Solder Resist
Placing
of Chip Components
and Leaded Components
Lead Wire
Soldering Iron
Soldr Resist
Placing
of Leaded Components
after Chip Components
Solder Resist
Lateral Mounting
JEMCGC-02985
20
NOTICE
2. Land Dimensions
Chip Capacitor
Land
2-1. Chip capacitors can be cracked due to the stress of PCB
bending, etc. if the land area is larger than needed and has
an excess amount of solder.
Please refer to the land dimensions in table 1 for flow
soldering, table 2 for reflow soldering.
Please confirm the suitable land dimension by evaluating
of the actual SET/PCB.
b
a
Solder Resist
Table 1 Flow Soldering Method
Part Number
Chip (L x W)
a
b
c
G□□18
G□□21
G□□31
1.6×0.8
2.0×1.25
3.2×1.6
0.6 to 1.0
1.0 to 1.2
2.2 to 2.6
0.8 to 0.9
0.9 to 1.0
1.0 to 1.1
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4
Flow soldering can only be used for products with a chip size of 3.2x1.6mm or less (in mm)
Table 2 Reflow Soldering Method
Part Number
G□□18
G□□21
G□□31
G□□32
G□□42
G□□43
G□□52
G□□55
(L W)
1.6×0.8
2.0×1.25
3.2×1.6
3.2×2.5
4.5×2.0
4.5×3.2
5.7×2.0
5.7×5.0
a
b
c
0.6 to 0.8
1.0 to 1.2
2.2 to 2.4
2.0 to 2.4
2.8 to 3.4
3.0 to 3.5
4.0 to 4.6
4.0 to 4.6
0.6 to 0.7
0.6 to 0.7
0.8 to 0.9
1.0 to 1.2
1.2 to 1.4
1.2 to 1.4
1.4 to 1.6
1.4 to 1.6
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4
1.8 to 2.3
1.4 to 1.8
2.3 to 3.0
2.1 to 2.6
3.5 to 4.8
(in mm)
3. Board Design
When designing the board, keep in mind that the amount of strain which occurs will increase depending
on the size and material of the board.
[Relationship with amount of strain to the board
thickness, length, width, etc.]
3PL
Relationship between load and strain
ε =
: Strain on center of board (st)
L: Distance between supporting point
2Ewh2
(mm)
w: Board width (mm)
h: Board thickness (mm)
E: Elastic modulus of
board(N/m2=Pa)
Y: Deflection (mm)
P
Y
h
L
w
When the load is constant, the following relationship can be established.
As the distance between the supporting points (L) increases, the amount
of strain also increases.
Reduce the distance between the supporting points.
As the elastic modulus (E) decreases, the amount of strain increases.
Increase the elastic modulus.
As the board width (w) decrease, the amount of strain increases.
Increase the width of the board.
As the board thickness of the board.
Increase the thickness of the board.
Since the board thickness is squared, the effect on the amount of strain
becomes even greater.
JEMCGC-02985
21
NOTICE
2. Adhesive Application
1. Thin or insufficient adhesive can cause the ships to loosen or become disconnected during flow
soldering. The amount of adhesive must be more than dimension c, shown in the drawing at right,
to obtain the correct bonding strength.
The chip's electrode thickness and land thickness must also be taken into consideration.
Chip Capacitor
a
a=20 to 70μm
b=30 to 35μm
c=50 to 105μm
c
Adhesive
b
Board
Land
2. Low viscosity adhesive can cause chips to slip after mounting. The adhesive must have a viscosity
of 5000Pa・s(500ps) min. (at 25°C).
3. Adhesive Coverage
Size (L x W)
1.6×0.8
Adhesive Coverage*
0.05mg min.
2.0×1.25
3.2×1.6
0.1mg min.
0.15mg min.
*Nominal Value
3. Adhesive Curing
1. Insufficient curing of the adhesive can cause chips to disconnect during flow soldering and causes
deterioration in the insulation resistance between the outer electrodes due to moisture absorption.
Control curing temperature and time in order to prevent insufficient hardening.
4. Flux Application
1. An excessive amount of flux generates a large quantity of flux gas, which can cause a deterioration of
solder ability, so apply flux thinly and evenly throughout. (A foaming system is generally used for flow
soldering.)
2. Flux containing too high a percentage of halide may cause corrosion of the outer electrodes unless
there is sufficient cleaning. Use flux with a halide content of 0.1% max.
3. Do not use strong acidic flux.
4. Do not use water-soluble flux.*
(*Water-soluble flux can be defined as non-rosin type flux including wash-type flux and non-wash-type
flux.)
5. Flow Soldering
●Set temperature and time to ensure that leaching of
the outer electrode does not exceed 25% of the
chip end area as a single chip (full length of the
edge A-B-C-D shown at right) and 25% of the length
A-B shown as mounted on substrate.
6. Washing
1. Please evaluate the capacitor using actual cleaning equipment and conditions to confirm the quality,
and select the solvent for cleaning.
2. Unsuitable cleaning solvent may leave residual flux or other foreign substances, causing deterioration
of electrical characteristics and the reliability of the capacitors.
3. Select the proper cleaning conditions.
3-1. Improper cleaning conditions (excessive or insufficient) may result in deterioration of the
performance of the capacitors.
JEMCGC-02985
22
NOTICE
7. Coating
1. A crack may be cause in the capacitor due to the stress of the thermal contraction of the resin during
curing process.
The stress is affected by the amount of resin and curing contraction.
Select a resin with low curing contraction.
The difference in the thermal expansion coefficient between a coating resin or a molding resin and the
capacitor may cause the destruction and deterioration of the capacitor such as a crack or peeling, and
lead to the deterioration of insulation resistance or dielectric breakdown.
Select a resin for which the thermal expansion coefficient is as close to that of the capacitor as possible.
A silicone resin can be used as an under-coating to buffer against the stress.
2. Select a resin that is less hygroscopic.
Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation
resistance of a capacitor.
An epoxy resin can be used as a less hygroscopic resin.
■Other
1. Transportation
1. The performance of a capacitor may be affected by the conditions during transportation.
1-1. The capacitors shall be protected against excessive temperature, humidity, and mechanical force
during transportation.
(1) Climatic condition
・low air temperature : -40°C
・change of temperature air/air : -25°C/+25°C
・low air pressure : 30kPa
・change of air pressure : 6kPa/min.
(2) Mechanical condition
Transportation shall be done in such a way that the boxes are not deformed and forced are not
directly passed on to the inner packaging.
1-2. Do not apply excessive vibration, shock, or pressure to the capacitor.
(1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking
may occur in the ceramic body of the capacitor.
(2) When the sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly
on the surface of the capacitor, the capacitor may crack and short-circuit.
1-3. Do not use a capacitor to which excessive shock was applied by dropping, etc.
A capacitor dropped accidentally during processing may be damaged.
2. Characteristics Evaluation in the Actual System
1. Evaluate the capacitor in the actual system, to confirm that there is no problem with the performance
and specification values in a finished product before using.
2. Since a voltage dependency and temperature dependency exists in the capacitance of high dielectric
type ceramic capacitors, the capacitance may change depending on the operating conditions in the
actual system. Therefore, be sure to evaluate the various characteristics, such as the leakage current
and noise absorptivity, which will affect the capacitance value of the capacitor.
3. In addition, voltages exceeding the predetermined surge may be applied to the capacitor by the
inductance in the actual system. Evaluate the surge resistance in the actual system as required.
NOTE
!
1. Please make sure that your product has been evaluated in view of your specifications with our product
being mounted to your product.
2. You are requested not to use our product deviating from this product specification.
3. We consider it not appropriate to include any terms and conditions with regard to the business transaction
in the product specifications, drawings or other technical documents. Therefore, if your technical documents
as above includes such terms and conditions such as warranty clause, product liability clause, intellectual
property infringement liability clause, or export control clause, they will be deemed to be invalid.
JEMCGC-02985
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